CN115346896A - Wafer cutting protection system - Google Patents

Wafer cutting protection system Download PDF

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Publication number
CN115346896A
CN115346896A CN202211003487.XA CN202211003487A CN115346896A CN 115346896 A CN115346896 A CN 115346896A CN 202211003487 A CN202211003487 A CN 202211003487A CN 115346896 A CN115346896 A CN 115346896A
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CN
China
Prior art keywords
wafer
pipe
spray pipe
cleaning
soaking
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Pending
Application number
CN202211003487.XA
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Chinese (zh)
Inventor
侯军
褚雨露
张楠
贺剑锋
李传友
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Zhejiang Aoshou Material Technology Co ltd
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Zhejiang Aoshou Material Technology Co ltd
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Application filed by Zhejiang Aoshou Material Technology Co ltd filed Critical Zhejiang Aoshou Material Technology Co ltd
Priority to CN202211003487.XA priority Critical patent/CN115346896A/en
Publication of CN115346896A publication Critical patent/CN115346896A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Abstract

The invention relates to a wafer cutting protection system which comprises dispensing coating equipment, glue layer curing equipment, cutting equipment and glue layer removing equipment, wherein the glue layer removing equipment comprises a soaking cleaning device and a rotary spraying cleaning device, a cleaning box body in the rotary spraying cleaning device is provided with a soaking cavity, a first flushing cavity and a second flushing cavity, gates are arranged between the soaking cavity and the first flushing cavity and between the first flushing cavity and the second flushing cavity, a first spray water pipe is arranged at the top of the soaking cavity, a first cleaning liquid spray pipe and a second spray water pipe are arranged at the top of the first flushing cavity, a second cleaning liquid spray pipe and a third spray water pipe are arranged at the top of the second flushing cavity, and a first nitrogen spray pipe is arranged at the top of the second flushing cavity. The invention solves the technical problems of low removal efficiency and poor removal effect of the wafer cutting protective coating.

Description

Wafer cutting protection system
Technical Field
The invention relates to a semiconductor processing device, in particular to a wafer cutting protection system, and belongs to the technical field of semiconductor cutting.
Background
Before the wafer is cut, the wafer needs to be transferred to an objective table of a spin coater, then a proper amount of protective liquid is dripped to the center position of the wafer, spin coating is started according to a set program, the wafer is transferred to an oven to be baked after uniform coating, the protective liquid is solidified to form a film and is cooled to room temperature, then the wafer is transferred to a cutter wheel cutting objective table to be cut, after cutting is completed, a temporary protective coating on the surface of the wafer needs to be removed, subsequent processes such as film expanding and sorting and chip inversion can be carried out, cleaning of the temporary protective coating of the wafer is a very critical step, after cutting is completed, the cleaning effect of the temporary protective coating of the wafer is achieved, the yield of a subsequent process is directly influenced, and if the condition that the temporary protective coating of the wafer cannot be completely cleaned, the subsequent process efficiency is greatly reduced.
However, the existing wafer cutting protective coating removing step is complex, the cleaning efficiency is low, the removing effect is not ideal, and how to remove the wafer cutting protective coating efficiently and thoroughly is a technical problem troubling technicians in the field.
Therefore, there is still a need for research and improvement of the wafer dicing protection system in the semiconductor cleaning equipment technology field, which is also a research focus and emphasis in the semiconductor cleaning equipment technology field at present and is the starting point of the present invention.
Disclosure of Invention
Based on the above defects and the technical problems of video memory, the technical problems to be solved by the present invention are: a wafer cutting protection system is provided to solve the technical problems of low removal efficiency and poor removal effect of a wafer cutting protection coating.
In order to solve the technical problem, the technical scheme of the invention is as follows: the wafer cutting protection system comprises glue dispensing and coating equipment, glue layer curing equipment, cutting equipment and glue layer removing equipment which are sequentially arranged, wherein the glue layer removing equipment comprises a soaking and cleaning device and a rotary spraying and cleaning device which are sequentially arranged, the rotary spraying and cleaning device comprises a support, a cleaning box body is fixedly arranged on the support, a cover plate is covered on the top of the cleaning box body, a lifting column which is driven by a first power mechanism and vertically ascends and descends is connected with a second power mechanism which drives the lifting column to rotate around a rotation center is arranged at the bottom of the cleaning box body, the lifting column penetrates through the bottom surface of the cleaning box body and stretches into the cleaning box body, a rotary disc is fixedly arranged at the top end of the lifting column, the lifting column is provided with a central through hole, a plurality of suckers are arranged on the upper surface of the rotary disc, all the suckers are communicated with the central through hole, and the bottom end of the lifting column is connected with a vacuum pump through a rotary joint; the cleaning box body is sequentially provided with a soaking cavity, a first washing cavity and a second washing cavity from bottom to top, soaking liquid medicine is contained in the soaking cavity, an ultrasonic generator is arranged in the soaking cavity, gates are arranged between the soaking cavity and the first washing cavity and between the first washing cavity and the second washing cavity, a first spray pipe is arranged at the top of the soaking cavity, a first drain pipe is arranged at the bottom of the soaking cavity, a first cleaning liquid spray pipe and a second spray pipe are arranged at the top of the first washing cavity, the second spray pipe is positioned above the first cleaning liquid spray pipe, a second drain pipe is arranged at the bottom of the first washing cavity, a second cleaning liquid spray pipe and a third spray pipe are arranged at the top of the second washing cavity, the third spray pipe is positioned above the second cleaning liquid spray pipe, a third drain pipe is arranged at the bottom of the second washing cavity, and a first nitrogen spray pipe is arranged above the third spray pipe, the first spray pipe is connected with the first cleaning liquid spray pipe, and the second spray pipe is connected with a second cleaning liquid storage tank.
The dispensing and coating equipment is preferably a spin coater, the glue layer curing equipment is preferably a baking box, the cutting equipment is preferably a wafer cutting machine, the equipment is mature products and can be directly purchased for use, and the description is omitted.
The cleaning tank is usually made of a corrosion-resistant material, such as polytetrafluoroethylene or stainless steel.
As an optimal technical scheme, the lifting column is connected with a second power mechanism for driving the lifting column to rotate around a rotation center, specifically, the lifting column is vertically rotatably installed on the lifting base and penetrates through the lifting base, the lifting base vertically slides through the guide slide rail, a first power mechanism is arranged below the lifting base, the first power mechanism is usually a hydraulic oil cylinder, a cylinder body of the hydraulic oil cylinder is fixed, a piston rod of the hydraulic oil cylinder is connected with the lifting base, and the lifting base drives the lifting column to synchronously lift. The rotation of lift post is through the drive of second power unit, and second power unit includes the rotating electrical machines of fixed mounting on the lift base, and fixed mounting has the driving gear on rotating electrical machines's the power output shaft, and fixed mounting has driven gear on the lift post, and driven gear and the coaxial setting of lift post, driving gear and driven gear mesh mutually, through rotating electrical machines's rotation, drive the rotation of lift post to the rotation and the lift mutually noninterfere of lift post.
Through the structure setting, can rotate simultaneously and go up and down to save man-hour, improved the cleaning efficiency.
As an optimal technical scheme, a plurality of airflow channels which are respectively communicated with the suckers and the central through hole are formed in the rotary disc, and all the suckers are communicated with the central through hole through the corresponding airflow channels.
Through the structure setting like this, when needs wash the wafer, with the wafer surface and the sucking disc laminating, start the vacuum pump, the sucking disc alright in order to adsorb the wafer, fixes the wafer on the gyration dish.
The ultrasonic generator can generate ultrasonic waves when the wafer is soaked, and can thoroughly clean the attachments on the surface of the wafer.
Wherein, the first nitrogen blowing pipe can be connected with a positive pressure nitrogen source, and hot nitrogen is generally adopted.
Through the structure, the soaking, the two-time washing and the drying operation of the wafer can be finished in the closed cleaning box body without being transferred in exposed air, so that the fine structure on the front surface of the wafer is effectively protected, foreign matters are prevented from falling to the front surface of the wafer to pollute the wafer, the cleaning effect of the temporary protective coating of the wafer is improved, and the cleaning efficiency is improved. In addition, the soaking liquid medicine, the first cleaning liquid and the second cleaning liquid are collected independently, so that cross contamination is avoided.
Further preferably, heating coils are arranged in the first cleaning liquid storage tank and the second cleaning liquid storage tank, so that the first cleaning liquid and the second cleaning liquid can meet the required washing temperature; furthermore, the first cleaning liquid storage tank and the second cleaning liquid storage tank are respectively provided with a stirring blade driven by a stirring motor, so that the temperature of the cleaning liquid in the storage tanks is uniform, and the optimal washing effect is achieved.
Through such structural arrangement, because the rotary spraying cleaning device the undermost layer has set up the soaking chamber, the wafer removes to the in-process that rotary spraying cleaning device detected through enlargiing detection device, if the coating that detects the wafer surface is not clear away, then needn't reuse soaking cleaning device again, and directly use the soaking chamber further soak can, and then improved the cleaning efficiency of wafer coating. If the wafer coating is detected to be removed, the wafer coating is not required to be continuously soaked in the soaking cavity, the first cleaning solution is directly sprayed and washed, and the cleaning efficiency of the wafer coating is further improved. In the wafer cutting protection system, as an improvement, the soaking and cleaning device comprises a steel structure frame, a soaking box body and a spraying box body are arranged in the steel structure frame, a walking frame driven by a walking power mechanism is arranged on the steel structure frame, a lifting basket driven by a hoisting power mechanism is arranged on the walking frame, the lifting basket corresponds to the soaking box body and the spraying box body in position, a plurality of clamping discs which are parallel to each other and arranged at intervals are fixedly arranged in the lifting basket, a plurality of clamping jaws used for clamping wafers are arranged on each clamping disc, and the axes of the clamping discs are perpendicular to the walking direction of the walking frame; and a fourth spray water pipe is arranged in the spray box body, and the spray direction of the fourth spray water pipe is consistent with the surface direction of the wafer.
Wherein, the soaking tank body is internally filled with soaking liquid medicine.
The steel structure frame is generally provided with a track, and the walking power mechanism comprises a driving roller which is driven by a walking motor and is arranged on the track in a rolling manner. Of course, according to the size and the actual demand of walking frame, also can set up a plurality of driven gyro wheels, will not be repeated herein.
The periphery of the lifting basket is provided with a plurality of circulation gaps so that liquid medicine can enter or flow out of the lifting basket, and technical personnel in the field of structures of the lifting basket can implement the lifting basket by referring to the prior art.
The wafer surface can be fully soaked, the effect of the liquid medicine is fully exerted, and the wafer surface is washed along with the reciprocating transverse movement of the lifting basket.
Furthermore, the bottom of the soaking box body in the soaking box body is provided with a nitrogen aeration pipe, the aeration pipe is a common component and comprises a micropore aeration pipe, a nanometer aeration pipe and the like, and the nitrogen aeration pipe can be purchased and used by a person skilled in the art as required and is not described herein again. The nitrogen aeration pipe can generate nitrogen bubbles in the liquid medicine to stir the liquid medicine, so that the liquid medicine can fully exert the effect on the protective layer on the surface of the wafer, and a better soaking effect is achieved.
And the fourth spray water pipe is connected with a purified water storage tank.
Wherein, through making the spray direction of fourth spray header is unanimous with wafer surface direction, can wash from the front and the back of the wafer side face of vertical placing and use the pure water to wash, washes and gets rid of the remaining liquid medicine on wafer surface, and fourth spray header is close to the inner wall that soaks the box to avoid interfering with lift basket each other. In the wafer cutting protection system, as an improvement, the hoisting power mechanism comprises a first rotating shaft and a second rotating shaft which are rotatably mounted on the traveling frame, the first rotating shaft and the second rotating shaft are arranged in parallel at intervals, the first rotating shaft is connected with the hoisting motor, the hoisting motor is fixedly mounted on the traveling frame, a first double-groove rope pulley and a second double-groove rope pulley are fixedly mounted on the first rotating shaft, a first rope pulley and a second rope pulley are fixedly mounted on the second rotating shaft, the first rope pulley corresponds to one of the first double-groove rope pulley, the second rope pulley corresponds to one of the second double-groove rope pulley, the first double-groove rope pulley, the second double-groove rope pulley, the first rope pulley and the second rope pulley respectively correspond to four corners of the lifting basket, a first steel wire rope is wound on one rope pulley of the first double-groove rope pulley, the other end of the first steel wire rope is fixed at the corresponding corner of the lifting basket, a second steel wire rope is wound on the other rope pulley of the first double-groove rope pulley, the second steel wire rope is fixed at the corresponding corner of the lifting basket after being wound on the first double-groove rope pulley, a third steel wire rope is fixed at the corresponding corner of the lifting basket, and a second steel wire rope pulley is wound at the corresponding corner of the fourth double-groove rope pulley, and the second steel wire rope is fixed at the corresponding corner of the position of the lifting basket, and the second rope pulley.
Through the structure setting, can use four wire rope of a elevator motor simultaneous drive, guaranteed four wire rope's synchronism to make the lift basket lift more steady.
In the wafer cutting protection system, as an improvement, a second nitrogen injection tube is arranged in the spraying box body and positioned at the top of the spraying box body, the second nitrogen injection tube is close to the inner wall of the spraying box body, and a plurality of nozzles facing the back of the wafer are arranged on the second nitrogen injection tube.
The second nitrogen blowing pipe is connected with a positive-pressure nitrogen source, hot nitrogen is usually used, all wafers clamped on the clamping disc can be dried one by one with purified water on the back of the wafer taken out continuously, and residual moisture on the back of the wafer is prevented from entering a downstream sucker.
Furthermore, in order to improve the blowing effect, two sets of fourth spray pipes with staggered upper and lower positions can be arranged in the soaking box body, the two sets of fourth spray pipes are respectively positioned on two opposite inner walls of the soaking box body, and the two sets of fourth spray pipes which are arranged oppositely can enable the surface of the wafer after soaking to be completely washed by residual liquid medicine. In the wafer cutting protection system, as an improvement, a plurality of waist-shaped grooves are arranged on the clamping disc in an annular array, the clamping jaws penetrate through the waist-shaped grooves and are slidably mounted in the waist-shaped grooves, clamping portions are arranged at the end portions, located on the front side of the clamping disc, of the clamping jaws, tensioning portions are arranged at the end portions, located on the back side of the clamping disc, of the clamping jaws, all the tensioning portions are connected together through elastic elements, each clamping jaw comprises a first half body and a second half body, connected together through fasteners, the first half body and the second half body are both of a T-shaped structure, the clamping portions are located on the first half bodies, and the tensioning portions are located on the second half bodies.
Wherein, the extending direction of each waist-shaped groove is along the radial direction of the circle, thereby playing a role of guiding.
Wherein, the elastic component usually is annular extension spring, or uses corrosion-resistant rubber elasticity strip, all tensioning portions are encircleed in proper order to the elastic component such as extension spring, and the wafer passes through the clamping jaw centre gripping under elastic component such as extension spring and fixes on the grip slipper, through such structural arrangement, can satisfy the use of the wafer of multiple diameter specification.
The first half body and the second half body are both in a T-shaped structure, namely a structure with a large end and a small end.
Wherein the clamping portion is located on the first half body, i.e. on the large end of the first half body; the tension is located on the second half, i.e. on the large end of the second half.
As a preferable technical scheme, the large end of the first half body abuts against the front face of the clamping disc, and the large end of the second half body abuts against the back face of the clamping disc. Through the structure setting, thereby the limiting effect is achieved.
The clamping jaw is divided into the first half body and the second half body by the fasteners such as screws, and the clamping jaw is convenient to manufacture, can only slide along the waist-shaped groove after being installed and cannot be separated from the waist-shaped groove, and is high in stability.
And a circulation gap is formed between the clamping part and the clamping disc, namely after the clamping jaw clamps the wafer, the circulation gap is reserved between the back of the wafer and the clamping disc, so that the back of the wafer can be soaked by the liquid medicine.
And the first half body is provided with a clamping part, and the clamping part is used for clamping the wafer, wherein the clamping part is used for clamping the wafer, and the clamping part is used for clamping the wafer.
Through foretell structure setting, thereby when using, respectively splendid attire appropriate amount soak the liquid medicine in the soaking box, place pending wafer in the clamping part of clamping jaw, utilize elastic element like extension spring's effort, fix the wafer on the grip slipper, a wafer is placed to every grip slipper, start elevator motor, place the lift basket in the soaking box, nitrogen gas aeration pipe begins the aeration, produce the nitrogen gas bubble, stir soaking the liquid medicine, start walking motor, drive the reciprocal sideslip of lift basket in the soaking box, about fifteen minutes can soak and accomplish, it is still better than traditional thirty minutes's soaking effect. And after soaking, starting a lifting motor, pulling out the lifting basket to soak the liquid medicine, starting a walking motor, moving the lifting basket into a spray box, starting a fourth spray pipe to spray purified water to the wafers in the lifting basket, flushing away the soaking liquid medicine on the surfaces of the wafers, then starting a second nitrogen injection pipe to inject hot nitrogen airflow to the back of the wafer on the outermost side, and drying the back of the wafer by the hot nitrogen airflow so as to enter the next process.
In the wafer cutting protection system, as an improvement, the gate comprises a gate plate fixed on the cleaning box body, an installation groove is formed in the gate plate, the width of the center of the installation groove is larger than the diameter of the rotary disc, a split telescopic joint is arranged in the installation groove, and a sealing strip is arranged between the periphery of the telescopic joint and the gate plate.
The shape of the mounting groove is matched with that of the telescopic joint, and the mounting groove can be generally in a step shape. In the wafer cutting protection system of the invention, as an improvement, the shutter plate is provided with a bulge part protruding upwards, and the mounting groove is opened in the bulge part.
Wherein, the flashboard is provided with a convex part which is convex upwards, so that a concave part is formed between the flashboard and the cleaning box body, and a drain valve is installed to discharge liquid. When the cleaning liquid is sprayed, the cleaning liquid is thrown to the inner wall of the cleaning box body by the rotary disc and flows into the concave part along the inner wall, so that the cleaning liquid is effectively prevented from being cross-polluted
Wherein, set up in the setting of bulge through the mounting groove, can be so that the position of telescopic joint is higher than the depressed part, avoided liquid to reveal to below cavity.
In the wafer cutting protection system, as an improvement, an arc-shaped groove matched with the lifting column is formed in the end part of the innermost layer of the telescopic joint.
Through the structural arrangement, when the two opposite telescopic joints are opened in a split mode, the rotary disc can enter the cavity above through the gap between the telescopic joints. When the two opposite telescopic joints are closed, the arc-shaped groove is attached to the lifting column to form sealing, so that cleaning liquid in the cavity is prevented from leaking to the cavity below, and cross contamination of the cleaning liquid is effectively avoided.
More preferably, the telescopic joint comprises a first joint body fixedly mounted on the gate plate, a second joint body is slidably mounted in the first joint body, a third joint body is slidably mounted in the second joint body, an arc-shaped groove matched with the lifting column is formed in the outer end of the third joint body, the first joint body is communicated with the second joint body, a plunger slidably mounted in the second joint body is fixedly mounted at the end of the third joint body, a third central cylinder is arranged in the third joint body, an oil through hole is formed in one end, far away from the plunger, of the third central cylinder, the other end of the third central cylinder penetrates through the plunger and extends into the second joint body, a second central cylinder is sleeved in the third central cylinder, a first central cylinder is sleeved in the second central cylinder, the first central cylinder is matched with the first joint body, a first working oil port communicated with the oil port is formed in the end of the first central cylinder, a second working oil port is communicated with an oil port of the reversing valve, the first working oil port is communicated with a reversing valve B of the reversing valve, an oil inlet of the reversing valve is connected with a T-way pipeline, and an oil return pipeline is connected with a T-way.
Through the structure setting, when first work hydraulic fluid port oil feed, the oil return of second work hydraulic fluid port, the third festival body withdrawal second festival body drives the second festival body withdrawal first festival body, has realized that the gate is opened. And when the second working oil port takes oil, the third section body and the second section body are pushed out by hydraulic oil, the gate is closed, the lifting column is plugged by the arc-shaped groove, and the bottom sealing of the cavity is realized.
Preferably, the first joint body, the second joint body and the third joint body are of a cavity structure with a square cross section, and are sequentially sleeved together, and a sealing rubber strip is arranged between every two adjacent joint bodies, so that hydraulic oil cannot be leaked.
Preferably, in order to improve the stability and accuracy of the sliding track of the telescopic joint, a third guide cylinder is arranged in the third section, the third guide cylinder and the third central cylinder are parallel to each other, one end of the third guide cylinder is fixed at one end of the third section, which is far away from the plunger, the other end of the third guide cylinder penetrates through the plunger and extends into the second section, a second guide cylinder is sleeved in the third guide cylinder and is matched with the second section, a first guide cylinder is sleeved in the second guide cylinder and is matched with the first section, and the end of the first guide cylinder is fixed at the end of the first section.
In the wafer cutting protection system, as an improvement, the first spray pipe, the first cleaning solution spray pipe, the second cleaning solution spray pipe, the third spray pipe and the first nitrogen gas spray pipe all extend into the cleaning box body, and the extending ends of the first spray pipe, the first cleaning solution spray pipe, the third spray pipe and the first nitrogen gas spray pipe are all hinged with a swing cylinder.
The cleaning device comprises a cleaning box body, a swing cylinder, a first cleaning liquid spray pipe, a second cleaning liquid spray pipe, a third cleaning liquid spray pipe and a first nitrogen gas spray pipe, wherein the cylinder body of the swing cylinder is hinged to the cleaning box body, a piston rod of the swing cylinder is hinged to the corresponding first spray pipe, the first cleaning liquid spray pipe, the second cleaning liquid spray pipe or the third spray pipe, and the first spray pipe, the first cleaning liquid spray pipe, the second cleaning liquid spray pipe, the third spray pipe and the first nitrogen gas spray pipe are all installed on the cleaning box body through self-aligning bearings.
Through the structural arrangement, the swing of the corresponding first spray header, the first cleaning liquid spray header, the second cleaning liquid spray header and the third spray header is realized through the pushing of the swing air cylinder.
Sealing elements are arranged between the first spray pipe, the first cleaning liquid spray pipe, the second cleaning liquid spray pipe, the third spray pipe, the first nitrogen injection pipe and the inner wall of the cleaning box body.
The sealing element is usually a rubber sealing sleeve, so that gaps between the corresponding first spray header, first cleaning liquid spray header, second cleaning liquid spray header, third spray header, first nitrogen injection pipe and cleaning box body can be sealed. The sealing sleeve is a common component, usually a corrugated sealing sleeve, and can be selected by a person skilled in the art according to needs, and is not described in detail herein.
Through the structure setting like this, first spray header, first washing liquid shower, second spray header, second washing liquid shower, third spray header and first nitrogen gas jetting pipe can be under swing cylinder's effect, and the operation of limit swing in wasing the box is accomplished when spraying or drying to wafer surface all-round, swings to gyration dish top position under swing cylinder effect. When spraying or drying is finished, the rotary disc needs to move upwards under the action of the lifting column, swings under the action of the swing cylinder, deviates the upwards moving track of the rotary disc, and avoids interference with the rotary disc.
In the wafer cutting protection system, as an improvement, a rotary pipe driven by a servo motor is rotatably mounted on the cleaning box body, the rotary pipe extends into the cleaning box body along the radial direction of the rotary disc, a sliding seat driven by a first cylinder is axially slidably mounted in the rotary pipe, a rhombic four-bar mechanism is mounted on one side, far away from the first cylinder, of the sliding seat, the four-bar mechanism comprises a first connecting bar, a second connecting bar, a third connecting bar and a fourth connecting bar which are sequentially hinged, a hinged point of the first connecting bar and the fourth connecting bar is hinged on the sliding seat, a second cylinder is mounted on the sliding seat, a hinged point of the second connecting bar and the third connecting bar is connected with a piston rod of the second cylinder, the second connecting bar and the third connecting bar are both provided with extending portions extending out of the hinged point, and the end portion of each extending portion is provided with a clamping portion.
Wherein, the servo motor can be connected with a rotary pipe through a gear pair transmission, and the rotary pipe can be normally arranged at the top position of the second flushing cavity.
The cylinder body of the second cylinder is fixedly arranged on the sliding seat, and the second cylinder and the first cylinder are positioned on the same side of the sliding seat.
Wherein, the clamping range of the clamping part is matched with the thickness of the wafer.
Through the structure setting like this, the automatic centre gripping upset of wafer not only can be realized to this structure, and under the effect of first cylinder, the lift orbit of opening the gyration dish can also be dodged to clamping portion moreover, has avoided interfering the gyration dish and has gone up and down, has replaced artifical upset wafer, has further improved the production efficiency of wafer. In the wafer cutting protection system, as an improvement, a limiting element for limiting the maximum stroke of the first air cylinder is arranged on the rotary pipe.
Wherein, the stop element can usually select to use the stop screw, the stop screw threaded connection is on the gyration pipe, the distance from the initial condition to the stop screw of first cylinder is less than the stroke of first cylinder, the stop screw has limited the biggest position that the first cylinder piston rod stretches out, when this position second cylinder promotes four-bar linkage, the effect of second cylinder 4 is acted on the stop screw, and not acted on the piston of first cylinder, therefore has protected the piston of first cylinder, has prolonged the life of first cylinder.
In the wafer cutting protection system, as an improvement, a compression spring arranged along the radial direction of the rotary pipe is arranged on the four-bar mechanism.
Through the arrangement of the compression spring, the acting force can act on the four-bar mechanism in time, the clamping part can be opened more quickly, and the radial acting force of the clamping part on the wafer is effectively avoided.
The specific operation principle and the process flow of the wafer cutting protection system are as follows: during operation, after the wafer is soaked in the soaking liquid medicine, the wafer is washed by pure water and the back of the wafer is dried, an operator opens the cover plate, a proper amount of the soaking liquid medicine is contained in the soaking cavity, the hydraulic oil cylinder pushes the lifting column to move upwards, the wafer to be treated is placed on the sucking disc, the vacuum pump is started to fix the wafer on the rotary disc, the lifting column moves downwards under the action of the hydraulic oil cylinder to block the cover plate, the cleaning box body is blocked, the rotary disc drives the wafer to sink into the soaking liquid medicine in the soaking cavity for soaking, after soaking, the lifting column drives the rotary disc to move upwards to a position below a first spray water pipe, the first spray water pipe is swung to the central position of the rotary disc by the swing cylinder and swings back and forth according to a certain swing amplitude, at the moment, the first spray water pipe starts to spray purified water, the lifting column moves upwards after the soaking liquid medicine residue is removed by washing, the wafer is transferred to the first washing cavity, closing the telescopic joint at the bottom of the first washing cavity, starting a rotary motor to drive the wafer to rotate, moving a first cleaning liquid spray pipe to the upper part of the wafer by a swing air cylinder, spraying and washing the surface of the wafer, opening a second liquid discharge pipe, allowing the washed first cleaning liquid to flow out and collect through the second liquid discharge pipe, after the first cleaning liquid is washed, swinging the first cleaning liquid spray pipe out of the central position without closing the rotary motor, swinging the second spray pipe to the central position, spraying purified water on the surface of the wafer, washing to remove the residue of the first cleaning liquid, discharging the first cleaning liquid remained in the first washing cavity through the second liquid discharge pipe, driving the wafer to move to the second washing cavity by a hydraulic oil cylinder, closing the telescopic joint at the bottom of the second washing cavity, swinging the second cleaning liquid spray pipe to the central position, spraying the second cleaning liquid on the surface of the wafer, and opening a third liquid discharge pipe at the moment, cleaning liquid is discharged and collected through a third liquid discharge pipe, after the cleaning is finished, purified water is sprayed on the surface of the wafer through a third spray pipe to wash and remove second cleaning liquid residues, after the cleaning is finished, the rotary motor drives the wafer to continuously rotate to throw off residual water drops on the front surface of the wafer, if the back surface of the wafer does not need to be cleaned, the first nitrogen injection pipe sprays nitrogen on the surface of the wafer to be dried, after the wafer is dried, the wafer can be taken out, if the back surface of some wafer products also need to be cleaned, and the front surface of the wafer products allows a sucking disc to adsorb, the rotary motor stops, the first air cylinder acts to push the sliding seat to move to the rotary disc, after the jaw part moves to the position of the wafer, the second air cylinder acts to push the four-bar mechanism to deform, two opposite jaw parts are combined to clamp the upper surface and the lower surface of the wafer, the vacuum pump stops sucking air, the sucking disc releases the wafer, the lifting column moves downwards for a certain distance, the servo motor is started, the rotary pipe drives the wafer to turn over for 180 degrees, the lifting column rises, the vacuum pump starts to pump air, the wafer is adsorbed by the sucking disc, the second cylinder pulls the four-bar linkage mechanism to deform, the clamp part opens, then the first cylinder pulls the sliding seat back, the lifting column moves downwards, the rotary motor starts to repeat the previous actions, the other surface of the wafer starts to continuously spray the first cleaning liquid and the second cleaning liquid, after the spraying and flushing are finished, the first nitrogen spraying pipe sprays nitrogen on the surface of the wafer for drying treatment, the third spraying water pipe deviates from the central position, the rotary motor stops, the cover plate is opened, the hydraulic oil cylinder drives the wafer to move upwards, the vacuum pump stops vacuumizing, an operator can take out the treated wafer, then put another wafer to be cleaned and continue to clean.
In order to reduce the labor intensity of an operator and improve the automation degree, a programmable controller or a microcomputer and other control units are usually used for controlling, and a temperature sensor and the like are arranged at a corresponding position so as to facilitate more accurate action instruction and temperature control and timely control related execution elements. And the pressure or the flow of the cleaning liquid spray pipe and the nitrogen gas spray pipe can be controlled independently so as to meet the use requirements of wafers with different specifications.
As described above, the present invention provides a wafer dicing protection system, which achieves a number of excellent technical effects through a unique structural design, including but not limited to:
after the technical scheme is adopted, the invention has the beneficial effects that:
(1) According to the embodiment of the invention, the soaking, the two-time washing and the drying of the wafer are completed in the closed cleaning box body, and the wafer does not need to be transferred in the exposed air, so that the wafer protective coating is effectively protected, the cleaning effect of the wafer protective coating is improved, the cleaning efficiency is improved, and the soaking liquid medicine, the first cleaning liquid and the second cleaning liquid are independently collected, so that the cross contamination is avoided.
(2) According to the embodiment of the invention, the first spray pipe, the first cleaning liquid spray pipe, the second cleaning liquid spray pipe, the third spray pipe and the first nitrogen gas spray pipe all penetrate through the cleaning box body, and the extending ends of the first spray pipe, the second cleaning liquid spray pipe, the third spray pipe and the first nitrogen gas spray pipe are all hinged with the swing cylinders, so that the operation while swinging is realized, the center position of a wafer can be accurately sprayed or dried, the center position can be timely moved away, and the interference with the lifting of a rotary disc is avoided.
(3) The flashboard is provided with the convex part protruding upwards, so that the concave part is formed between the flashboard and the cleaning box body, the mounting groove is formed in the convex part, the position of the expansion joint is higher than that of the concave part, and therefore the liquid drainage valve can be mounted to drain liquid.
(4) The soaking liquid medicine, the first cleaning liquid and the second cleaning liquid can be independently recovered and recycled, so that the use cost is saved.
(5) Because the rotary spraying cleaning device is provided with the soaking cavity at the lowest layer, the wafer moves to the rotary spraying cleaning device, if the coating on the surface of the wafer is detected not to be removed, the soaking cleaning device does not need to be reused, and the soaking cavity is directly used for further soaking, so that the cleaning efficiency of the wafer coating is improved, if the wafer coating is detected to be removed, the wafer coating does not need to be continuously soaked in the soaking cavity, the first cleaning solution is directly sprayed and washed, and the cleaning efficiency of the wafer coating is further improved.
(6) Because the rotary pipe is arranged on the cleaning box body, the rhombic four-bar mechanism is arranged in the rotary pipe, and the clamping parts are arranged on the four-bar mechanism, the automatic clamping and overturning of the wafer can be realized, and the clamping parts can also avoid the lifting track of the rotary disc under the action of the first air cylinder, so that the interference of the lifting of the rotary disc is avoided, the manual overturning of the wafer is replaced, and the production efficiency of the wafer is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.
FIG. 1 is a schematic structural diagram of a rotary spray cleaning device in an embodiment of the present invention;
FIG. 2 is a schematic view of a rotary disk according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a lock gate in the embodiment of the present invention;
FIG. 4 is a schematic top view of the structure of FIG. 3;
FIG. 5 is a schematic structural view of an expansion joint in an embodiment of the present invention;
FIG. 6 is a schematic view of a first cleaning solution spray pipe in an embodiment of the present invention in an in-use state;
FIG. 7 is a schematic view showing an installation structure of a rotary pipe in the embodiment of the present invention;
FIG. 8 is a schematic view of the clamping of the jaw portions in an embodiment of the present invention;
FIG. 9 is a schematic view of an embodiment of the present invention with the jaw portions open;
FIG. 10 is a schematic diagram illustrating a second cleaning solution spraying state in an embodiment of the present invention;
FIG. 11 is a schematic structural view of a soaking and cleaning device according to an embodiment of the present invention;
FIG. 12 is a schematic left side view of the structure of FIG. 11;
FIG. 13 is a schematic view of the structure of a chuck plate in the embodiment of the present invention;
FIG. 14 is a schematic left side view of the structure of FIG. 13;
FIG. 15 is a schematic view of the right side structure of FIG. 13;
FIG. 16 is an enlarged partial view of A in FIG. 13;
FIG. 17 is a schematic top view of the structure of FIG. 16;
FIG. 18 is a schematic view of the connection of the jaws in an embodiment of the invention;
wherein in fig. 1 to 18, each numerical reference refers to the following specific meanings, elements and/or components, respectively.
In the figure: 1. a bracket, 2, a cleaning box body, 201, a soaking cavity, 202, a first flushing cavity, 203, a second flushing cavity, 204, an ultrasonic generator, 3, a cover plate, 4, a lifting column, 401, a central through hole, 5, a lifting base, 6, a rotary disc, 601, an air flow channel, 7, a suction disc, 8, a hydraulic oil cylinder, 9, a driving gear, 10, a driven gear, 11, a rotary motor, 12, a rotary joint, 13, a first spray water pipe, 14, a first cleaning liquid spray pipe, 15, a second spray water pipe, 16, a second cleaning liquid spray pipe, 17, a third spray water pipe, 18, a gate, 1801, a gate plate 1802, a telescopic joint, 1803, a sealing strip, an arc-shaped groove, 1805, a first joint body, 1806, a second joint body, 1807, a third joint body, 1808, a third central cylinder, 1809, a second central cylinder, 1810, a first central cylinder, 1811, a plunger, 1812, a third guide cylinder, 1813, a second guide cylinder, 1814, a first guide cylinder, 1815, a first working oil port, 1816, a second working oil port, 1817, a protrusion, 1818, a recess, 19, a first drain pipe, 20, a second drain pipe, 21, a third drain pipe, 22, a self-aligning bearing, 23, a sealing element, 24, a swing cylinder, 25, a first cleaning solution storage tank, 26, a second cleaning solution storage tank, 27, a heating coil, 28, a stirring motor, 29, a stirring blade, 30, a revolving tube, 31, a servo motor, 32, a sliding seat, 33, a first cylinder, 34, a second cylinder, 35, a first connecting rod, 36, a second connecting rod, 37, a third connecting rod, 38, a fourth connecting rod, 39, a jaw portion, 40, a limit screw, 41, a steel structure frame, 42, a traveling frame, 43, a traveling, 44, a hoisting power mechanism, 45, a lifting basket, 46, a clamping disk, 4601, a type waist groove, 47. the device comprises clamping jaws, 4701, a first half body, 4702, a second half body, 4703, clamping parts, 4704, tensioning parts, 48, a soaking box body, 49, a nitrogen aeration pipe, 50, a fourth spray water pipe, 51, an extension spring, 52, an anti-falling limiting block, 53, a first nitrogen injection pipe, 54, a spray box body, 55 and a second nitrogen injection pipe.
Detailed Description
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present specification, the terms "front", "rear", "left", "right", "inner", "outer" and "middle" are used for the sake of clarity only, and are not intended to limit the scope of the present invention, and changes or modifications of the relative relationship between the terms and the corresponding parts are also regarded as the scope of the present invention without substantial changes in the technical contents.
The utility model provides a wafer cutting protection system, including the some coating equipment that sets gradually, glue line curing equipment, cutting equipment and glue line removal equipment, wherein, the coating equipment is preferably the spin coating machine to some coating, and glue line curing equipment is preferably toasts the case, and cutting equipment is preferably wafer cutting machine, and these equipment are ripe product, can directly purchase the use, no longer describe herein. The glue film removing equipment comprises a soaking cleaning device and a rotary spraying cleaning device which are sequentially arranged, as shown in fig. 1, the rotary spraying cleaning device comprises a support 1, a cleaning box body 2 is fixedly arranged on the support 1, the cleaning box body 2 is usually made of corrosion-resistant materials such as polytetrafluoroethylene or stainless steel, a cover plate 3 is sealed at the top of the cleaning box body 2, a lifting column 4 which is driven by a first power mechanism and vertically ascends and descends is arranged at the bottom of the cleaning box body 2, the lifting column 4 is connected with a second power mechanism which drives the lifting column 4 to rotate around a rotation center, specifically, the lifting column 4 is vertically rotated and arranged on a lifting base 5 and penetrates through the lifting base 5, the lifting base 5 vertically slides through a guide slide rail, a first power mechanism is arranged below the lifting base 5, the first power mechanism is usually a hydraulic oil cylinder 8, the cylinder body of the hydraulic oil cylinder 8 is fixed, the lifting base 5 is connected with a piston rod of the hydraulic oil cylinder 8, and the lifting base 5 drives the lifting column 4 to synchronously ascend and descend. The rotation of lift post 4 is through the drive of second power unit, second power unit includes rotary motor 11 of fixed mounting on lift base 5, fixed mounting has driving gear 9 on rotary motor 11's the power output shaft, fixed mounting has driven gear 10 on the lift post 4, driven gear 10 and the coaxial setting of lift post 4, driving gear 9 meshes with driven gear 10 mutually, rotation through rotary motor 11, drive the rotation of lift post 4, and the rotation of lift post 4 and the mutual noninterference that goes up and down, can go on simultaneously, save man-hour, the cleaning efficiency is improved. The lifting column 4 penetrates through the bottom surface of the cleaning box body 2 and extends into the cleaning box body 2, as shown in fig. 2, a rotary disc 6 is fixedly installed at the top end of the lifting column 4, the lifting column 4 is provided with a central through hole 401, a plurality of suction cups 7 are arranged on the upper surface of the rotary disc 6, a plurality of airflow channels which are respectively communicated with the suction cups 7 and the central through hole 401 are formed in the rotary disc 6, all the suction cups 7 are communicated with the central through hole 401 through the corresponding airflow channels, the bottom end of the lifting column 4 is connected with a vacuum pump through a rotary connector 12, when a wafer needs to be cleaned, the surface of the wafer is attached to the suction cups 7, the vacuum pump is started, the suction cups 7 can adsorb the wafer and fix the wafer on the rotary disc 6, the cleaning box body 2 is sequentially provided with a soaking cavity 201, a first flushing cavity 202 and a second flushing cavity 203 from bottom to top, soaking liquid medicine liquid is filled in the soaking cavity 201, an ultrasonic generator 204 is arranged in the soaking cavity 201, the ultrasonic generator 204 can generate ultrasonic waves when the wafer is soaked, the wafer so as to thoroughly clean attachments on the surface of the wafer, a first soaking cavity 201 and the first flushing cavity 202, a row of a gate 18 is arranged between the soaking pipe 201 and the first flushing cavity 202, and the bottom of the soaking pipe 13 is arranged between the first flushing cavity 202; the top of first washing chamber 202 is equipped with first washing liquid shower 14 and second spray header 15, second spray header 15 is located the top of first washing liquid shower 14, the bottom of first washing chamber 202 is equipped with second fluid-discharge tube 20, the top of second washing chamber 203 is equipped with second washing liquid shower 16 and third spray header 17, third spray header 17 is located the top of second washing liquid shower 16, the bottom of second washing chamber 203 is equipped with third fluid-discharge tube 21, the top of second washing chamber 303 is located the top of third spray header 17 and is equipped with first nitrogen gas jetting pipe 53, first nitrogen gas jetting pipe 53 connects malleation nitrogen gas source, adopt hot nitrogen gas usually.
The soaking, the two-time washing and the drying of the wafer are all completed in the closed cleaning box body 2, and the wafer does not need to be transferred in exposed air, so that the fine structure of the front surface of the wafer is effectively protected, foreign matters are prevented from falling to the front surface of the wafer to pollute the wafer, the cleaning effect of a temporary protective coating of the wafer is improved, the cleaning efficiency is improved, and the soaking liquid medicine, the first cleaning liquid and the second cleaning liquid are independently collected, so that the cross contamination is avoided. First washing liquid shower 14 connects first washing liquid storage tank 25, and second washing liquid shower 16 connects the second washing liquid storage tank, all is equipped with heating coil 27 in first washing liquid storage tank 25 and the second washing liquid storage tank 26 for first washing liquid and second washing liquid can satisfy required washing temperature, all be equipped with in first washing liquid storage tank 25 and the second washing liquid storage tank 26 by agitator motor 28 driven stirring vane 29, make the washing liquid temperature in the storage tank even, in order to reach best washing effect.
Because the soaking cavity 201 is arranged at the lowest layer of the rotary spraying cleaning device, when the wafer is moved to the rotary spraying cleaning device, detection is carried out through the amplification detection device, if the coating on the surface of the wafer is detected not to be removed, the soaking cleaning device does not need to be reused, the soaking cavity is directly used for further soaking, the cleaning efficiency of the wafer coating is further improved, if the wafer coating is detected to be removed, the wafer coating does not need to be continuously soaked in the soaking cavity 201, the first cleaning solution is directly sprayed and washed, and the cleaning efficiency of the wafer coating is further improved.
As shown in fig. 3 and fig. 4, the gate 18 includes a gate plate 1801 fixed on the cleaning box 2, the gate plate 1801 is provided with a mounting groove, the width of the central position of the mounting groove is larger than the diameter of the rotary plate 6, a split telescopic joint 1802 is arranged in the mounting groove, the shape of the mounting groove is adapted to the shape of the telescopic joint 1802, the mounting groove is generally in a step shape, a sealing strip 1803 is arranged between the periphery of the telescopic joint 1802 and the gate plate 1801, an arc-shaped groove 1804 adapted to the lifting column 4 is arranged at the innermost end of the telescopic joint 1802, when two opposite telescopic joints 1802 are split, the rotary plate 6 can enter the upper cavity through the gap between the telescopic joints 1802, when the two opposite telescopic joints 1802 are closed, the arc-shaped groove 1804 is attached to the lifting column 4 to form a seal, so as to prevent the cleaning liquid in the cavity from leaking to the lower cavity, thereby effectively preventing the cross contamination of the cleaning liquid, the gate plate 1801 is provided with an upward convex portion 1817, so that a concave portion 1818 is formed between the gate plate 1801 and the cleaning box 2, so as to facilitate the installation of the valve to discharge the liquid, the convex portion 1817, so that the cleaning liquid can not be leaked from the inner wall of the concave portion 1818 along the inner wall of the telescopic joint 1818, and the cleaning liquid can be prevented from being polluted by the cleaning liquid, when the cleaning liquid, and the cleaning liquid can be effectively prevented from the inner wall of the rotary plate 1802, and the cleaning box 1802, and the cleaning liquid. Specifically, as shown in fig. 5, the telescopic joint 1802 includes a first joint body 1805 fixedly installed on the gate plate 1801, a second joint body 1806 is slidably installed in the first joint body 1805, a third joint body 1807 is slidably installed in the second joint body 1806, an arc-shaped groove 1804 adapted to the lifting column 4 is provided at an outer end of the third joint body 1807, the first joint body 1805 is communicated with the second joint body 1806, a plunger 1810 slidably installed in the second joint body 1806 is fixedly installed at an end of the third joint body 1807, a third central cylinder 1808 is provided in the third joint body 1807, an oil through port is provided at one end of the third central cylinder 1808 far from the plunger 1811, the other end of the third central cylinder 1808 penetrates through the plunger 1811 and extends into the second joint body 1806, a second central cylinder 1809 is installed in the third central cylinder 1808, the second central cylinder 1809 is adapted to the second joint body 1806, a first central cylinder is installed in the second central cylinder 1809, the first center cylinder 1810 is matched with the first section body 1805, a first working oil port 1815 connected with an oil port is arranged at the end of the first center cylinder 1810, a second working oil port 1816 is arranged at the end of the first section body 1805, the second working oil port 1816 is communicated with an oil port A of the reversing valve, the first working oil port 1815 is communicated with an oil port B of the reversing valve, an oil port P of the reversing valve is connected with an oil inlet pipeline, an oil port T of the reversing valve is connected with an oil return pipeline, when the first working oil port 1815 takes oil, the second working oil port 1816 returns oil, the third section body 1807 retracts into the second section body 1806, the second section body 1806 is driven to retract into the first section body 1805, the opening of the gate 18 is realized, when the second working oil port 1816 takes oil, hydraulic oil pushes out the third section body 1807 and the second section body 1806, the gate 18 is closed, the arc-shaped groove 1804 plugs the lifting column 4, and the bottom sealing of the cavity is realized.
