CN105101680B - A kind of processing method of circuit board - Google Patents
A kind of processing method of circuit board Download PDFInfo
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- CN105101680B CN105101680B CN201410219997.XA CN201410219997A CN105101680B CN 105101680 B CN105101680 B CN 105101680B CN 201410219997 A CN201410219997 A CN 201410219997A CN 105101680 B CN105101680 B CN 105101680B
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- Prior art keywords
- power amplifier
- hole
- amplifier groove
- groove
- circuit board
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Abstract
The invention discloses a kind of processing method of circuit board, to avoid damaging power amplifier channel opening when evening filling holes with resin out, also, simplifies manufacture craft, reduces heavy copper plating number, circuit board surface copper thickness uniformity is improved, to facilitate making fine-line.Method may include：Through hole and power amplifier groove are processed on multilayer boards；The through hole and power amplifier groove are metallized；The potting resin in the through hole；Water filling and ice cube is frozen into the power amplifier groove；Excess resin around the through hole aperture is rooted out.
Description
Technical field
The present invention relates to circuit board processing technique field, and in particular to a kind of processing method of circuit board.
Background technology
In circuit board with embedded metal base, the top of its Metal Substrate typically offers power amplifier groove, and the power amplifier groove can
For accommodating chip or other sorts of electronic elements.
In the manufacturing process of foregoing circuit plate, for the through hole on circuit board, generally require to carry out filling holes with resin, and resin
After consent, unnecessary resin, such as resin meeting projection etc. at aperture can be typically remained at through hole aperture.At this time, it is necessary to
Technique is evened out using machinery to even unnecessary resin out.Due to more big compared with the aperture of through hole of the opening of power amplifier groove, in machine
During tool is evened out, the metal level at power amplifier channel opening is easily rooted out, so that exposing base material, influences the property of circuit board
Energy.
In order to solve the above problems, the following technique of generally use makes the above-mentioned type circuit board in the prior art, i.e.,：Make
After going out through hole, heavy copper plating for the first time is carried out, makes via metal, and carry out filling holes with resin and machinery is evened out；Then, work(is made
Groove is put, after power amplifier groove is produced, second of heavy copper plating is carried out, power amplifier groove is metallized.
Above-mentioned technique solves the problems, such as that power amplifier channel opening easily evens damage out by machinery, still, in above-mentioned technique, it is necessary to
Via hole and power amplifier groove are made at twice, it is necessary to perform heavy copper electroplating technology twice, the defects of technological process complexity be present；And
And heavy copper plating twice can cause the copper of circuit board surface thick serious uneven, and corruption was easily caused in circuit etching figure
The defects of erosion or deficient corrosion, lead to not produce finer line pattern.
The content of the invention
The embodiment of the present invention provides a kind of processing method of circuit board, to avoid damaging when evening filling holes with resin out
Power amplifier channel opening, also, simplify manufacture craft, heavy copper plating number is reduced, circuit board surface copper thickness uniformity is improved, with convenient
Make fine-line.
The present invention provides a kind of processing method of circuit board, including：
Through hole and power amplifier groove are processed on multilayer boards；
The through hole and power amplifier groove are metallized；
The potting resin in the through hole；
Water filling and ice cube is frozen into the power amplifier groove；
Excess resin around the through hole aperture is rooted out.
Therefore the embodiment of the present invention is metallized through hole and power amplifier groove using once heavy copper plating, then in power amplifier
In groove water filling and be frozen into ice cube rear shovel remove resin technical scheme, achieve following technique effect：Using ice cube to power amplifier groove
Notch is protected, and can avoid the ground damage of the metal level around power amplifier groove notch as far as possible；Only need once to sink copper plating
Operation, simplifies technique, also, the number electroplated by reducing heavy copper, improves the copper thickness uniformity of circuit board surface, can be with
Excessive erosion or the deficient corrosion phenomenon in etching step are reduced as far as possible, so as to easily produce finer line pattern.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of schematic flow sheet of the processing method of circuit board provided in an embodiment of the present invention；
Fig. 2 a are multiple-plate schematic diagrames in the present embodiment；
Fig. 2 b are the schematic diagrames for making via hole and power amplifier groove on multilayer boards；
Fig. 2 c are the schematic diagrames for carrying out heavy copper plating to circuit board on multilayer boards；
Fig. 2 d are the schematic diagrames that filling holes with resin is carried out to multi-layer sheet；
Fig. 2 e are water filling and to be frozen into the schematic diagram of ice in power amplifier groove；
Fig. 2 f are that the schematic diagram that machinery is evened out is carried out to multi-layer sheet；
Fig. 2 g are the schematic diagrames for removing the circuit board obtained after ice cube.
Embodiment
The embodiment of the present invention provides a kind of processing method of circuit board, to avoid damaging when evening filling holes with resin out
Power amplifier channel opening, also, simplify manufacture craft, heavy copper plating number is reduced, circuit board surface copper thickness uniformity is improved, with convenient
Make fine-line.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of processing method of circuit board, it may include：
110th, through hole and power amplifier groove are processed on multilayer boards.
In the embodiment of the present invention, the circuit board may be based on the multi-layer sheet that double face copper lamination forms.Such as Fig. 2 a institutes
Show, be the schematic diagram of the present embodiment circuit board 200, the circuit board 200 may include two outer layers metal level and at least one layer of internal layer
Line layer and multilayer insulation dielectric layer.Optionally, Metal Substrate 201, and it is assumed that multi-layer sheet can be embedded with described circuit board
The one side of insertion Metal Substrate 201 be the first face.
As shown in Figure 2 b, the present embodiment can make through hole 202 using mechanical drilling process on circuit board 200, and, can
Power amplifier groove 203 is made in the face of circuit board 200 second using controlled depth milling technique.Described through hole 202 runs through circuit board 200.It is described
Power amplifier groove 203 can be used for accommodating the electronic component such as chip.It can be seen that the power amplifier positioned at the face of circuit board 200 second
The bottom of groove 203 is arrived inside the surface or the Metal Substrate of Metal Substrate 201, so as to by Metal Substrate 201 to being accommodated in blind slot 203
Electronic component such as chip radiated.
120th, the through hole and power amplifier groove are metallized.
As shown in Figure 2 c, the present embodiment is electroplated by carrying out heavy copper to the multi-layer sheet, by the through hole and power amplifier groove gold
Categoryization.In specific implementation, heavy copper and plating can be carried out to the first face of circuit board 200 and the second face, in the second face of circuit board
With the inwall of through hole 202 and the inwall of power amplifier groove 203, heavy copper electrodeposited coating 204 is generated, is realized through hole 202 and power amplifier groove 203
Inwall metallization.
130th, the potting resin in the through hole.
As shown in Figure 2 d, in this step, conventional filling holes with resin technique can be used, through hole 202 is filled with resin 205.
It is seen that after filling holes with resin, the resin 205 at the aperture of through hole 202 has raised or residue.The projection or residue
Removal subsequently will evened out by machinery.
140th, water filling and it is frozen into ice cube in the power amplifier groove.
As shown in Figure 2 e, in order to avoid machinery evens 203 parameatal metal level of process damage power amplifier groove out, power amplifier is avoided
203 parameatal metal level of groove, which is rooted out, causes to expose base material, in the present embodiment, the water filling and cold in power amplifier groove 203 in advance
Ice cube 206 is frozen into, to being protected around the opening of power amplifier groove 203.
In some embodiments of the invention, the water filling in the power amplifier groove is simultaneously frozen into ice cube and may include：
The multi-layer sheet 200 is horizontal positioned, and make the one side at the place of power amplifier groove 203 upward；In the power amplifier groove
After filling water in 203, freezed in freezing equipment, until the water noted build-ups ice；The multi-layer sheet is taken from freezing equipment
Go out.
150th, the Excess resin around the through hole aperture is rooted out.
Evened out in this step by machinery and remove resin unnecessary at the aperture of through hole 202.In the present embodiment, such as Fig. 2 f
It is shown, multiple-plate surface can be polished using sbrasive belt grinding technique, will be unnecessary at the aperture of through hole 202
Resin 205 is rooted out, and described abrasive band is represented with 300 in figure.Abrasive band is flexible abrasive product, compares solid grinding tool emery wheel during polishing, more
To be flexible with safe, precision is higher, and grinding cost is lower.In bruting process, the ice cube 206 in the power amplifier groove 203 is used to protect
The not ground damage of the metal level protected around the notch of power amplifier groove 203, it is ensured that base material does not expose.
As shown in Figure 2 g, it can even out and finish in machinery, the ice cube 206 in the power amplifier groove 203 is melted into removal.
Optionally, after above-mentioned steps, some other conventional steps can also be included, for example, making outer-layer circuit, set
Welding resistance, partially plating gold etc., are no longer repeated one by one herein.
Therefore the embodiment of the invention discloses a kind of processing method of circuit board, this method is using once heavy copper electricity
Through hole and power amplifier groove are metallized in plating, then water filling and are frozen into the technical scheme that ice cube rear shovel removes resin in power amplifier groove, take
Obtained following technique effect：
Power amplifier groove notch is protected using ice cube, as far as possible the metal level around power amplifier groove notch can be avoided to be ground
Damage；Only need once to sink copper electroplating operations, simplify technique, also, the number electroplated by reducing heavy copper, improve circuit
The copper thickness uniformity of plate surface, can reduce the excessive erosion in etching step or deficient corrosion phenomenon as far as possible, so as to easily make
Make finer line pattern.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to
According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
A kind of processing method of the circuit board provided above the embodiment of the present invention is described in detail, but real above
The explanation for applying example is only intended to help the method and its core concept for understanding the present invention, should not be construed as limiting the invention.
Those skilled in the art, according to the thought of the present invention, the invention discloses technical scope in, the change that can readily occur in
Change or replace, should all be included within the scope of the present invention.
Claims (7)
- A kind of 1. processing method of circuit board, it is characterised in that including：Through hole and power amplifier groove are processed on multilayer boards；The through hole and power amplifier groove are metallized；The potting resin in the through hole；Water filling and ice cube is frozen into the power amplifier groove；Excess resin around the through hole aperture is rooted out.
- 2. according to the method for claim 1, it is characterised in that multiple-plate first face is embedded with Metal Substrate, described Processing through hole and power amplifier groove on multilayer boards includes：In multiple-plate second face processing power amplifier groove, the Metal Substrate is arrived in the bottom of the power amplifier groove.
- 3. according to the method for claim 1, it is characterised in that described to include the through hole and the metallization of power amplifier groove：Heavy copper plating is carried out to the multi-layer sheet, the through hole and power amplifier groove are metallized.
- 4. according to the method for claim 1, it is characterised in that the potting resin in the through hole includes：Using tree Fat jack process potting resin in the through hole.
- 5. according to the method for claim 1, it is characterised in that the water filling in the power amplifier groove is simultaneously frozen into ice cube bag Include：The multi-layer sheet is horizontal positioned, and make one side where the power amplifier groove upward；After filling water in the power amplifier groove, freezed in freezing equipment, until the water noted build-ups ice；The multi-layer sheet is taken out from freezing equipment.
- 6. according to the method for claim 1, it is characterised in that the Excess resin by around the through hole aperture is rooted out Including：Multiple-plate surface is polished using sbrasive belt grinding technique, the Excess resin around the through hole aperture is shoveled Remove；In bruting process, the ice cube in the power amplifier groove is used to protect the metal level around the power amplifier groove notch not to be ground damage Wound.
- 7. according to the method for claim 1, it is characterised in that also include：By the ice melting removal in the power amplifier groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219997.XA CN105101680B (en) | 2014-05-22 | 2014-05-22 | A kind of processing method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219997.XA CN105101680B (en) | 2014-05-22 | 2014-05-22 | A kind of processing method of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105101680A CN105101680A (en) | 2015-11-25 |
| CN105101680B true CN105101680B (en) | 2018-03-16 |
Family
ID=54580881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410219997.XA Active CN105101680B (en) | 2014-05-22 | 2014-05-22 | A kind of processing method of circuit board |
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| Country | Link |
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| CN (1) | CN105101680B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4610756A (en) * | 1982-07-16 | 1986-09-09 | Cirtech S.A. | Printed circuit board and process for its manufacture |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
| CN103391682A (en) * | 2012-05-10 | 2013-11-13 | 深南电路有限公司 | Method for processing PCB with step groove |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100659510B1 (en) * | 2006-02-16 | 2006-12-20 | 삼성전기주식회사 | Method for manufacturing a substrate with cavity |
-
2014
- 2014-05-22 CN CN201410219997.XA patent/CN105101680B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4610756A (en) * | 1982-07-16 | 1986-09-09 | Cirtech S.A. | Printed circuit board and process for its manufacture |
| CN103391682A (en) * | 2012-05-10 | 2013-11-13 | 深南电路有限公司 | Method for processing PCB with step groove |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105101680A (en) | 2015-11-25 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |