CN113242654B - Copper block embedding process of multilayer circuit board - Google Patents
Copper block embedding process of multilayer circuit board Download PDFInfo
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- CN113242654B CN113242654B CN202110463810.0A CN202110463810A CN113242654B CN 113242654 B CN113242654 B CN 113242654B CN 202110463810 A CN202110463810 A CN 202110463810A CN 113242654 B CN113242654 B CN 113242654B
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- circuit board
- copper block
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a copper block embedding process of a multilayer circuit board, which comprises the following steps: milling a groove hole on the surface of a circuit board, processing a copper block to be embedded, forming a circle of groove at the upper opening and the lower opening of the groove hole of the circuit board, forming a circle of clamping groove on the side edges of the upper surface and the lower surface of the copper block respectively, plugging the copper block into the groove hole of the circuit board, arranging 4 abutting pieces at the upper end and the lower end of the copper block respectively, abutting the abutting pieces respectively and the groove and the clamping groove, placing the circuit board on a bottom plate, forming a through hole on a pressing plate, pressing the pressing plate on the circuit board to position the copper block and the abutting pieces, pouring an adhesive between gaps of the copper block and the groove hole through the through hole, placing the adhesive into an oven to be cured, taking out the circuit board after drying is completed, and polishing to remove residual adhesive on the upper surface and the lower surface of the circuit board. The invention prevents the copper block from separating from the circuit board, increases the heat-conducting property of the adhesive and ensures the heat-radiating effect of the circuit board.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a copper block embedding process of a multilayer circuit board.
Background
Along with the rapid development of electronic products in the light, thin, small, high-density and multifunctional directions, the volumes of electronic components and logic circuits are reduced by times, the operating frequency is increased rapidly, the power consumption is increased continuously, the working environment of the components is changed in the high-temperature direction, the heat dissipation of the PCB product is required more and more, and if no good heat dissipation way is used for removing the heat generated by the electrons, the excessive temperature causes the phenomena of electron dissociation, thermal stress and the like generated by the electronic components, the overall stability is reduced, and the service life of the electronic components is shortened.
The prior art is that metal copper blocks or other metal blocks are directly embedded in a printed circuit board, so that the heat dissipation problem of the printed circuit board is solved, but the peripheral side walls of the copper blocks are smooth and vertical, after the embedded copper blocks are arranged in a groove of the printed circuit board, the bonding force between the copper blocks and peripheral boards is not good due to the vertical side walls, the copper blocks are easily separated from a solidified adhesive, and the quality problems that the copper blocks fall off and the like occur.
Disclosure of Invention
The invention mainly solves the technical problem of providing a copper block embedding process of a multilayer circuit board, which prevents the copper block from being separated from the circuit board, increases the heat-conducting property of an adhesive and ensures the heat-radiating effect of the circuit board.
In order to solve the technical problems, the invention adopts a technical scheme that: a copper block embedding process of a multilayer circuit board comprises the following steps:
s1: milling a slotted hole on the surface of the circuit board, and processing a copper block to be embedded to enable the size of the copper block to be plugged into the slotted hole, wherein the thickness of the copper block is the same as that of the circuit board;
s2: sequentially putting the circuit board and the copper block into a pickling tank containing a pickling agent and a rinsing tank containing tap water for cleaning, and removing impurities and micro-dust on the surfaces of the slotted hole and the copper block;
s3: a circle of groove is formed at the upper opening and the lower opening of the slotted hole of the circuit board, and a circle of clamping groove is respectively processed at the side edges of the upper surface and the lower surface of the copper block;
s4: plugging a copper block into a slot hole of the circuit board, wherein 4 abutting pieces are respectively arranged at the upper end and the lower end of the copper block, and the abutting pieces are respectively abutted against the groove and the clamping groove;
s5: placing the circuit board in the step S4 on a bottom plate, forming a through hole in a pressing plate, wherein the size of the through hole is equal to that of the slotted hole, the position of the through hole corresponds to that of the slotted hole, and pressing the pressing plate on the circuit board to position the copper block and the abutting piece;
s6: pouring the adhesive into the gap between the copper block and the slot hole through the through hole, and putting the gap into an oven to cure the adhesive, wherein the temperature of the oven is 60-70 ℃, and the drying time is 20-30 min;
s7: and after the drying is finished, taking off the pressing plate, taking out the circuit board, and polishing to remove the residual adhesive on the upper surface and the lower surface of the circuit board.
Further, the pickling agent in the step S2 is sulfuric acid with a mass percentage concentration of 5-8%, the bottoms of the pickling tank and the rinsing tank are both provided with air pipes, the air pipes are communicated with the air pump, and the air pipes are provided with uniformly distributed air holes, so that liquid in the tank can fully clean the board surface and the slotted holes of the circuit board.
The supporting piece is a metal supporting piece, the supporting piece comprises two supporting arms and two elastic connecting arms, two ends of each supporting arm are connected with the two elastic connecting arms respectively, and each elastic connecting arm is a V-shaped elastic connecting arm.
Further, the adhesive comprises the following components in parts by weight: 20-30 parts of waterborne chlorinated polypropylene emulsion, 20-25 parts of waterborne thermoplastic resin emulsion, 1-2 parts of butter emulsifier, 5-8 parts of metal heat conducting particles, 2-3 parts of organic solvent and 10-12g of deionized water.
Further, the metal heat conductive particles are at least one of copper particles and silver particles.
Further, the aqueous thermoplastic resin emulsion is aqueous polyurethane emulsion, aqueous acrylic resin emulsion or aqueous vinyl chloride-vinyl acetate resin emulsion.
Further, the organic solvent is ethyl acetate, butyl acetate, ethanol or ethylene glycol.
Further, in the step S7, the sanding is performed manually by using sand paper, wherein the sanding is performed by performing rough grinding and then fine grinding, and the angle of sanding by using sand paper needs to be rotated by 90 ° every 5 to 8 times of sanding.
Furthermore, the mesh number of the sand paper selected for the coarse grinding is 400-600 meshes, and the mesh number of the sand paper selected for the fine grinding is 1000-1200 meshes.
Furthermore, the side wall of the copper block is provided with a plurality of inwards-concave U-shaped grooves.
The invention has the following beneficial effects:
the circuit board and the copper block are sequentially placed into a pickling tank containing a pickling agent and a rinsing tank containing tap water for cleaning, so that impurities and micro-dust on the surfaces of the slotted hole and the copper block are removed, and the firmness of the connection of the subsequent slotted hole and the copper block is ensured;
the upper end and the lower end of the copper block are respectively provided with 4 abutting pieces, and the abutting pieces are respectively abutted against the grooves and the clamping grooves, so that the copper block is preliminarily positioned, the copper block is prevented from inclining in the process of using an adhesive to fill, and after the adhesive is cured, the abutting pieces can limit the copper block to prevent the copper block from falling off, and the elastic connecting arms can position the copper blocks with different sizes;
the circuit board is placed on the bottom plate, the pressing plate is provided with the through hole, the size of the through hole is equal to that of the groove hole, the position of the through hole corresponds to that of the groove hole, and the pressing plate is pressed on the circuit board to position the copper block and the abutting part, so that the upper surface and the lower surface of the copper block are flush with the upper surface and the lower surface of the circuit board;
according to the circuit board, the upper opening and the lower opening of the slotted hole are provided with the circle of groove, so that the adhesive is prevented from falling off from the slotted hole after being cured and formed, the side edges of the upper surface and the lower surface of the copper block are respectively provided with the circle of clamping groove, and the copper block is prevented from being separated from the adhesive after the adhesive is cured and formed;
the adhesive is added with the metal heat conduction particles, and the metal heat conduction particles are at least one of copper particles and silver particles, so that the heat conduction performance of the adhesive is improved, and the heat dissipation effect of a circuit board is ensured;
the side wall of the copper block is provided with a plurality of inwards-concave U-shaped grooves, and the arrangement of the grooves improves the roughness of the side surface of the copper block, so that the copper block is further prevented from being separated from a circuit board;
the abutting piece is a metal abutting piece, and the heat conduction effect is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a copper block of the present invention;
FIG. 3 is a schematic diagram of the structure of the wiring board of the present invention;
FIG. 4 is a schematic view of the fastener of the present invention;
the parts in the figures are numbered as follows:
the circuit board comprises a circuit board 1, a slot hole 11, a groove 12, a copper block 2, a clamping groove 21, a U-shaped groove 22, a pressing piece 3, a pressing arm 31, an elastic connecting arm 32, a bottom plate 4, a pressing plate 5 and a through hole 51.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Example (b): a process for embedding copper blocks into a multilayer wiring board, as shown in fig. 1-4, comprising the steps of:
s1: milling a slotted hole 11 on the surface of the circuit board 1, and processing the copper block 2 to be embedded to enable the size of the copper block 2 to be plugged into the slotted hole 11, wherein the thickness of the copper block 2 is the same as that of the circuit board 1;
s2: sequentially putting the circuit board 1 and the copper block 2 into a pickling tank containing a pickling agent and a rinsing tank containing tap water for cleaning, and removing impurities and micro-dust on the surfaces of the slotted hole 11 and the copper block 2;
s3: a circle of grooves 12 are formed at the upper opening and the lower opening of a slotted hole 11 of the circuit board 1, and a circle of clamping grooves 21 are respectively formed on the side edges of the upper surface and the lower surface of the copper block 2;
s4: the copper block 2 is plugged into the slotted hole 11 of the circuit board 1, 4 abutting pieces 3 are respectively arranged at the upper end and the lower end of the copper block 2, and the abutting pieces 3 are respectively abutted against the groove 12 and the clamping groove 21;
s5: placing the circuit board 1 in the step S4 on the bottom plate 4, forming a through hole 51 in the pressing plate 5, wherein the size of the through hole 51 is equal to the size of the slot hole 11, the position of the through hole 51 corresponds to the slot hole 11, and pressing the pressing plate 5 on the circuit board 1 to position the copper block 2 and the abutting piece 3;
s6: pouring the adhesive between the copper block 2 and the gap of the slot hole 11 through the through hole 51, and putting the copper block into an oven to cure the adhesive, wherein the temperature of the oven is 60-70 ℃, and the drying time is 20-30 min;
s7: after the drying is completed, the pressing plate 5 is taken off, the circuit board 1 is taken out, and the residual adhesive on the upper surface and the lower surface of the circuit board 1 is polished and removed.
The pickling agent in the step S2 is sulfuric acid with the mass percentage concentration of 5-8%, the bottoms of the pickling tank and the rinsing tank are both provided with air pipes, the air pipes are communicated with an air pump, and the air pipes are provided with air holes which are uniformly distributed, so that liquid in the tank can fully clean the board surface and the slotted holes 11 of the circuit board 1.
The piece 3 that supports is the metal piece that supports, support the piece 3 and include that two support tight arm 31 and two elastic connecting arm 32, the both ends that support tight arm 31 are connected with two elastic connecting arm 32 respectively, elastic connecting arm 32 is the elastic connecting arm of "V" type.
The adhesive comprises the following components in parts by weight: 20-30 parts of waterborne chlorinated polypropylene emulsion, 20-25 parts of waterborne thermoplastic resin emulsion, 1-2 parts of butter emulsifier, 5-8 parts of metal heat conducting particles, 2-3 parts of organic solvent and 10-12g of deionized water.
The following is the composition of the raw materials of the adhesive in the specific examples of the invention, as reported in table 1 below:
TABLE 1
| Example 1 | Example 2 | Example 3 | Example 4 | |
| Aqueous chlorinated polypropylene emulsion | 20 | 30 | 25 | 30 |
| Aqueous thermoplastic resin emulsion | 20 | 25 | 22 | 25 |
| |
1 | 2 | 1 | 1.5 |
| Metal |
5 | 8 | 5 | 6 |
| |
2 | 3 | 2 | 2.5 |
| Deionized water | 10 | 12 | 10 | 11 |
The adhesives of examples 1-4 were each allowed to stand at 60 ℃ for 20min and tested for degree of cure, with the results shown in the following table:
| example 1 | Example 2 | Example 3 | Example 4 | |
| Standing at 60 deg.C for 20min | Has been cured | Has been cured | Has been cured | Has been cured |
The metal heat conduction particles are at least one of copper particles and silver particles.
The aqueous thermoplastic resin emulsion is aqueous polyurethane emulsion, aqueous acrylic resin emulsion or aqueous vinyl chloride-vinyl acetate resin emulsion.
The organic solvent is ethyl acetate, butyl acetate, ethanol or ethylene glycol.
And in the step S7, manual grinding is performed by using abrasive paper, coarse grinding is performed during grinding, fine grinding is performed, and the angle of abrasive paper grinding needs to be rotated by 90 degrees every 5-8 times of grinding.
The mesh number of the sand paper selected for coarse grinding is 400-600 meshes, and the mesh number of the sand paper selected for fine grinding is 1000-1200 meshes.
The side wall of the copper block 2 is provided with a plurality of U-shaped grooves 22 which are sunken inwards.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A copper block embedding process of a multilayer circuit board is characterized in that: the method comprises the following steps:
s1: milling a slotted hole (11) on the surface of the circuit board (1), and processing a copper block (2) to be embedded to enable the size of the copper block to be plugged into the slotted hole, wherein the thickness of the copper block is the same as that of the circuit board;
s2: sequentially putting the circuit board and the copper block into a pickling tank containing a pickling agent and a rinsing tank containing tap water for cleaning, and removing impurities and micro-dust on the surfaces of the slotted hole and the copper block;
s3: a circle of groove (12) is arranged at the upper opening and the lower opening of the slotted hole of the circuit board, and a circle of clamping groove (21) is respectively processed at the side edges of the upper surface and the lower surface of the copper block;
s4: the copper block is plugged into the slotted hole of the circuit board, 4 abutting pieces (3) are respectively arranged at the upper end and the lower end of the copper block, and the abutting pieces are respectively abutted against the groove and the clamping groove;
s5: placing the circuit board in the step S4 on a bottom plate (4), forming a through hole (51) in a pressing plate (5), wherein the size of the through hole is equal to that of the slotted hole, the position of the through hole corresponds to that of the slotted hole, and pressing the pressing plate on the circuit board to position the copper block and the abutting piece;
s6: pouring the adhesive into the gap between the copper block and the slot hole through the through hole, and putting the gap into an oven to cure the adhesive, wherein the temperature of the oven is 60-70 ℃, and the drying time is 20-30 min;
s7: and after the drying is finished, taking off the pressing plate, taking out the circuit board, and polishing to remove the residual adhesive on the upper surface and the lower surface of the circuit board.
2. The process of claim 1, wherein: the pickling agent in the step S2 is sulfuric acid with the mass percentage concentration of 5-8%, the bottoms of the pickling tank and the rinsing tank are both provided with air pipes, the air pipes are communicated with an air pump, and the air pipes are provided with air holes which are uniformly distributed, so that liquid in the tank can fully clean the board surface and the slotted holes of the circuit board.
3. The process of claim 1, wherein: the supporting piece is a metal supporting piece, the supporting piece comprises two supporting arms (31) and two elastic connecting arms (32), two ends of each supporting arm are connected with the two elastic connecting arms respectively, and each elastic connecting arm is a V-shaped elastic connecting arm.
4. The process of claim 1, wherein: the adhesive comprises the following components in parts by weight: 20-30 parts of waterborne chlorinated polypropylene emulsion, 20-25 parts of waterborne thermoplastic resin emulsion, 1-2 parts of butter emulsifier, 5-8 parts of metal heat conducting particles, 2-3 parts of organic solvent and 10-12g of deionized water.
5. The process of claim 4, wherein: the metal heat conduction particles are at least one of copper particles and silver particles.
6. The process of claim 4, wherein: the aqueous thermoplastic resin emulsion is aqueous polyurethane emulsion, aqueous acrylic resin emulsion or aqueous vinyl chloride-vinyl acetate resin emulsion.
7. The process of claim 4, wherein: the organic solvent is ethyl acetate, butyl acetate, ethanol or ethylene glycol.
8. The process of claim 1, wherein: and in the step S7, manual grinding is performed by using abrasive paper, coarse grinding is performed during grinding, fine grinding is performed, and the angle of abrasive paper grinding needs to be rotated by 90 degrees every 5-8 times of grinding.
9. The process of claim 8, wherein: the mesh number of the sand paper selected for coarse grinding is 400-600 meshes, and the mesh number of the sand paper selected for fine grinding is 1000-1200 meshes.
10. The process of claim 1, wherein: the side wall of the copper block is provided with a plurality of U-shaped grooves (22) which are sunken inwards.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110463810.0A CN113242654B (en) | 2021-04-28 | 2021-04-28 | Copper block embedding process of multilayer circuit board |
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| CN202110463810.0A CN113242654B (en) | 2021-04-28 | 2021-04-28 | Copper block embedding process of multilayer circuit board |
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| CN113242654B true CN113242654B (en) | 2022-03-08 |
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| CN114567976B (en) * | 2022-03-22 | 2024-02-09 | 上海山崎电路板有限公司 | Copper burying process for multilayer circuit board |
| CN117042305B (en) * | 2023-10-09 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Manufacturing method for improving flatness of copper-clad laminate |
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| CN207744228U (en) * | 2018-02-06 | 2018-08-17 | 深圳市亿方电子有限公司 | A kind of double-face aluminium substrate circuit board |
| CN108925065A (en) * | 2018-08-20 | 2018-11-30 | 胜宏科技（惠州）股份有限公司 | Copper billet method for manufacturing circuit board is buried in one kind |
| CN110708859A (en) * | 2019-09-20 | 2020-01-17 | 深圳崇达多层线路板有限公司 | Embedded copper block and manufacturing method for enhancing bonding force of embedded copper block |
| CN210725485U (en) * | 2019-11-12 | 2020-06-09 | 胜伟策电子(江苏)有限公司 | Heat dissipation type embedded copper block equal-seam occlusion glue-sealed PCB |
| CN112689380A (en) * | 2021-01-15 | 2021-04-20 | 深圳市鼎盛电路技术有限公司 | Manufacturing method of embedded copper block circuit board structure and circuit board |
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