TWI759326B - 含填料膜 - Google Patents

含填料膜 Download PDF

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Publication number
TWI759326B
TWI759326B TW106130309A TW106130309A TWI759326B TW I759326 B TWI759326 B TW I759326B TW 106130309 A TW106130309 A TW 106130309A TW 106130309 A TW106130309 A TW 106130309A TW I759326 B TWI759326 B TW I759326B
Authority
TW
Taiwan
Prior art keywords
filler
resin layer
containing film
layer
film
Prior art date
Application number
TW106130309A
Other languages
English (en)
Chinese (zh)
Other versions
TW201825563A (zh
Inventor
尾怜司
三宅健
Original Assignee
日商迪睿合股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017166277A external-priority patent/JP7081097B2/ja
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201825563A publication Critical patent/TW201825563A/zh
Application granted granted Critical
Publication of TWI759326B publication Critical patent/TWI759326B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Conductive Materials (AREA)
TW106130309A 2016-09-13 2017-09-05 含填料膜 TWI759326B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2016179042 2016-09-13
JPJP2016-179042 2016-09-13
JPJP2017-084913 2017-04-23
JP2017084913 2017-04-23
JP2017158302 2017-08-20
JPJP2017-158302 2017-08-20
JPJP2017-166277 2017-08-30
JP2017166277A JP7081097B2 (ja) 2016-09-13 2017-08-30 フィラー含有フィルム

Publications (2)

Publication Number Publication Date
TW201825563A TW201825563A (zh) 2018-07-16
TWI759326B true TWI759326B (zh) 2022-04-01

Family

ID=61618854

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106130309A TWI759326B (zh) 2016-09-13 2017-09-05 含填料膜

Country Status (5)

Country Link
JP (1) JP7352114B2 (ko)
KR (1) KR20190010879A (ko)
CN (1) CN116003858A (ko)
TW (1) TWI759326B (ko)
WO (1) WO2018051799A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024042720A1 (ja) * 2022-08-26 2024-02-29 株式会社レゾナック 回路接続用接着剤フィルム及び接続構造体、並びに、それらの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016103476A (ja) * 2014-11-17 2016-06-02 デクセリアルズ株式会社 異方性導電フィルム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3214228B2 (ja) * 1994-05-17 2001-10-02 住友金属工業株式会社 潤滑性に優れた金属板およびその製造方法
JP2003064324A (ja) 2001-06-11 2003-03-05 Hitachi Chem Co Ltd 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体
JP2004207689A (ja) * 2002-12-12 2004-07-22 Tokyo Electron Ltd 異方導電性フィルム、その製造方法及びプローブ装置
JP2006015680A (ja) 2004-07-05 2006-01-19 Oike Ind Co Ltd 艶消しフィルム
JP2013103368A (ja) 2011-11-11 2013-05-30 Sekisui Chem Co Ltd 多層フィルム
CN107254263A (zh) 2012-08-24 2017-10-17 迪睿合电子材料有限公司 各向异性导电膜的制造方法和各向异性导电膜
KR102345819B1 (ko) 2012-08-24 2022-01-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6221285B2 (ja) 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6289831B2 (ja) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
JP6264897B2 (ja) 2014-01-23 2018-01-24 トヨタ自動車株式会社 高誘電率フィルム及びフィルムコンデンサ
WO2015141830A1 (ja) * 2014-03-20 2015-09-24 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP7081097B2 (ja) * 2016-09-13 2022-06-07 デクセリアルズ株式会社 フィラー含有フィルム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016103476A (ja) * 2014-11-17 2016-06-02 デクセリアルズ株式会社 異方性導電フィルム

Also Published As

Publication number Publication date
KR20220080204A (ko) 2022-06-14
KR20190010879A (ko) 2019-01-31
JP2022126655A (ja) 2022-08-30
JP7352114B2 (ja) 2023-09-28
TW201825563A (zh) 2018-07-16
WO2018051799A1 (ja) 2018-03-22
CN116003858A (zh) 2023-04-25
TW202227543A (zh) 2022-07-16

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