CN113337864A - Wafer cleaning device and wafer electroplating system comprising same - Google Patents
Wafer cleaning device and wafer electroplating system comprising same Download PDFInfo
- Publication number
- CN113337864A CN113337864A CN202110720663.0A CN202110720663A CN113337864A CN 113337864 A CN113337864 A CN 113337864A CN 202110720663 A CN202110720663 A CN 202110720663A CN 113337864 A CN113337864 A CN 113337864A
- Authority
- CN
- China
- Prior art keywords
- wafer
- liquid
- liquid containing
- driving
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a wafer cleaning device and a wafer electroplating system comprising the same, wherein the wafer cleaning device comprises a liquid conveying part, a liquid containing disc and a first driving part, the liquid conveying part can contain liquid for cleaning a wafer, a liquid conveying port of the liquid conveying part is aligned to the surface of the wafer, and the liquid in the liquid conveying part can flow to the wafer from the liquid conveying port; the liquid containing disc is arranged around the edge side of the wafer; the first driving part is connected with a wafer horizontally arranged and can drive the wafer to rotate along an axis. According to the invention, the waste water for cleaning the wafer can be thrown into the liquid containing disc through the rotation of the wafer, so that the wafer can be cleaned through the purest liquid all the time, the wafer is not in the liquid mixed with the electroplating liquid for a long time, the secondary utilization of the waste water for cleaning the wafer is effectively prevented, and the cleaning effect of the wafer is improved.
Description
Technical Field
The invention relates to the field of semiconductor processing, in particular to a wafer cleaning device and a wafer electroplating system comprising the same.
Background
In the process of carrying out the wafer electroplating process, in order to ensure the electroplating quality, the whole wafer needs to be soaked in the electroplating solution in the electroplating bath. After the electroplating is finished, a large amount of electroplating solution can exist on the surface of the wafer, the surface of the wafer needs to be cleaned by clear water, the electroplating solution attached to the surface of the wafer is completely cleaned, and the subsequent use of the wafer is not influenced.
In the prior art, a method for cleaning an electroplating solution attached to the surface of a wafer is to soak the wafer attached with the electroplating solution in a cleaning tank containing clean clear water for cleaning, the clear water after cleaning the wafer can be mixed with the electroplating solution attached to the wafer originally, and the purity of the clear water is deteriorated. In actual operation, the clean water used for cleaning one wafer can be used for continuously cleaning the next wafer and cannot be directly discarded, so that the purity of the clean water used for cleaning the subsequent wafer is lowered, the cleaning effect is poor, and the more the cleaning times are, the poorer the cleaning effect is. In addition, before the cleaning method is adopted, the wafer needs to be transported to the cleaning tank from a position close to the electroplating tank, and the whole process is complex.
Disclosure of Invention
The invention aims to overcome the defect of poor cleaning effect of a wafer in the prior art, and provides a wafer cleaning device and a wafer electroplating system comprising the same.
The invention solves the technical problems through the following technical scheme:
a wafer cleaning apparatus, comprising:
the liquid conveying part can contain liquid for cleaning the wafer, an infusion port of the liquid conveying part is aligned to the surface of the wafer, and the liquid in the liquid conveying part can flow to the wafer from the infusion port;
the liquid containing disc is arranged around the edge side of the wafer;
and the first driving part is connected with the horizontally arranged wafer and can drive the wafer to rotate along the axis.
In this embodiment, the liquid supply unit is used to supply a clean liquid to clean the plating solution adhering to the surface of the wafer. The liquid containing disc is used for containing waste liquid of the wafer to be cleaned, secondary utilization of the waste liquid is prevented, the purity of the liquid for cleaning the wafer is guaranteed, and the cleaning effect is improved. First drive division is used for the drive wafer rotatory for in the liquid containing disc can both be got rid of under the rotation of wafer to the attached plating solution originally on the wafer and the waste liquid of wasing the wafer, be favorable to the collection of waste liquid, prevent the pollution of waste liquid to other parts simultaneously. The liquid containing disc is arranged around the wafer, so that the liquid containing disc is arranged at each position in the circumferential direction of the wafer as far as possible, and liquid thrown out by the wafer in the rotating process can be thrown into the liquid containing disc. This scheme makes the waste water of wasing the wafer get rid of in the flourishing liquid dish through the rotation of wafer to can wash the wafer through purest liquid always, can not let the wafer be in for a long time in the liquid that has the plating solution, and effectively prevent to wash the reutilization of the waste water of wafer, improve the cleaning performance of wafer.
