CN204424227U - A kind of wafer surface metal-stripping system - Google Patents
A kind of wafer surface metal-stripping system Download PDFInfo
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- CN204424227U CN204424227U CN201520114206.7U CN201520114206U CN204424227U CN 204424227 U CN204424227 U CN 204424227U CN 201520114206 U CN201520114206 U CN 201520114206U CN 204424227 U CN204424227 U CN 204424227U
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Abstract
A kind of wafer surface metal-stripping system, in order to the metal on removed wafer surface, this system is made up of service area and upper and lower section, it is characterized in that: described service area is by contact stripping off device, high pressure removal device, manipulator, described contact stripping off device, by enter film volume, lower saddle weight, microscope carrier, guide rail, membrane roll up form; Described high pressure removal device, is made up of high-pressure liquid line, air blowing pipeline, rotation microscope carrier, wafer clamping apparatus, retracting device.Described upper and lower section comprises at least one slide glass frame.The system adopting the utility model to provide, can realize entire roboticized work, improve metal-stripping efficiency, decrease manpower consumption.
Description
Technical field
The utility model relates to a kind of wafer surface metal-stripping system, particularly relates to a kind of system of by different level, automatically Metal metal level and the photoresist lift off of LED wafer being got off.
Background technology
Existing semiconductor LED wafer Metal metal level and photoresist lift off, manual work mode is mostly adopted to carry out Metal metal level and photoresist lift off: to be specially and to adopt tunica albuginea to peel off Metal metal level, and this stripping mode can not peel off recovery noble metal completely, reclaiming refinement at follow-up noble metal can exist loss; In addition Metal metal level carries out photoresist lift off operation after peeling off, and adopts SF-M15 removing photoresistance liquid immersion way to remove the glue of wafer surface, then uses pure water rinsing clean; This part Metal metal level is difficult to reclaim, and causes precious metal losses.
Summary of the invention
Problem to be solved in the utility model is, provide a kind of can automated job, noble metal high-recovery wafer surface metal-stripping system, realize user's convenient and efficient operation metal level and the object of photoresist lift off.
For solving above technical problem, the utility model provides one can automatic upper and lower film, the system peeled off by different level, preliminary removed wafer surface metal-layer, further stripping metal layer and photoresist.It is characterized in that: this system is made up of upper and lower section, service area and manipulator; Described upper and lower section is provided with the slide glass frame of carrying slide glass dish, and slide glass dish has at least one first wafer slots; Described service area comprises contact stripping off device, high pressure removal device; Described contact stripping off device, by contact wafer surface, provides the viscosity suction being greater than adhesion between metal and wafer, tentatively realizes metal and peel off from wafer surface; Described flushing removal device, is impacted wafer surface by high-pressure fluid, realizes metal-stripping and photoresist lift off further; Described upper and lower section and service area, by manipulator, realize wafer transferring, work continuously.
Preferably, described viscosity suction is provided by tunica albuginea, utilizes tunica albuginea viscosity by metal-stripping.
Preferably, described contact stripping off device comprises into film volume, lower saddle weight, microscope carrier, guide rail, membrane volume.Described enter film volume tunica albuginea is provided, membrane rollback receives old film, reclaims precious metal by old film.
Preferably, the high-pressure fluid of described flushing removal device, be preferably SF-M15 and remove photoresist liquid, its main component is the mixed liquor of NMP, MEA, DMSO.
Preferably, described flushing removal device, by the relative sprinkler head angle of program control microscope carrier, rotating speed, high-pressure fluid impact velocity, thus by adjustment programme, improve metal-stripping efficiency.
Preferably, described screen pack, has fine hole, thus ensures that the solution after using passes through, and leaves metal fragment simultaneously, improves metal recovery rate, reduce production cost.
Preferably, there is the sucker of the number of wafers equaling single slide glass dish in described robot work face, captures wafer, realize wafer transferring by sucker.
The beneficial effects of the utility model include but not limited to:
Adopt wafer surface metal-stripping system of the present utility model, solve the problem in background technology, peel off by multiple-layer metal of the present utility model, improve the efficiency of metal-stripping, only wafer need be placed in slide glass frame and can complete metal-stripping voluntarily, save manpower, and due to be with retracting device, improve metal and solution recovery, reduce production cost.
Accompanying drawing explanation
Fig. 1 is the system in situ schematic view of the embodiment of the utility model.
Fig. 2 is the schematic diagram of section up and down of the embodiment of the utility model.
Fig. 3 is the slide glass frame position view of the embodiment of the utility model.
Fig. 4 is the contact stripping off device schematic diagram of the embodiment of the utility model.
Fig. 5 is the flushing removal device schematic diagram of the embodiment of the utility model.
Fig. 6 is the manipulator schematic diagram of the embodiment of the utility model.
Fig. 7 is the wafer of the band metal level of the embodiment of the utility model.
Fig. 8 is the wafer after the metal level of the embodiment of the utility model is peeled off.
Fig. 9 is the wafer completed after metal level and photoresist lift off of the embodiment of the utility model.
Accompanying drawing indicates: 1: wafer surface metal-stripping system; 2: section up and down; 21: slide glass frame; 22: slide glass dish; 23: the first wafer slots; 31: reference column; 32: location hole; 4: contact stripping off device; 41: enter film volume; 42: lower saddle weight; 43: guide rail; 44: microscope carrier; 45: membrane is rolled up; 46: the second wafer slots; 47: tunica albuginea; 5: rinse removal device; 51: high-pressure liquid line; 52: rotate microscope carrier; 53: retracting device; 54: screen pack; 55: rotary gemel; 56: rotating shaft; 6: manipulator; 61: mechanical arm; 62: sucker; 63: main shaft; 71: metal level; 72: photoresist; 73:P electrode; 74:N electrode; 75: substrate.
Embodiment
With preferred embodiment, the utility model is described in further detail by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic system of the present utility model are described schematically, and therefore it only shows the formation relevant with the utility model.Obviously; described embodiment is only the utility model part embodiment; instead of whole embodiments; based on the embodiment in the utility model; those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.It should be noted that, the word in the expression orientation in literary composition " on " D score only for describing the present embodiment in detail, do not limit content of the present utility model.
Embodiment
As shown in Figure 1, the present embodiment provides a kind of wafer surface metal-stripping system 1, and this system comprises upper and lower section 2, contact stripping off device 4, rinses removal device 5 and manipulator 6.
As shown in Figure 2, upper and lower section 2 comprises a slide glass frame 21, slide glass frame 21 can be fully loaded with two dish slide glass dishes 22, each slide glass dish 22 structure is consistent, slide glass dish 22 and slide glass frame 21 position by becoming the reference column 31 of three angular ranges to agree with location hole 32 as shown in Figure 3, slide glass dish 22 upper surface comprises 3 the first wafer slots 23, carries a wafer comprising substrate 75 as shown in Figure 7 by each first wafer slots 23.
As shown in Figure 4, contact stripping off device 4 is provided with into film volume 41, lower saddle weight 42, guide rail 43, microscope carrier 44, membrane volume 45; As shown in Figure 5, rinse removal device 5 to comprise high-pressure liquid line 51, rotate microscope carrier 52, retracting device 53, screen pack 54, rotary gemel 55, rotating shaft 56.
The sucker 62 connected by the mechanical arm 61 of Fig. 6 is rotated with main shaft 63, moves up and down, and realizes getting sheet, bottom sheet.
1) during operation, after wafer is placed in slide glass dish 22 by operator, suction vacuum is utilized to get sheet by the sucker 62 of manipulator 6, once by the wafer of 3 on slide glass dish 22 from upper and lower section 2, the second wafer slots 46, second wafer slots 46 surface be transported in contact stripping off device 4 on microscope carrier 44 comprises pore, and pore is connected with vacuum pump, the suction vacuum of opening the second wafer slots 46 is arranged, fixed wafer.
2) microscope carrier 44 passes through guide rail 43 under the drive of cylinder, from the muscle-setting exercise of Fig. 1 to lower saddle weight 42 and enter below the tunica albugineas that provide of film volume 41, lower saddle weight 42 moves straight down under cylinder drives, tunica albuginea is contacted with wafer surface metal level 71, lower saddle weight 42 rises, original position return by microscope carrier 44, and tunica albuginea is peeled off together with part metals.
3) manipulator 6 is by the wafer on microscope carrier 44, is transported on the rotation microscope carrier 52 of flushing removal device 5.Rinse removal device 5 by high-pressure liquid line 51, rotate rotary gemel 55 and rotating shaft 56 below microscope carrier 52 by program control to move, the angle, the relative position that make to rotate microscope carrier 52 and high-pressure fluid constantly change in the course of the work, carry out three-wheel flushing successively, first round pure water pipeline Multi-angle impact wafer, utilize pure water impulsive force to peel off metal level 71, after peeling off, effect as shown in Figure 8; Second takes turns removing photoresistance liquid pipeline uses SF-M15 blocking solution of delustering to peel off photoresist 72 and residual metal by high-pressure liquid line 51, and the main component of SF-M15 is the mixed liquor of NMP, MEA, DMSO; Third round, by after the first pure water rinsing of pure water pipeline, is dried up wafer by nitrogen pipeline nitrogen blowing, and P electrode 73 and the N electrode 74 of the rear wafer of process are out exposed.Metal after stripping is brought into retracting device 53 by high-pressure fluid, is filtered by screen pack 54, realizes metal and is separated with waste liquid.
4) by manipulator 6, the chip conveying peeled off as shown in Figure 8 is returned on the slide glass dish 22 of upper and lower section 2.Manipulator 6 gets chip conveying to be processed again to the microscope carrier 44 of contact stripping off device 4 from upper and lower section 2 subsequently.So far, wafer surface metal-stripping system 1 realizes circulating efficient removal wafer surface metal.Operator, by changing the wafer on slide glass dish 22, ensures circulation running, and periodic replacement membrane volume 45 and screen pack 54, realize metal recovery.
Claims (10)
1. a wafer surface metal-stripping system, comprise upper and lower section, service area and manipulator, it is characterized in that: described service area comprises contact stripping off device, rinses removal device, get sheet, bottom sheet by manipulator, the wafer of upper and lower section delivered to successively contact stripping off device and rinse operation on removal device.
2. wafer surface metal-stripping system according to claim 1, is characterized in that: described upper and lower section is provided with the slide glass frame of carrying slide glass dish, and slide glass dish is at least provided with first wafer slots, for placing wafer.
3. wafer surface metal-stripping system according to claim 1, is characterized in that: described contact stripping off device comprises into film volume, lower saddle weight, microscope carrier, guide rail, membrane volume, by contact wafer surface, provides viscosity suction to wafer surface.
4. wafer surface metal-stripping system according to claim 3, it is characterized in that: described microscope carrier comprises second wafer slots the same number of with the first wafer slots on slide glass dish, second wafer slots surface is provided with pore, and pore is connected with vacuum pump, carries out absorption fix wafer; Wafer is being delivered to below tunica albuginea by guide rail by microscope carrier, provides pressure by lower saddle weight to tunica albuginea and wafer, thus carries out contact stripping metal.
5. wafer surface metal-stripping system according to claim 1, is characterized in that: described flushing removal device, uses high-pressure fluid to impact wafer surface.
6. wafer surface metal-stripping system according to claim 1, is characterized in that: described flushing removal device comprises high-pressure liquid line, rotates microscope carrier and retracting device.
7. wafer surface metal-stripping system according to claim 6, is characterized in that: described high-pressure liquid line comprises pure water pipeline, removing photoresistance liquid pipeline and nitrogen pipeline.
