CN115866892A - Process method for plugging holes in PCB (printed circuit board) by resin - Google Patents
Process method for plugging holes in PCB (printed circuit board) by resin Download PDFInfo
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- CN115866892A CN115866892A CN202211489398.0A CN202211489398A CN115866892A CN 115866892 A CN115866892 A CN 115866892A CN 202211489398 A CN202211489398 A CN 202211489398A CN 115866892 A CN115866892 A CN 115866892A
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- resin
- processing plate
- plugging
- holes
- pcb
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
Abstract
The invention relates to the technical field of printed circuit board processing, and provides a process method for plugging holes in a PCB resin, which comprises the following steps: cutting: drilling holes on the processing plate; electroplating: the processing plate is sequentially plated with copper and the whole plate to metalize the holes; vacuum resin hole plugging: the processing plate is vertically hung, and the plug hole head moves downwards to fill resin in the plug hole; setting a scraper: two sides of the processing plate are respectively provided with a scraper, resin on the surface of the processing plate is scraped by the scrapers, and the two scrapers move by adopting non-equal-height synchronous flitch; and (3) curing: heating and baking the processing plate to solidify the resin in the plug hole; grinding: and grinding the polishing piece to remove the excessive resin layer protruding on the processing plate. The invention can ensure that pits and depressions appearing in the plug holes are smaller or not to a certain extent, the plug holes are fuller, and the filling effect is better.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a process method for plugging holes in a PCB resin.
Background
In some working sections of the PCB board in the processing process, resin is required to fill processed holes with resin, especially in some products with high layers and large board thickness, and copper plating or lamination of other boards may be required on the surface of the resin after filling, so that the quality requirement of resin hole filling is high.
A vacuum hole plugging machine is used for plugging holes in PCB resin, and the working process of the vacuum hole plugging machine is mainly characterized in that after equipment is vacuumized, ink in an ink clip is pushed to small holes in a hole plugging head by a piston, the two transversely moving hole plugging heads clamp a board firstly, and the ink is filled into through holes or blind holes of the board through a plurality of small holes in the hole plugging head. The plate is vertically hung in a vacuum box, the transversely moving hole plugging head can synchronously move downwards until holes in the plate are filled with resin, and after hole plugging is completed, ink for plugging holes in the plate is scraped by a scraper. However, in the process of drying and curing the plugged holes, the resin can shrink, so that pits at the plugged holes can be sunken, the plugged holes are not full, or gaps exist in the resin-plugged holes, so that the quality of the plugged holes is not satisfactory, and adverse effects are caused on subsequent processes.
Disclosure of Invention
The invention aims to provide a process method for plugging holes in PCB resin, which can reduce or avoid the occurrence of hole plugging depression and pits, and has the advantages of more full hole plugging and better filling effect.
The embodiment of the invention is realized by the following technical scheme: a process method for plugging holes with resin in a PCB comprises the following steps:
s1, cutting: drilling holes in the processing plate;
s2, electroplating: the processing plate is sequentially plated with copper and the whole plate to metalize the holes;
s3, vacuum resin hole plugging: the processing plate is vertically hung, and the plug hole head moves downwards to fill resin in the plug hole;
s4, setting a scraper: two sides of the processing plate are respectively provided with a scraper, resin on the surface of the processing plate is scraped by the scrapers, and the two scrapers move by adopting non-equal-height synchronous flitch;
s5, curing: heating and baking the processing plate to solidify the resin in the plug hole;
s6, grinding: grinding the polishing piece to remove the excess resin layer protruding from the processing plate;
further, in the step S3, the filling pressure of a plug hole head of the vacuum plug hole machine is adjusted to be 0-4bar;
further, in step S4, after the scraper on one side of the processing plate is scraped, the scraper on the other side moves down to scrape off the resin.
Further, in steps S5-S6, the processing plate is horizontally vacuum-plugged, secondary resin filling is performed, and curing is performed.
Further, the viscosity of the resin for plugging the holes in step S3 is 500 to 800dpas.
Further, in step S5, the baking curing time is 30min-60min, and the baking temperature is 100-130 ℃.
Further, in the step S4, the moving speed of the scraper is 12-15cm/S.
Further, in step S6, the resin on the processing plate is polished using a ceramic roller.
The technical scheme of the embodiment of the invention at least has the following advantages and beneficial effects: compared with the prior art, the invention improves and optimizes the process, after resin is filled in the holes of the processing plate by using a vacuum hole plugging machine, the scrapers at two sides of the processing plate have time difference or height difference in working, so that after the left resin of the same hole plugging on the processing plate is scraped by one of the scrapers, the other scraper can scrape the resin through the right side of the hole plugging, and thus when the left scraper moves downwards, the resin in the hole plugging can be extruded to the right to a certain extent to form a part, the left resin of the processing plate is scraped to be flat, and the right resin can protrude a part of resin.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments.
Examples
The following embodiments are further described, and the present embodiment is a process method for resin plugging holes of a PCB, including the following steps:
s1, cutting: drilling holes on the processing plate; according to the design drawing, a mechanical drilling mode is used for drilling holes in the processing plate, and the processed holes mainly comprise plug holes needing resin filling.
S2, electroplating: the processing plate is sequentially plated with copper and the whole plate to metalize the holes; the pores of the processed board are metallized by depositing a thin layer of copper on the walls of the pores by a chemical reaction.
S3, vacuum resin hole plugging: the processing plate is vertically hung, and the plug hole head moves downwards to fill resin in the plug hole; the plug hole head works on two sides of the processing plate simultaneously, the plug hole head moves to the bottom from the upper side of the processing plate, and vacuum needs to be pumped for a certain time before plug hole.
S4, setting a scraper: two sides of the processing plate are respectively provided with a scraper, resin on the surface of the processing plate is scraped by the scrapers, and the two scrapers move by adopting non-equal-height synchronous flitch; specifically, the resin is filled in the plug holes, redundant resin overflows on two sides, and compared with the resin on two sides of the scraper synchronous equal-height downward scraping processing plate in the prior art, the two scrapers cannot simultaneously pass through two sides of the same plug hole, more specifically, the two scrapers can have a forward and backward downward moving sequence, so that one scraper can pass through the right side of the plug hole after passing through the left side of the same plug hole, the scraper on the right side can pass through the right side of the plug hole, the volume of the filled resin in the plug hole is slightly larger than the volume of the plug hole, and the excessive volume difference can offset the shrinkage after the resin is cured.
S5, curing: heating and baking the processing plate to solidify the resin in the plug hole; the resin is dried and cured by adopting a gradient heating mode, for example, 30min is baked at 80 ℃, 60min is baked at 100 ℃, and the resin can continuously shrink towards the middle part, namely towards the inside of the plug hole.
S6, grinding: and grinding by a grinding piece to remove the excessive resin layer protruding on the processing plate. More specifically, processing board surface after the first packing resin of consent remains has unnecessary resin, needs to get rid of the resin layer through the grinding, can adopt the corase grind and the mode that combines together of polishing of essence, and the face texture of the board is softer than the processing board in resin layer, uses the corase grind earlier when the resin layer is thicker to get rid of most of the resin layer, adopts the finish machining of correct grinding when the resin layer is thinner to prevent to cause excessive damage to the face of processing board.
On the basis, more specifically, in step S3, the filling pressure of the plugging head of the vacuum plugging machine is adjusted to 0-4bar, and through pressure adjustment and measurement, the excessive pressure of the vacuum plugging machine can cause the filled resin to be brought out of the plugging hole, and the plugging hole is not filled.
In the step S4, after the scraper on one side of the processing plate scrapes off, the scraper on the other side moves down to scrape off the resin, when resin scraping is performed on two sides of the processing plate in the prior art, the scraper moves down from two sides of the processing plate synchronously to scrape off the resin, so that the resin amount in the plug hole is just filled in the plug hole, and in the subsequent drying and curing process, the resin shrinks to cause the plug hole to be not filled fully, so that a depression occurs.
And S5-S6, horizontally vacuum plugging the machining plate, filling and curing secondary resin, wherein on the basis, smaller pits may exist, the machining plate is horizontally placed, and fine filling is performed at two sides of the plugging hole, so that the flatness of plugging hole filling is further improved.
The viscosity of the resin for plugging the holes in the step S3 is 500-800dpas; specifically, the processing plate is filled in a vertical vacuum mode, if the viscosity of the resin is too low, the resin can easily flow out of the plug holes after the plug holes are completed, and through tests, the resin with the viscosity of about 650dpas can be well adhered to the plug holes with the diameter of 0.3-0.5mm, so that resin overflow holes at multiple positions on the processing plate can be effectively avoided.
In step S5, the baking curing time is 30min-60min, and the baking temperature is 100-130 ℃.
In the step S4, the downward moving speed of the scraper is 12-15cm/S; specifically, the scraper speed should not be too fast nor too slow, and the filling fullness of the plug holes is influenced to a certain extent.
In step S6, grinding the resin on the processing plate by using a ceramic roller; specifically, a ceramic roller is used for roughly polishing redundant resin layers on the processing plate, a flexible needle brush is used for finely polishing, and the flexible needle brush is made of silicon carbide.
The present invention has been described in terms of the preferred embodiment, and it is not intended to be limited to the embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A process method for plugging holes with resin in a PCB is characterized by comprising the following steps:
s1, cutting: drilling holes on the processing plate;
s2, electroplating: the processing plate is sequentially plated with copper and the whole plate to metalize the holes;
s3, vacuum resin hole plugging: the processing plate is vertically hung, and the plug hole head moves downwards to fill the plug hole with resin;
s4, setting a scraper: two sides of the processing plate are respectively provided with a scraper, resin on the surface of the processing plate is scraped by the scrapers, and the two scrapers move by adopting non-equal-height synchronous flitch;
s5, curing: heating and baking the processing plate to solidify the resin in the plug hole;
s6, grinding: and grinding the polishing piece to remove the excessive resin layer protruding on the processing plate.
2. The process of resin plugging holes of PCB board according to claim 1 wherein: and in the step S3, the filling pressure of a plug hole head of the vacuum plug hole machine is adjusted to be 0-4bar.
3. The process of PCB resin hole plugging of claim 1, wherein: in step S4, after the resin is scraped by the scraper on one side of the processing plate, the scraper on the other side moves down to scrape the resin.
4. The process of PCB resin hole plugging of claim 1, wherein: and S5-S6, horizontally vacuum plugging the machining plate, filling secondary resin and curing.
5. The process of resin plugging holes of PCB board according to claim 1 wherein: the viscosity of the resin for plugging the holes in step S3 is 500 to 800dpas.
6. The process of PCB resin hole plugging of claim 1, wherein: in the step S5, the baking curing time is 30-60 min, and the baking temperature is 100-130 ℃.
7. The process of PCB resin hole plugging of claim 1, wherein: in the step S4, the moving speed of the scraper is 12-15cm/S.
8. The process of PCB resin hole plugging of claim 1, wherein: in step S6, the resin on the processing plate is ground using a ceramic roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211489398.0A CN115866892B (en) | 2022-11-25 | 2022-11-25 | Process method for plugging holes of PCB (printed circuit board) with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211489398.0A CN115866892B (en) | 2022-11-25 | 2022-11-25 | Process method for plugging holes of PCB (printed circuit board) with resin |
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| CN115866892A true CN115866892A (en) | 2023-03-28 |
| CN115866892B CN115866892B (en) | 2023-08-18 |
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| CN202211489398.0A Active CN115866892B (en) | 2022-11-25 | 2022-11-25 | Process method for plugging holes of PCB (printed circuit board) with resin |
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Citations (11)
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|---|---|---|---|---|
| JPH104255A (en) * | 1996-06-13 | 1998-01-06 | Mitsui Petrochem Ind Ltd | Printed wiring board and manufacturing thereof |
| JP2000216526A (en) * | 1999-01-26 | 2000-08-04 | Nippon Rekku Kk | Vacuum stencil printing method |
| JP2000228410A (en) * | 1999-02-05 | 2000-08-15 | Nippon Rekku Kk | Vacuum stencil printing method |
| KR20060062628A (en) * | 2004-12-04 | 2006-06-12 | 삼성테크윈 주식회사 | Flattening apparatus of photo-solder resist and method for manufacturing pcb using the same |
| JP2011201271A (en) * | 2010-03-26 | 2011-10-13 | Toppan Printing Co Ltd | Screen printing apparatus for pushing coating material on mask surface, and printing method therefor |
| CN104244609A (en) * | 2013-06-19 | 2014-12-24 | 南昌欧菲光科技有限公司 | Double-face hole plugging device for base material |
| JP2016175276A (en) * | 2015-03-20 | 2016-10-06 | 東レエンジニアリング株式会社 | Printer and printing method |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN211792323U (en) * | 2020-04-22 | 2020-10-27 | 深圳市超淦科技有限公司 | Machining mechanism for vacuum hole plugging machine |
| CN113826453A (en) * | 2020-04-13 | 2021-12-21 | 野田士克林股份有限公司 | Method for manufacturing printed circuit board |
| CN113905526A (en) * | 2021-10-13 | 2022-01-07 | 广州兴森快捷电路科技有限公司 | Hole plugging device and hole plugging method for circuit board |
-
2022
- 2022-11-25 CN CN202211489398.0A patent/CN115866892B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104255A (en) * | 1996-06-13 | 1998-01-06 | Mitsui Petrochem Ind Ltd | Printed wiring board and manufacturing thereof |
| JP2000216526A (en) * | 1999-01-26 | 2000-08-04 | Nippon Rekku Kk | Vacuum stencil printing method |
| JP2000228410A (en) * | 1999-02-05 | 2000-08-15 | Nippon Rekku Kk | Vacuum stencil printing method |
| KR20060062628A (en) * | 2004-12-04 | 2006-06-12 | 삼성테크윈 주식회사 | Flattening apparatus of photo-solder resist and method for manufacturing pcb using the same |
| JP2011201271A (en) * | 2010-03-26 | 2011-10-13 | Toppan Printing Co Ltd | Screen printing apparatus for pushing coating material on mask surface, and printing method therefor |
| CN104244609A (en) * | 2013-06-19 | 2014-12-24 | 南昌欧菲光科技有限公司 | Double-face hole plugging device for base material |
| JP2016175276A (en) * | 2015-03-20 | 2016-10-06 | 東レエンジニアリング株式会社 | Printer and printing method |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN113826453A (en) * | 2020-04-13 | 2021-12-21 | 野田士克林股份有限公司 | Method for manufacturing printed circuit board |
| CN211792323U (en) * | 2020-04-22 | 2020-10-27 | 深圳市超淦科技有限公司 | Machining mechanism for vacuum hole plugging machine |
| CN113905526A (en) * | 2021-10-13 | 2022-01-07 | 广州兴森快捷电路科技有限公司 | Hole plugging device and hole plugging method for circuit board |
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| CN115866892B (en) | 2023-08-18 |
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