TW329983U - Wafer having protection loop - Google Patents
Wafer having protection loopInfo
- Publication number
- TW329983U TW329983U TW086211944U TW86211944U TW329983U TW 329983 U TW329983 U TW 329983U TW 086211944 U TW086211944 U TW 086211944U TW 86211944 U TW86211944 U TW 86211944U TW 329983 U TW329983 U TW 329983U
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- protection loop
- loop
- protection
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086211944U TW329983U (en) | 1997-07-17 | 1997-07-17 | Wafer having protection loop |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086211944U TW329983U (en) | 1997-07-17 | 1997-07-17 | Wafer having protection loop |
Publications (1)
Publication Number | Publication Date |
---|---|
TW329983U true TW329983U (en) | 1998-04-11 |
Family
ID=54629993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086211944U TW329983U (en) | 1997-07-17 | 1997-07-17 | Wafer having protection loop |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW329983U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115896881A (en) * | 2022-11-17 | 2023-04-04 | 安徽建筑大学 | Semiconductor wafer capable of preventing deviation, pretreatment method and electroplating system thereof |
-
1997
- 1997-07-17 TW TW086211944U patent/TW329983U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115896881A (en) * | 2022-11-17 | 2023-04-04 | 安徽建筑大学 | Semiconductor wafer capable of preventing deviation, pretreatment method and electroplating system thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |