CN210171733U - Self-cleaning gluing device and wafer bearing tray for same - Google Patents
Self-cleaning gluing device and wafer bearing tray for same Download PDFInfo
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- CN210171733U CN210171733U CN201920861749.3U CN201920861749U CN210171733U CN 210171733 U CN210171733 U CN 210171733U CN 201920861749 U CN201920861749 U CN 201920861749U CN 210171733 U CN210171733 U CN 210171733U
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- bearing tray
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- wafer bearing
- cleaning liquid
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Abstract
The utility model relates to an automatically cleaning rubber coating device and automatically cleaning rubber coating device belong to the optical element production facility field of receiving a nanometer with holding piece tray. The self-cleaning gluing device comprises a protective cover upper cover, a protective cover base, a sheet bearing tray, a cleaning device, a vacuum adsorption system, a driving motor and a rotating shaft. An obliquely upward pipeline is arranged in the radial direction in the wafer bearing tray and used for spraying cleaning liquid, and the wafer bearing tray can fully clean the side wall of the protective cover in the rotating process; the cleaning device comprises a cleaning liquid supply device and a cleaning liquid pipe; the cleaning liquid pipe is connected with the bottom of the wafer bearing tray. The side wall of the upper cover of the protective cover is arc-shaped in the area corresponding to and above the wafer and is used for changing the sputtering direction of the photoresist and solving the problems of the comet tail of the surface of the photoresist and the like; an obliquely upward cleaning liquid channel is formed in the wafer bearing tray and used for spraying cleaning liquid to comprehensively clean the inner wall of the protective cover; the side wall of the bottom of the protective cover is in the shape of an arc slope, so that waste liquid after cleaning is easily discharged, and the operation is simple. The whole device has low complexity and low cost.
Description
Technical Field
The utility model relates to an automatically cleaning rubber coating device and automatically cleaning rubber coating device belong to the optical element production facility field of receiving a nanometer with holding piece tray.
Background
The gluing is an important process in the production process of the micro-nano optical element, and refers to the process of uniformly coating photoresist on the surface of a wafer. At present, spin-on coating equipment is generally used for coating photoresist, and the principle is that the photoresist dropped in the central area of a wafer is flatly laid on the surface of the wafer during low-speed movement, and redundant photoresist on the surface is thrown out of the wafer during subsequent high-speed movement, so that the effect of uniform and consistent photoresist thickness is achieved.
In the spin coating mode, after the photoresist is thrown out of the surface of the wafer at a high speed, the photoresist rebounds on the inner wall of the protective cover, part of the photoresist returns to the surface of the wafer again, the sputtering phenomenon of the photoresist surface such as comet tail or halo is generated, the uniformity of the photoresist surface is damaged, and the subsequent photoetching is adversely affected; in addition, most of the photoresist thrown out will adhere to the inner wall of the protective cover, and if not cleaned regularly, the surface of the wafer will be contaminated during the spin coating process.
The existing gluing device generally has the phenomenon of photoresist sputtering, and the method for solving the problem mainly comprises the following steps: the problem of photoetching sputtering is relieved by reducing the rotating speed of the wafer, and the problem is not solved fundamentally; patent CN203561823 proposes a glue applicator chamber, which adopts a glue cup cover with a trapezoidal cross section to replace the original cylindrical outer cover; patent CN107783374 proposes a glue spreader system, which introduces an air pumping system to take away photoresist particles in addition to the inclined side wall; however, neither of the above two methods considers how to clean the photoresist adhered to the sidewall of the spin coater.
At present, the side wall of the spin coater is cleaned in a disassembling and cleaning mode generally, and the cleaning cost is high and the time consumption is long. Patent CN203764494 proposes a neotype rubber coating machine device, changes the safety cover into dustcoat and the inner cover that can move relative to the dustcoat, through reciprocating and the horizontal rotation of inner cover, washs the inner cover, has saved and has demolishd abluent step. The cleaning process of the mode is relatively complex, the up-down movement and the horizontal rotation of the inner cover are controlled by an additional driving motor, the cost is high, and the system is complex.
SUMMERY OF THE UTILITY MODEL
For solving above-mentioned photoresist sputtering problem and spin coater lateral wall photoresist washing problem, the utility model provides a automatically cleaning rubber coating device and automatically cleaning rubber coating device are with holding piece tray.
The purpose of the utility model is realized like this:
a self-cleaning gluing device comprises a protective cover upper cover, a protective cover base, a sheet bearing tray, a cleaning device, a vacuum adsorption system, a driving motor and a rotating shaft;
the side wall of the upper cover of the protective cover is arc-shaped in the area corresponding to and above the wafer and is used for changing the sputtering direction of the photoresist;
the side wall of the base of the protective cover base is a round-corner inclined plane, so that photoresist and cleaning liquid can flow out conveniently;
an obliquely upward pipeline is arranged in the radial direction in the wafer bearing tray, the angle between the oblique direction and the horizontal line is 4-12 degrees, the pipeline is used for spraying cleaning liquid, and the wafer bearing tray can fully clean the side wall of the upper cover in the rotating process; a through hole is formed in the middle of the wafer bearing tray, an air guide channel is formed in the upper surface of the wafer bearing tray, the upper side of the through hole is connected with the air guide channel, and the lower side of the through hole is connected with the vacuum adsorption system; a counter bore is formed in the middle of the wafer bearing tray, the upper end of the counter bore is communicated with the obliquely upward pipeline, and the lower end of the counter bore is connected with a cleaning fluid pipe;
the cleaning device comprises a cleaning liquid supply device and a cleaning liquid pipe, and the cleaning liquid pipe is connected with the bottom of the wafer bearing tray.
Above-mentioned automatically cleaning rubber coating device still includes waste liquid collection device, safety cover base lower extreme links to each other with waste liquid collection device via the waste liquid pipeline.
In the self-cleaning gluing device, the driving motor is a hollow shaft motor.
A self-cleaning glue spreading device is provided with a sheet bearing tray, wherein an inclined upward pipeline is arranged in the radial direction of the inner part of the sheet bearing tray, the angle between the inclined direction and the horizontal line is 4-12 degrees, the pipeline is used for spraying cleaning liquid, and the sheet bearing tray can fully clean the side wall of an upper cover in the rotating process; a through hole is formed in the middle of the wafer bearing tray, an air guide channel is formed in the upper surface of the wafer bearing tray, the upper side of the through hole is connected with the air guide channel, and the lower side of the through hole is connected with a vacuum adsorption system; and a counter bore is formed in the middle of the wafer bearing tray, the upper end of the counter bore is communicated with the obliquely upward pipeline, and the lower end of the counter bore is connected with the cleaning fluid pipe.
The working principle of the photoresist spin-coating device is as follows:
and closing the cleaning device during gluing, placing the substrate to be glued on the substrate bearing tray, adsorbing the substrate to be glued by the vacuum adsorption system through the central through hole of the substrate bearing tray, and driving the substrate bearing tray to drive the substrate to rotate by the driving motor. Because the side wall of the upper cover of the protective cover is arc-shaped in the area corresponding to and above the wafer, the sputtering direction of the photoresist can be effectively changed, and the problem that the photoresist rebounds to the wafer to damage the uniformity of the photoresist surface is solved.
And when the coating is finished and the cleaning is carried out, closing the vacuum adsorption system, taking out the wafer substrate, and starting the cleaning device. And starting the driving motor to drive the sheet bearing tray to rotate. Cleaning liquid is introduced into the cleaning device, and the cleaning liquid is sprayed upwards through the inclined upward channel inside the wafer bearing tray to rotate, so that the photoresist on the inner wall of the protective cover is cleaned. The cleaned cleaning liquid and the cleaned photoresist flow out of the photoresist spin coating device along the round angle inclined plane at the bottom of the protective cover, so that the aim of comprehensive cleaning is fulfilled.
Has the advantages that:
firstly, the side wall of the upper cover of the protective cover is designed into an arc shape, so that the sputtering direction of the photoresist can be effectively changed, the problem that the photoresist rebounds to the wafer to damage the uniformity of the photoresist surface is solved, and the yield of the gluing is improved;
secondly, when the upper cover of the protective cover is buckled, a relatively sealed space is formed inside the photoresist spin-coating device, so that the volatilization of photoresist can be reduced, and the improvement of the uniformity of the photoresist is facilitated;
thirdly, the purpose of cleaning the photoresist spin coating device can be achieved without disassembly, the wafer bearing tray is provided with an obliquely upward channel for spraying cleaning liquid, and waste liquid and photoresist after cleaning are discharged by virtue of the inclined surface at the bottom of the protective cover, so that the purpose of cleaning equipment is achieved, and the complexity of a system and the time cost of cleaning the equipment are reduced.
Drawings
Fig. 1 is a schematic structural view of the self-cleaning gluing device of the present invention.
Fig. 2 is a schematic structural view of the wafer supporting tray for the self-cleaning glue spreading device of the present invention.
In the figure: 1 protective cover upper cover, 11 upper cover side wall, 2 protective cover base, 21 base side wall, 3 sheet bearing tray, 31 pipeline, 32 through hole, 33 air guide channel, 34 counter bore, 4 cleaning device, 41 cleaning liquid supply device, 42 cleaning liquid pipe, 5 vacuum adsorption system, 6 driving motor, 7 rotating shaft, 8 waste liquid collecting device, 9 driving motor.
Detailed Description
The following describes in further detail embodiments of the present invention with reference to the accompanying drawings.
Detailed description of the preferred embodiment
The embodiment is an embodiment of a self-cleaning gluing device.
The self-cleaning gluing device of the embodiment has a structure schematic diagram as shown in fig. 1, and comprises a protective cover upper cover 1, a protective cover base 2, a sheet bearing tray 3, a cleaning device 4, a vacuum adsorption system 5, a driving motor 6 and a rotating shaft 7;
the upper cover side wall 11 of the upper cover 1 of the protective cover is arc-shaped in the area corresponding to the wafer and above the wafer and is used for changing the sputtering direction of the photoresist;
the base side wall 21 of the protective cover base 2 is a round-angle inclined plane, so that photoresist and cleaning liquid can flow out conveniently;
the structural schematic diagram of the wafer bearing tray 3 is shown in fig. 2, wherein fig. 2(a) is an upper view and a cross-sectional view of the wafer bearing tray, and fig. 2(b) is an axial view of the wafer bearing tray; an inclined upward pipeline 31 is arranged in the radial direction in the wafer bearing tray, the angle between the inclined direction and the horizontal line is 4-12 degrees, the pipeline 31 is used for spraying cleaning liquid, and the wafer bearing tray 3 can fully clean the side wall 11 of the upper cover in the rotating process; a through hole 32 is formed in the middle of the wafer bearing tray 3, an air guide channel 33 is formed in the upper surface of the wafer bearing tray 3, the upper side of the through hole 32 is connected with the air guide channel 33, and the lower side of the through hole 32 is connected with the vacuum adsorption system 5; a counter bore 34 is formed in the middle of the wafer bearing tray 3, the upper end of the counter bore 34 is communicated with the obliquely upward pipeline 31, and the lower end of the counter bore 34 is connected with a cleaning liquid pipe 42;
the cleaning device 4 comprises a cleaning liquid supply device 41 and a cleaning liquid pipe 42, and the cleaning liquid pipe 42 is connected with the bottom of the sheet bearing tray 3.
The working process of the photoresist spin-coating device is as follows:
when in gluing, the cleaning device is closed, the substrate to be glued is placed on the substrate bearing tray 3, the vacuum adsorption system 5 adsorbs the substrate to be glued through the central through hole of the substrate bearing tray 3, and the driving motor 6 drives the substrate bearing tray 3 to rotate through the rotating shaft 7, so as to drive the substrate to rotate. The photoresist is thrown out under the action of centrifugal force, the movement direction is changed on the arc-shaped side wall of the upper cover 1 of the movement protective cover, the movement route is shown by a dotted line arrow in figure 1 and flows out along the inner wall of the protective cover and the bottom of the slope, and the problem that the photoresist rebounds to the wafer to damage the uniformity of the photoresist surface is solved.
And when the gluing is finished and the cleaning is carried out, closing the vacuum adsorption system 5, opening the upper cover 1 of the protective cover, taking out the wafer substrate, closing the upper cover 1 of the protective cover and cleaning the device 4. And starting a driving motor (6) to drive the wafer bearing tray 3 to rotate. Cleaning liquid is introduced into the cleaning device 4, and the cleaning liquid is sprayed upwards through the inclined upward channel 31 in the wafer bearing tray 3 to clean the photoresist on the inner wall of the protective cover. The movement route of the cleaning liquid is shown by a solid arrow in fig. 1, the cleaning liquid is upwards sprayed to the inner wall of the protective cover upper cover 1 and then flows out along the inner wall and the bottom of the slope, and the cleaning liquid enters the waste liquid collecting device 8 through the waste liquid pipeline 9, so that the purpose of comprehensive cleaning is achieved.
Detailed description of the invention
The embodiment is an embodiment of a self-cleaning gluing device.
The self-cleaning gluing device of the embodiment further comprises a waste liquid collecting device 8 on the basis of the first specific embodiment, and the lower end of the protective cover base 2 is connected with the waste liquid collecting device 8 through a waste liquid pipeline 9.
Detailed description of the preferred embodiment
The embodiment is an embodiment of a self-cleaning gluing device.
The self-cleaning gluing device of the embodiment further defines the driving motor 6 as a hollow shaft motor on the basis of the first embodiment or the second embodiment. Only in the case of a hollow shaft motor as the drive motor 6, this can be achieved in that the wash liquor pipe 42 and the lines in the vacuum suction system 5 can pass through the rotary shaft 7.
Detailed description of the invention
The embodiment is an embodiment of a wafer bearing tray for a self-cleaning gluing device.
The structure schematic diagram of the wafer bearing tray for the self-cleaning gluing device of the embodiment is shown in fig. 2, wherein fig. 2(a) is a top view and a cross-sectional view of the wafer bearing tray, and fig. 2(b) is an axial view of the wafer bearing tray; an inclined upward pipeline 31 is arranged in the radial direction in the wafer bearing tray of the self-cleaning gluing device, the angle between the inclined direction and the horizontal line is 4-12 degrees, the pipeline 31 is used for spraying cleaning liquid, and the wafer bearing tray 3 can fully clean the side wall 11 of the upper cover in the rotating process; a through hole 32 is formed in the middle of the wafer bearing tray 3, an air guide channel 33 is formed in the upper surface of the wafer bearing tray 3, the upper side of the through hole 32 is connected with the air guide channel 33, and the lower side of the through hole 32 is connected with the vacuum adsorption system 5; a counter bore 34 is arranged in the middle of the wafer bearing tray 3, the upper end of the counter bore 34 is communicated with the obliquely upward pipeline 31, and the lower end of the counter bore 34 is connected with a cleaning liquid pipe 42.
Claims (4)
1. A self-cleaning gluing device is characterized by comprising a protective cover upper cover (1), a protective cover base (2), a wafer bearing tray (3), a cleaning device (4), a vacuum adsorption system (5), a driving motor (6) and a rotating shaft (7);
the upper cover side wall (11) of the upper cover (1) of the protective cover is arc-shaped in the area corresponding to and above the wafer and is used for changing the sputtering direction of the photoresist;
the side wall (21) of the base of the protective cover base (2) is a rounded inclined plane, so that photoresist and cleaning liquid can flow out conveniently;
an inclined upward pipeline (31) is arranged in the radial direction in the wafer bearing tray (3), the angle between the inclined direction and the horizontal line is 4-12 degrees, the pipeline (31) is used for spraying cleaning liquid, and the wafer bearing tray (3) can fully clean the side wall (11) of the upper cover in the rotating process; a through hole (32) is formed in the middle of the wafer bearing tray (3), an air guide channel (33) is formed in the upper surface of the wafer bearing tray (3), the upper side of the through hole (32) is connected with the air guide channel (33), and the lower side of the through hole (32) is connected with the vacuum adsorption system (5); a counter bore (34) is formed in the middle of the wafer bearing tray (3), the upper end of the counter bore (34) is communicated with the obliquely upward pipeline (31), and the lower end of the counter bore (34) is connected with a cleaning liquid pipe (42);
the cleaning device (4) comprises a cleaning liquid supply device (41) and a cleaning liquid pipe (42), and the cleaning liquid pipe (42) is connected with the bottom of the wafer bearing tray (3).
2. Self-cleaning gluing device according to claim 1, characterised in that it further comprises a waste liquid collecting device (8), the lower end of the protective cover base (2) being connected to the waste liquid collecting device (8) via a waste liquid conduit (9).
3. Self-cleaning gluing device according to claim 1 or 2, characterised in that said drive motor (6) is a hollow shaft motor.
4. A wafer bearing tray for a self-cleaning gluing device is characterized in that an obliquely upward pipeline (31) is arranged in the radial direction of the interior of the wafer bearing tray, the angle between the oblique direction and the horizontal line is 4-12 degrees, the pipeline (31) is used for spraying cleaning liquid, and the wafer bearing tray (3) can fully clean the side wall (11) of an upper cover in the rotating process; a through hole (32) is formed in the middle of the wafer bearing tray (3), an air guide channel (33) is formed in the upper surface of the wafer bearing tray (3), the upper side of the through hole (32) is connected with the air guide channel (33), and the lower side of the through hole (32) is connected with a vacuum adsorption system (5); a counter bore (34) is formed in the middle of the wafer bearing tray (3), the upper end of the counter bore (34) is communicated with the obliquely upward pipeline (31), and the lower end of the counter bore (34) is connected with a cleaning liquid pipe (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920861749.3U CN210171733U (en) | 2019-06-10 | 2019-06-10 | Self-cleaning gluing device and wafer bearing tray for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920861749.3U CN210171733U (en) | 2019-06-10 | 2019-06-10 | Self-cleaning gluing device and wafer bearing tray for same |
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| Publication Number | Publication Date |
|---|---|
| CN210171733U true CN210171733U (en) | 2020-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920861749.3U Active CN210171733U (en) | 2019-06-10 | 2019-06-10 | Self-cleaning gluing device and wafer bearing tray for same |
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| CN (1) | CN210171733U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112083629A (en) * | 2020-08-05 | 2020-12-15 | 宁波润华全芯微电子设备有限公司 | Novel glue cup for photoetching glue |
| CN112588159A (en) * | 2020-12-11 | 2021-04-02 | 漳州捷龙自动化技术有限公司 | Drum glue mixer capable of stirring uniformly |
| CN112808670A (en) * | 2020-12-30 | 2021-05-18 | 上海至纯洁净系统科技股份有限公司 | Semiconductor cleaning equipment with self-cleaning function |
| CN114345643A (en) * | 2021-12-10 | 2022-04-15 | 江阴市纪泽万家科技有限公司 | Spin coater with light path |
-
2019
- 2019-06-10 CN CN201920861749.3U patent/CN210171733U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112083629A (en) * | 2020-08-05 | 2020-12-15 | 宁波润华全芯微电子设备有限公司 | Novel glue cup for photoetching glue |
| CN112588159A (en) * | 2020-12-11 | 2021-04-02 | 漳州捷龙自动化技术有限公司 | Drum glue mixer capable of stirring uniformly |
| CN112808670A (en) * | 2020-12-30 | 2021-05-18 | 上海至纯洁净系统科技股份有限公司 | Semiconductor cleaning equipment with self-cleaning function |
| CN114345643A (en) * | 2021-12-10 | 2022-04-15 | 江阴市纪泽万家科技有限公司 | Spin coater with light path |
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