CN116003858A - 含填料膜 - Google Patents

含填料膜 Download PDF

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Publication number
CN116003858A
CN116003858A CN202211291848.5A CN202211291848A CN116003858A CN 116003858 A CN116003858 A CN 116003858A CN 202211291848 A CN202211291848 A CN 202211291848A CN 116003858 A CN116003858 A CN 116003858A
Authority
CN
China
Prior art keywords
filler
resin layer
containing film
layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211291848.5A
Other languages
English (en)
Chinese (zh)
Inventor
塚尾怜司
三宅健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017166277A external-priority patent/JP7081097B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN116003858A publication Critical patent/CN116003858A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Conductive Materials (AREA)
CN202211291848.5A 2016-09-13 2017-08-31 含填料膜 Pending CN116003858A (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2016-179042 2016-09-13
JP2016179042 2016-09-13
JP2017-084913 2017-04-23
JP2017084913 2017-04-23
JP2017158302 2017-08-20
JP2017-158302 2017-08-20
JP2017166277A JP7081097B2 (ja) 2016-09-13 2017-08-30 フィラー含有フィルム
JP2017-166277 2017-08-30
CN201780052909.3A CN109642037A (zh) 2016-09-13 2017-08-31 含填料膜
PCT/JP2017/031318 WO2018051799A1 (ja) 2016-09-13 2017-08-31 フィラー含有フィルム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201780052909.3A Division CN109642037A (zh) 2016-09-13 2017-08-31 含填料膜

Publications (1)

Publication Number Publication Date
CN116003858A true CN116003858A (zh) 2023-04-25

Family

ID=61618854

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211291848.5A Pending CN116003858A (zh) 2016-09-13 2017-08-31 含填料膜

Country Status (5)

Country Link
JP (1) JP7352114B2 (ko)
KR (2) KR20190010879A (ko)
CN (1) CN116003858A (ko)
TW (2) TWI759326B (ko)
WO (1) WO2018051799A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024042720A1 (ja) * 2022-08-26 2024-02-29 株式会社レゾナック 回路接続用接着剤フィルム及び接続構造体、並びに、それらの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07308632A (ja) * 1994-05-17 1995-11-28 Sumitomo Metal Ind Ltd 潤滑性に優れた金属板およびその製造方法
JP2004207689A (ja) * 2002-12-12 2004-07-22 Tokyo Electron Ltd 異方導電性フィルム、その製造方法及びプローブ装置
CN104541416A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜的制造方法和各向异性导电膜
CN105358642A (zh) * 2013-07-29 2016-02-24 迪睿合株式会社 导电性粘接膜的制造方法、导电性粘接膜、连接体的制造方法
JP2016103476A (ja) * 2014-11-17 2016-06-02 デクセリアルズ株式会社 異方性導電フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064324A (ja) 2001-06-11 2003-03-05 Hitachi Chem Co Ltd 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体
JP2006015680A (ja) 2004-07-05 2006-01-19 Oike Ind Co Ltd 艶消しフィルム
JP2013103368A (ja) 2011-11-11 2013-05-30 Sekisui Chem Co Ltd 多層フィルム
KR101716945B1 (ko) 2012-08-24 2017-03-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6221285B2 (ja) 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6264897B2 (ja) 2014-01-23 2018-01-24 トヨタ自動車株式会社 高誘電率フィルム及びフィルムコンデンサ
JP2015195198A (ja) * 2014-03-20 2015-11-05 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP7081097B2 (ja) 2016-09-13 2022-06-07 デクセリアルズ株式会社 フィラー含有フィルム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07308632A (ja) * 1994-05-17 1995-11-28 Sumitomo Metal Ind Ltd 潤滑性に優れた金属板およびその製造方法
JP2004207689A (ja) * 2002-12-12 2004-07-22 Tokyo Electron Ltd 異方導電性フィルム、その製造方法及びプローブ装置
CN104541416A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜的制造方法和各向异性导电膜
CN105358642A (zh) * 2013-07-29 2016-02-24 迪睿合株式会社 导电性粘接膜的制造方法、导电性粘接膜、连接体的制造方法
JP2016103476A (ja) * 2014-11-17 2016-06-02 デクセリアルズ株式会社 異方性導電フィルム

Also Published As

Publication number Publication date
TWI759326B (zh) 2022-04-01
WO2018051799A1 (ja) 2018-03-22
JP2022126655A (ja) 2022-08-30
TW201825563A (zh) 2018-07-16
JP7352114B2 (ja) 2023-09-28
TW202227543A (zh) 2022-07-16
KR20220080204A (ko) 2022-06-14
KR20190010879A (ko) 2019-01-31

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