8. wafer surface metal-stripping system according to claim 6, is characterized in that: the height of described rotation microscope carrier is controlled by the liftable rotating shaft be positioned at below it; Described rotation microscope carrier is controlled by the rotary gemel be positioned at below described rotation microscope carrier relative to the angle of high-pressure fluid line way outlet.
9. wafer surface metal-stripping system according to claim 6, is characterized in that: described retracting device comprises screen pack and devil liquor recovery pipe.
10. wafer surface metal-stripping system according to claim 1, is characterized in that: described robot work face is provided with sucker, captures wafer by sucker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520114206.7U CN204424227U (en) | 2015-02-17 | 2015-02-17 | A kind of wafer surface metal-stripping system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520114206.7U CN204424227U (en) | 2015-02-17 | 2015-02-17 | A kind of wafer surface metal-stripping system |
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| CN204424227U true CN204424227U (en) | 2015-06-24 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409717A (en) * | 2015-07-27 | 2017-02-15 | 沈阳芯源微电子设备有限公司 | Wafer metal-stripping and photoresist-stripping cleaning device |
| CN107017318A (en) * | 2015-09-25 | 2017-08-04 | 晶元光电股份有限公司 | Metal recovery equipment and method for recovering metal on surface of wafer by using metal recovery equipment |
| CN107469456A (en) * | 2016-06-07 | 2017-12-15 | 沈阳芯源微电子设备有限公司 | A kind of metal recovery system for tearing golden degumming process |
| CN108987537A (en) * | 2017-06-01 | 2018-12-11 | 山东浪潮华光光电子股份有限公司 | A kind of processing method of the more gold abnormalities of LED wafer |
| CN109212918A (en) * | 2018-09-04 | 2019-01-15 | 宁波润华全芯微电子设备有限公司 | A kind of surface metal and photoresist removal device |
| CN109560020A (en) * | 2018-09-27 | 2019-04-02 | 厦门市三安集成电路有限公司 | A kind of structures and methods using NMP steam removing chip metal film |
| CN112687591A (en) * | 2021-01-29 | 2021-04-20 | 合肥新汇成微电子有限公司 | Automatic film removing machine for wafer |
-
2015
- 2015-02-17 CN CN201520114206.7U patent/CN204424227U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409717A (en) * | 2015-07-27 | 2017-02-15 | 沈阳芯源微电子设备有限公司 | Wafer metal-stripping and photoresist-stripping cleaning device |
| CN107017318A (en) * | 2015-09-25 | 2017-08-04 | 晶元光电股份有限公司 | Metal recovery equipment and method for recovering metal on surface of wafer by using metal recovery equipment |
| CN107017318B (en) * | 2015-09-25 | 2020-03-06 | 晶元光电股份有限公司 | Metal recovery equipment and method for recovering metal on surface of wafer by using metal recovery equipment |
| CN107469456A (en) * | 2016-06-07 | 2017-12-15 | 沈阳芯源微电子设备有限公司 | A kind of metal recovery system for tearing golden degumming process |
| CN108987537A (en) * | 2017-06-01 | 2018-12-11 | 山东浪潮华光光电子股份有限公司 | A kind of processing method of the more gold abnormalities of LED wafer |
| CN108987537B (en) * | 2017-06-01 | 2020-08-14 | 山东浪潮华光光电子股份有限公司 | Processing method for LED wafer multi-gold abnormity |
| CN109212918A (en) * | 2018-09-04 | 2019-01-15 | 宁波润华全芯微电子设备有限公司 | A kind of surface metal and photoresist removal device |
| CN109560020A (en) * | 2018-09-27 | 2019-04-02 | 厦门市三安集成电路有限公司 | A kind of structures and methods using NMP steam removing chip metal film |
| CN112687591A (en) * | 2021-01-29 | 2021-04-20 | 合肥新汇成微电子有限公司 | Automatic film removing machine for wafer |
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