CN115896881B - Semiconductor wafer electroplating system capable of preventing deflection - Google Patents
Semiconductor wafer electroplating system capable of preventing deflection Download PDFInfo
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- CN115896881B CN115896881B CN202211441268.XA CN202211441268A CN115896881B CN 115896881 B CN115896881 B CN 115896881B CN 202211441268 A CN202211441268 A CN 202211441268A CN 115896881 B CN115896881 B CN 115896881B
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Abstract
The invention discloses a semiconductor wafer electroplating system capable of preventing offset, belonging to the field of semiconductors, comprising the following steps: s1, preparing pretreatment liquid, connecting the pretreatment liquid with a spraying module, and spraying by using the spraying module; s2, placing the semiconductor wafer in the processing device, and clamping by using a clamping module; s3, placing the whole treatment device in the pretreatment liquid, and rotating the whole treatment device by using a rotating part; s4, taking out the whole treatment device from the pretreatment liquid, turning the whole treatment device upside down, and pretreating the bottom of the semiconductor wafer by using a spraying module; s5, the drying component dries the semiconductor wafer, and then electroplating is carried out by using the electroplating module. The method and the device ensure that the appearance of the semiconductor wafer is free from floating dust or impurities by fully preprocessing the semiconductor wafer before processing the semiconductor wafer, and ensure the normal use of the semiconductor wafer.
Description
Technical Field
The present invention relates to the field of semiconductor technology, and more particularly, to a semiconductor wafer electroplating system capable of preventing offset.
Background
The silicon dioxide is purified, melted and distilled to be made into silicon crystal bars, and then the silicon crystal bars are taken by a wafer factory to be ground, polished and sliced into wafer master slices, so that the wafer is the basis of the semiconductor industry, wherein the wafer is a foreign product with better quality, but in recent years, with the development of China, the manufacturing factory of the semiconductor wafer is continuously developed in China, and the processing of the semiconductor wafer is more and more important.
When a wafer is processed, floating dust impurities are easy to adhere to the surface of the wafer, so that the processing quality of the wafer is affected.
Therefore, we propose a semiconductor wafer plating system that prevents misalignment.
Disclosure of Invention
The invention aims to solve the problem that the processing quality of a wafer is affected due to the fact that floating dust impurities are attached to the surface of the wafer during processing of the wafer in the prior art, and provides a semiconductor wafer electroplating system capable of preventing offset.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the plating system comprises a processing part, a processing device, a clamping part, a drying part and a plating module, wherein the processing device is used for processing the semiconductor wafer and controlling the movement of the position of the semiconductor wafer, the clamping part is arranged inside the processing device and is used for clamping and fixing the semiconductor wafer, the drying part comprises a top drying part, the top drying part is detachably arranged at the output end of a movable supporting seat, the movable supporting seat is arranged at the output end of the movable part and is used for moving the position of the drying part, and the plating module is arranged on the movable supporting seat after the top drying part is detached and is used for moving the plating position under the action of the movable part;
the method also comprises the following specific pretreatment steps of adopting an electroplating system to treat:
s1, preparing pretreatment liquid, connecting the pretreatment liquid with a spraying module, and spraying by using the spraying module;
s2, placing the semiconductor wafer in the processing device, and clamping by using a clamping component;
s3, placing the whole treatment device in the pretreatment liquid, and rotating the whole treatment device by using a rotating part;
s4, taking out the whole treatment device from the pretreatment liquid, turning the whole treatment device upside down, and pretreating the bottom of the semiconductor wafer by using a spraying module;
s5, the drying component dries the semiconductor wafer, and then electroplating is carried out by using the electroplating module.
As a further scheme of the invention: the preparation of the pretreatment liquid comprises the following steps:
s11, preparing deionized water, dividing the deionized water into two parts, taking one part of the deionized water for placement, and continuing the other part of the deionized water for the following steps;
s12, dividing the other part of deionized water into three parts, and respectively adding hydrogen peroxide, ammonium hydroxide and hydrogen fluoride;
and S13, connecting deionized water, hydrogen peroxide, ammonium hydroxide and hydrogen fluoride solution pipelines to different spraying ports of the spraying module respectively.
As a further scheme in the above: the concentrations of the prepared hydrogen peroxide, ammonium hydroxide and hydrogen fluoride solution are respectively as follows: 28% -32%, 27% -30% and 20-25%.
As a further aspect of the invention, the electroplating system comprises the following specific pretreatment steps:
the method comprises the steps that firstly, a processing component is used for preprocessing a semiconductor wafer, floating dust and impurities outside the wafer are removed, namely, the semiconductor wafer is sufficiently processed by the preprocessing, and the semiconductor wafer is processed and the position of the semiconductor wafer is movably controlled by a processing device, so that the sufficient processing of the semiconductor wafer by a preprocessing liquid can be ensured;
the second step, the clamping part is arranged in the processing device and used for clamping and fixing the semiconductor wafer, in order to enable the semiconductor wafer to be convenient for electroplating processing, the drying part comprises a top drying part, the top drying part is detachably arranged at the output end of the movable supporting seat, the movable supporting seat is arranged at the output end of the movable part and used for moving the position of the drying part, namely, the movable part can be used for moving the electric top drying part, so that the semiconductor wafer can be sufficiently dried;
and thirdly, electroplating under the action of an electroplating module, wherein the electroplating module is arranged on the movable supporting seat after the top drying piece is removed and is used for moving the electroplating position under the action of the movable part.
As a further scheme of the invention: the treatment device comprises a spraying module, a rotating module and an installation shell, wherein the rotating module comprises a rotating motor, a driving rotating shaft, a bottom supporting seat and a waste liquid collecting box, the rotating motor is fixed on the installation shell, the installation shell is fixed at a fixed position, the rotating motor is connected with the driving rotating shaft in a driving mode, the bottom supporting seat is fixed on the driving rotating shaft, the waste liquid collecting box is fixed on the bottom supporting seat, and the spraying module is arranged on the waste liquid collecting box.
As a further scheme in the above: the spraying module comprises a spraying unit and a rotating unit, wherein the rotating unit comprises a bottom motor, a bottom turntable, a connecting plate, a fixed supporting seat and a treatment shell, the bottom motor is fixed at the middle position of the waste liquid collecting box, the bottom turntable is connected with the bottom motor in a driving mode, the connecting plate is fixed on the bottom turntable, the end portion of the connecting plate is fixed with the fixed supporting seat, and the end portion of the fixed supporting seat is fixed with the treatment shell.
As a further scheme in the above: the spraying unit comprises a water spraying support frame, a water spraying pipe and a bottom water leakage screen plate, wherein the water spraying pipe is fixed at the bottom of the treatment shell, a plurality of groups of water spraying pipes are arranged and used for connecting different treatment liquids, the end parts of the water spraying pipes are connected with the water spraying support frame, multi-angle spray heads are uniformly arranged on the water spraying support frame, the bottom water leakage screen plate is arranged in the middle of the bottom of the treatment shell, and the bottom water leakage screen plate is sunken downwards.
As a further scheme in the above: the multi-angle spray head comprises a water inlet pipe, an adjusting motor, a driving gear, a multi-angle spray head and a driven gear, wherein the water inlet pipe is connected with a spray pipe, the end part of the water inlet pipe is connected with the multi-angle spray head, the driven gear is fixed outside the multi-angle spray head, the adjusting motor is fixed inside the water spray support frame, the driving gear is connected with the adjusting motor in a driving mode, and the driven gear is arranged on the side edge of the driving gear in a meshed mode.
As a further scheme of the invention: the clamping component comprises an inner connecting plate, an inner telescopic rod, a step support frame and a limit clamping plate, wherein the step support frame is arranged inside the processing shell in a step shape, the limit clamping plate is arranged on the side edge of the step support frame in a transverse moving mode, the processing shell is of a hollow structure, the inner telescopic rod is fixed inside the processing shell, the inner connecting plate is fixed at the end of the inner telescopic rod, and the limit clamping plate is fixed at the end of the inner connecting plate.
The semiconductor wafer capable of preventing offset comprises a semiconductor wafer body, wherein the semiconductor wafer body consists of a wafer, an electroplated layer and a protective ring, and the semiconductor wafer body is subjected to pretreatment processing by a pretreatment method and an electroplating system.
Compared with the prior art, the invention has the beneficial effects that:
1. the method and the device ensure that the appearance of the semiconductor wafer is free from floating dust or impurities by fully preprocessing the semiconductor wafer before processing the semiconductor wafer, and ensure the normal use of the semiconductor wafer.
2. According to the clamping device, the clamping component is arranged to fixedly clamp the clamping component, so that the position deviation of the semiconductor wafer can be avoided when the semiconductor wafer is processed.
3. The whole processing apparatus that rotates through being provided with rotating member for can place the semiconductor wafer and handle at pretreatment liquid, also can utilize spraying member to spray it simultaneously and handle.
Drawings
FIG. 1 is a block diagram illustrating a pre-processing method of a semiconductor wafer plating system capable of preventing offset according to the present invention;
FIG. 2 is a schematic diagram of an electroplating system of a semiconductor wafer electroplating system capable of preventing offset according to the present invention;
FIG. 3 is a schematic view of a processing apparatus of a plating system for preventing offset of a semiconductor wafer according to the present invention;
FIG. 4 is a schematic view of a clamping member of a system for electroplating a semiconductor wafer capable of preventing misalignment according to the present invention;
FIG. 5 is a schematic diagram of a rotation module of a system for electroplating a semiconductor wafer capable of preventing offset according to the present invention;
FIG. 6 is a schematic diagram of a multi-angle showerhead of the anti-migration plating system for semiconductor wafers according to the present invention;
fig. 7 is a schematic diagram of a semiconductor wafer body structure of a semiconductor wafer electroplating system capable of preventing offset according to the present invention.
In the figure: 1. a bottom motor; 2. a bottom turntable; 3. a connecting plate; 4. fixing the supporting seat; 5. a processing enclosure; 6. a multi-angle spray head; 7. a step support; 8. a limiting clamping plate; 9. a bottom water leakage screen; 10. a water spray pipe; 11. a water spraying support frame; 12. an internal connection board; 13. an inner telescopic rod; 14. a top drying member; 15. moving the supporting seat; 16. a bottom support base; 17. a rotating motor; 18. driving the rotating shaft; 19. a waste liquid collection box; 20. a drive gear; 21. adjusting a motor; 22. a water inlet pipe; 23. a driven gear; 24. a multi-angle spray head; 25. a semiconductor wafer body.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention are included in the protection scope of the present invention.
Example 1
The implementation is a method for preprocessing a semiconductor wafer capable of preventing offset;
as shown in fig. 1, includes specific pretreatment steps for treatment with an electroplating system:
s1, preparing pretreatment liquid, connecting the pretreatment liquid with a spraying module, and spraying by using the spraying module;
s2, placing the semiconductor wafer in the processing device, and clamping by using a clamping component;
s3, placing the whole treatment device in the pretreatment liquid, and rotating the whole treatment device by using a rotating part;
s4, taking out the whole treatment device from the pretreatment liquid, turning the whole treatment device upside down, and pretreating the bottom of the semiconductor wafer by using a spraying module;
s5, the drying component dries the semiconductor wafer, and then electroplating is carried out by using the electroplating module.
In the above, in step S1: spraying the pretreatment liquid onto the semiconductor wafer by using the spraying module to sufficiently flush, and in step S2: the semiconductor wafer is fixed to avoid the deviation during the processing or cleaning, and in step S3: under the rotation action of the rotating part, the whole treatment device can be immersed in the pretreatment liquid and then rotated out, dust and impurities adhered on the semiconductor wafer are taken away along with the flow of the pretreatment liquid, and in the step S4: after the immersion treatment is finished, the whole treatment device is reversely fixed, and the spraying module can spray the bottom of the semiconductor wafer, so that the bottom of the semiconductor wafer is cleaned, and in step S5: and the subsequent processing dryness of the semiconductor wafer is ensured by drying.
Based on the above, the preparation of the pretreatment liquid comprises the following steps:
s11, preparing deionized water, dividing the deionized water into two parts, taking one part of the deionized water for placement, and continuing the other part of the deionized water for the following steps;
s12, dividing the other part of deionized water into three parts, and respectively adding hydrogen peroxide, ammonium hydroxide and hydrogen fluoride;
and S13, connecting deionized water, hydrogen peroxide, ammonium hydroxide and hydrogen fluoride solution pipelines to different spraying ports of the spraying module respectively.
Through the above technical solution, in step S11: the deionized water is used to clean water, so as to avoid impurities in the water affecting the quality of the semiconductor wafer, and in step S12: a solution of hydrogen peroxide, ammonium hydroxide and hydrogen fluoride is prepared by adding hydrogen peroxide, ammonium hydroxide and hydrogen fluoride to deionized water, in step S13: the hydrogen peroxide, ammonium hydroxide and hydrogen fluoride solutions can be directly sprayed through different spraying ports, so that the spraying treatment of the surface of the semiconductor wafer is ensured: .
Based on the above, the prepared hydrogen peroxide, ammonium hydroxide and hydrogen fluoride solutions have the following concentrations: 28% -32%, 27% -30% and 20-25%.
Example two
The embodiment is an electroplating system for a semiconductor wafer capable of preventing offset;
as shown in fig. 2 to 6, the electroplating system includes a processing unit for processing a semiconductor wafer and moving the position of the semiconductor wafer, a processing unit, a holding unit provided inside the processing unit for holding and fixing the semiconductor wafer, a drying unit including a top drying unit 14, the top drying unit 14 being detachably provided at an output end of a moving support 15, the moving support 15 being provided at an output end of the moving unit for moving the position of the drying unit, and an electroplating module mounted on the moving support 15 after the top drying unit 14 is removed for moving the electroplating position under the action of the moving unit.
Based on the above, the electroplating system comprises the following specific pretreatment steps:
the method comprises the steps that firstly, a processing component is used for preprocessing a semiconductor wafer, floating dust and impurities outside the wafer are removed, namely, the semiconductor wafer is sufficiently processed by the preprocessing, and the semiconductor wafer is processed and the position of the semiconductor wafer is movably controlled by a processing device, so that the sufficient processing of the semiconductor wafer by a preprocessing liquid can be ensured;
the second step, the clamping component is arranged inside the processing device and used for clamping and fixing the semiconductor wafer, in order to enable the semiconductor wafer to be convenient for electroplating processing, the drying component comprises a top drying component 14, the top drying component 14 is detachably arranged at the output end of a movable supporting seat 15, the movable supporting seat 15 is arranged at the output end of the movable component and used for moving the position of the drying component, namely, the movable component can be used for moving the electric top drying component 14, so that the semiconductor wafer can be sufficiently dried;
and thirdly, electroplating under the action of an electroplating module, wherein the electroplating module is arranged on the movable supporting seat 15 after the top drying piece 14 is removed and is used for moving the electroplating position under the action of the movable component.
Specifically, as shown in fig. 3 and 4, the clamping component includes an inner connecting plate 12, an inner telescopic rod 13, a ladder support frame 7 and a limit clamping plate 8, the ladder support frame 7 is arranged in the processing shell 5 in a ladder shape, the limit clamping plate 8 is arranged on the lateral side of the ladder support frame 7 in a lateral movement manner, the processing shell 5 is of a hollow structure, the inner telescopic rod 13 is fixed in the processing shell 5, the inner connecting plate 12 is fixed at the end part of the inner telescopic rod 13, and the limit clamping plate 8 is fixed at the end part of the inner connecting plate 12.
Through the above technical scheme, be the echelonment and be provided with ladder support frame 7 in processing shell 5 inside, wherein ladder support frame 7 is used for selecting the ladder of corresponding size, places the semiconductor wafer and gets into, later is provided with spacing grip block 8 at ladder support frame 7 side lateral shifting for fix the semiconductor wafer, wherein in order to control the centre gripping of spacing grip block 8, utilizes the extension of inside telescopic link 13 afterwards, drives the extension of inside connecting plate 12 to utilize spacing grip block 8 to carry out the centre gripping to the semiconductor wafer.
Specifically, as shown in fig. 5, the treatment device comprises a spraying module, a rotating module and a mounting housing, wherein the rotating module comprises a rotating motor 17, a driving rotating shaft 18, a bottom supporting seat 16 and a waste liquid collecting box 19, the rotating motor 17 is fixed on the mounting housing, the mounting housing is fixed at a fixed position, the rotating motor 17 is in driving connection with the driving rotating shaft 18, the driving rotating shaft 18 is fixedly provided with the bottom supporting seat 16, the bottom supporting seat 16 is fixedly provided with the waste liquid collecting box 19, and the spraying module is arranged on the waste liquid collecting box 19.
Through above-mentioned technical scheme, utilize the module of spraying to spray pretreatment liquid, utilize the rotation module to drive the installation shell and wholly rotate, thereby can with the installation shell submergence in pretreatment liquid inside, fix rotation motor 17 on the installation shell, the installation shell is fixed in the fixed part, rotation motor 17 drive connection drive pivot 18, can drive pivot 18 promptly with rotation motor 17, and then make the drive fix the epaxial bottom sprag seat 16 of drive pivot 18 rotate, then utilize the rotation module to move, make the installation shell can be in the state of submerging in pretreatment liquid inside and rotating out constantly, thereby can utilize the flow of pretreatment liquid to take away the impurity on the semiconductor wafer, after handling, utilize the module of spraying to move, handle the bottom of semiconductor wafer, guarantee the clean degree of semiconductor wafer.
Based on the above, as shown in fig. 3, the spraying module comprises a spraying unit and a rotating unit, the rotating unit comprises a bottom motor 1, a bottom turntable 2, a connecting plate 3, a fixed supporting seat 4 and a treatment shell 5, the bottom motor 1 is fixed at the middle position of a waste liquid collecting box 19, the bottom motor 1 is connected with the bottom turntable 2 in a driving manner, the connecting plate 3 is fixed on the bottom turntable 2, the end part of the connecting plate 3 is fixed with the fixed supporting seat 4, and the end part of the fixed supporting seat 4 is fixed with the treatment shell 5.
Through above-mentioned technical scheme, utilize the rotation unit to drive processing apparatus and wholly rotate, increase the relative rotational speed of water and semiconductor wafer, be convenient for rivers erode semiconductor wafer surface, drive the rotation of bottom carousel 2 through bottom motor 1 to can drive processing shell 5 and rotate, guarantee to rotate the processing semiconductor wafer.
Based on the above, as shown in fig. 3, the spraying unit includes a water spraying support frame 11, a water spraying pipe 10 and a bottom water leaking screen 9, the water spraying pipe 10 is fixed at the bottom of the processing shell 5, and the water spraying pipe 10 is provided with a plurality of groups for connecting different processing liquids, the end of the water spraying pipe 10 is connected with the water spraying support frame 11, the water spraying support frame 11 is uniformly provided with a multi-angle spray head 6, the bottom water leaking screen 9 is arranged in the middle of the bottom of the processing shell 5, and the bottom water leaking screen 9 is concave downwards.
Through above-mentioned technical scheme, utilize multi-angle shower nozzle 6 to spray on the semiconductor wafer each angle, wherein in order to collect the pretreatment liquid that sprays out, be convenient for follow-up cyclic utilization, and bottom screen plate 9 that leaks is the undercut, can drop the pretreatment liquid inside waste liquid collection box 19 through bottom screen plate 9 that leaks, realize circulating hand and collect.
Based on the above, as shown in fig. 3 and 6, the multi-angle spray head 6 includes a water inlet pipe 22, an adjusting motor 21, a driving gear 20, a multi-angle spray head 24 and a driven gear 23, the water inlet pipe 22 is connected with the spray pipe 10, the end of the water inlet pipe 22 is connected with the multi-angle spray head 24, the driven gear 23 is fixed on the outside of the multi-angle spray head 24, the adjusting motor 21 is fixed inside the spray supporting frame 11, the driving gear 20 is connected in a driving manner by the adjusting motor 21, and the driven gear 23 is arranged on the side of the driving gear 20 in a meshed manner.
Through above-mentioned technical scheme, in order to guarantee the normal use of multi-angle shower nozzle 6, wherein multi-angle shower nozzle 24 is rotatable, utilizes adjustment motor 21 to drive gear 20 and rotates afterwards to drive driven gear 23 and rotate, and then make multi-angle shower nozzle 24 can rotate at any time, guarantee its pivoted scope.
Example III
The embodiment is a semiconductor wafer capable of preventing offset;
as shown in fig. 7, a semiconductor wafer capable of preventing offset includes a semiconductor wafer body 25, wherein the semiconductor wafer body 25 is composed of a wafer, an electroplated layer and a guard ring, and the semiconductor wafer body 25 is subjected to pretreatment processing by a pretreatment method and an electroplating system.
Through the above technical scheme, before processing, the semiconductor wafer body 25 is washed the surface through spraying pretreatment liquid, then avoids the semiconductor wafer to deviate through its guard ring of clamping part centre gripping, finally through drying treatment, accomplishes the preliminary treatment before electroplating, then electroplates the surface of semiconductor wafer body 25 with the electroplated layer through electroplating module, accomplishes electroplating.
The working principle of the invention is as follows: the steps with corresponding sizes are selected, the semiconductor wafer is placed and enters, the extension of the inner telescopic rod 13 is utilized to drive the extension of the inner connecting plate 12, the semiconductor wafer is clamped by the limiting clamping plate 8, the pretreatment liquid is placed under the whole treatment device, the rotation module is utilized to act, the installation shell can be immersed and rotated in the pretreatment liquid at any time, impurities on the semiconductor wafer can be taken away by utilizing the flow of the pretreatment liquid, and after the treatment is finished, the spray pipe 10 is utilized to enter different pretreatment liquids to treat the bottom of the semiconductor wafer.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (7)
1. The semiconductor wafer electroplating system capable of preventing deflection is characterized by comprising a processing part, a processing device, a clamping part, a drying part and an electroplating module, wherein the processing device is used for processing a semiconductor wafer and controlling the movement of the position of the semiconductor wafer, the clamping part is arranged inside the processing device and used for clamping and fixing the semiconductor wafer, the drying part comprises a top drying part (14), the top drying part (14) is detachably arranged at the output end of a movable supporting seat (15), the movable supporting seat (15) is arranged at the output end of a movable part and used for moving the position of the drying part, the electroplating module is arranged on the movable supporting seat (15) after the top drying part (14) is detached and used for moving the electroplating position under the action of the movable part,
the treatment device comprises a spraying module, a rotating module and a mounting shell, wherein the spraying module comprises a spraying unit and a rotating unit, the rotating unit comprises a bottom motor (1), a bottom turntable (2), a connecting plate (3), a fixed supporting seat (4) and a treatment shell (5), the bottom motor (1) is fixed at the middle position of a waste liquid collecting box (19), the bottom motor (1) is in driving connection with the bottom turntable (2), the connecting plate (3) is fixed on the bottom turntable (2), the fixed supporting seat (4) is fixed at the end part of the connecting plate (3), and the treatment shell (5) is fixed at the end part of the fixed supporting seat (4);
the clamping component comprises an inner connecting plate (12), an inner telescopic rod (13), a step support frame (7) and a limiting clamping plate (8), wherein the step support frame (7) is arranged in the processing shell (5) in a step shape, the limiting clamping plate (8) is arranged on the side edge of the step support frame (7) in a lateral movement mode, the processing shell (5) is of a hollow structure, the inner telescopic rod (13) is fixed in the processing shell (5), the inner connecting plate (12) is fixed at the end portion of the inner telescopic rod (13), and the limiting clamping plate (8) is fixed at the end portion of the inner connecting plate (12);
the method also comprises the following specific pretreatment steps of adopting an electroplating system to treat:
s1, preparing pretreatment liquid, connecting the pretreatment liquid with a spraying module, and spraying by using the spraying module;
s2, placing the semiconductor wafer in the processing device, and clamping by using a clamping component;
s3, placing the whole treatment device in the pretreatment liquid, and rotating the whole treatment device by using a rotating part;
s4, taking out the whole treatment device from the pretreatment liquid, turning the whole treatment device upside down, and pretreating the bottom of the semiconductor wafer by using a spraying module;
s5, the drying component dries the semiconductor wafer, and then electroplating is carried out by using the electroplating module.
2. The migration-preventing semiconductor wafer plating system according to claim 1, wherein the preparation of the pretreatment liquid comprises the steps of:
s11, preparing deionized water, dividing the deionized water into two parts, taking one part of the deionized water for placement, and continuing the other part of the deionized water for the following steps;
s12, dividing the other part of deionized water into three parts, and respectively adding hydrogen peroxide, ammonium hydroxide and hydrogen fluoride;
and S13, connecting deionized water, hydrogen peroxide, ammonium hydroxide and hydrogen fluoride solution pipelines to different spraying ports of the spraying module respectively.
3. The anti-migration semiconductor wafer plating system of claim 2, wherein the hydrogen peroxide, ammonium hydroxide and hydrogen fluoride solutions after preparation have respective concentrations of: 28% -32%, 27% -30% and 20-25%.
4. The system for electroplating a semiconductor wafer capable of preventing misalignment according to claim 1, wherein the electroplating system comprises the following pre-processing steps:
the method comprises the steps that firstly, a processing component is used for preprocessing a semiconductor wafer, floating dust and impurities outside the wafer are removed, namely, the semiconductor wafer is sufficiently processed by the preprocessing, and the semiconductor wafer is processed and the position of the semiconductor wafer is movably controlled by a processing device, so that the sufficient processing of the semiconductor wafer by a preprocessing liquid can be ensured;
the second step, the clamping part is arranged in the processing device and used for clamping and fixing the semiconductor wafer, in order to enable the semiconductor wafer to be convenient for electroplating processing, the drying part comprises a top drying part (14), the top drying part (14) is detachably arranged at the output end of the movable supporting seat (15), and the movable supporting seat (15) is arranged at the output end of the movable part and used for moving the position of the drying part, namely, the movable part can be used for moving the electric top drying part (14), so that the semiconductor wafer can be sufficiently dried;
and thirdly, electroplating under the action of an electroplating module, wherein the electroplating module is arranged on the movable supporting seat (15) after the top drying piece (14) is removed and is used for moving the electroplating position under the action of the movable part.
5. The system of claim 1, wherein the rotation module comprises a rotation motor (17), a driving shaft (18), a bottom support (16) and a waste liquid collection box (19), the rotation motor (17) is fixed on a mounting housing, the mounting housing is fixed at a fixed position, the rotation motor (17) is in driving connection with the driving shaft (18), the bottom support (16) is fixed on the driving shaft (18), the waste liquid collection box (19) is fixed on the bottom support (16), and the waste liquid collection box (19) is provided with a spraying module.
6. The system of claim 1, wherein the spray unit comprises a spray support (11), a spray pipe (10) and a bottom water leakage screen (9), the spray pipe (10) is fixed at the bottom of the processing housing (5), and the spray pipe (10) is provided with a plurality of groups for connecting different processing liquids, the spray pipe (10) is connected with the spray support (11) at the end, the spray support (11) is uniformly provided with a multi-angle spray head (6), the bottom water leakage screen (9) is arranged in the middle of the bottom of the processing housing (5), and the bottom water leakage screen (9) is concave downwards.
7. The system for electroplating a semiconductor wafer capable of preventing offset according to claim 6, wherein the multi-angle nozzle (6) comprises a water inlet pipe (22), an adjusting motor (21), a driving gear (20), a multi-angle spray head (24) and a driven gear (23), wherein the water inlet pipe (22) is connected with the water spraying pipe (10), the end part of the water inlet pipe (22) is connected with the multi-angle spray head (24), the driven gear (23) is fixed outside the multi-angle spray head (24), the adjusting motor (21) is fixed inside the water spraying support frame (11), the adjusting motor (21) is connected with the driving gear (20) in a driving mode, and the driven gear (23) is arranged on the side edge of the driving gear (20) in a meshed mode.
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| CN211376617U (en) * | 2019-11-18 | 2020-08-28 | 至微半导体(上海)有限公司 | Guide sheet clamping device for preventing wafer from shifting forwards and backwards |
| CN111446163A (en) * | 2020-03-27 | 2020-07-24 | 绍兴同芯成集成电路有限公司 | Wafer with edge stepped/gentle slope type protection ring and manufacturing method thereof |
| CN213321012U (en) * | 2020-08-26 | 2021-06-01 | 河南通用智能装备有限公司 | Wafer processing illumination positioning structure |
| CN214134979U (en) * | 2020-12-08 | 2021-09-07 | 洪泽县杰诚制管有限公司 | Titanium is clamping device for pipe processing with prevent titanium pipe deformation structure |
| CN112981482B (en) * | 2021-02-02 | 2022-05-13 | 无锡华友微电子有限公司 | Method for electroplating conductive material on semiconductor wafer |
| CN114351225B (en) * | 2021-03-18 | 2023-08-25 | 青岛惠芯微电子有限公司 | Electroplating hanger and electroplating device |
| CN214655335U (en) * | 2021-03-18 | 2021-11-09 | 青岛惠芯微电子有限公司 | Electroplating hanger and electroplating device |
| CN113337864A (en) * | 2021-06-28 | 2021-09-03 | 硅密芯镀(海宁)半导体技术有限公司 | Wafer cleaning device and wafer electroplating system comprising same |
| CN216288340U (en) * | 2021-08-16 | 2022-04-12 | 飞锃半导体（上海）有限公司 | Wafer storage box |
| CN215902303U (en) * | 2021-09-08 | 2022-02-25 | 江苏科沛达半导体科技有限公司 | Wafer preprocessing device |
| CN113789562A (en) * | 2021-10-21 | 2021-12-14 | 新阳硅密（上海）半导体技术有限公司 | Wafer electroplating pretreatment equipment, system and method |
| CN216585278U (en) * | 2021-10-21 | 2022-05-24 | 新阳硅密（上海）半导体技术有限公司 | Wafer electroplating pretreatment equipment and system |
| CN114197021A (en) * | 2021-11-04 | 2022-03-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Double-wafer film coating clamp |
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2022
- 2022-11-17 CN CN202211441268.XA patent/CN115896881B/en active Active
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