CN115172228A - Wafer protective coating integral type cleaning equipment - Google Patents

Abstract

The invention relates to integrated cleaning equipment for a wafer protective coating, which comprises a support, wherein a cleaning box body is fixedly arranged on the support, the top of the cleaning box body is sealed and covered with a cover plate, the bottom of the cleaning box body is provided with a lifting column, the top end of the lifting column is provided with a rotary disc, and the upper surface of the rotary disc is provided with a sucker; the cleaning box body is equipped with the steeping chamber from top to bottom in proper order, firstly washes the chamber and the second washes the chamber, and the steeping chamber and the first chamber of washing and the second of washing all are equipped with the gate between washing the chamber, and the top of steeping chamber is equipped with first spray header, and the first top of washing the chamber is equipped with first liquid medicine shower and second spray header, and the second washes the top in chamber and is equipped with second liquid medicine shower and third spray header. The wafer cleaning device solves the technical problem that the wafer cannot be effectively protected in the process of soaking and transferring to the cleaning process, so that the cleaning difficulty is high and the cleaning efficiency is low.

Description

Wafer protective coating integral type cleaning equipment

Technical Field

The invention relates to a wafer protective coating cleaning device, in particular to a wafer protective coating integrated cleaning device, and belongs to the technical field of semiconductor cleaning devices.

Background

In the semiconductor packaging process flow, the cleaning of the temporary wafer protective coating is a very critical step, and after the cutting is completed, the cleaning effect on the temporary wafer protective coating directly affects the yield of the subsequent process, and if the temporary wafer protective coating cannot be completely cleaned, the subsequent process efficiency is greatly reduced.

In order to improve the cleaning effect, a wafer protective coating needs to be soaked before cleaning, and in the prior art, CN216054589U discloses cleaning equipment for cleaning a wafer, which comprises a soaking box, a lifting type sealing cover, a vertical supporting platform, a lifting driving mechanism and a swinging driving mechanism, wherein the lifting type sealing cover is arranged above the soaking box, a partition plate is arranged in the middle of the soaking box to divide the soaking box into two soaking tanks, a circulation interval is arranged between the partition plate and the bottom surface of the soaking box, and the vertical supporting platform is arranged at the rear part of the soaking box; the lifting driving mechanism comprises a servo hydraulic cylinder and a sliding seat, two linear guide rails are arranged on the front surface of the vertical supporting table, the swing driving mechanism comprises two electric push rod driving groups and two fixing seats, the two fixing seats are oppositely arranged on the sliding seat, and the two electric push rod driving groups are respectively arranged on the two fixing seats. However, when the scheme is implemented, the wafers are placed in the lifting basket, ordered and stable conditions cannot be realized, the wafers collide with each other in the shaking process, the wafers are damaged, even two adjacent wafers are overlapped together and cannot be soaked by liquid medicine, and the subsequent cleaning effect is not ideal.

In the subsequent cleaning process, CN104658947B in the prior art discloses a wafer cleaning device, comprising: a cleaning tank; the cleaning tank is provided with a containing cavity; a wafer support device; the wafer supporting device is arranged in the containing cavity and used for supporting a wafer; at least one spray head; the spray head can spray liquid or gas towards the wafer; also includes at least one bracket; the bracket is rotatably and liftably arranged; the bracket is provided with at least one spray head wafer cleaning device; the device also comprises at least one third driving device; each third driving device drives one support to do lifting motion or drives one support to do lifting motion through a third transmission device; the device also comprises at least one fourth driving device; each fourth driving device drives one bracket to rotate or drives one bracket to rotate through a fourth transmission device; the device also comprises at least one liquid receiving groove; the liquid receiving tank is arranged on one side of the cleaning tank and is used for collecting liquid sprayed by the spray head in an area outside the containing cavity; the system also comprises a control host and at least one position detection device; each position detection device is used for detecting the position of one bracket and sending a signal to the control host; the control host controls the fourth driving device to work and determines the fourth driving device to start or stop according to the signal of the position detection device; the position detection device comprises a proximity switch and a lug; the lug and the bracket rotate synchronously; the proximity switch is located on a path of travel of the tab; the proximity switch sends different signals to the control host according to whether the lug is positioned in the detection range of the proximity switch; and the control host determines the operation of the fourth driving device according to the signal of the proximity switch. However, the cleaning device works in an open mode when cleaning, and the wafer protection layer needs to be cleaned in a closed state or a nitrogen protection state, so that how to realize the method is a technical problem troubling the technical personnel in the field.

More importantly, the cleaning devices are arranged in a split mode, the wafer needs to be transferred to the cleaning devices after being soaked, the transfer process cannot be closed, nitrogen protection cannot be achieved, the protective coating on the surface of the wafer is oxidized, the cleaning difficulty and the cleaning time are increased, and the cleaning efficiency of the protective coating of the wafer is reduced.

Therefore, in the technical field of semiconductor cleaning equipment, research and improvement needs still exist for wafer protective coating integrated cleaning equipment, which is also a research hotspot and focus in the technical field of semiconductor cleaning equipment at present and is the starting point of the completion of the invention.

Disclosure of Invention

Based on the defects of the prior art, the technical problems to be solved by the invention are as follows: the utility model provides a wafer protective coating integral type cleaning equipment to solve the wafer and shift to the cleaning process from soaking and can't obtain effective protection, lead to wasing the technical problem that the degree of difficulty is big inefficiency.

In order to solve the technical problems, the technical scheme of the invention is as follows: the wafer protection coating integrated cleaning equipment comprises a support, a cleaning box body is fixedly mounted on the support, a cover plate is covered on the top of the cleaning box body, a lifting column which is driven by a first power mechanism and vertically ascends and descends is arranged at the bottom of the cleaning box body, the lifting column is connected with a second power mechanism which drives the lifting column to rotate around a rotation center, the lifting column penetrates through the bottom surface of the cleaning box body and extends into the cleaning box body, a rotary disc is fixedly mounted at the top end of the lifting column, the lifting column is provided with a center through hole, a plurality of suckers are arranged on the upper surface of the rotary disc, all the suckers are communicated with the center through hole, and the bottom end of the lifting column is connected with a vacuum pump through a rotary joint; the cleaning box body is sequentially provided with a soaking cavity, a first flushing cavity and a second flushing cavity from bottom to top, gates are arranged between the soaking cavity and the first flushing cavity and between the first flushing cavity and the second flushing cavity, a first spray pipe is arranged at the top of the soaking cavity, a first liquid discharge pipe is arranged at the bottom of the soaking cavity, a first liquid medicine spray pipe and a second spray pipe are arranged at the top of the first flushing cavity, the second spray pipe is located above the first liquid medicine spray pipe, a second liquid discharge pipe is arranged at the bottom of the first flushing cavity, a second liquid medicine spray pipe and a third spray pipe are arranged at the top of the second flushing cavity, the third spray pipe is located above the second liquid medicine spray pipe, a third liquid discharge pipe is arranged at the bottom of the second flushing cavity, the first liquid medicine spray pipe is connected with a first liquid medicine storage tank, the second liquid medicine spray pipe is connected with a second liquid medicine storage tank, and a nitrogen spray pipe is arranged at the top of the second flushing cavity.

The cleaning tank is usually made of a corrosion-resistant material, such as polytetrafluoroethylene or stainless steel.

Particularly or preferably, the lifting column is vertically rotatably installed on the lifting base and penetrates through the lifting base, the lifting base vertically slides through the guide sliding rail, a first power mechanism is arranged below the lifting base, the first power mechanism is usually a hydraulic oil cylinder, a cylinder body of the hydraulic oil cylinder is fixed, a piston rod of the hydraulic oil cylinder is connected with the lifting base, and the lifting base drives the lifting column to synchronously lift. The rotation of lift post is through the drive of second power unit, second power unit includes the rotating electrical machines of fixed mounting on the lift base, fixed mounting has the driving gear on rotating electrical machines's the power output shaft, fixed mounting has driven gear on the lift post, driven gear and the coaxial setting of lift post, the driving gear meshes with driven gear mutually, rotation through rotating electrical machines, the rotation of drive lift post, and the rotation and the lift mutually noninterfere of lift post, can go on simultaneously, when having saved, the cleaning efficiency has been improved.

The rotary disc is provided with a plurality of airflow channels which are respectively communicated with the suckers and the central through hole, and all the suckers are communicated with the central through hole through the corresponding airflow channels.

The wafer cleaning device comprises a wafer, a first spray pipe, a lifting column, a first spray pipe, a first rinsing chamber, a second spray pipe, a wafer cleaning chamber and a wafer cleaning chamber, wherein the soaking chamber is filled with soaking liquid medicine, the wafer can be soaked in the soaking chamber, and after the soaking is finished, the soaking liquid medicine is removed through pure water spraying through the first spray pipe, so that the wafer can enter the first rinsing chamber under the pushing of the lifting column.

Wherein, the wafer firstly carries out spraying of first liquid medicine at first washing the intracavity, sprays the preferred gondola water faucet formula of adopting and sprays, and the effect is better, then uses the first liquid medicine that the pure water washed the residue on the wafer surface through second spray header again, then first liquid medicine is through the second fluid-discharge tube after the discharge, and the wafer gets into the second and washes the chamber.

The wafer is firstly sprayed with the second liquid medicine in the second washing cavity, then the wafer is flushed with the second liquid medicine remained on the surface of the wafer through the third spraying water pipe by using pure water, and the second liquid medicine is discharged through the third liquid discharge pipe.

The nitrogen injection pipe is connected with positive-pressure hot nitrogen, nitrogen injection drying is carried out on the surface of the wafer, the cover plate can be opened after drying, the cleaned wafer is taken out, then another wafer needing to be processed is placed in, and soaking and cleaning are continued.

The soaking operation, the two-time washing operation and the drying operation of the wafer are finished in the closed cleaning box body, the wafer does not need to be transferred in exposed air, the wafer protective coating is effectively protected, the cleaning effect of the wafer protective coating is improved, the cleaning efficiency is improved, and the soaking liquid medicine, the first liquid medicine and the second liquid medicine are collected independently, so that the cross contamination is avoided.

Wherein, all be equipped with heating coil in first liquid medicine storage tank and the second liquid medicine storage tank for first liquid medicine and second liquid medicine can satisfy required washing temperature, all are equipped with the stirring vane by agitator motor drive in first liquid medicine storage tank and the second liquid medicine storage tank, make the liquid medicine temperature in the storage tank even, in order to reach best washing effect.

In the integrated cleaning equipment for the wafer protective coating, the gate comprises a gate plate fixed on the cleaning box body, an installation groove is formed in the gate plate, the width of the center of the installation groove is larger than the diameter of the rotary disc, and a split telescopic joint is arranged in the installation groove.

Wherein, the shape of the mounting groove is matched with that of the telescopic joint, and the mounting groove is usually in a step shape.

In the integrated cleaning equipment for the wafer protective coating, a sealing strip is arranged between the periphery of the expansion joint and the flashboard as an improvement.

In the integrated cleaning equipment for the wafer protective coating, as an improvement, the end part of the innermost layer of the telescopic joint is provided with an arc-shaped groove matched with the lifting column.

Through the structural arrangement, when the two opposite telescopic joints are opened in a split mode, the rotary disc can enter the cavity above through the gap between the telescopic joints. When the two opposite telescopic joints are closed, the arc-shaped groove is attached to the lifting column to form sealing, so that the liquid medicine in the cavity is prevented from leaking to the cavity below, and the cross contamination of the liquid medicine is effectively avoided.

In the integrated cleaning equipment for wafer protective coating, the flashboard is provided with a convex part protruding upwards, and the installation groove is arranged on the convex part.

Wherein, the flashboard is provided with a convex part which is convex upwards, so that a concave part is formed between the flashboard and the cleaning box body, and a drain valve is installed to discharge liquid.

Wherein, through making the mounting groove is seted up in the bulge to make the position of telescopic joint be higher than the depressed part, avoided liquid to reveal to below cavity. When the liquid medicine is sprayed, the liquid medicine is thrown to the inner wall of the cleaning box body by the rotary disc and flows into the concave part along the inner wall, so that the cross contamination of the liquid medicine is effectively avoided.

As a more preferable technical scheme, the telescopic joint comprises a first joint body fixedly mounted on the gate plate, a second joint body is slidably mounted in the first joint body, a third joint body is slidably mounted in the second joint body, an arc-shaped groove matched with the lifting column is formed in the outer end of the third joint body, the first joint body is communicated with the second joint body, a plunger slidably mounted in the second joint body is fixedly mounted at the end of the third joint body, a third central cylinder is arranged in the third joint body, an oil through port is formed in one end, far away from the plunger, of the third central cylinder, the other end of the third central cylinder penetrates through the plunger and extends into the second joint body, a second central cylinder is sleeved in the third central cylinder, the second central cylinder is matched with the second joint body, a first central cylinder is sleeved in the second central cylinder, the first central cylinder is matched with the first joint body, a first working oil port connected with the oil port is formed in the end of the first central cylinder, a second working oil port is formed in the end of the first joint body, a second working oil port is communicated with an oil port A of the reversing valve, a first working oil port is communicated with a B of the reversing valve, and an oil return pipeline connected with a T return oil port.

Through the structure setting, when the oil is fed from the first working oil port, the second working oil port returns oil, the third section body retracts into the second section body, the second section body retracts into the first section body, and the gate is opened. And when the second working oil port takes oil, the third section body and the second section body are pushed out by hydraulic oil to close the gate, and the lifting column is plugged by the arc-shaped groove, so that the bottom of the cavity is sealed.

The first section body, the second section body and the third section body are preferably of a cavity structure with a square cross section and are sequentially sleeved together, and sealing rubber strips are arranged between the two adjacent section bodies, so that hydraulic oil cannot be leaked.

In order to improve the stability and accuracy of the sliding track of the telescopic joint, it is further preferable that a third guide cylinder is arranged in the third section, the third guide cylinder is parallel to the third central cylinder, one end of the third guide cylinder is fixed at one end of the third section, which is far away from the plunger, the other end of the third guide cylinder penetrates through the plunger and extends into the second section, a second guide cylinder is sleeved in the third guide cylinder, the second guide cylinder is matched with the second section, a first guide cylinder is sleeved in the second guide cylinder, the first guide cylinder is matched with the first section, and the end of the first guide cylinder is fixed at the end of the first section.

Through the structure setting, the first guide cylinder, the second guide cylinder and the third guide cylinder which are sleeved together play a good guiding role, the telescopic joint is prevented from being blocked in an inclined mode in the stretching or retracting process, and the telescopic joint is more smooth in stretching.

In the integrated cleaning equipment for the wafer protective coating, provided by the invention, as another improvement, the first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe and the third spray pipe all extend into the cleaning box body, and the extending ends of the first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe and the third liquid medicine spray pipe are hinged with a swing cylinder.

The cylinder body of the swing cylinder is hinged to the cleaning box body, and the piston rod of the swing cylinder is hinged to the corresponding first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe, the third spray pipe or the nitrogen injection pipe.

In the integrated cleaning equipment for the wafer protective coating, as a further improvement, the first spray header, the first liquid medicine spray header, the second liquid medicine spray header and the third spray header are all mounted on the cleaning box body through self-aligning bearings.

Through such structure setting to the promotion of accessible swing cylinder realizes the swing of corresponding first spray header, first liquid medicine shower, second spray header, second liquid medicine shower, third spray header and nitrogen gas jetting pipe, and the jetting is in the limit of the swing during use, thoroughly sprays or jets to the whole surface of wafer.

In the integrated cleaning equipment for the wafer protective coating, as a further improvement, sealing elements are arranged between the first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe and the third spray pipe and the inner wall of the cleaning box body.

The sealing element is usually a rubber sealing sleeve, and seals gaps between the corresponding first spray pipe, first liquid medicine spray pipe, second liquid medicine spray pipe, third spray pipe, nitrogen injection pipe and cleaning box body.

Through the structural arrangement, the first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe, the third spray pipe and the nitrogen injection pipe can swing in the cleaning box body under the action of the swing cylinder. When the wafer needs to be sprayed or dried, the wafer swings to the position above the rotary disc to swing in a reciprocating mode under the action of the swing air cylinder. When spraying or drying is finished, the rotary disc needs to move upwards under the action of the lifting column, and the upward moving track of the rotary disc is deviated under the action of the swing cylinder, so that the interference with the rotary disc is avoided.

In the integrated cleaning equipment for the wafer protective coating, as another improvement, a rotary pipe driven by a servo motor is rotatably mounted on the cleaning box body, the rotary pipe extends into the cleaning box body along the radial direction of the rotary disc, a sliding seat driven by a first cylinder is axially and slidably mounted in the rotary pipe, a rhombic four-bar mechanism is mounted on one side, far away from the first cylinder, of the sliding seat, the four-bar mechanism comprises a first connecting bar, a second connecting bar, a third connecting bar and a fourth connecting bar which are sequentially hinged, a hinge point of the first connecting bar and the fourth connecting bar is hinged on the sliding seat, a second cylinder is mounted on the sliding seat, a hinge point of the second connecting bar and the third connecting bar is connected with a piston rod of the second cylinder, the second connecting bar and the third connecting bar are both provided with extending parts extending out of the hinge point, and the end part of each extending part is provided with a clamping part.

Wherein, servo motor accessible gear pair transmission connects the gyration pipe.

Wherein the height position of the rotary pipe is usually arranged between the second liquid medicine spray pipe and the third spray pipe.

The cylinder body of the second cylinder is fixedly arranged on the sliding seat, and the second cylinder and the first cylinder are positioned on the same side of the sliding seat.

The clamping range of the clamping part is matched with the thickness of the wafer, the structure can realize automatic clamping and overturning of the wafer, the clamping part can avoid the lifting track of the rotary disc under the action of the first air cylinder, interference in lifting of the rotary disc is avoided, manual overturning of the wafer is replaced, and the production efficiency of the wafer is further improved.

In the integrated cleaning equipment for the wafer protective coating, a limiting element for limiting the maximum stroke of the first air cylinder is arranged on the rotary pipe as a further improvement.

The limiting element is usually selected to use a limiting screw, the limiting screw is in threaded connection with the rotary pipe, the distance from the initial state to the limiting screw of the first air cylinder is smaller than the stroke of the first air cylinder, the limiting screw limits the maximum extending position of a piston rod of the first air cylinder, and when the second air cylinder pushes the four-bar linkage mechanism at the position, the acting force of the second air cylinder acts on the limiting screw instead of the piston of the first air cylinder, so that the piston of the first air cylinder is protected, and the service life of the first air cylinder is prolonged.

The four-bar mechanism is provided with a compression spring which is arranged along the radial direction of the rotary pipe, the acting force of the compression spring can act on the four-bar mechanism in time, the clamping part can be opened more quickly, and therefore the radial acting force of the clamping part on the wafer is effectively avoided.

The specific operation principle and the process flow of the integrated cleaning equipment for the wafer protective coating are as follows: when the device is used, an operator opens the cover plate, a proper amount of soaking liquid medicine is contained in the soaking cavity, the hydraulic oil cylinder pushes the lifting column to move upwards, the back of a wafer to be treated is placed on the sucking disc, the vacuum pump is started, the wafer is fixed on the rotary disc, the lifting column moves downwards under the action of the hydraulic oil cylinder to block the cover plate, the cleaning box body is blocked, the rotary disc drives the wafer to sink into the soaking liquid medicine in the soaking cavity for soaking, after soaking is finished, the lifting column drives the rotary disc to start to move upwards to a position below the first spraying water pipe, the first spraying water pipe swings to the center position of the rotary disc through the swing air cylinder and then swings back and forth according to a certain swing amplitude, at the moment, the first spraying water pipe starts to spray purified water, the lifting column moves upwards after the soaking liquid medicine residue is removed through washing, the wafer is transferred to the first washing cavity, the telescopic joint at the bottom of the first washing cavity is closed, then the rotary motor is started to drive the wafer to rotate, at the moment, the swing air cylinder moves the first liquid medicine spray pipe to the upper part of the wafer to spray and wash the surface of the wafer, the second liquid discharge pipe is opened, the washed first liquid medicine flows out and is collected through the second liquid discharge pipe, after the first liquid medicine is washed, the rotary motor is not required to be closed, the first liquid medicine spray pipe is swung out of the central position, the second liquid medicine spray pipe is swung to the central position to spray purified water on the surface of the wafer to wash and remove the first liquid medicine residue, meanwhile, the first liquid medicine remained in the first washing cavity is discharged through the second liquid discharge pipe, the hydraulic oil cylinder drives the wafer to move to the second washing cavity, the expansion joint at the bottom of the second washing cavity is closed, the second liquid medicine spray pipe is swung to the central position to spray the second liquid medicine on the surface of the wafer, the third liquid discharge pipe is opened at the moment, the liquid medicine is discharged and collected through the third liquid discharge pipe, after spraying, the third liquid medicine spray pipe is swung to the upper part of the wafer to start purified water spraying and washing, after the flushing is finished, the rotary motor drives the wafer to continuously rotate, residual water drops on the front surface of the wafer are thrown away, then the rotary motor is stopped, if the back surface of the wafer does not need to be cleaned, a nitrogen gas jetting pipe jets nitrogen gas on the surface of the wafer to be dried, the wafer can be taken out, if the back surface of some wafer products also needs to be cleaned, and the front surface of the wafer products allows a sucker to adsorb, a first air cylinder acts to push a sliding seat to move towards the rotary disk, after a jaw portion moves to the position of the wafer, a second air cylinder acts to push a four-bar mechanism to deform, two opposite jaw portions are combined to clamp the upper surface and the lower surface of the wafer, a vacuum pump stops pumping, the sucker releases the wafer, a lifting column moves downwards for a certain distance, a servo motor is started, the rotary pipe drives the wafer to turn over for 180 degrees, the lifting column rises, the vacuum pump starts to pump, the sucker adsorbs the front surface of the wafer, a second air cylinder pulls the four-bar mechanism to deform, the jaw portions open, the first air cylinder pulls the sliding seat, the lifting column downwards, the rotary motor starts to repeat the previous actions, the rotary motor starts to drive the rotary pump to move downwards, the rotary motor to continuously spray the nitrogen gas jetting pipe to clean the wafer, and dry the back surface of the wafer to be cleaned, and the rotary motor can be cleaned, and the wafer to be removed, and the operator can be cleaned.

In order to reduce the labor intensity of an operator and improve the automation degree, a programmable controller or a microcomputer and other control units are usually used for controlling, and a temperature sensor and the like are arranged at a corresponding position so as to facilitate more accurate action instruction and temperature control and timely control related execution elements. And the pressure or the flow of the independent liquid medicine spraying pipe, the spraying water pipe and the nitrogen spraying and blowing pipe can be controlled so as to meet the use requirements of wafers with different specifications.

As described above, the present invention provides a wafer protective coating integrated cleaning apparatus, which is related by a unique structure, thereby achieving a number of excellent technical effects, including but not limited to:

1. the soaking, the two-time washing and the drying of the wafer are all finished in the closed cleaning box body, the wafer is not required to be transferred in exposed air, the wafer protective coating is effectively protected, the cleaning effect of the wafer protective coating is improved, the cleaning efficiency is improved, and the soaking liquid medicine, the first liquid medicine and the second liquid medicine are independently collected, so that the cross contamination is avoided.

2. According to the invention, the first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe, the third spray pipe and the nitrogen gas spray pipe all extend into the cleaning box body, the extending ends are respectively hinged with the swing air cylinders, and the swing air cylinders are used for spraying or spraying while swinging, so that the omnibearing spraying and drying on the surface of the wafer can be accurately realized, the central position can be timely moved away, and the interference with the lifting of the rotary disc is avoided.

3. The flashboard is provided with the convex part protruding upwards, so that the concave part is formed between the flashboard and the cleaning box body, the mounting groove is formed in the convex part, the position of the telescopic joint is higher than that of the concave part, and therefore the liquid discharging valve can be mounted to discharge liquid.

4. The soaking liquid medicine, the first liquid medicine and the second liquid medicine can be independently recycled, so that the use cost is saved.

5. Because set up the rotary pipe on wasing the box, be equipped with the four-bar linkage of rhombus in the rotary pipe, and be equipped with the pincers clamping part on four-bar linkage, not only can realize the automatic centre gripping upset of wafer, under the effect of first cylinder, the lift orbit of gyration dish can also be dodged out to the pincers clamping part moreover, has avoided interfering the gyration dish and has gone up and down, has replaced artifical upset wafer, has further improved the production efficiency of wafer.

As described above, the invention provides an integrated cleaning device for a wafer protective coating, which has a unique structural design, thereby achieving a great number of excellent technical effects, being applicable to cleaning of the wafer protective coating, greatly improving the cleaning efficiency and the production efficiency, realizing full-automatic operation, and having good application potential in the field of semiconductor processing.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a schematic view of a rotary disk according to an embodiment of the present invention;

FIG. 3 is a schematic structural view of a lock gate in the embodiment of the present invention;

FIG. 4 is a schematic top view of the structure of FIG. 3;

FIG. 5 is a schematic structural view of an expansion joint in an embodiment of the present invention;

FIG. 6 is a schematic view of an installation structure of a first chemical liquid shower pipe in the embodiment of the present invention;

FIG. 7 is a schematic view showing another state of use of the first liquid chemical shower in the embodiment of the present invention;

FIG. 8 is a schematic view showing an installation structure of a rotary pipe in the embodiment of the present invention;

FIG. 9 is a schematic view of the clamping of the jaw portions in an embodiment of the present invention;

FIG. 10 is a schematic view of an embodiment of the present invention with the jaw portions open;

FIG. 11 is a schematic view illustrating a first chemical liquid spraying state in the embodiment of the present invention;

FIG. 12 is a schematic view showing a second chemical liquid spraying state in the embodiment of the present invention;

wherein in fig. 1 to 12, each numerical reference refers to the following specific meanings, elements and/or components, respectively.

In the figure: 1. a support, 2, a cleaning box body, 201, a soaking cavity, 202, a first flushing cavity, 203, a second flushing cavity, 3, a cover plate, 4, a lifting column, 401, a central through hole, 5, a lifting base, 6, a rotary disc, 601, an air flow channel, 7, a sucker, 8, a hydraulic oil cylinder, 9, a driving gear, 10, a driven gear, 11, a rotary motor, 12, a rotary joint, 13, a first spray water pipe, 14, a first liquid medicine spray pipe, 15, a second spray water pipe, 16, a second liquid medicine spray pipe, 17, a third spray water pipe, 18, a gate, 1801, a gate plate 1802, a telescopic joint, 1803, a sealing strip, 1804, an arc groove, 1805, a first joint body, 1806, a second joint body, 1807, a third joint body, 1808, a third central cylinder, 1809, a second central cylinder, 1810 and a first central cylinder, 1811, a plunger, 1812, a third guide cylinder, 1813, a second guide cylinder, 1814, a first guide cylinder, 1815, a first working oil port, 1816, a second working oil port, 1817, a protrusion, 1818, a recess, 19, a first drain pipe, 20, a second drain pipe, 21, a third drain pipe, 22, a self-aligning bearing, 23, a sealing element, 24, a swing cylinder, 25, a first medical fluid storage tank, 26, a second medical fluid storage tank, 27, a heating coil, 28, a stirring motor, 29, a stirring blade, 30, a rotary pipe, 31, a servo motor, 32, a slide seat, 33, a first cylinder, 34, a second cylinder, 35, a first connecting rod, 36, a second connecting rod, 37, a third connecting rod, 38, a fourth connecting rod, 39, a jaw part, 40, a limit screw, 41, and a blowing pipe.

Detailed Description

The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the present specification, the terms "front", "rear", "left", "right", "inner", "outer" and "middle" are used for the sake of clarity only, and are not intended to limit the scope of the present invention, and changes or modifications of the relative relationship between the terms and the corresponding parts are also regarded as the scope of the present invention without substantial changes in the technical contents.

As shown in fig. 1, the invention provides a wafer protective coating integrated cleaning device, which comprises a support 1, wherein a cleaning box body 2 is fixedly installed on the support 1, the cleaning box body 2 is usually made of corrosion-resistant materials such as polytetrafluoroethylene or stainless steel, a cover plate 3 is sealed at the top of the cleaning box body 2, a lifting column 4 which is driven by a first power mechanism and vertically ascends and descends is arranged at the bottom of the cleaning box body 2, the lifting column 4 is connected with a second power mechanism which drives the lifting column 4 to rotate around a rotation center, specifically, the lifting column 4 is vertically rotatably installed on a lifting base 5 and penetrates through the lifting base 5, the lifting base 5 vertically slides through a guide slide rail, a first power mechanism is arranged below the lifting base 5, the first power mechanism is usually a hydraulic oil cylinder 8, the cylinder body of the hydraulic oil cylinder 8 is fixed, the piston rod of the hydraulic oil cylinder 8 is connected with the lifting base 5, and the lifting base 5 drives the lifting column 4 to synchronously ascend and descend. The rotation of lift post 4 is through the drive of second power unit, second power unit includes rotary motor 11 of fixed mounting on lift base 5, fixed mounting has driving gear 9 on rotary motor 11's the power output shaft, fixed mounting has driven gear 10 on the lift post 4, driven gear 10 and the coaxial setting of lift post 4, driving gear 9 meshes with driven gear 10 mutually, rotation through rotary motor 11, drive the rotation of lift post 4, and the rotation of lift post 4 and the mutual noninterference that goes up and down, can go on simultaneously, save man-hour, the cleaning efficiency is improved. Lifting column 4 runs through the bottom surface that washs box 2 and stretches into in wasing box 2, as shown in fig. 2, lifting column 4's top fixed mounting has rotary disk 6, lifting column 4 has central through hole 401, rotary disk 6's upper surface is equipped with a plurality of sucking disc 7, a plurality of air current channel that communicate sucking disc 7 and central through hole 401 respectively has been seted up on the rotary disk 6, all sucking discs 7 communicate with central through hole 401 through the air current channel that corresponds, rotary joint 12 is passed through to lifting column 4's bottom and is connected the vacuum pump, when needing to wash the wafer, laminate wafer surface and sucking disc 7, start the vacuum pump, sucking disc 7 alright adsorb the wafer, fix the wafer on rotary disk 6. The cleaning box body 2 is provided with a soaking cavity 201, a first washing cavity 202 and a second washing cavity 203 from bottom to top in sequence, a gate 18 is arranged between the soaking cavity 201 and the first washing cavity 202 and between the first washing cavity 202 and the second washing cavity 203, a first spray pipe 13 is arranged at the top of the soaking cavity 201, a first drain pipe 19 is arranged at the bottom of the soaking cavity 201, soaking liquid medicine is contained in the soaking cavity 201, wafers can be soaked in the soaking cavity 201, after soaking is completed, the soaking liquid medicine is removed through the first spray pipe 13 by spraying pure water, the wafers can enter the first washing cavity 202 under the push of a lifting column 4, a first liquid medicine spray pipe 14 and a second spray pipe 15 are arranged at the top of the first washing cavity 202, the second spray pipe 15 is positioned above the first liquid medicine spray pipe 14, and a second drain pipe 20 is arranged at the bottom of the first washing cavity 202, the wafer firstly sprays of first liquid medicine in first washing chamber 202, it preferably adopts the gondola water faucet formula to spray, the effect is better, then use pure water to wash the first liquid medicine of remaining on the wafer surface through second spray header 15 again, then first liquid medicine is after the discharge of second fluid-discharge tube 20, the wafer gets into the second and washes chamber 203, the top that the second washed chamber 203 is equipped with second liquid medicine shower 16 and third spray header 17, third spray header 17 is located the top of second liquid medicine shower 16, the bottom that the second washed chamber 203 is equipped with third fluid-discharge tube 21, the wafer firstly carries out spraying of second liquid medicine in second washing chamber 203, then use pure water to wash the second liquid medicine of remaining on the wafer surface through third spray header 17 again, the second liquid medicine is discharged through third fluid-discharge tube 21. The top of the second flushing cavity 203 is provided with a nitrogen injection tube 41, the nitrogen injection tube 41 is connected with positive-pressure hot nitrogen, nitrogen injection drying is carried out on the surface of the wafer, the cover plate 3 can be opened after drying, the cleaned wafer is taken out, then another wafer to be processed is placed in, and soaking and cleaning are continued. The soaking, the two-time washing and the drying of the wafer are all completed in the closed cleaning box body 2, the wafer does not need to be transferred in the exposed air, the wafer protective coating is effectively protected, the cleaning effect of the wafer protective coating is improved, the cleaning efficiency is improved, and the soaking liquid medicine, the first liquid medicine and the second liquid medicine are independently collected, so that the cross contamination is avoided. First liquid medicine storage tank 25 is connected to first liquid medicine shower 14, second liquid medicine storage tank 26 is connected to second liquid medicine shower 16, all be equipped with heating coil 27 in first liquid medicine storage tank 25 and the second liquid medicine storage tank 26 for first liquid medicine and second liquid medicine can satisfy required washing temperature, all be equipped with in first liquid medicine storage tank 25 and the second liquid medicine storage tank 26 by agitator motor 28 driven stirring vane 29, make the liquid medicine temperature in the storage tank even, in order to reach best washing effect.

As shown in fig. 3 and 4, the gate 18 includes a gate plate 1801 fixed on the cleaning box 2, the gate plate 1801 is provided with a mounting groove, the width of the center of the mounting groove is larger than the diameter of the rotary disk 6, a split telescopic joint 1802 is arranged in the mounting groove, and the shape of the mounting groove is matched with the shape of the telescopic joint 1802, and is generally in a step shape.

Sealing strips 1803 are arranged between the periphery of the telescopic joint 1802 and the flashboard 1801, the innermost end portion of the telescopic joint 1802 is provided with an arc-shaped groove 1804 matched with the lifting column 4, when the two opposite telescopic joints 1802 are opened in opposite directions, the rotary disc 6 can enter into a cavity above through a gap between the telescopic joints 1802, when the two opposite telescopic joints 1802 are closed, the arc-shaped groove 1804 is attached to the lifting column 4 to form sealing, the liquid medicine in the cavity is prevented from leaking to the cavity below, and therefore cross contamination of the liquid medicine is effectively avoided.

The flashboard 1801 has the protruding portion 1817 that makes progress to rise for form the depressed part 1818 between flashboard 1801 and the washing box 2, so that the installation flowing back valve discharge liquid, the mounting groove is seted up in the protruding portion 1817, make telescopic joint 1802's position be higher than the depressed part 1818, avoided liquid to reveal to the cavity below, when spraying liquid medicine, the liquid medicine is got rid of to washing box 2 inner wall by gyration dish 6, along inner wall inflow depressed part 1818, liquid medicine cross contamination has effectively been avoided. Specifically, as shown in fig. 5, the telescopic joint 1802 includes a first joint body 1805 fixedly installed on the gate plate 1801, a second joint body 1806 is slidably installed in the first joint body 1805, a third joint body 1807 is slidably installed in the second joint body 1806, an arc-shaped groove 1804 adapted to the lifting column 4 is provided at an outer end of the third joint body 1807, the first joint body 1805 is communicated with the second joint body 1806, a plunger 1810 slidably installed in the second joint body 1806 is fixedly installed at an end of the third joint body 1807, a third central cylinder 1808 is provided in the third joint body 1807, an oil through port is provided at one end of the third central cylinder 1808 far from the plunger 1811, the other end of the third central cylinder 1808 penetrates through the plunger 1811 and extends into the second joint body 1806, a second central cylinder 1809 is installed in the third central cylinder 1808, the second central cylinder 1809 is adapted to the second joint body 1806, a first central cylinder is installed in the second central cylinder 1809, the first center cylinder 1810 is matched with the first section body 1805, a first working oil port 1815 connected with an oil port is arranged at the end of the first center cylinder 1810, a second working oil port 1816 is arranged at the end of the first section body 1805, the second working oil port 1816 is communicated with an oil port A of the reversing valve, the first working oil port 1815 is communicated with an oil port B of the reversing valve, an oil port P of the reversing valve is connected with an oil inlet pipeline, an oil port T of the reversing valve is connected with an oil return pipeline, when the first working oil port 1815 takes oil, the second working oil port 1816 returns oil, the third section body 1807 retracts into the second section body 1806, the second section body 1806 is driven to retract into the first section body 1805, the opening of the gate 18 is realized, when the second working oil port 1816 takes oil, hydraulic oil pushes out the third section body 1807 and the second section body 1806, the gate 18 is closed, the arc-shaped groove 1804 plugs the lifting column 4, and the bottom sealing of the cavity is realized.

Here, the first section 1805, the second section 1806, and the third section 1807 are preferably of a cavity structure with a square cross section, and are sequentially sleeved together, and a sealing rubber strip is arranged between two adjacent sections, so that hydraulic oil cannot leak.

In order to improve the smoothness and accuracy of the sliding track of the telescopic joint 1802, a third guide cylinder 1812 is arranged in the third section 1807, the third guide cylinder 1812 and the third center cylinder 1808 are parallel to each other, one end of the third guide cylinder 1812 is fixed at one end of the third section 1807, which is far away from the plunger 1811, the other end of the third guide cylinder 1812 penetrates through the plunger 1811 and extends into the second section 1806, a second guide cylinder 1813 is arranged in the third guide cylinder 1812, the second guide cylinder 1813 is matched with the second section 1806, a first guide cylinder 1814 is arranged in the second guide cylinder 1813, the first guide cylinder 1814 is matched with the first section 1805, and the end of the first guide cylinder 1814 is fixed at the end of the first section 1805.

As shown in fig. 6 and 7, the first spray pipe 13, the first chemical liquid spray pipe 14, the second spray pipe 15, the second chemical liquid spray pipe 16 and the third spray pipe 17 all extend into the cleaning box 2, and the extending ends of the first spray pipe, the second chemical liquid spray pipe and the third spray pipe 17 are all hinged with one swing cylinder 24, the cylinder body of the swing cylinder 24 is hinged with the cleaning box 2, and the piston rod of the swing cylinder 24 is hinged with the corresponding first spray pipe 13, the first chemical liquid spray pipe 14, the second spray pipe 15, the second chemical liquid spray pipe 16, the third spray pipe 17 or the nitrogen gas spray pipe 41.

The first spray pipe 13, the first liquid medicine spray pipe 14, the second spray pipe 15, the second liquid medicine spray pipe 16, the third spray pipe 17 and the nitrogen gas spray pipe 41 are all installed on the cleaning box body 2 through a self-aligning bearing 22.

Therefore, the swing of the corresponding first spray pipe 13, the first liquid medicine spray pipe 14, the second spray pipe 15, the second liquid medicine spray pipe 16, the third spray pipe 17 and the nitrogen injection pipe 41 can be realized through the pushing of the swing cylinder 24, and the wafer can be completely sprayed or injected by swinging and injecting during use.

Sealing elements 23 are arranged between the first spray pipe 13, the first liquid medicine spray pipe 14, the second spray pipe 15, the second liquid medicine spray pipe 16, the third spray pipe 17, the nitrogen injection pipe 41 and the inner wall of the cleaning box body 2.

The sealing element 23 is usually a rubber sealing sleeve, and seals the gaps between the corresponding first spray pipe 13, first liquid medicine spray pipe 14, second spray pipe 15, second liquid medicine spray pipe 16, third spray pipe 17, nitrogen gas spray pipe 41 and the cleaning box body 2, and the sealing sleeve is a common component, usually a corrugated sealing sleeve, and can be selected by a person skilled in the art as required, and is not described herein.

First spray header 13, first liquid medicine shower 14, second spray header 15, second liquid medicine shower 16, third spray header 17 and nitrogen gas injection pipe 41 can be under the effect of swing cylinder 24, swing in rinsing box 2, when needing to spray or dry the wafer, swing to the reciprocal swing in gyration dish 6 top position under the effect of swing cylinder 24, when spraying or dry the end, gyration dish 6 need move up under the effect of lift post 4, under the effect of swing cylinder 24, the orbit that moves up of gyration dish 6 is deviate from, avoid taking place to interfere with gyration dish 6.

As shown in fig. 8, 9 and 10 together, a rotary pipe 30 driven by a servo motor 31 is rotatably mounted on the cleaning box body 2 through a bearing, the servo motor 31 is connected with the rotary pipe 30 through a gear pair transmission, the rotary pipe 30 extends into the cleaning box body 2 along the radial direction of the rotary disk 6, the height position of the rotary pipe 30 is usually arranged between the second liquid medicine spray pipe 16 and the third spray pipe 17, a slide carriage 32 driven by a first cylinder 33 is slidably mounted in the rotary pipe 30 along the axial direction, a diamond-shaped four-bar mechanism is mounted on one side of the slide carriage 32 far away from the first cylinder 33, the four-bar linkage mechanism comprises a first connecting bar 35, a second connecting bar 36, a third connecting bar 37 and a fourth connecting bar 38 which are sequentially hinged, a hinged point of the first connecting bar 35 and the fourth connecting bar 38 is hinged on the sliding seat 32, a second air cylinder 34 is installed on the sliding seat 32, a cylinder body of the second air cylinder 34 is fixedly installed on the sliding seat 32, the second air cylinder 34 and the first air cylinder 33 are located on the same side of the sliding seat 32, the hinged point of the second connecting bar 36 and the third connecting bar 37 is connected with a piston rod of the second air cylinder 34, the second connecting bar 36 and the third connecting bar 37 are both provided with extending portions extending out of the hinged point, the end portions of the extending portions are provided with clamping portions 39, and the clamping range of the clamping portions 39 is matched with the thickness of a wafer. The structure can realize automatic clamping and overturning of the wafer, and under the action of the first air cylinder 33, the clamping part 39 can avoid the lifting track of the rotary disk, so that the interference of lifting of the rotary disk is avoided, the manual overturning of the wafer is replaced, and the production efficiency of the wafer is further improved.

The rotary pipe 30 is provided with a limiting element for limiting the maximum stroke of the first air cylinder 33, the limiting element is usually selected to use a limiting screw 40, the limiting screw 40 is in threaded connection with the rotary pipe 30, the distance from the initial state to the limiting screw 40 of the first air cylinder 33 is smaller than the stroke of the first air cylinder 33, the limiting screw 40 limits the maximum extending position of the piston rod of the first air cylinder 33, and when the second air cylinder 34 pushes the four-bar linkage mechanism, the action of the second air cylinder 34 acts on the limiting screw 40 instead of the piston of the first air cylinder 33, so that the piston of the first air cylinder 33 is protected, and the service life of the first air cylinder 33 is prolonged.

The four-bar mechanism is provided with a compression spring arranged along the radial direction of the rotary pipe 30, the acting force of the compression spring can act on the four-bar mechanism in time, the clamping part 39 can be opened more quickly, and the wafer is effectively prevented from being subjected to the radial acting force of the clamping part 39.

The specific operation principle and the process flow of the integrated cleaning equipment for the wafer protective coating are as follows: when in use, an operator opens the cover plate 3, a proper amount of soaking liquid medicine is contained in the soaking cavity 201, the hydraulic oil cylinder 8 pushes the lifting column 4 to move upwards, the back of a wafer to be processed is placed on the sucking disc 7, the vacuum pump is started to fix the wafer on the rotary disc 6, the lifting column 4 moves downwards under the action of the hydraulic oil cylinder 8 to block the cover plate 3, the cleaning box body 2 is blocked, as shown in figure 1, the rotary disc 6 drives the wafer to sink into the soaking liquid medicine in the soaking cavity 201 to be soaked, after soaking is finished, the lifting column 4 drives the rotary disc 6 to move upwards to a position below the first spray water pipe 13, the swing air cylinder 24 swings the first spray water pipe 13 to the center position of the rotary disc 6 and swings back and forth according to a certain swing amplitude, at the moment, the first spray water pipe 13 starts to spray purified water, after the soaking liquid medicine residue is removed by flushing, the lifting column 4 moves upwards, as shown in figure 11, the wafer is transferred to the first flushing cavity 202, the expansion joint 1802 at the bottom of the first washing cavity 202 is closed, then the rotary motor 11 is started to drive the wafer to rotate, at the moment, the swing cylinder 24 moves the first liquid medicine spray pipe 14 to the upper part of the wafer to spray and wash the surface of the wafer, the second liquid discharge pipe 20 is opened, the washed first liquid medicine flows out and is collected through the second liquid discharge pipe 20, after the first liquid medicine is washed, the rotary motor 11 is not required to be closed, the first liquid medicine spray pipe 14 is swung out of the central position, the second liquid medicine spray pipe 15 is swung to the central position to spray purified water on the surface of the wafer to wash and remove the first liquid medicine residue, meanwhile, the first liquid medicine remained in the first washing cavity 202 is discharged through the second liquid discharge pipe 20, as shown in figure 12, the hydraulic oil cylinder 8 drives the wafer to be moved to the second washing cavity 203, the expansion joint 1802 at the bottom of the second washing cavity 203 is closed, the second liquid medicine spray pipe 16 is swung to the central position, spraying a second liquid medicine on the surface of the wafer, opening a third liquid discharge pipe 21 at the moment, discharging and collecting the liquid medicine through the third liquid discharge pipe 21, after spraying, swinging a third spray water pipe 17 to the upper part of the wafer to start pure water spray washing, after washing, driving the wafer to continuously rotate by a rotary motor 11 to throw off residual water drops on the front surface of the wafer, stopping the rotary motor 11, if the back surface of the wafer does not need cleaning, spraying nitrogen on the surface of the wafer by a nitrogen spraying pipe 41 to dry, after drying, taking out the wafer, if the back surface of some wafer products also needs cleaning, and allowing a sucker to adsorb on the front surface of the wafer products, actuating a first air cylinder 33, pushing a sliding seat 32 to move to the rotary disk 6, actuating a second air cylinder 34 to push a four-bar mechanism to deform after a jaw part 39 moves to the position of the wafer, combining two opposite jaw parts 39 to clamp the upper and lower surfaces of the wafer, the vacuum pump stops pumping air, the sucker 7 releases the wafer, the lifting column 4 moves downwards for a certain distance, the servo motor 31 is started, the rotary pipe 30 drives the wafer to turn 180 degrees, the lifting column 4 rises, the vacuum pump starts pumping air, the sucker 7 adsorbs the front side of the wafer, the second air cylinder 34 pulls the four-bar linkage mechanism to deform, the jaw part 39 opens, then the first air cylinder 33 pulls the sliding seat 32 back, the lifting column 4 moves downwards, the rotary motor 11 starts to repeat the previous actions, the first liquid medicine spraying and the second liquid medicine spraying are carried out on the back side of the wafer, after the spraying and flushing are finished, the nitrogen spraying and blowing pipe 41 sprays nitrogen on the surface of the wafer for drying, after the drying, the nitrogen spraying and blowing pipe 41 deviates from the central position, the rotary motor 11 stops, the cover plate 3 is opened, the hydraulic oil cylinder 8 drives the wafer to move upwards, the vacuum pump stops pumping air, and an operator can take out the processed wafer, and then another wafer to be cleaned is put in the cleaning machine and is continuously cleaned.

In order to reduce the labor intensity of an operator and improve the automation degree, a programmable controller or a microcomputer and other control units are usually used for controlling, and a temperature sensor and the like are arranged at a corresponding position so as to facilitate more accurate action instruction and temperature control and timely control related execution elements. And the pressure or flow rate of the individual chemical solution shower, shower pipe and nitrogen gas injection pipe 41 can be controlled to meet the use of wafers of different specifications.

As described above, the invention provides the integrated cleaning equipment for the wafer protective coating, and the integrated cleaning equipment for the wafer protective coating obtains a great number of excellent technical effects through a unique structural design, can realize soaking, spraying and drying in the closed cleaning box body, has good soaking and cleaning effects, shortens the soaking and cleaning time, further improves the production efficiency of wafers, can greatly improve the cleaning efficiency and the production efficiency, realizes full-automatic operation, and has good application potential in the field of semiconductor processing.

Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims (10)

1. A wafer protection coating integrated cleaning device comprises a support, wherein a cleaning box body is fixedly installed on the support, and a cover plate is covered on the top of the cleaning box body in a sealing manner; the cleaning box body is sequentially provided with a soaking cavity, a first flushing cavity and a second flushing cavity from bottom to top, gates are arranged between the soaking cavity and the first flushing cavity and between the first flushing cavity and the second flushing cavity, a first spray pipe is arranged at the top of the soaking cavity, a first liquid discharge pipe is arranged at the bottom of the soaking cavity, a first liquid medicine spray pipe and a second spray pipe are arranged at the top of the first flushing cavity, the second spray pipe is located above the first liquid medicine spray pipe, a second liquid discharge pipe is arranged at the bottom of the first flushing cavity, a second liquid medicine spray pipe and a third spray pipe are arranged at the top of the second flushing cavity, the third spray pipe is located above the second liquid medicine spray pipe, a third liquid discharge pipe is arranged at the bottom of the second flushing cavity, the first liquid medicine spray pipe is connected with a first liquid medicine storage tank, the second liquid medicine spray pipe is connected with a second liquid medicine storage tank, and a nitrogen spray pipe is arranged at the top of the second flushing cavity.

2. The integrated cleaning equipment for wafer protection coatings as claimed in claim 1, wherein the gate comprises a gate plate fixed on the cleaning box body, the gate plate is provided with an installation groove, the width of the center position of the installation groove is larger than the diameter of the rotary disk, and a split telescopic joint is arranged in the installation groove.

3. The integrated wafer protective coating cleaning device as claimed in claim 2, wherein a sealing strip is arranged between the periphery of the telescopic joint and the shutter.

4. The integrated cleaning device for wafer protective coating according to claim 3, characterized in that the end of the innermost layer of the telescopic joint is provided with an arc-shaped groove matched with the lifting column.

5. The integrated wafer protective coating cleaning device as claimed in claim 4, wherein the shutter has a protrusion portion protruding upward, and the mounting groove is opened in the protrusion portion.

6. The integrated cleaning equipment for the wafer protective coating according to any one of claims 1 to 5, wherein the first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe, the third spray pipe and the nitrogen gas spray pipe all extend into the cleaning box body, and the extending ends of the first spray pipe, the second liquid medicine spray pipe, the third spray pipe and the nitrogen gas spray pipe are hinged with one swing cylinder.

7. The integrated cleaning equipment for wafer protective coatings according to claim 6, wherein the first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe, the third spray pipe and the nitrogen gas spray pipe are all arranged on the cleaning box body through self-aligning bearings.

8. The integrated cleaning equipment for wafer protective coatings according to claim 7, wherein sealing elements are arranged between the first spray pipe, the first liquid medicine spray pipe, the second liquid medicine spray pipe, the third spray pipe and the nitrogen gas spray pipe and the inner wall of the cleaning box body.

9. The integrated cleaning equipment for wafer protective coatings according to any one of claims 1 to 8, wherein a rotary pipe driven by a servo motor is rotatably installed on the cleaning box body, the rotary pipe extends into the cleaning box body along the radial direction of the rotary disc, a sliding seat driven by a first air cylinder is installed in the rotary pipe in an axial sliding manner, a rhombic four-bar mechanism is installed on one side of the sliding seat far away from the first air cylinder, the four-bar mechanism comprises a first connecting bar, a second connecting bar, a third connecting bar and a fourth connecting bar which are sequentially hinged, a hinge point of the first connecting bar and the fourth connecting bar is hinged on the sliding seat, a second air cylinder is installed on the sliding seat, a hinge point of the second connecting bar and the third connecting bar is connected with a piston rod of the second air cylinder, the second connecting bar and the third connecting bar are both provided with extending portions extending out of the hinge point, and the end portion of the extending portion is provided with a clamping portion.

10. The integrated cleaning equipment for wafer protection coating according to claim 9, wherein the rotary pipe is provided with a limiting element for limiting the maximum stroke of the first cylinder.

Images