Here, the first section 1805, the second section 1806, and the third section 1807 are preferably of a cavity structure with a square cross section, and are sequentially sleeved together, and a sealing rubber strip is arranged between two adjacent sections, so that hydraulic oil cannot leak.
In order to improve the smoothness and accuracy of the sliding track of the telescopic joint 1802, a third guide cylinder 1812 is arranged in the third section 1807, the third guide cylinder 1812 and the third center tube 1808 are parallel to each other, one end of the third guide cylinder 1812 is fixed at one end of the third section 1807, which is far away from the plunger 1811, the other end of the third guide cylinder 1812 penetrates through the plunger 1811 and extends into the second section 1806, a second guide cylinder 1813 is sleeved in the third guide cylinder 1812, the second guide cylinder 1813 is matched with the second section 1806, a first guide cylinder 1814 is sleeved in the second guide cylinder 1813, the first guide cylinder 1814 is matched with the first section 1805, the end of the first guide cylinder 1814 is fixed at the end of the first section 1805, and the first guide cylinder 1814, the second guide cylinder 1813 and the third guide cylinder 1812 which are sleeved together play a good guiding role, so that the telescopic joint 1802 is prevented from being inclined and blocked in the extending or retracting process, and the telescopic joint 1802 is more smooth.
As shown in fig. 6, the first spray pipe 13, the first cleaning solution spray pipe 14, the second spray pipe 15, the second cleaning solution spray pipe 16, the third spray pipe 17 and the first nitrogen spray pipe 53 all extend into the cleaning tank 2, the extending ends of the first spray pipe 13, the third spray pipe 17 and the first nitrogen spray pipe 53 are all hinged with one swing cylinder 24, the cylinder body of the swing cylinder 24 is hinged on the cleaning tank 2, the piston rod of the swing cylinder 24 is hinged on the corresponding first spray pipe 13, the first cleaning solution spray pipe 14, the second spray pipe 15, the second cleaning solution spray pipe 16 or the third spray pipe 17, the first spray pipe 13, the first cleaning solution spray pipe 14, the second spray pipe 15, the second cleaning solution spray pipe 16, the third spray pipe 17 and the first nitrogen spray pipe 53 are all mounted on the cleaning tank 2 through a self-aligning bearing 22, and the swing of the swing cylinder 24 realizes the corresponding swing of the first spray pipe 13, the first cleaning solution spray pipe 14, the second spray pipe 15, the second cleaning solution spray pipe 16 and the third spray pipe 17, the swing of the first spray pipe 13, the second spray pipe 13, the third spray pipe 17, the inner walls of the first spray pipe 13, the second spray pipe 14, the second cleaning solution spray pipe 23 and the second spray pipe 17 are all provided with the cleaning solution spray pipe 23, the inner walls of the second spray pipe 23, the third spray pipe 17, and the cleaning solution spray pipe 23, and the inner walls of the cleaning tank 2. The sealing element 23 is usually a rubber sealing sleeve, and seals the gap between the corresponding first spray header 13, first cleaning solution spray header 14, second spray header 15, second cleaning solution spray header 16, third spray header 17, first nitrogen gas spray header 53 and cleaning box body 2, and this sealing sleeve is a common component, usually a corrugated sealing sleeve, and those skilled in the art can select and use the sealing sleeve as required, and will not be described herein.
First spray header 13, first washing liquid shower 14, second spray header 15, second washing liquid shower 16, third spray header 17 and first nitrogen gas injection pipe 53 can be under the effect of swing cylinder 24, the operation of limit swing in wasing box 2, when having realized that all-round spraying or stoving to the wafer surface, swing to gyration dish 6 top position under the effect of swing cylinder 24, when spraying or stoving end, gyration dish 6 need move up under the effect of lift column 4, swing under the effect of swing cylinder 24, the orbit that moves up of skew gyration dish 6, avoid taking place to interfere with gyration dish 6.
As shown in fig. 11 and fig. 12, the soaking and cleaning device includes a steel structural frame 41, a soaking tank 48 and a spraying tank 54 are disposed in the steel structural frame 41, the soaking tank 48 contains soaking liquid medicine, a traveling frame 42 driven by a traveling power mechanism 43 is disposed on the steel structural frame 41, a rail is generally disposed on the steel structural frame 41, the traveling power mechanism 43 includes a driving roller driven by a traveling motor and rolling-mounted on the rail, of course, a plurality of driven rollers may be disposed according to the size of the traveling frame 42, which is not described herein, a lifting basket 45 driven by a hoisting power mechanism 44 is mounted on the traveling frame 42, a plurality of circulation gaps are disposed around the lifting basket 45 to facilitate the liquid medicine to enter or flow out of the lifting basket 45, and the structure of the lifting basket 45 may be implemented by those skilled in the art with reference to the prior art, the lifting basket 45 corresponds to the positions of the soaking box 48 and the spraying box 54, a plurality of clamping discs 46 which are parallel to each other and arranged at intervals are fixedly arranged in the lifting basket 45, a plurality of clamping jaws 47 used for clamping wafers are arranged on each clamping disc 46, the axes of the clamping discs 46 are perpendicular to the walking direction of the walking frame 42, namely, the surfaces of the wafers are parallel to the walking direction of the walking frame 42, the resistance of the wafers during the transverse movement of the wafers in the liquid medicine is small, all the wafers correspondingly arranged on the clamping discs 46 can be washed by the liquid medicine, the clamping jaws 47 clamp the wafers and fix the wafers on the clamping discs 46, a plurality of wafers can be simultaneously placed in the lifting basket 45 and soaked, the wafers are fixed on the clamping discs 46 at intervals, the surface area of the wafers exposed in the liquid medicine is large, and the wafers can swing back and forth in the soaking box 48 along with the lifting of the lifting basket 45 and the transverse movement of the walking frame 42, thereby fully soaking the surface of the wafer, fully playing the role of the liquid medicine, and flushing the surface of the wafer along with the reciprocating transverse movement of the lifting basket 45.
As shown in fig. 13, 14 and 15, the clamping disk 46 is provided with a plurality of waist-shaped grooves 4601 in an annular array, the extending direction of each waist-shaped groove 4601 is along the radial direction of the circle, the clamping jaws 47 penetrate through the waist-shaped grooves 4601 and are slidably mounted in the waist-shaped grooves 4601, the waist-shaped grooves 4601 play a role of guiding, the ends of the clamping jaws 47 on the front surface of the clamping disk are provided with clamping parts 4703, the ends of the clamping jaws 47 on the back surface of the clamping disk 46 are provided with tensioning parts 4704, all the tensioning parts 4704 are connected together through elastic elements, the elastic elements are generally annular tension springs 51, or corrosion-resistant rubber elastic strips are used, the tension springs 51 sequentially surround all the tensioning parts 4704, the wafer is clamped and fixed on the clamping disk 46 through the clamping jaws 47 under the action of the tension springs 51, and the use of wafers with various diameter specifications can be met. As shown in fig. 16, 17 and 18, the clamping jaw 47 comprises a first half body 4701 and a second half body 4702 which are connected together by a fastener, wherein the first half body 4701 and the second half body 4702 are both T-shaped structures, i.e., a structure with a large end and a small end, wherein a clamping portion 4703 is positioned on the first half body 4701, i.e., on the large end of the first half body 4701, a tensioning portion 4704 is positioned on the second half body 4702, i.e., on the large end of the second half body 4702, the large end of the first half body 4701 abuts against the front surface of the clamping disk 46, the large end of the second half body 4702 abuts against the back surface of the clamping disk 46 to play a limiting role, the small ends of the first half body 4701 and the second half body 4702 both slide in the kidney-shaped slot 4601 and are connected together by a fastener such as a screw to divide the clamping jaw 47 into the first half body 4701 and the second half body 4702, which is not only convenient to manufacture but also enables the clamping jaw 47 to slide along the kidney-shaped slot 4601 after installation but not to be removed from the high stability. A circulation gap is formed between the clamping portion 4703 and the clamping disk 46, that is, after the clamping jaws 47 clamp the wafer, the circulation gap is left between the back surface of the wafer and the clamping disk 46, so that the back surface of the wafer can be soaked by the chemical liquid.
In order to prevent the wafer from being released from the clamping portion 4703 during the movement of the lifting basket 45, a release preventing stopper 52 is provided on the first half 4701 at an end surface of the clamping portion 4703, and the release preventing stopper 52 is mounted on the first half 4701, typically using a fastener, for preventing the wafer from being released from the clamping portion 4703.
Specifically, the hoisting power mechanism 44 includes a first rotating shaft and a second rotating shaft rotatably mounted on the traveling frame 42, the first rotating shaft and the second rotating shaft are arranged in parallel at intervals, the first rotating shaft is connected with the lifting motor, the lifting motor is fixedly mounted on the traveling frame 42, a first double-groove rope pulley and a second double-groove rope pulley are fixedly mounted on the first rotating shaft, a first rope pulley and a second rope pulley are fixedly mounted on the second rotating shaft, the first rope pulley corresponds to one of the first double-groove rope pulley, the second rope pulley corresponds to one of the second double-groove rope pulley, the first double-groove rope pulley, the second double-groove rope pulley, the first rope pulley and the second rope pulley respectively correspond to four corners of the lifting basket 45, a first steel wire rope is wound on one rope pulley of the first double-groove rope pulley, the other end of the first steel wire rope is fixed at a position corresponding to a corner of the lifting basket 45, a second steel wire rope is wound on the other rope pulley of the first double-groove rope pulley, the second steel wire rope pulley is fixed at a position corresponding to a corresponding corner of the lifting basket 45, and the second steel wire rope is further fixed at a position corresponding to a fourth double-groove lifting basket 45, and the lifting rope pulley is further, and the lifting motor is fixed at a position corresponding to a fourth double-lifting basket 45.
The bottom that is located soaking box 48 in soaking box 48 is equipped with nitrogen gas aeration pipe 49, and the aeration pipe is the commonly used part, has micropore aeration pipe, nanometer aeration pipe etc. and the use can be purchased as required to the technical staff in the field, no longer gives unnecessary details here, and nitrogen gas aeration pipe 49 can produce the nitrogen gas bubble in the liquid medicine, produces the stirring effect to the liquid medicine for the liquid medicine fully exerts effect to the protective layer on wafer surface, reaches better soaking effect.
Be equipped with fourth spray header 50 in the spray box 54, fourth spray header 50 connects the pure water storage tank, and fourth spray header 50's the direction of spraying is unanimous with wafer surface direction, can wash from the front and the back of the wafer side face of vertical placing and use the pure water to wash, washes the remaining liquid medicine of getting rid of wafer surface, and fourth spray header 50 is close to the inner wall that soaks box 48 to avoid interfering with lift basket 45.
Be located being equipped with second nitrogen gas jetting pipe 55 at the top of spraying box 54 in the spraying box 54, second nitrogen gas jetting pipe 55 is close to the inner wall of spraying box 54, be equipped with the nozzle of a plurality of orientation wafer back on the second nitrogen gas jetting pipe 55, second nitrogen gas jetting pipe 55 malleation nitrogen gas source, generally use hot nitrogen gas, can be with all the centre gripping wafers on clamping disk 46 along with constantly taking out the pure water at the wafer back one by one and weather to avoid the wafer back to remain moisture and enter into in the sucking disc of low reaches.
In order to improve the blowing effect, two sets of fourth spray pipes 50 with staggered upper and lower positions are usually arranged in the soaking box body 48, the two sets of fourth spray pipes 50 are respectively positioned on two opposite inner walls of the soaking box body 48, and the two sets of fourth spray pipes 50 arranged oppositely can thoroughly wash the residual liquid medicine on the surface of the soaked wafer.
When the device is used, a proper amount of soaking liquid medicine is respectively contained in the soaking box 48, a wafer to be treated is placed in the clamping parts 4703 of the clamping jaws 47, the wafer is fixed on the clamping discs 46 by the aid of acting force of the tension springs 51, one wafer is placed on each clamping disc 46, the lifting motor is started, the lifting basket 45 is placed in the soaking box 48, the nitrogen aeration pipe 49 starts aeration to generate nitrogen bubbles, the soaking liquid medicine is stirred, the walking motor is started to drive the lifting basket 45 to move in the soaking box 48 in a reciprocating mode, soaking can be completed in fifteen minutes, the soaking effect is better than that of the traditional thirty minutes, after soaking is completed, the lifting motor is started to pull the lifting basket 45 out of the soaking liquid medicine, the walking motor is started to move the lifting basket 45 into the spraying box 54, the fourth spraying water pipe 50 starts to spray purified water on the wafer in the lifting basket 45, the soaking liquid medicine on the surface of the wafer is washed away, and then the second nitrogen spraying pipe 55 starts to spray hot nitrogen air flow on the back of the outermost wafer, and dry the back of the wafer so that the back of the wafer can enter the next process.
The wafer is turned over by adopting a mechanism, as shown in fig. 7, 8 and 9, a rotary pipe 30 driven by a servo motor 31 is rotatably mounted on the cleaning box body 2 through a bearing, the servo motor 31 is usually connected with the rotary pipe 30 through a gear pair transmission, the rotary pipe 30 extends into the cleaning box body 2 along the radial direction of the rotary disc 6, the rotary pipe 30 is usually arranged at the top position of the second washing cavity 203, a slide carriage 32 driven by a first air cylinder 33 is axially and slidably mounted in the rotary pipe 30, a diamond-shaped four-bar mechanism is mounted on one side of the slide carriage 32 far away from the first air cylinder 33, the four-bar linkage mechanism comprises a first connecting bar 35, a second connecting bar 36, a third connecting bar 37 and a fourth connecting bar 38 which are sequentially hinged, hinged points of the first connecting bar 35 and the fourth connecting bar 38 are hinged on the sliding base 32, a second air cylinder 34 is installed on the sliding base 32, a cylinder body of the second air cylinder 34 is fixedly installed on the sliding base 32, the second air cylinder 34 and the first air cylinder 33 are located on the same side of the sliding base 32, the hinged points of the second connecting bar 36 and the third connecting bar 37 are connected with a piston rod of the second air cylinder 34, the second connecting bar 36 and the third connecting bar 37 are both provided with extending portions extending out of the hinged points, the end portions of the extending portions are provided with clamping portions 39, and the clamping range of the clamping portions 39 is matched with the thickness of a wafer. The structure can realize automatic clamping and overturning of the wafer, and under the action of the first air cylinder 33, the clamping part 39 can avoid the lifting track of the rotary disk, so that the interference of lifting of the rotary disk is avoided, the manual overturning of the wafer is replaced, and the production efficiency of the wafer is further improved.
The rotary pipe 30 is provided with a limiting element for limiting the maximum stroke of the first air cylinder 33, the limiting element is usually selected to use a limiting screw 40, the limiting screw 40 is in threaded connection with the rotary pipe 30, the distance from the initial state to the limiting screw 40 of the first air cylinder 33 is smaller than the stroke of the first air cylinder 33, the limiting screw 40 limits the maximum extending position of the piston rod of the first air cylinder 33, and when the second air cylinder 34 pushes the four-bar linkage mechanism, the action of the second air cylinder 34 acts on the limiting screw 40 instead of the piston of the first air cylinder 33, so that the piston of the first air cylinder 33 is protected, and the service life of the first air cylinder 33 is prolonged.
The four-bar mechanism is provided with a compression spring arranged along the radial direction of the rotary pipe 30, the acting force of the compression spring can act on the four-bar mechanism in time, the clamping part 39 can be opened more quickly, and the wafer is effectively prevented from being subjected to the radial acting force of the clamping part 39.
In operation, after the wafer is completely soaked in the soaking liquid medicine, the wafer is washed by pure water and the back surface of the wafer is dried, an operator opens the cover plate 3, a proper amount of soaking liquid medicine is contained in the soaking cavity 201, the hydraulic oil cylinder 8 pushes the lifting column 4 to move upwards, the wafer to be treated is placed on the sucking disc 7, the vacuum pump is started to fix the wafer on the rotary disc 6, the lifting column 4 moves downwards under the action of the hydraulic oil cylinder 8 to plug the cover plate 3 and plug the cleaning box body 2, as shown in fig. 1, the rotary disc 6 drives the wafer to sink into the soaking liquid medicine in the soaking cavity 201 for soaking, after soaking, the lifting column 4 drives the rotary disc 6 to start to move upwards to a position below the first spray water pipe 13, the swing air cylinder 24 swings the first spray water pipe 13 to the central position of the rotary disc 6 and swings to reciprocate according to a certain swing amplitude, at the moment, the first spray water pipe 13 starts to spray pure water, after the residues of the soaking liquid medicine are removed by washing, the lifting column 4 moves upwards, as shown in fig. 10, the wafer is transferred to the first washing cavity 202, the expansion joint 1802 at the bottom of the first washing cavity 202 is closed, then the rotary motor 11 is started to drive the wafer to rotate, at the moment, the swing air cylinder 24 moves the first cleaning liquid spray pipe 14 to the position above the wafer to spray and wash the surface of the wafer, the second liquid discharge pipe 20 is opened, the washed first cleaning liquid flows out and is collected through the second liquid discharge pipe 20, after the first cleaning liquid is washed, the rotary motor 11 does not need to be closed, the first cleaning liquid spray pipe 14 is swung out of the central position, the second spray pipe 15 is swung to the central position to spray purified water on the surface of the wafer, the residues of the first cleaning liquid are removed by washing, meanwhile, the first cleaning liquid remained in the first washing cavity 202 is discharged through the second liquid discharge pipe 20, the hydraulic oil cylinder 8 drives the wafer to move upwards to the second washing cavity 203, closing the telescopic joint 1802 at the bottom of the second washing cavity 203, swinging the second washing liquid spray pipe 16 to the central position, spraying a second washing liquid on the surface of the wafer, opening the third liquid discharge pipe 21 at the moment, discharging and collecting the washing liquid through the third liquid discharge pipe 21, after the washing is finished, spraying pure water on the surface of the wafer by the third spray pipe 17, washing to remove the residual second washing liquid, after the washing is finished, driving the wafer to continue rotating by the rotary motor 11, throwing away the residual water drops on the front surface of the wafer, if the back surface of the wafer does not need to be washed, spraying nitrogen on the surface of the wafer by the first nitrogen spraying pipe 53 for drying treatment, after the drying, taking out the wafer, if the back surfaces of some wafer products also need to be washed, and the front surfaces of the wafer products allow sucking disc adsorption, stopping the rotary motor 11, actuating the first air cylinder 33, pushing the slide carriage 32 to move to the rotary disc 6, moving the clamp part 39 to the wafer position, the second cylinder 34 acts to push the four-bar linkage mechanism to deform, the two opposite clamp parts 39 are combined to clamp the upper surface and the lower surface of the wafer, the vacuum pump stops pumping air, the sucker 7 releases the wafer, the lifting column 4 moves downwards for a certain distance, the servo motor 31 is started, the rotary pipe 30 drives the wafer to turn 180 degrees, the lifting column 4 rises, the vacuum pump starts pumping air, the sucker 7 adsorbs the wafer, the second cylinder 34 pulls the four-bar linkage mechanism to deform, the clamp parts 39 are opened, then the first cylinder 33 pulls the sliding seat 32 back, the lifting column 4 moves downwards, the rotary motor 11 starts to repeat the previous actions, the other surface of the wafer starts to continuously perform first cleaning fluid spraying and second cleaning fluid spraying, after the spraying and flushing are finished, the first nitrogen gas spraying and blowing pipe 53 sprays nitrogen gas on the surface of the wafer to perform drying treatment, the third spraying and blowing pipe 17 deviates from the central position, the rotary motor 11 stops, and opening the cover plate 3, driving the wafer to move upwards by the hydraulic oil cylinder 8, stopping vacuumizing by the vacuum pump, taking out the processed wafer by an operator, putting another wafer to be cleaned, and continuously cleaning.
In order to reduce the labor intensity of an operator and improve the automation degree, a programmable controller or a microcomputer and other control units are usually used for controlling, and a temperature sensor and the like are arranged at a corresponding position so as to facilitate more accurate action instruction and temperature control and timely control related execution elements. And the pressure or the flow of the cleaning liquid spray pipe and the nitrogen gas spray pipe can be controlled independently so as to meet the use requirements of wafers with different specifications.
As described above, the present invention provides a wafer dicing protection system, which achieves a great number of excellent technical effects through a unique structural design,
although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims (10)

1. A wafer cutting protection system comprises glue dispensing and coating equipment, glue layer curing equipment, cutting equipment and glue layer removing equipment which are sequentially arranged, and is characterized in that the glue layer removing equipment comprises a soaking and cleaning device and a rotary spraying and cleaning device which are sequentially arranged, the rotary spraying and cleaning device comprises a support, a cleaning box body is fixedly installed on the support, a cover plate is covered on the top of the cleaning box body, a lifting column which is driven by a first power mechanism and vertically ascends and descends is connected with a second power mechanism which drives the lifting column to rotate around a rotation center is arranged at the bottom of the cleaning box body, the lifting column penetrates through the bottom surface of the cleaning box body and stretches into the cleaning box body, a rotary disc is fixedly installed at the top end of the lifting column, the lifting column is provided with a central through hole, a plurality of suckers are arranged on the upper surface of the rotary disc, all the suckers are communicated with the central through hole, and the bottom end of the lifting column is connected with a vacuum pump through a rotary joint; the cleaning box body is sequentially provided with a soaking cavity, a first flushing cavity and a second flushing cavity from bottom to top, soaking liquid medicine is contained in the soaking cavity, an ultrasonic generator is arranged in the soaking cavity, a gate is arranged between the soaking cavity and the first flushing cavity and between the first flushing cavity and the second flushing cavity, a first spray pipe is arranged at the top of the soaking cavity, a first drain pipe is arranged at the bottom of the soaking cavity, a first cleaning liquid spray pipe and a second spray pipe are arranged at the top of the first flushing cavity, the second spray pipe is arranged above the first cleaning liquid spray pipe, a second drain pipe is arranged at the bottom of the first flushing cavity, a second cleaning liquid spray pipe and a third spray pipe are arranged at the top of the second flushing cavity, the third spray pipe is arranged above the second cleaning liquid spray pipe, a third drain pipe is arranged at the bottom of the second flushing cavity, the first cleaning liquid spray pipe is connected with the first cleaning liquid storage tank, the second cleaning liquid spray pipe is connected with the second cleaning liquid storage tank, and the top of the second flushing cavity is arranged above the third spray pipe.
2. The wafer cutting protection system as claimed in claim 1, wherein the soaking and cleaning device comprises a steel structural frame, a soaking box and a spraying box are arranged in the steel structural frame, a traveling frame driven by a traveling power mechanism is arranged on the steel structural frame, a lifting basket driven by a hoisting power mechanism is arranged on the traveling frame, the lifting basket corresponds to the soaking box and the spraying box in position, a plurality of clamping discs which are parallel to each other and arranged at intervals are fixedly arranged in the lifting basket, a plurality of clamping jaws for clamping wafers are arranged on each clamping disc, and the axes of the clamping discs are perpendicular to the traveling direction of the traveling frame; and a fourth spray water pipe is arranged in the spray box body, and the spray direction of the fourth spray water pipe is consistent with the surface direction of the wafer.
3. The wafer cutting protection system as claimed in claim 2, wherein a second nitrogen injection pipe is arranged in the spraying box body and positioned at the top of the spraying box body, the second nitrogen injection pipe is close to the inner wall of the spraying box body, and a plurality of nozzles facing the back of the wafer are arranged on the second nitrogen injection pipe.
4. The wafer cutting protection system as claimed in claim 3, wherein the clamping disk has a plurality of slots, the clamping jaw extends through the slots and is slidably mounted in the slots, the clamping jaw has a clamping portion at an end of the clamping disk at the front side, the clamping jaw has a tensioning portion at an end of the clamping disk at the back side, all the tensioning portions are connected together by an elastic element, the clamping jaw includes a first half and a second half connected together by a fastener, the first half and the second half are T-shaped, the clamping portion is located on the first half, and the tensioning portion is located on the second half.
5. The wafer cutting protection system according to any one of claims 1 to 4, wherein the gate comprises a gate plate fixed on the cleaning box body, a mounting groove is formed in the gate plate, the width of the center of the mounting groove is larger than the diameter of the rotary disk, a split telescopic joint is arranged in the mounting groove, and a sealing strip is arranged between the periphery of the telescopic joint and the gate plate.
6. The wafer dicing protection system according to claim 5, wherein the shutter has a projection projecting upward, and the mounting groove opens in the projection.
7. The wafer cutting protection system of claim 6, wherein the innermost end of the telescopic joint is provided with an arc-shaped groove matched with the lifting column.
8. The wafer cutting protection system according to any one of claims 1 to 7, wherein the first spray pipe, the first cleaning solution spray pipe, the second cleaning solution spray pipe, the third spray pipe and the first nitrogen gas spray pipe all extend into the cleaning box body, and a swing cylinder is hinged to the extending end of each of the first spray pipe, the second cleaning solution spray pipe, the third spray pipe and the first nitrogen gas spray pipe.
9. The wafer cutting protection system according to any one of claims 1 to 8, wherein a rotary pipe driven by a servo motor is rotatably mounted on the cleaning box body, the rotary pipe extends into the cleaning box body along a radial direction of the rotary disc, a sliding seat driven by a first cylinder is axially slidably mounted in the rotary pipe, a diamond-shaped four-bar mechanism is mounted on one side of the sliding seat far away from the first cylinder, the four-bar mechanism comprises a first connecting bar, a second connecting bar, a third connecting bar and a fourth connecting bar which are sequentially hinged, a hinge point of the first connecting bar and the fourth connecting bar is hinged on the sliding seat, a second cylinder is mounted on the sliding seat, a hinge point of the second connecting bar and the third connecting bar is connected with a piston rod of the second cylinder, the second connecting bar and the third connecting bar are respectively provided with an extension portion extending out of the hinge point, and a clamping portion is arranged at an end of the extension portion.
10. The wafer dicing protection system of claim 9, wherein a limit element is provided on the rotary pipe to limit a maximum stroke of the first cylinder.
CN202211003487.XA 2022-08-21 2022-08-21 Wafer cutting protection system Pending CN115346896A (en)

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Application Number Priority Date Filing Date Title
CN202211003487.XA CN115346896A (en) 2022-08-21 2022-08-21 Wafer cutting protection system

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Application Number Priority Date Filing Date Title
CN202211003487.XA CN115346896A (en) 2022-08-21 2022-08-21 Wafer cutting protection system

Publications (1)

Publication Number Publication Date
CN115346896A true CN115346896A (en) 2022-11-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116174383A (en) * 2023-04-25 2023-05-30 保定三晶电子材料有限公司 Germanium single chip production cleaning equipment with cyclic utilization function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116174383A (en) * 2023-04-25 2023-05-30 保定三晶电子材料有限公司 Germanium single chip production cleaning equipment with cyclic utilization function
CN116174383B (en) * 2023-04-25 2023-07-04 保定三晶电子材料有限公司 Germanium single chip production cleaning equipment with cyclic utilization function

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