CN116095958A

CN116095958A - Circuit board processing method and circuit board

Info

Publication number: CN116095958A
Application number: CN202111306651.XA
Authority: CN
Inventors: 吴科建
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2021-11-05
Filing date: 2021-11-05
Publication date: 2023-05-09

Abstract

The application discloses a circuit board processing method and circuit board, this circuit board processing method includes: obtaining a plate to be treated, wherein the plate to be treated comprises at least one through hole; the end face of the plate to be treated is also electroplated with a copper layer. Carrying out resin plugging on a plate to be processed, which comprises at least one through hole; performing resin bulking treatment on the to-be-treated plate after the resin is plugged; and (3) leveling the plate to be treated after the resin bulking treatment, and removing redundant resin on the surface of the plate to be treated. This application is through after the resin consent, before carrying out the resin and leveling the step, has increased the process that carries out the bulk to the resin and handled, and the resin after the bulk becomes soft, and is easier when carrying out the shovel flat unnecessary resin of terminal surface of getting rid of to panel, and required dynamics is littleer, is difficult to cause the damage to the copper layer on panel surface.

Description

Circuit board processing method and circuit board

Technical Field

The present disclosure relates to the field of circuit board manufacturing technologies, and in particular, to a circuit board manufacturing method and a circuit board.

Background

Printed circuit boards (i.e., printed Circuit Board, PCBs), also known as printed circuit boards, are providers of electrical connections for electronic components, and are used in a variety of electronic devices, where three types of vias, blind vias, and buried vias are commonly drilled in PCBs, and the vias must pass through a resin plug flow to meet customer requirements.

As PCB boards are developed toward high frequency, high speed, and high density, HDI board applications are increasing.

The inner layer board of HDI is formed by the lamination of multilayer circuit board, exists the through-hole and need to carry out the jack to the through-hole with resin on the HDI inner layer board, for the jack is full, does not have the resin cavity in the hole, and after general resin jack, the resin can bulge the drill way, overflows even on the drill way copper face. After plugging the resin, the resin has been thermally cured. In order to clean the orifice resin, when the resin is mechanically ground by using an abrasive belt, a non-woven fabric or a ceramic brush roll, the grinding force is large, and the loss is brought to the copper surface while the resin is removed, so that the copper is thick and thin, and even the base material is exposed.

Disclosure of Invention

The technical problem that this application mainly solves is to provide a processing method and circuit board of circuit board, carries out resin jack back to panel, carries out the processing of bulking to resin earlier, and the resin of stirring to unnecessary bulkiness again carries out the shovel, can solve and carry out the shovel at ordinary times to resin and can lead to the fact the problem of damage to panel surface's copper layer.

In order to solve the technical problem, a first technical scheme adopted in the application is to provide a processing method of a circuit board, which comprises the following steps: obtaining a plate to be treated, wherein the plate to be treated comprises at least one through hole; carrying out resin plugging on a plate to be processed, which comprises at least one through hole; performing resin bulking treatment on the to-be-treated plate after the resin is plugged; and (3) leveling the plate to be treated after the resin bulking treatment, and removing redundant resin on the surface of the plate to be treated.

Wherein, before obtaining the board to be processed, the board to be processed comprises at least one through hole, the method specifically comprises: obtaining a plate to be processed, and carrying out through hole drilling treatment on the plate to be processed; and carrying out copper deposition and plate electricity deposition on the through hole of the plate to be processed after the through hole drilling treatment, so that the hole wall of the through hole is covered with a metal copper layer.

The resin bulking treatment is carried out on the to-be-treated plate after the resin is plugged, and the method specifically comprises the following steps: and (3) performing resin bulking treatment on the to-be-treated plate subjected to resin plugging by using the bulking agent.

The method for removing the redundant resin on the surface of the plate to be treated comprises the steps of: and mechanically grinding and leveling the plate to be treated after the resin bulking treatment to remove redundant resin on the surface of the plate to be treated.

The method comprises the steps of mechanically grinding and leveling the to-be-treated plate after resin bulking treatment and removing redundant resin on the surface of the to-be-treated plate, and further comprises the following steps: and baking the plate to be treated after the resin bulking treatment to solidify the resin bulked in the through holes.

Wherein, in the step of baking the plate to be treated after the resin bulking treatment, the baking temperature is higher than the glass transition temperature of the resin.

Wherein the resin is epoxy resin.

Wherein the baking time is 60+/-10 min.

Wherein the baking temperature is 120-170 ℃.

In order to solve the above technical problems, a second technical solution adopted in the present application is to provide a circuit board, which is manufactured by the processing method of the circuit board described in any one of the above.

The beneficial effects of this application are: in order to solve the problems, the present application provides a circuit board and a method for manufacturing the circuit board, wherein after a resin is plugged to be manufactured, the resin is firstly subjected to bulking treatment, and then the redundant bulked resin is flattened, so that the resin which is bulked is flattened more easily, and the copper layer on the surface of the board is not damaged.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:

FIG. 1 is a schematic flow chart of an embodiment of a circuit board processing method of the present application;

FIG. 2 is a flow chart of an embodiment of a method for obtaining the sheet material to be processed in S11;

FIG. 3 is a schematic view of an embodiment of a board to be processed;

FIG. 4 is a schematic view of the structure of the latter embodiment of the resin plug hole of the board to be processed;

FIG. 5 is a schematic view of the structure of the post-processing plate in accordance with the embodiment after the plate is flattened;

fig. 6 is a schematic structural diagram of an embodiment of a circuit board of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.

It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

It should be understood that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.

The inner layer board of HDI is generally formed by the lamination of multilayer circuit board, and the inner layer board surface still covers one deck copper layer, exists the through-hole on the HDI inner layer board, needs to carry out the jack to the through-hole, and after the resin jack, resin can overflow the terminal surface of inner layer board, then need carry out resin spading and get rid of the unnecessary resin in HDI board surface, and resin spading is at ordinary times the resin has solidified, need use abrasive band, non-woven fabric or ceramic brush roll to carry out mechanical grinding to resin, when getting rid of the resin, also can bring the loss to the copper face, leads to copper thickness to be thinner, even exposes the substrate. To avoid this problem, the present application optimizes the process of resin jack leveling by first bulking the once cured resin with a bulking agent prior to resin leveling and then performing resin leveling.

The following describes a circuit board processing method and a circuit board provided by the application in detail with reference to embodiments.

Referring to fig. 1, fig. 1 is a flow chart of an embodiment of a circuit board processing method of the present application. As shown in fig. 1, in the present embodiment, the method includes:

s11: obtaining a plate to be treated, wherein the plate to be treated comprises at least one through hole.

In this embodiment, the board to be processed is an inner layer board of HDI, and is formed by laminating a plurality of layers of circuit boards. The number of the through holes is at least one, and the specific number of the through holes can be determined according to requirements, so that the application is not limited.

Specifically, referring to fig. 2, fig. 2 is a flow chart of an embodiment of a method for obtaining the board to be processed in S11. As shown in fig. 2, in the present embodiment, the method includes:

s21: and obtaining a plate to be processed, and carrying out through hole drilling treatment on the plate to be processed.

In this embodiment, the through-hole drilling process is performed on the board to be processed by means of machining or laser ablation.

Wherein, the through hole is at least one, and the specific quantity of through hole can be confirmed according to the demand, this application is not limited to.

S22: and carrying out copper deposition and plate electricity deposition on the through hole of the plate to be processed after the through hole drilling treatment, so that the hole wall of the through hole is covered with a metal copper layer.

In this embodiment, the copper deposition method is electroless copper deposition, a thin layer of copper is deposited on the entire surface of the wall of the through hole by chemical reaction, the copper deposited on the wall of the through hole is used to connect the multilayer circuit boards of the inner layer board, and the plating is to perform electroplating treatment on the through hole after copper deposition to form an electroplated copper layer.

In the embodiment, the circuit is distributed on the surface of the plate to be processed, and the electroplating not only deposits a layer of thin copper on the surface of the through hole wall, but also enlarges the copper thickness of the circuit on the surface of the plate, thereby ensuring the conductivity and other physical properties of the plate.

Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of a board to be processed provided in the present application.

As shown in fig. 3, in the present embodiment, the number of through holes 301 in the sheet material 300 to be processed is 3. Wherein, at least one through hole 301 is provided, the specific number of through holes 301 can be determined according to the requirement, and this application is not limited.

In this embodiment, the board to be processed is an inner layer board of HDI, and is formed by laminating a plurality of layers of circuit boards.

Wherein, the through hole of the plate to be treated is internally provided with a metallic copper layer formed by copper deposition and plate electricity.

S12: and (5) carrying out resin plugging on the plate to be treated, on which the through holes are drilled.

Wherein the resin is epoxy resin.

In this embodiment, the resin plugging method may be used to plug the holes in the plate to be processed, in which the holes are plugged by using a vacuum resin plugging machine having an ink clamp and two laterally movable plugging heads with a plurality of small holes. After the vacuum resin hole plugging machine is vacuumized, the ink in the ink clamp is pushed to the small holes in the hole plugging head by the piston, the two traversing hole plugging heads clamp the plate first, then the ink is filled into the through holes through a plurality of small holes in the hole plugging head, and the traversing hole plugging head can move downwards until the through holes are filled with resin. In other embodiments, the non-vacuum resin plugging method may be used, and the through holes may be plugged by a non-vacuum resin plugging machine, which is not limited in this application.

In this embodiment, in the process of plugging the resin, the resin plugged into the through hole is in a liquid state, and after the resin is plugged, the liquid resin needs to be cured. For resin filling after plugging, the resin generally protrudes out of the hole after curing and even overflows onto the copper surface of the hole. Referring specifically to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of a board to be processed according to the present application after plugging a hole with resin.

As shown in fig. 4, in the present embodiment, the through holes 401 of the board 400 to be processed are filled with the resin 402, and the resin 402 has cured to protrude out of the through holes 401 and overflows onto the end faces of the through holes 401.

In this embodiment, after the resin is plugged, resin will remain on the board surface to be treated, and the unnecessary resin that remains on the board surface needs to be removed later, and traditional flow is, after the through hole of board is plugged with resin and cured, the direct mechanical grinding shovel level, because after the resin is plugged, liquid resin has passed once the curing process, and the resin after the curing needs the great dynamics of machine in the mechanical grinding process, probably can cause the damage to board surface copper layer.

S13: and (3) performing resin bulking treatment on the to-be-treated plate after the resin is plugged.

The resin bulking treatment is carried out on the to-be-treated plate after the resin is plugged by using a bulking agent. The resin after the bulking treatment becomes soft by curing.

In a preferred embodiment, the leavening agent is a chemical leavening agent, and the kind of the leavening agent can be determined according to requirements, which is not limited in this application.

S14: and (3) leveling the plate to be treated after the resin bulking treatment, and removing redundant resin on the surface of the plate to be treated.

Wherein, this step specifically includes: and mechanically grinding and leveling the plate to be treated after the resin bulking treatment to remove redundant resin on the surface of the plate to be treated. After the resin after solidification is treated by the leavening agent, the resin becomes soft, is easier to mechanically grind and level at ordinary times, has smaller grinding and leveling force and is not easy to damage a copper layer on the surface of the plate.

In a preferred embodiment, the board to be treated is mechanically ground and shoveled by a nonwoven fabric grinder, and in other embodiments, the mechanical grinding and shoveling can be achieved by using other grinding tools such as a belt grinder, a ceramic brush roll, and the like.

In this embodiment, in order to avoid dust generated in the mechanical grinding and leveling process from accumulating on the plate and in the hole, in the grinding and leveling process, the surface to be ground of the plate is placed downwards, and meanwhile, the grinding surface placed downwards is respectively subjected to transverse grinding and longitudinal grinding, so that the resin remained on the surface of the plate is ensured to be ground completely.

Wherein, after mechanical grinding and leveling are carried out on the plate to be treated, the method further comprises the step of baking the plate to be treated after resin bulking treatment.

Wherein the baking time is 60+/-10 min.

Wherein the baking temperature is higher than the glass transition temperature of the resin, and the baking temperature is 120-170 ℃.

In this embodiment, the baking temperature was 150℃and the baking time was 60 minutes. In other embodiments, the baking temperature may be 170 ℃ at maximum, 120 ℃ at minimum, 50min at minimum, and 70min at maximum. The present application is not particularly limited thereto.

Specifically, the baking is to secondarily solidify the resin which is bulked by the bulking agent, the baking temperature is 120-170 ℃, the temperature in the baking temperature range is higher than the glass transition temperature of the epoxy resin, the resin can be converted from a high-elasticity state to a glass state at the temperature, and meanwhile, the resin rapidly expands again when the temperature is lower than 170 ℃ to avoid overflowing the resin in the through hole from the plate. Under the conditions that the baking temperature is 120-170 ℃ and the baking time is 60+/-10 min, the bulked resin is dehydrated slowly until the bulked resin is hardened completely. Referring specifically to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of the present application after leveling a board to be processed after resin bulking treatment.

As shown in fig. 5, in the present embodiment, the resin 502 of the sheet 500 to be processed that overflows the through hole 501 has been shoveled clean, and the resin 502 is flush with the port of the through hole 501.

Compared with the prior art, the method is characterized in that resin is firstly subjected to bulking before the excessive resin of the plate after the resin is plugged is shoveled, then the excessive bulked resin is shoveled, the resin which is bulked is shoveled, the shoveling is easier, and the copper layer on the surface of the plate cannot be damaged in the shoveling process.

Correspondingly, the application provides a circuit board which is manufactured by the processing method.

Specifically, referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of a circuit board 600 according to the present application. In the present embodiment, the wiring board 600 includes a through hole 601, and a resin 602 is filled in the through hole 601.

Wherein, resin 602 in the through hole 601 is flush with the end face of the through hole 601, and no excessive resin 602 remains on the surface of the circuit board 600.

Specifically, in the present embodiment, in the process of processing and producing the circuit board 600, the resin 602 is plugged into the through hole 601, after the resin 602 overflows the through hole 601 and is cured once, the resin 602 is not directly mechanically polished and shoveled, a process of bulking the resin 602 is added before mechanically polishing and shoveling, and mechanically polishing and shoveling the resin 602 which is fluffy after bulking is performed again.

Compared with the prior art, the through hole of the circuit board inner plate of the embodiment is added with the process of resin bulking by using the bulking agent before the resin leveling process after filling the resin, mechanical grinding leveling is performed on the resin after bulking, and then the resin after bulking is subjected to secondary curing treatment, so that the resin after bulking is easier in the mechanical grinding leveling process, and the copper layer on the inner plate surface is not damaged due to overlarge leveling force.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent principle changes made by the specification and the drawings of the present application, or direct or indirect application in other related technical fields, are included in the scope of the patent protection of the present application.

Claims

1. The circuit board processing method is characterized by comprising the following steps of:

obtaining a plate to be processed, wherein the plate to be processed comprises at least one through hole;

carrying out resin plugging on the board to be processed, which comprises at least one through hole;

performing resin bulking treatment on the to-be-treated plate after resin plugging;

and (3) leveling the plate to be treated after the resin bulking treatment, and removing redundant resin on the surface of the plate to be treated.

2. The method for processing a circuit board according to claim 1, wherein before the step of obtaining a board to be processed, the board to be processed includes at least one through hole, specifically includes:

obtaining a plate to be processed, and carrying out through hole drilling treatment on the plate to be processed;

and carrying out copper deposition and plate electricity deposition on the through hole of the plate to be processed after the through hole drilling treatment, so that the hole wall of the through hole is covered with a metal copper layer.

3. The method for manufacturing a circuit board according to claim 1, wherein,

the resin bulking treatment is carried out on the board to be treated after the resin is plugged, and the method specifically comprises the following steps:

and (3) performing resin bulking treatment on the to-be-treated plate after the resin is plugged by using a bulking agent.

4. The method for manufacturing a circuit board according to claim 1, wherein,

the step of leveling the plate to be treated after the resin bulking treatment and removing the redundant resin on the surface of the plate to be treated specifically comprises the following steps:

and mechanically grinding and leveling the plate to be treated after the resin is bulked, and removing redundant resin on the surface of the plate to be treated.

5. The method for manufacturing a circuit board according to claim 4, wherein,

after the step of mechanically grinding and leveling the plate to be treated after the resin bulking treatment and removing the superfluous resin on the surface of the plate to be treated, the method further comprises the following steps:

and baking the plate to be treated after the resin bulking treatment to solidify the resin bulked in the through hole.

6. The method for manufacturing a circuit board according to claim 5, wherein,

in the step of baking the plate to be treated after the resin is bulked, the baking temperature is higher than the glass transition temperature of the resin.

7. The method for manufacturing a circuit board according to claim 1, wherein,

the resin is epoxy resin.

8. The method for manufacturing a circuit board according to claim 6, wherein,

the baking time is 60+/-10 min.

9. The method for manufacturing a circuit board according to claim 6, wherein,

the baking temperature is 120-170 ℃.

10. A wiring board, characterized in that the wiring board is produced by the processing method of the wiring board according to any one of claims 1 to 9.