Preferably, the liquid containing disc is at least positioned below the wafer.
In this scheme, the waste liquid of throwing away from the wafer receives the influence of gravity can fall downwards, and above-mentioned setting is used for guaranteeing that the flourishing liquid dish can collect all waste liquids of throwing away from the wafer, improves wafer cleaning device's feasibility.
Preferably, the upper end surface of the liquid containing tray is recessed downwards to form a first shielding portion located on the radially inner side of the liquid containing tray, a second shielding portion located on the radially outer side of the liquid containing tray, and a liquid containing tank located between the first shielding portion and the second shielding portion, the first shielding portion and the second shielding portion form two side walls of the liquid containing tank, and the liquid containing tank is used for containing liquid used for cleaning the wafer.
In this scheme, above-mentioned setting makes to form the flourishing cistern that is used for holding the waste liquid on the flourishing liquid dish, can hold more numerous waste liquid on the one hand, and on the other hand also can restrict the waste liquid and flow out flourishing liquid dish easily, is favorable to the collection of waste liquid, prevents the pollution of waste liquid to other parts simultaneously.
Preferably, the height of the first shielding portion is smaller than the height of the second shielding portion.
In this scheme, first occlusion part designs into less value in order to make the waste liquid can pass first occlusion part and get rid of the liquid containing groove, and can not shelter from by first occlusion part, and the second occlusion part sets to great value is in order to prevent that the waste liquid that should get rid of in the liquid containing groove further gets rid of the scope in the liquid containing groove to be favorable to the collection of waste liquid, prevent the pollution of waste liquid to other parts simultaneously.
Preferably, the wafer cleaning device further comprises a second driving part, the second driving part is connected with the liquid containing disc, and the second driving part can drive the liquid containing disc to lift.
In this scheme, the second drive division is used for driving flourishing liquid dish and goes up and down, makes things convenient for the switching of flourishing liquid dish position, not only can adjust the relative height between flourishing liquid dish and the wafer piece, guarantees in the waste liquid can all get rid of flourishing liquid dish, accomodates the flourishing liquid dish that is in unoperated state moreover, reduces the space that flourishing liquid dish occupy to prevent flourishing liquid dish from interfering other parts.
Preferably, the number of the second driving parts is multiple, and the multiple second driving parts are uniformly arranged around the liquid containing disc.
In this scheme, above-mentioned setting can make each part atress of flourishing liquid dish even for the lift of flourishing liquid dish is more stable, prevents that the waste liquid in the flourishing liquid dish from leaking.
Preferably, the second driving part comprises a cylinder, the cylinder comprises a piston which extends and retracts in the lifting direction of the liquid containing disc, and a piston head of the piston is connected with the liquid containing disc.
In this scheme, provide a concrete structure of second drive division, cylinder simple structure can provide stable drive power, and flourishing liquid dish is connected with the piston and goes up and down according to the flexible of piston.
Preferably, the wafer cleaning device further comprises a control part, the control part is electrically connected with the first driving part, and the control part is used for controlling the rotation speed of the first driving part for driving the wafer to rotate.
In this scheme, the control unit is used for controlling the rotational speed of wafer for in the waste liquid on the wafer can all get rid of the flourishing liquid dish, improve wafer cleaning device's feasibility.
Preferably, the liquid containing tray is C-shaped, a water inlet is formed in the liquid containing tray, and the liquid infusion part penetrates through the water inlet and extends to the wafer.
In this scheme, above-mentioned setting makes infusion portion can not produce the interference with flourishing liquid dish, guarantees infusion portion and flourishing liquid dish's normal use, improves wafer cleaning device's feasibility.
A wafer electroplating system comprises the wafer cleaning device.
In the scheme, an application scene of the wafer cleaning device is provided, and the wafer cleaning device is used for cleaning the wafer subjected to the electroplating process.
Preferably, the wafer electroplating system further comprises an electroplating bath and a manipulator, the manipulator is arranged above the electroplating bath, the wafer is placed on the manipulator, and the manipulator can lift in the vertical direction and drive the wafer to enter and exit the electroplating bath;
the manipulator forms the first driving part and can drive the wafer to rotate along the axis, and the liquid containing disc is arranged on the edge side of the manipulator in a surrounding mode.
In this scheme, the manipulator originally just can drive the wafer rotatory in electroplating process, guarantees that the wafer electroplates more evenly, further regards the manipulator as first drive division, can need not set up solitary first drive division in addition, reduces the structure among the wafer electroplating system. Moreover, the manipulator directly serves as the first driving part, so that the process of transferring the wafer to other first driving parts can be omitted, a transfer device is not needed to be additionally arranged, the cleaning process is simplified, and the cleaning efficiency is improved.
Preferably, the liquid containing disc is arranged above the electroplating bath.
In this scheme, above-mentioned setting is arranged in preventing that the waste liquid from just falling the plating solution in the plating bath before still not getting into flourishing liquid dish, guarantees the purity of plating solution, guarantees the electroplating effect of wafer piece.
Preferably, the wafer electroplating system further comprises an operation table, the electroplating tank is mounted on the operation table, and a second driving part for driving the liquid containing disc to lift is fixed on the operation table.
In this scheme, the operation panel is used for supporting the second drive division, guarantees the stability of second drive division, and then guarantees that the flourishing liquid tray of second drive division stable drive goes up and down.
The positive progress effects of the invention are as follows: the liquid infusion part is used for providing clean liquid and cleaning the electroplating liquid attached to the surface of the wafer. The liquid containing disc is used for containing waste liquid of the wafer to be cleaned, secondary utilization of the waste liquid is prevented, the purity of the liquid for cleaning the wafer is guaranteed, and the cleaning effect is improved. First drive division is used for the drive wafer rotatory for in the liquid containing disc can both be got rid of under the rotation of wafer to the attached plating solution originally on the wafer and the waste liquid of wasing the wafer, be favorable to the collection of waste liquid, prevent the pollution of waste liquid to other parts simultaneously. The liquid containing disc is arranged around the wafer, so that the liquid containing disc is arranged at each position in the circumferential direction of the wafer as far as possible, and liquid thrown out by the wafer in the rotating process can be thrown into the liquid containing disc. According to the invention, the waste water for cleaning the wafer can be thrown into the liquid containing disc through the rotation of the wafer, so that the wafer can be cleaned through the purest liquid all the time, the wafer is not in the liquid mixed with the electroplating liquid for a long time, the secondary utilization of the waste water for cleaning the wafer is effectively prevented, and the cleaning effect of the wafer is improved.
Drawings
Fig. 1 is a schematic perspective view of a wafer electroplating system when a liquid containing tray is lifted according to an embodiment of the invention.
FIG. 2 is a schematic side view of a wafer plating system with a tray elevated according to an embodiment of the present invention.
Fig. 3 is a schematic perspective view of a wafer cleaning apparatus according to an embodiment of the invention.
Fig. 4 is a schematic perspective view of a liquid tray according to an embodiment of the invention.
FIG. 5 is a schematic perspective view of a wafer plating system with a liquid tray lowered according to an embodiment of the present invention.
FIG. 6 is a schematic side view of a wafer plating system with a lower tray according to an embodiment of the invention.
Description of reference numerals:
operation table 11
First shielding part 21
Second shielding part 22
Connecting part 25
First drive part 3
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.
The embodiment provides a wafer electroplating system, which is used for electroplating a wafer, cleaning the wafer after the electroplating process is completed, and removing electroplating solution attached to the surface of the wafer. As shown in fig. 1 to 6, the wafer plating system includes a station 11, a plating tank 12, a robot 13, and a wafer cleaning apparatus.
The plating tank 12 is mounted on the operation table 11, and the operation table 11 functions to support the plating tank 12. The plating vessel 12 contains a plating solution, and the wafer is immersed in the plating solution in the plating vessel 12 to be subjected to plating. The manipulator 13 is arranged above the electroplating bath 12, the manipulator 13 is provided with a bracket 131 for supporting the wafer, the manipulator 13 can ascend and descend in the vertical direction to drive the wafer on the bracket 131 to enter and exit the electroplating bath 12, and the manipulator 13 can also drive the wafer to rotate along the axis to ensure that the wafer is electroplated more uniformly.
As shown in fig. 1 to 4, the wafer cleaning apparatus includes a liquid-feeding section (not shown), a liquid-containing tray 2, and a first driving section 3. The infusion portion can contain liquid used for cleaning the wafer, an infusion port of the infusion portion is aligned to the surface of the wafer, the liquid in the infusion portion can flow to the wafer from the infusion port, the infusion portion is used for providing clean liquid, and electroplating liquid attached to the surface of the wafer is cleaned. The liquid containing disc 2 is arranged at the edge side of the wafer in a surrounding mode and used for containing waste liquid of the wafer to be cleaned, secondary utilization of the waste liquid is prevented, the purity of the liquid for cleaning the wafer is guaranteed, and the cleaning effect is improved. First drive division 3 is connected with the wafer that the level set up to can drive the wafer and rotate along the axis, make originally adnexed plating solution and wash the waste liquid of wafer can both get rid of flourishing liquid dish 2 under the rotation of wafer on the wafer in, be favorable to the collection of waste liquid, prevent the pollution of waste liquid to other parts simultaneously.
In this embodiment, because the wafer is placed horizontally, and the liquid containing disc 2 surrounds the edge side of the wafer, and the axis of the wafer is parallel to the axis of the liquid containing disc 2, therefore, in the process that the wafer rotates along the axis, the wastewater on the wafer can be thrown out uniformly to the radial outer side of the wafer, and then thrown into the liquid containing disc 2 located on the radial outer side of the wafer, thereby ensuring the feasibility of the wafer cleaning device. The liquid containing disc 2 is arranged around the wafer, so that the liquid containing disc 2 is arranged at each position in the circumferential direction of the wafer as far as possible, and the liquid thrown out by the wafer in the rotating process can be thrown into the liquid containing disc 2. In other alternative embodiments, the wafer may be placed non-parallel or not rotated along its own axis, but regardless of how the wafer is placed and rotated, it should be ensured that the waste liquid on the wafer is thrown into the liquid-holding tray 2 as completely as possible.
The rotation that this embodiment passed through the wafer makes the waste water of wasing the wafer can get rid of in flourishing liquid dish 2 to can wash the wafer through purest liquid always, can not let the wafer be in for a long time in the liquid that has the plating solution, and effectively prevent to wash the reutilization of the waste water of wafer, improve the cleaning performance of wafer.
The infusion portion in this embodiment includes the pipeline that is used for carrying liquid and is used for driving the driving piece that the interior liquid of pipeline flows, and the export of pipeline is the infusion mouth of infusion portion promptly, and the driving piece can drive the interior clean liquid flow direction wafer of pipeline, washs the attached plating solution on wafer surface. The specific structure of the driving member is the prior art in this field and will not be described herein.
As shown in fig. 1 and 2, the liquid containing tray 2 is located entirely below the wafer, and in other alternative embodiments, the liquid containing tray 2 may be flush with the wafer, or the two may have other relative positions, but at least it is necessary to ensure that the waste liquid on the wafer can fall into the liquid containing tray 2 as completely as possible to prevent the waste liquid from leaking. This embodiment is located the whole below of wafer with flourishing liquid dish 2, because the waste liquid that throws away from on the wafer receives the influence of gravity and can fall downwards, with the whole below that is located the wafer of flourishing liquid dish 2, can guarantee that flourishing liquid dish 2 can collect all waste liquids that throw away from on the wafer, prevents the leakage of waste liquid, improves wafer cleaning device's feasibility.
As shown in fig. 4, the upper end surface of the liquid containing tray 2 is recessed downward to form a first shielding portion 21 located on the radial inner side of the liquid containing tray 2, a second shielding portion 22 located on the radial outer side of the liquid containing tray 2, and a liquid containing tank 23 located between the first shielding portion 21 and the second shielding portion 22, the first shielding portion 21 and the second shielding portion 22 form two side walls of the liquid containing tank 23, and the liquid containing tank 23 is used for containing liquid used for cleaning the wafer. Design into the cell body structure with flourishing liquid dish 2, can hold more waste liquid on the one hand, on the other hand also can restrict the waste liquid and flow flourishing liquid dish 2 easily, is favorable to the collection of waste liquid, prevents the pollution of waste liquid to other parts simultaneously.
As shown in fig. 4, the height of the first shielding portion 21 is smaller than the height of the second shielding portion 22. In the embodiment, the first shielding portion 21 is designed to have a smaller value so that the waste liquid can be thrown into the liquid containing tank 23 through the first shielding portion 21, and cannot be shielded by the first shielding portion 21 and cannot enter the liquid containing tank 23, thereby improving the feasibility of the wafer cleaning device. The waste liquid passing through the first shielding portion 21 in this embodiment does not mean that the waste liquid passes directly through the first shielding portion 21, but means that the waste liquid passes through the liquid containing tank 23 from above the first shielding portion 21. The reason for setting the second shielding portion 22 to a large value is to prevent the waste liquid that should be thrown into the liquid tank 23 from being further thrown out of the liquid tank 23, thereby facilitating the collection of the waste liquid and preventing the pollution of the waste liquid to other components.
As shown in FIG. 4, the liquid containing tray 2 of the present embodiment is C-shaped, and both ends of the liquid containing tank 23 in the extending direction are closed to prevent the waste liquid in the liquid containing tank 23 from leaking. The liquid containing disc 2 is provided with a water inlet 24, and the infusion part penetrates through the water inlet 24 and extends to the wafer, so that the infusion part is prevented from interfering with the liquid containing disc 2, the normal use of the infusion part and the liquid containing disc 2 is ensured, and the feasibility of cleaning and cleaning the wafer is improved. In other alternative embodiments, the liquid-receiving disk can also be designed in a shape, for example, a circular ring.
In order to ensure that the waste liquid on the wafer can be completely thrown into the liquid containing disc 2, simulation operation needs to be performed in advance, the operation of spinning the wafer is simulated through a simulation system, the rotating speed of the wafer and the height difference between the wafer and the liquid containing disc 2 are correspondingly adjusted, and after the simulation is successful (namely in the simulation system, the waste water on the wafer can be completely thrown into the liquid containing disc 2), the rotating speed of the wafer and the height difference between the wafer and the liquid containing disc 2 are adjusted to be corresponding to each other in reality. The specific operation of the simulation system belongs to the prior art in the field, and is not described herein.
In order to adjust the rotation speed of the wafer and the height difference between the wafer and the liquid containing disc 2, the wafer cleaning device further comprises a control part (not shown in the figure) and a second driving part 4.
The control part is electrically connected with the first driving part 3 and is used for controlling the rotating speed of the first driving part 3 for driving the wafer to rotate, so that the waste liquid on the wafer can be thrown into the liquid containing disc 2 completely, and the feasibility of the wafer cleaning device is improved. The specific structure of the control unit and how to adjust the rotation speed of the wafer belong to the prior art in the field, and are not described herein.
As shown in fig. 3, the second driving part 4 is connected with the liquid containing tray 2, and the second driving part 4 can drive the liquid containing tray 2 to ascend and descend, so that the position of the liquid containing tray 2 can be switched conveniently. The second driving part 4 can adjust the relative height between the liquid containing disc 2 and the wafer, ensures that the waste liquid can be thrown into the liquid containing disc 2, and stores the liquid containing disc 2 in a non-working state, reduces the space occupied by the liquid containing disc 2, and prevents the liquid containing disc 2 from interfering other parts.
The quantity of second drive division 4 in this embodiment is two, and two 4 symmetries of second drive division set up in the both sides of flourishing liquid dish 2, guarantee that the whole atress of flourishing liquid dish 2 is even for flourishing liquid dish 2's lift is more stable, prevents that the waste liquid in the flourishing liquid dish 2 from leaking. In other alternative embodiments, the number of the second driving parts 4 may be one or more, and when the number of the second driving parts 4 is plural, the plural second driving parts 4 are uniformly arranged around the liquid containing tray 2, so that the liquid containing tray 2 is uniformly stressed as a whole.
As shown in fig. 3, the second driving part 4 in this embodiment includes a cylinder including a cylinder body 41 and a piston 42 that extends and contracts with respect to the cylinder body 41, the piston 42 extends and contracts in the direction in which the liquid containing tray 2 moves up and down, a head of the piston 42 is connected to the liquid containing tray 2, and the liquid containing tray 2 moves up and down according to the extension and contraction of the piston 42. In other alternative embodiments, the second driving portion 4 may adopt other lifting driving members capable of achieving the above-mentioned effects, and the cylinder is selected as the second driving portion 4 in this embodiment because the cylinder has a simple structure, and can provide a stable driving force, thereby ensuring that the liquid containing tray 2 is lifted stably.
As shown in fig. 1, 2, 5, and 6, the robot 13 in the present embodiment is provided with a first driving unit 3 capable of driving the wafer to rotate along the axis, and the liquid containing tray 2 is provided around the edge of the robot 13. Wherein, the axial line of the manipulator 13, the axial line of the wafer and the axial line of the liquid containing disc 2 are parallel. The manipulator 13 can drive the wafer to rotate in the electroplating process, so that the wafer is ensured to be electroplated more uniformly, the manipulator 13 is further used as the first driving part 3, the independent first driving part 3 is not required to be additionally arranged, and the structure in a wafer electroplating system is reduced. Moreover, the manipulator 13 directly used as the first driving part 3 can also save the process of transferring the wafer to other first driving parts 3, and a transfer device is not needed to be additionally arranged, so that the cleaning process is simplified, and the cleaning efficiency is improved.
As shown in fig. 1, 2, 5 and 6, the liquid containing tray 2 is disposed above the plating tank 12 to prevent waste liquid from falling into the plating solution in the plating tank 12 before entering the liquid containing tray 2, thereby ensuring purity of the plating solution and plating effect of the wafer. The liquid containing disc 2 and the mechanical arm 13 have a certain interval in the radial direction thereof so that the mechanical arm 13 can normally rotate, but the interval is not easy to be too large so as to prevent waste liquid on the wafer from falling into the electroplating bath 12 below from the interval and polluting the electroplating solution in the electroplating bath 12.
As shown in fig. 1, 2, 5 and 6, the second driving unit 4 is fixed to the console 11 and is located on opposite sides of the console 11. The operation panel 11 is used for supporting the second driving part 4, ensuring the stability of the second driving part 4, and further ensuring that the second driving part 4 can stably drive the liquid containing tray 2 to lift. Install second drive division 4 in the side of operation panel 11 and can enough reduce the space that second drive division 4 shared on the mesa of operation panel 11, also can guarantee second drive division 4's removal route for flourishing liquid dish 2 can descend to the mesa department that is close to operation panel 11, makes things convenient for taking in of flourishing liquid dish 2.
As shown in fig. 3, the liquid containing tray 2 further includes two connecting portions 25, the two connecting portions 25 are symmetrically disposed on two sides of the liquid containing groove 23, and the positions of the two connecting portions 25 are respectively connected with the positions of the two second driving portions 4. The connection 25 is connected between the second drive part 4 and the liquid tank 23, so that the liquid tank 23 can be designed without a large value. The connecting portion 25 in this embodiment is a flat plate structure, and has a simple structure and is convenient to manufacture and connect.
The wafer cleaning process is briefly described as follows:
as shown in fig. 5 and 6, after the completion of the plating process, the robot 13 is raised to move the wafer placed on the holder 131 of the robot 13 out of the plating tank 12, and a large amount of plating solution adheres to the surface of the wafer at this time. The piston 42 of the second driving member is in a contracted state, and the liquid containing disc 2 is in a retracted state, so that waste liquid cannot be completely collected.
As shown in fig. 1 and 2, after the manipulator 13 drives the wafer to rise to a specified position, the piston 42 extends out to drive the liquid containing disc 2 to rise to a corresponding height, so as to ensure that the height difference between the wafer and the liquid containing disc 2 is within a set range, then the mechanical head is adjusted to a set rotating speed, the wafer synchronously rotates along with the mechanical head, the liquid conveying part conveys liquid to the wafer to clean the wafer, and the cleaned waste water is thrown into the liquid containing disc 2 under the action of the rotating force. After the cleaning is finished, the waste water in the liquid containing disc 2 is collected and then is subjected to unified waste discharge treatment.
The wafer plating system according to the present invention is not limited to the form shown in fig. 1, 2, 5, and 6, and the wafer cleaning apparatus according to the present invention is also applicable to a wafer plating system having another structure, and can be used independently.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on normal use of the device or assembly, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or assembly referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the present invention.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.
Claims (13)
1. A wafer cleaning apparatus, comprising:
the liquid conveying part can contain liquid for cleaning the wafer, an infusion port of the liquid conveying part is aligned to the surface of the wafer, and the liquid in the liquid conveying part can flow to the wafer from the infusion port;
the liquid containing disc is arranged around the edge side of the wafer;
and the first driving part is connected with the horizontally arranged wafer and can drive the wafer to rotate along the axis.
2. The wafer cleaning apparatus as set forth in claim 1 wherein the liquid tray is located at least below the wafer.
3. The wafer cleaning apparatus as set forth in claim 1, wherein the upper end surface of the liquid tray is recessed downward to form a first shielding portion located radially inward of the liquid tray, a second shielding portion located radially outward of the liquid tray, and a liquid tank located between the first shielding portion and the second shielding portion, the first shielding portion and the second shielding portion forming two side walls of the liquid tank, the liquid tank being configured to contain liquid for cleaning the wafer.
4. The wafer cleaning device as set forth in claim 3, characterized in that the height of the first shielding portion is smaller than the height of the second shielding portion.
5. The wafer cleaning device as set forth in claim 1 further comprising a second driving part connected to the liquid containing tray, the second driving part being capable of driving the liquid containing tray to move up and down.
6. The wafer cleaning device as set forth in claim 5, wherein the number of the second driving portions is plural, and the plural second driving portions are uniformly arranged around the liquid containing tray.
7. The wafer cleaning apparatus as set forth in claim 5, wherein the second driving section includes a cylinder including a piston that extends and contracts in a direction in which the liquid containing tray is raised and lowered, and a head of the piston is connected to the liquid containing tray.
8. The wafer cleaning apparatus as set forth in claim 1, further comprising a control section electrically connected to the first driving section, the control section being configured to control a rotation speed at which the first driving section drives the wafer to rotate.
9. The wafer cleaning apparatus as set forth in any one of claims 1 to 8, wherein the liquid containing tray is C-shaped, the liquid containing tray is formed with a water inlet through which the liquid feeding portion extends toward the wafer.
10. A wafer plating system comprising the wafer cleaning apparatus as recited in any one of claims 1 to 9.
11. The wafer plating system of claim 10, further comprising a plating bath and a robot, wherein the robot is disposed above the plating bath, the wafer is placed on the robot, and the robot is capable of being lifted in a vertical direction and driving the wafer into and out of the plating bath;
the manipulator forms the first driving part and can drive the wafer to rotate along the axis, and the liquid containing disc is arranged on the edge side of the manipulator in a surrounding mode.
12. The wafer plating system of claim 11, wherein the drip tray is disposed above the plating bath.
13. The wafer plating system as claimed in claim 11, further comprising an operation table, wherein the plating tank is mounted on the operation table, and a second driving portion for driving the liquid containing tray to ascend and descend is fixed on the operation table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110720663.0A CN113337864A (en) | 2021-06-28 | 2021-06-28 | Wafer cleaning device and wafer electroplating system comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110720663.0A CN113337864A (en) | 2021-06-28 | 2021-06-28 | Wafer cleaning device and wafer electroplating system comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113337864A true CN113337864A (en) | 2021-09-03 |
Family
ID=77479278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110720663.0A Pending CN113337864A (en) | 2021-06-28 | 2021-06-28 | Wafer cleaning device and wafer electroplating system comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113337864A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115896881A (en) * | 2022-11-17 | 2023-04-04 | 安徽建筑大学 | Semiconductor wafer capable of preventing deviation, pretreatment method and electroplating system thereof |
| CN114182333B (en) * | 2021-12-24 | 2023-06-23 | 新阳硅密（上海）半导体技术有限公司 | Metal plating equipment and method for sharing wafer clamp |
-
2021
- 2021-06-28 CN CN202110720663.0A patent/CN113337864A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114182333B (en) * | 2021-12-24 | 2023-06-23 | 新阳硅密（上海）半导体技术有限公司 | Metal plating equipment and method for sharing wafer clamp |
| CN115896881A (en) * | 2022-11-17 | 2023-04-04 | 安徽建筑大学 | Semiconductor wafer capable of preventing deviation, pretreatment method and electroplating system thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113337864A (en) | Wafer cleaning device and wafer electroplating system comprising same | |
| JPH09299895A (en) | Streaming liquid scrubber cleaning and device therefor | |
| CN209810873U (en) | Full self-cleaning disinfection system of bacterin bottle | |
| CN215163232U (en) | Wafer cleaning device and wafer electroplating system comprising same | |
| CN207735274U (en) | A kind of rolling bearing steel ball surface cleaning device | |
| CN211420309U (en) | Gold and silver plating equipment capable of processing multiple groups | |
| US20030070932A1 (en) | Plating apparatus and plating method | |
| CN103628105A (en) | Electroplating device | |
| JP2011094193A (en) | Carrier type plating equipment | |
| CN217070026U (en) | Reaction cup washing mechanism | |
| CN215727195U (en) | Multi-station production line for immunohistochemical and HE (high-temperature) atomization dyeing mounting | |
| CN214271103U (en) | Active rotary electrolytic polishing equipment | |
| CN214896212U (en) | Wafer photoresist removing device | |
| CN112405339A (en) | Temporary storage placing system for polishing silicon wafers | |
| CN212494301U (en) | Double-throwing machine carrier cleaning equipment | |
| CN114525205A (en) | Automatic liquid changing device for cell culture | |
| CN115718023A (en) | Multi-station production line for immunohistochemical and HE (high-temperature) atomization dyeing mounting | |
| CN212483596U (en) | Chemiluminescence cleaning and incubating device | |
| CN112509945A (en) | Wafer processing system and wafer electroplating method | |
| CN217084395U (en) | Automatic proportioning device of dyeing reagent | |
| CN213889548U (en) | Semiconductor silicon chip polishing is with loading temporary storage mechanism | |
| CN217190503U (en) | Automatic source coating device for wafer | |
| CN208373660U (en) | A kind of new type superthin diagnosing chip surface cleaning apparatus | |
| CN219302378U (en) | Automatic titration device for electroplating solution | |
| CN215465731U (en) | Glue filling device for radio frequency connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |