CN115884875B - 转印膜、层叠体的制造方法、电路配线的制造方法、电子器件的制造方法 - Google Patents

转印膜、层叠体的制造方法、电路配线的制造方法、电子器件的制造方法 Download PDF

Info

Publication number
CN115884875B
CN115884875B CN202180050843.0A CN202180050843A CN115884875B CN 115884875 B CN115884875 B CN 115884875B CN 202180050843 A CN202180050843 A CN 202180050843A CN 115884875 B CN115884875 B CN 115884875B
Authority
CN
China
Prior art keywords
resin composition
composition layer
group
transfer film
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180050843.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN115884875A (zh
Inventor
山田悟
野副宽
两角一真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN115884875A publication Critical patent/CN115884875A/zh
Application granted granted Critical
Publication of CN115884875B publication Critical patent/CN115884875B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
CN202180050843.0A 2020-08-24 2021-08-19 转印膜、层叠体的制造方法、电路配线的制造方法、电子器件的制造方法 Active CN115884875B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020140811 2020-08-24
JP2020-140811 2020-08-24
PCT/JP2021/030399 WO2022044963A1 (ja) 2020-08-24 2021-08-19 転写フィルム、積層体の製造方法、回路配線の製造方法、電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
CN115884875A CN115884875A (zh) 2023-03-31
CN115884875B true CN115884875B (zh) 2025-05-30

Family

ID=80355084

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180050843.0A Active CN115884875B (zh) 2020-08-24 2021-08-19 转印膜、层叠体的制造方法、电路配线的制造方法、电子器件的制造方法

Country Status (5)

Country Link
US (1) US20230194988A1 (https=)
JP (1) JP7682185B2 (https=)
CN (1) CN115884875B (https=)
TW (1) TWI867240B (https=)
WO (1) WO2022044963A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021075304A1 (ja) * 2019-10-18 2021-04-22 富士フイルム株式会社 透明積層体、画像表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101568883A (zh) * 2006-12-27 2009-10-28 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法
CN102341753A (zh) * 2009-03-13 2012-02-01 日立化成工业株式会社 感光性树脂组合物、使用了该组合物的感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7128412B2 (en) * 2003-10-03 2006-10-31 Xerox Corporation Printing processes employing intermediate transfer with molten intermediate transfer materials
JP2010078814A (ja) 2008-09-25 2010-04-08 Fujifilm Corp 感光性樹脂組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP5608413B2 (ja) 2010-04-30 2014-10-15 太陽ホールディングス株式会社 硬化性樹脂組成物
JP4947244B2 (ja) 2010-06-02 2012-06-06 Ｄｉｃ株式会社 カチオン重合性組成物、それを含む接着剤、ならびに、それらを用いて得られた硬化物及び偏光板
WO2017057348A1 (ja) 2015-09-29 2017-04-06 富士フイルム株式会社 転写フィルム、静電容量型入力装置の電極保護膜、積層体、積層体の製造方法および静電容量型入力装置
WO2018155193A1 (ja) * 2017-02-22 2018-08-30 富士フイルム株式会社 感光性転写材料、回路配線の製造方法及びタッチパネルの製造方法
WO2019065373A1 (ja) * 2017-09-29 2019-04-04 富士フイルム株式会社 感光性転写材料、回路配線の製造方法及びタッチパネルの製造方法
JP2019133143A (ja) * 2018-01-30 2019-08-08 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
JPWO2020105457A1 (ja) 2018-11-20 2021-10-14 富士フイルム株式会社 転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101568883A (zh) * 2006-12-27 2009-10-28 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法
CN102341753A (zh) * 2009-03-13 2012-02-01 日立化成工业株式会社 感光性树脂组合物、使用了该组合物的感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法

Also Published As

Publication number Publication date
CN115884875A (zh) 2023-03-31
TW202224952A (zh) 2022-07-01
WO2022044963A1 (ja) 2022-03-03
US20230194988A1 (en) 2023-06-22
JP7682185B2 (ja) 2025-05-23
JPWO2022044963A1 (https=) 2022-03-03
TWI867240B (zh) 2024-12-21

Similar Documents

Publication Publication Date Title
CN115768838B (zh) 组合物、转印膜、层叠体的制造方法、电路配线的制造方法及电子器件的制造方法
US12426166B2 (en) Method of manufacturing conductive pattern, touch sensor, electromagnetic wave shield, antenna, wiring board, conductive heating element, and structure
CN116157433B (zh) 组合物、转印膜、层叠体的制造方法、电路配线的制造方法及电子器件的制造方法
TW202208988A (zh) 結構體的製造方法及結構體
CN115884875B (zh) 转印膜、层叠体的制造方法、电路配线的制造方法、电子器件的制造方法
JP7530983B2 (ja) 転写フィルム、積層体の製造方法、回路配線の製造方法、及び電子デバイスの製造方法
TWI894437B (zh) 具有導體圖案之積層體之製造方法
CN115087927A (zh) 感光性薄膜以及感光性薄膜的制造方法
JP7759347B2 (ja) 積層体の製造方法、回路配線の製造方法、転写フィルム
CN115485621B (zh) 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法
JP7771090B2 (ja) 感光性転写材料、樹脂パターンの製造方法、積層体の製造方法、回路配線の製造方法、及び、電子デバイスの製造方法
TWI921429B (zh) 轉印材料及積層體之製造方法
CN114930250B (zh) 树脂图案的制造方法、电路配线的制造方法、触摸面板的制造方法及感光性转印部件
CN116868125A (zh) 层叠体的制造方法、电路布线的制造方法
CN115542669A (zh) 层叠体、转印膜、图案形成方法、电路板的制造方法
CN116149139A (zh) 感光性组合物、转印膜、图案形成方法、电路配线的制造方法
TW202311049A (zh) 轉印膜、具有導體圖案之積層體之製造方法
CN116981996A (zh) 转印膜、层叠体的制造方法、电路配线的制造方法
CN116981997A (zh) 具有导体图案的层叠体的制造方法
CN117940848A (zh) 转印膜、转印膜的制造方法、图案形成方法、电路布线的制造方法、触摸面板的制造方法
CN115480446A (zh) 转印膜、层叠体、图案形成方法、电路板的制造方法
CN116745697A (zh) 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法
CN116670588A (zh) 感光性转印材料、树脂图案的制造方法、层叠体的制造方法、电路配线的制造方法及电子器件的制造方法
CN116249939A (zh) 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及电子设备的制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant