CN116057092A - 导热性树脂组合物及电子设备 - Google Patents

导热性树脂组合物及电子设备 Download PDF

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Publication number
CN116057092A
CN116057092A CN202180054329.4A CN202180054329A CN116057092A CN 116057092 A CN116057092 A CN 116057092A CN 202180054329 A CN202180054329 A CN 202180054329A CN 116057092 A CN116057092 A CN 116057092A
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meth
acrylic monomer
thermally conductive
monomer unit
resin composition
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CN202180054329.4A
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Chinese (zh)
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五十岚和幸
小野冢正雄
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Denka Co Ltd
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Denka Co Ltd
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    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C08F220/301—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52—Amides or imides
    • C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/58—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing oxygen in addition to the carbonamido oxygen, e.g. N-methylolacrylamide, N-(meth)acryloylmorpholine
    • C08F220/585—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing oxygen in addition to the carbonamido oxygen, e.g. N-methylolacrylamide, N-(meth)acryloylmorpholine and containing other heteroatoms, e.g. 2-acrylamido-2-methylpropane sulfonic acid [AMPS]
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    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
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    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
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    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/068—Polysiloxanes
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
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    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180054329.4A 2020-10-05 2021-10-05 导热性树脂组合物及电子设备 Pending CN116057092A (zh)

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JP2020-168732 2020-10-05
JP2020168732 2020-10-05
PCT/JP2021/036778 WO2022075307A1 (ja) 2020-10-05 2021-10-05 熱伝導性樹脂組成物及び電子機器

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US (1) US20230374189A1 (https=)
EP (1) EP4227336A4 (https=)
JP (1) JP7144644B2 (https=)
KR (1) KR20230080430A (https=)
CN (1) CN116057092A (https=)
WO (1) WO2022075307A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230374363A1 (en) * 2020-10-05 2023-11-23 Denka Company Limited Thermally conductive resin composition and electronic device
JP7644137B2 (ja) * 2020-10-06 2025-03-11 デンカ株式会社 組成物、硬化体及び金属ベース基板
JP2023095001A (ja) * 2021-12-24 2023-07-06 デンカ株式会社 組成物及び放熱シート
JPWO2024096000A1 (https=) * 2022-11-02 2024-05-10

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102131873A (zh) * 2008-09-10 2011-07-20 瓦克化学股份公司 具有改善的抗龟裂性的硅酮弹性体
JP2011178983A (ja) * 2010-01-26 2011-09-15 Yokohama Rubber Co Ltd:The シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体
JP2011225733A (ja) * 2010-04-20 2011-11-10 Kaneka Corp 硬化性組成物及び硬化物
JP2011252070A (ja) * 2010-06-01 2011-12-15 Kaneka Corp 反応性官能基を有する化合物中に含まれる揮発分の脱揮方法および光学材料用硬化性組成物
WO2018131486A1 (ja) * 2017-01-13 2018-07-19 デンカ株式会社 熱伝導性樹脂組成物、放熱シート、放熱部材及びその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53408U (https=) 1976-06-23 1978-01-06
JPS60179417A (ja) * 1984-02-27 1985-09-13 Shin Etsu Chem Co Ltd 液状シリコ−ンゴム組成物
JP2900408B2 (ja) * 1989-06-27 1999-06-02 大日本インキ化学工業株式会社 低起泡性フッ素系界面活性剤
JP2002146155A (ja) * 2000-11-16 2002-05-22 Daicel Chem Ind Ltd 水性樹脂分散液及びそれを含む水性塗料
JP4403355B2 (ja) * 2002-09-13 2010-01-27 Ｄｉｃ株式会社 カラーレジスト組成物
JP5300408B2 (ja) 2008-10-21 2013-09-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US20140248504A1 (en) * 2011-09-08 2014-09-04 Hitachi Chemical Company, Ltd. Resin composition, resin sheet, cured resin sheet, resin-adhered metal foil and heat dissipation device
JP2015140395A (ja) 2014-01-29 2015-08-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP6582967B2 (ja) * 2014-12-24 2019-10-02 東洋インキＳｃホールディングス株式会社 シリカ分散体、および、活性エネルギー線硬化性樹脂組成物
JP6510315B2 (ja) * 2015-05-14 2019-05-08 デンカ株式会社 熱伝導性グリース用組成物、熱伝導性グリースおよび放熱部材
JP6451541B2 (ja) * 2015-07-28 2019-01-16 信越化学工業株式会社 縮合硬化型シリコーン組成物
JP6708005B2 (ja) 2016-06-20 2020-06-10 信越化学工業株式会社 熱伝導性シリコーンパテ組成物
JP6583207B2 (ja) 2016-10-12 2019-10-02 信越化学工業株式会社 熱伝導性ポリマー組成物
CN107325782A (zh) * 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102131873A (zh) * 2008-09-10 2011-07-20 瓦克化学股份公司 具有改善的抗龟裂性的硅酮弹性体
JP2011178983A (ja) * 2010-01-26 2011-09-15 Yokohama Rubber Co Ltd:The シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体
JP2011225733A (ja) * 2010-04-20 2011-11-10 Kaneka Corp 硬化性組成物及び硬化物
JP2011252070A (ja) * 2010-06-01 2011-12-15 Kaneka Corp 反応性官能基を有する化合物中に含まれる揮発分の脱揮方法および光学材料用硬化性組成物
WO2018131486A1 (ja) * 2017-01-13 2018-07-19 デンカ株式会社 熱伝導性樹脂組成物、放熱シート、放熱部材及びその製造方法

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JP7144644B2 (ja) 2022-09-29
KR20230080430A (ko) 2023-06-07
EP4227336A4 (en) 2024-04-17
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EP4227336A1 (en) 2023-08-16
US20230374189A1 (en) 2023-11-23
WO2022075307A1 (ja) 2022-04-14

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