CN105657989B - The processing method of printed wiring board - Google Patents
The processing method of printed wiring board Download PDFInfo
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- CN105657989B CN105657989B CN201610182294.3A CN201610182294A CN105657989B CN 105657989 B CN105657989 B CN 105657989B CN 201610182294 A CN201610182294 A CN 201610182294A CN 105657989 B CN105657989 B CN 105657989B
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
Abstract
The invention discloses a kind of processing methods of printed wiring board, and first production forms the first conductive circuit layer before resin fill-up hole processing.The processing method of printed wiring board of the invention, first production forms the first conductive circuit layer before resin fill-up hole processing, during avoiding cull from appearing in the first conductive circuit layer of production, the first conductive circuit layer is avoided the quality problems of short circuit occur, by the scrappage control of printed wiring board in the range of being lower than 0.5%, the qualification rate of printed wiring board is substantially increased.
Description
Technical field
The present invention relates to printed wiring board manufacturing field, in particular to a kind of processing method of printed wiring board.
Background technique
Printed wiring board as supporter main when providing electronic components installation with grafting, be all electronic products not
The part that can or lack.Information, communication and consumer electrical product manufacturing industry have become the fastest production of whole world growth in recent years
One of industry, electronic product make rapid progress, and towards small in size, light weight, the direction of function complexity is continued to develop, this is to wiring board
More stringent requirements are proposed.Traditional wiring board and encapsulating carrier plate manufacturing method, by reduce plate face conducting wire line width or
Line-spacing improves printed line direction density, is developed with adapting to electronic product to lighter, smaller direction.But the reduction amount of line width or line-spacing
Growth requirement that is limited, being only unable to satisfy electronic product by improving plate face line density, therefore high-density interconnection technology (High
Density Interconnect Technology, HDI) it comes into being.High density interconnection line technology is by multilayer line superimposed layer
Pressure, produces slim, multilayer, stable high density interconnection wiring board.Wherein the coarctate route of superimposed layer need to realize layer with
Connection between layer can just be played the role of improving printed line direction density.
Summary of the invention
Purpose of the invention is to overcome the shortcomings in the prior art, provides a kind of each layer conductive material layer connection of realization
Printed wiring board processing method.
In order to achieve the above object, the invention is realized by the following technical scheme:
The processing method of printed wiring board, which comprises the steps of:
A, a substrate is provided；The substrate includes at least one layer of insulation material layer and at least two layers of conductive material layer；Arbitrarily
Two layers of conductive material layer is provided respectively therein the two sides of one layer of insulation material layer, is insulated by the insulation material layer
Isolation；At least one layer of outermost layer of the substrate is the conductive material layer；
B, it drills on the substrate, formation extends to another layer positioned at the outermost conductive material layer of the substrate certainly and leads
The hole of material layer；
C, electroless copper plating at least once is carried out to the substrate to handle, metallic copper is made to cover the inner wall in the hole；Hole inner wall
On metallic copper will be located at the outermost conductive material layer of the substrate be connected to another layer of conductive material layer；
D, after electroless copper plating processing, pattern transfer processing is carried out to the outermost conductive material layer of the substrate is located at, with
Form the first conductive circuit layer；First conductive circuit layer is connected to another layer of conductive material layer by the metallic copper；
E, after pattern transfer processing, the chemical treatment of surface metal copper is carried out to the substrate, makes the metallic copper on the inner wall of hole
Surface roughness and the surface roughness of first conductive circuit layer increase, and the surface of the metallic copper on the inner wall of hole
And the surface of first conductive circuit layer forms organic film；
F, after the chemical treatment of surface metal copper, resin fill-up hole processing is carried out to substrate, the hole is clogged using resin；
G, at least one layer of insulation material layer and at least one layer of conductive material layer are sequentially laminated in the first conductive circuit layer；And
Repeating said steps b-e forms the printed wiring board for having multilayer conductive route layer stackup and interconnecting.
Preferably, after electroless copper plating processing, before pattern transfer processing, the substrate is electroplated at least once
Copper treatment makes electro-coppering cover the metallic copper on the inner wall of hole and positioned at the surface of the outermost conductive material layer of the substrate；
The electro-coppering of the copper surface will be located at the outermost conductive material layer of the substrate and be connected to another layer of conductive material layer；
First conductive circuit layer and another layer of conductive material layer are by the metallic copper and positioned at the plating of the copper surface
Copper connection.
Preferably, in the step e, pattern transfer processing include etching, laser cutting, one of machine cuts or
It is any several.
Preferably, the pattern transfer processing includes etching；Specific step is as follows for the etching: firstly, being located at
The surface of the outermost conductive material layer of substrate covers photoresist film；Then, processing is exposed to the photoresist film,
Keep the photoresist film for being located at the region overlay on the outermost conductive material layer of substrate needed to etch away uncured, makes to be located at base
The photoresist film solidification of the region overlay etched away is not needed on the outermost conductive material layer of plate；Then, substrate is impregnated
In the K that mass concentration is 0.8%-1.2%2CO3In solution, 1-2min is impregnated, makes uncured photoresist film from copper foil surface
It falls off；Followed by using HCl and CuCl2Mixed solution to be located at the outermost conductive material layer of substrate on do not cover it is photosensitive
The region of protective film is corroded, and the region of photoresist film is covered on the outermost conductive material layer of substrate in photosensitive guarantor
It avoids being etched corrosion under the protection of cuticula, to form the first conductive circuit layer；Finally, the substrate is immersed in concentration
For 1-2min in the NaOH solution of 15-30g/L, removal is located at the remaining sense of the outermost conductive material layer surface covering of substrate
Light film.
Preferably, after the surface metal copper chemical treatment and before clogging resin into the hole, to described
Substrate carries out drying and processing, to remove the steam in the hole.
Preferably, the filling rate in the hole is more than or equal to 80%.
Preferably, at least one layer of exhausted using being sequentially laminated behind the resin filling hole and in the first conductive circuit layer
Before edge material layer and at least one layer of conductive material layer, pressure is rolled or is caught up with using polyethylene film or oil-Absorbing Sheets, by described first
The resin of conducting wire layer surface removes.
Preferably, after the resin of the first conducting wire layer surface being removed and in the first conductive circuit layer
It is sequentially laminated before at least one layer of insulation material layer and at least one layer of conductive material layer, the temperature by the substrate at 100-150 DEG C
Degree is lower to toast 15-40min.
Preferably, in the step b, the substrate is bored using mechanical drilling process or laser drilling process
Hole；The laser drilling process selects carbon dioxide laser or UV laser.
Preferably, at least one layer of insulation material layer is soft board.
Preferably, at least one layer of insulation material layer is hardboard.
The processing method of printed wiring board provided by the invention, after carrying out electroless copper plating processing to the first hole, if first to the
One hole carries out resin filling processing, then carries out pattern transfer processing, the resin of resin fill-up hole processing to the first conductive material layer
The surface of the metallic copper covered on the first conductive material layer can be remained in.Remain in the metallic copper covered on the first conductive material layer
If the resin on surface does not remove the figure turn that completely will have a direct impact on the metallic copper of the first conductive material layer and the covering of its surface
There are the quality problems of short circuit in shifting processing, the first conductive circuit layer for forming pattern transfer processing, lead to final print obtained
Brush wiring board is scrapped, and scrappage is up to 8%, to reduce the production qualification rate of printed wiring board.To avoid cull to figure
The influence of shape transfer processing can carry out nog plate processing to substrate after resin filling processing, before pattern transfer processing,
To remove the resin for remaining in the copper surface covered on the first conductive material layer.But nog plate processing is in removal cull
Meanwhile it can be removed together together with the metallic copper covered on the first conductive material layer, or even have the wind for grinding off the first conductive material layer
Danger, is thinned the thickness of the first conductive material layer, so as to cause the thickness of the first conducting wire formed after pattern transfer processing
It is thinned, reduces the transmission performance of the first conducting wire, reduce the quality of final printed wiring board obtained.
Especially for the substrate of soft or hard combination, the above problem is more prominent.When the first insulation material layer of substrate and second
Insulation material layer is that one of the first insulation material layer and second insulation material layer of soft board or substrate are soft board, another is
When hardboard, that is, when processing flexible printed wiring board or soft or hard combination printed wiring board, the first conductive material layer, the first insulating materials
After layer, the second conductive material layer and the lamination of the second insulation material layer, the surface of substrate can have uneven phenomenon.Resin is filled out
After consent, the remaining resin of substrate surface can fill up the recess of substrate surface, even if nog plate processing not can be removed substrate table yet
The cull of the recess in face, the quality that the first conductive circuit layer formed after pattern transfer later still will appear short circuit are asked
Topic.
Therefore, the processing method of printed wiring board of the invention, after carrying out electroless copper plating processing to the first hole, first to the
One conductive material layer and its metallic copper on surface carry out pattern transfer processing and form the first conductive circuit layer, then again to the first hole
Resin filling processing is carried out, i.e., first production forms the first conductive circuit layer before resin filling processing, and cull is avoided to go out
Now during the first conductive circuit layer of production, the first conductive circuit layer is avoided the quality problems of short circuit occur, by track
The scrappage control of road plate substantially increases the qualification rate of printed wiring board in the range of being lower than 0.5%.Meanwhile this implementation
The method of the first production conducting wire consent again of example, eliminates the nog plate processing to substrate, simplifies manufacturing procedure, improve production
Efficiency, while can avoid nog plate and conductive circuit layer thickness is thinned, it is ensured that the transmission performance of conductive circuit layer, it is ensured that track
The quality of road plate.
Processing for flexible printed wiring board and soft or hard combination printed wiring board, processing method of the invention --- i.e.
First production forms conductive circuit layer before resin fill-up hole processing, and more first resin fill-up hole processing makes to form conducting wire again
Layer, fundamentally avoiding nog plate processing not can be removed the appearance of resin this problem remained in recess, can be obtained extensively
Popularization.
Plating Copper treatment is carried out on the basis of electroless copper plating processing, with what is covered on the first hole of increase and the second hole inner wall
The thickness of conductive metal, to improve the reliability and stabilization transmitted between the first conductive circuit layer and the second conductive material layer
Property, improve the reliability and stability transmitted between third conductive circuit layer and the first conductive circuit layer.
Plating Copper treatment is carried out on the basis of electroless copper plating processing, the first conductive material layer and conduction material can also be increased
The thickness of the bed of material, to increase the thickness of the first conductive circuit layer and third conductive circuit layer that are formed, so that it is conductive to improve first
The transmission reliability and stability of line layer, the transmission reliability and stability for improving third conductive circuit layer.
As previously mentioned, if first carry out resin fill-up hole processing carry out pattern transfer processing again, need to increase nog plate processing with
There are the quality problems of short circuit in the conductive circuit layer for avoiding pattern transfer from obtaining.And the thickness of conductive circuit layer can be thinned in nog plate processing
Degree, so in the identical situation of transmission performance for ensuring final printed wiring board obtained, needed for processing method of the invention
The thickness that the more advanced row resin fill-up hole processing of the thickness of electro-coppering carries out electro-coppering needed for pattern transfer is handled again reduces not
Lower than 3um, the consumption of electro-coppering is saved, production cost is reduced, annual savable production cost is up to 7,000,000.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of substrate described in step a in embodiment 1；
Fig. 2 is structural schematic diagram described in step b in embodiment 1；
Fig. 3 is structural schematic diagram described in step c in embodiment 1；
Fig. 4 is the structural schematic diagram before exposing described in step d in embodiment 1；
Fig. 5 is the structural schematic diagram after exposing described in step d in embodiment 1；
It is the structural schematic diagram solidified after photoresist film removal described in step d that Fig. 6, which is in embodiment 1,；
Fig. 7 is the structural schematic diagram after corroding described in step d in embodiment 1；
Fig. 8 is the finally formed structural schematic diagram of step d in embodiment 1；
Fig. 9 is structural schematic diagram described in step f in embodiment 1；
Figure 10 is the structural schematic diagram in embodiment 1 after step g lamination；
Figure 11 is the structural schematic diagram of the final printed wiring board obtained of processing method described in embodiment 1；
Figure 12 is electro-coppering treated structural schematic diagram in embodiment 2；
Figure 13 is the structural schematic diagram of the final printed wiring board obtained of processing method described in embodiment 2；
Figure 14 is the structural schematic diagram of substrate described in step a in embodiment 3；
Figure 15 is the schematic diagram in embodiment 3 during substrate manufacture described in step a；
Figure 16 is structural schematic diagram described in step b in embodiment 3；
Figure 17 is structural schematic diagram described in step c in embodiment 3；
Figure 18 is that 3 step c resulting structures of embodiment are carried out with resin filling treated structural schematic diagram；
Figure 19 is to carry out nog plate treated structural schematic diagram to structure shown in Figure 18；
Figure 20 is the structural schematic diagram before exposing described in step d in embodiment 3；
Figure 21 is the structural schematic diagram after exposing described in step d in embodiment 3；
It is the structural schematic diagram solidified after photoresist film removal described in step d that Figure 22, which is in embodiment 3,；
Figure 23 is the structural schematic diagram after corroding described in step d in embodiment 3；
Figure 24 is the finally formed structural schematic diagram of step d in embodiment 3；
Figure 25 is structural schematic diagram described in step f in embodiment 3.
Specific embodiment
The present invention is described in detail with reference to the accompanying drawing:
Embodiment 1
The processing method of printed wiring board, which comprises the steps of:
A, a substrate 1 is provided.Substrate 1 includes at least one layer of insulation material layer and at least two layers of conductive material layer.Any two
Layer conductive material layer is provided respectively therein the two sides of one layer of insulation material layer, is dielectrically separated from by insulation material layer.Substrate 1 is extremely
Few one layer of outermost layer is conductive material layer.Preferred embodiment as shown in Figure 1, substrate 1 include two layers of insulation material layer, respectively
For the first insulation material layer 11 and the second insulation material layer 12.Substrate 1 further includes three layers of conductive material layer, and respectively first is conductive
Material layer 13, the second conductive material layer 14 and third conductive material layer 15.First conductive material layer 13 and the second conductive material layer
14 are located at the two sides of the first insulation material layer 11, are dielectrically separated from by the first insulation material layer 11；Second conductive material layer 14
It is located at the two sides of the second insulation material layer 12 with third conductive material layer 15, is dielectrically separated from by the second insulation material layer 12.
First insulation material layer 11 and the second insulation material layer 12 are separately positioned on the two sides of the second conductive material layer 14.Substrate 1 its
In outermost layer be the first conductive material layer 13, another outermost layer is third conductive material layer 15.Second conductive material layer
14 have the second conducting wire.
B, as shown in Fig. 2, being drilled on substrate 1 using mechanical drilling process or laser drilling process, formation is led from first
Material layer 13 extends to the first hole 2 of third conductive material layer 15.Carbon dioxide laser or UV can be selected in laser drilling process
Laser.Preferred embodiment is to be drilled on substrate 1 using laser drilling process.
C, it is handled as shown in figure 3, carrying out electroless copper plating at least once to substrate 1, metallic copper 3 is made to cover the interior of the first hole 2
The surface of wall and the first conductive material layer 13.Metallic copper 3 on first hole, 2 inner wall is conductive by the first conductive material layer 13 and second
Material layer 14 is connected to.
D, as shown in figure 8, after electroless copper plating processing, metallic copper 3 that the first conductive material layer 13 and its surface are covered into
Row pattern transfer processing, to form the first conductive circuit layer 4.First conductive circuit layer 4 and the second conductive material layer 14 pass through the
The metallic copper 3 covered on one hole, 2 inner wall is connected to.Pattern transfer processing include etching, laser cutting, one of machine cuts or
It is any several.Etch process is selected in the present embodiment preferred embodiment, pattern transfer processing.Specific step is as follows for etch process: first
First, as shown in figure 4, providing the corresponding area of metallic copper 3 and the first hole 2 that photoresist film 5 covers 13 surface of the first conductive material layer
Domain.Then, as shown in figure 5, being exposed processing to photoresist film 5, make to need to etch away on the first conductive material layer 13
The photoresist film 51 of region overlay is uncured, makes the photosensitive guarantor for the region overlay for not needing to etch away on the first conductive material layer
Cuticula 52 solidifies.Then, as shown in fig. 6, substrate 1 is immersed in the K that mass concentration is 0.8%-1.2%2CO3In solution, impregnate
1-2min makes uncured photoresist film 51 fall off from the surface of the first conductive material layer.Followed by as shown in fig. 7, using
HCl and CuCl2Mixed solution the region for not covering photoresist film on the first conductive material layer 13 is corroded, first leads
The region that photoresist film is covered on material layer 13 avoids being etched corrosion under the protection of photoresist film, to be formed
First conductive circuit layer 4.Finally, substrate 1 is immersed in 1-2min in the NaOH solution that concentration is 15-30g/L, removal first is led
The remaining cured light-sensitive surface 52 of 4 surface of electric line layer covering.
E, after pattern transfer processing, the chemical treatment of surface metal copper is carried out to substrate 1, is formed with the surface in metallic copper 3
The organic film (not shown) of certain roughness, so that the surface roughness of metallic copper 3 is increased, to increase metallic copper with after
Bond strength between the insulation material layer 15 of subsequent layers pressure, avoids the appearance of lamination, improves the quality of printed wiring board.
F, after the chemical treatment of surface metal copper, resin fill-up hole processing is carried out to substrate: the first hole 2 is clogged using resin 6,
Make the filling rate in the first hole 2 not less than 80%, it is corresponding to avoid the first hole 2 when subsequent lamination insulation material layer or conductive material layer
Place collapses, it is ensured that the quality and using effect of printed wiring board.As shown in figure 9, clogging filling out for the first hole 2 after resin 6
Filling rate is 100%.
After the chemical treatment of surface metal copper before resin fill-up hole processing, drying and processing can be carried out to substrate 1, with removal
Steam in first hole 2, avoiding existing due to the steam in the first hole 2 causes cracked after resin fill-up hole or layering etc. existing
As.
Inner wall of the electroless copper plating processing in the first hole 2 deposits one layer thin metallic copper 3 to realize 13 He of the first conductive material layer
Connection between second conductive material layer 14, the method for then clogging the first hole 2 using resin can both press exhausted to avoid succeeding layer
2 corresponding position of the first hole collapses when edge material layer, relatively reduces the dosage of copper again using the first hole of copper plating process filling 2,
Reduce production cost.
G, at least one layer of insulation material layer and at least one layer of conductive material layer are sequentially laminated in the first conductive circuit layer 4,
And the b-e that repeats the above steps, form the printed wiring board that there is multilayer conductive route layer stackup and interconnect.As shown in Figure 10 preferably
Embodiment is sequentially laminated one layer of insulation material layer 15 and layer of conductive material layer 16 in the first conductive circuit layer 4, and repeats
Above-mentioned steps b-e forms the second hole that self-conductance material layer 16 extends to the first conductive circuit layer 4, and by electroless copper plating
Reason makes 16 surface of hole wall and conductive material layer in the covering of metallic copper 7 second hole.Conductive material layer 16 and its surface are covered
Metallic copper 7 carry out pattern transfer processing, at third conductive circuit layer 17, third conductive circuit layer 17 passes through the hole in the second hole
The metallic copper 7 covered on wall is connected to the first conductive circuit layer 4, so as to form having the first conductive circuit layer 4, third conductive
The printed wiring board 01 (as shown in figure 11) that line layer 17, the second conductive material layer 14 with the second conducting wire are laminated,
In the first conductive circuit layer 4 and the second conductive material layer 14 with the second conducting wire pass through the metal on 2 hole wall of the first hole
Copper 3 is connected to, and third conductive circuit layer 17 is connected to the first conductive circuit layer 4 by the metallic copper 3 on the second hole hole wall.First hole
2 be the buried via hole in printed wiring board 01, and the second hole is the blind hole in printed wiring board 01.
It is laminated before insulation material layer 15 and conductive material layer, adopts in the first conductive circuit layer 4 after resin filling processing
Pressure is rolled or caught up with polyethylene film or oil-Absorbing Sheets, the resin on 4 surface of the first conductive circuit layer is removed, is avoided because remaining
Resin fruit is excessive, causes the uneven of dielectric thickness, influences the quality of line transmissions.
Insulation material is laminated after the resin on 4 surface of the first conductive circuit layer is removed and in the first conductive circuit layer 4
Before the bed of material 15 and conductive material layer, by substrate 1 100-150 DEG C at a temperature of toast 15-40min, obtain the resin of consent
The drying and preliminary solidification arrived, avoid pollution in the handling process.
The process of insulation material layer 15 is laminated in the first conductive circuit layer 4 preferably after the chemical treatment of surface metal copper
It is completed in 72 hours, fail to avoid the organic film that surface metal copper chemistry is formed or scratches and reduce the first conductive circuit layer 4
Binding force between insulation material layer 15.
In above-mentioned steps, after carrying out electroless copper plating processing to the first hole 2, if first carrying out resin filling processing to the first hole 2,
Pattern transfer processing is carried out to the first conductive material layer 13 again, the resin of resin fill-up hole processing can remain in the first conductive material
The surface of the metallic copper 3 covered on layer 13.If remaining in the resin on 3 surface of metallic copper covered on the first conductive material layer 13 not
The pattern transfer processing that completely will have a direct impact on the metallic copper 3 of the first conductive material layer 13 and the covering of its surface is removed, figure is made
There are the quality problems of short circuit in the first conductive circuit layer 4 that shape transfer processing is formed, leads to final printed wire blackboard newspaper obtained
Useless, scrappage is up to 8%, to reduce the production qualification rate of printed wiring board.To avoid cull to pattern transfer processing
Influence, can resin fill-up hole processing after, pattern transfer processing before, to substrate 1 carry out nog plate processing, it is residual to remove
Stay in the resin on 3 surface of metallic copper covered on the first conductive material layer 13.But nog plate is handled while removing cull,
It can be removed together together with the metallic copper 3 covered on the first conductive material layer 13, or even have the wind for grinding off the first conductive material layer 13
Danger, is thinned the thickness of the first conductive material layer 13, so as to cause the thickness of the first conducting wire 4 formed after pattern transfer processing
Degree is thinned, and reduces the transmission performance of the first conducting wire 4, reduces the quality of final printed wiring board obtained.
Embodiment 2
As shown in figure 12, on the basis of embodiment 1, after carrying out electroless copper plating processing to the first hole 2 on substrate 1,
Before carrying out pattern transfer processing to the metallic copper 3 that the first conductive material layer 13 and its surface cover, at least one is carried out to substrate 1
Secondary plating Copper treatment makes electro-coppering 8 cover the gold on 13 surface of metallic copper 3 and the first conductive material layer of 2 inner wall of the first hole of hole
Belong to copper 3.The electro-coppering 8 on 3 surface of metallic copper is for the first conductive material layer 13 to be connected to the second conductive material layer 14.First leads
Material layer 13 and the second conductive material layer 14 pass through the metallic copper 3 covered on 2 inner wall of the first hole and covering 3 surface of metallic copper
Electro-coppering 8 is connected to.
After carrying out electroless copper plating processing to the second hole on substrate 1, to the metal of conductive material layer and its surface covering
Before copper 7 carries out pattern transfer processing, Copper treatment is electroplated to substrate 1 at least once, covers electro-coppering 9 in the second hole of hole
The metallic copper 7 of wall and the metallic copper 7 of conductive material layer surface.The electro-coppering 9 on 7 surface of metallic copper be used for conductive material layer and
The connection of first conductive circuit layer 4.Conductive material layer and the first conductive circuit layer 4 pass through the metallic copper 7 covered on the second hole inner wall
It is connected to the electro-coppering 9 on covering 7 surface of metallic copper.Final printed wiring board obtained 01 is as shown in figure 13.
Plating Copper treatment is carried out on the basis of electroless copper plating processing, is covered on the first hole 2 and the second hole inner wall with increasing
Conductive metal thickness, thus improve the reliability transmitted between the first conductive circuit layer 4 and the second conductive material layer 14 and
Stability improves the reliability and stability transmitted between third conductive circuit layer 17 and the first conductive circuit layer 4.
Plating Copper treatment is carried out on the basis of electroless copper plating processing, the first conductive material layer 13 and conduction can also be increased
The thickness of material layer, to increase the thickness of the first conductive circuit layer 4 and third conductive circuit layer 17 formed, to improve first
The transmission reliability and stability of conductive circuit layer 4, the transmission reliability and stability for improving third conductive circuit layer 17.
Embodiment 3
The processing method of printed wiring board of the invention is particularly suitable for processing soft or hard combination printed wiring board.The present embodiment
It illustrates and soft or hard combination printed wiring board is processed using the processing method of printed wiring board of the invention.
A, a substrate 1 is provided.Substrate 1 includes at least one layer of insulation material layer and at least two layers of conductive material layer.Any two
Layer conductive material layer is provided respectively therein the two sides of one layer of insulation material layer, is dielectrically separated from by insulation material layer.Substrate 1 is extremely
Few one layer of outermost layer is conductive material layer.Preferred embodiment as shown in figure 14, substrate 1 include two layers of insulation material layer, point
It Wei not the first insulation material layer 11, the second insulation material layer 12 and third insulation material layer 18.Substrate 1 further includes four layers of conduction material
The bed of material, respectively the first conductive material layer 13, the second conductive material layer 14, third conductive material layer 19 and the 4th conductive material layer
20.First conductive material layer 13 and the second conductive material layer 14 are located at the two sides of the first insulation material layer 11, absolutely by first
Edge material layer 11 is dielectrically separated from；Second conductive material layer 14 and third conductive material layer 19 are located at the second insulation material layer 12
Two sides, be dielectrically separated from by the second insulation material layer 12；Third conductive material layer 19 and the 4th conductive material layer 20 are located at
The two sides of third insulation material layer 18 are dielectrically separated from by third insulation material layer 18.One of outermost layer of substrate 1 is first
Conductive material layer 13, another outermost layer are the 4th conductive material layer 20.Second conductive material layer 14 has the second conducting wire,
Third conductive material layer 14 has third conducting wire.Wherein the first insulation material layer 11 and the second insulation material layer 18 are hard
Plate, the second insulation material layer 12 are soft board.
In the manufacturing process of aforesaid substrate 1, need the first conductive material layer 13 being laminated to the first insulation material layer 11
Before upper, the 4th conductive material layer 20 is laminated on third insulation material layer 18, to 11 He of the first insulation material layer for hardboard
Third insulation material layer 18 opens the first window 101 and the second window 102 respectively, there is the second insulation material layer 12 for soft board can from
One insulation material layer 11 and 18 two sides of third insulation material layer are exposed, and realize printed wiring board in the first window 101 and the second window 102
The bending of corresponding position flexibility.But the first conductive material layer 13 is being laminated on the first insulation material layer 11 and by the 4th conduction material
During the bed of material 20 is laminated on third insulation material layer 18, first in order to avoid 101 corresponding position of the first window is conductive
4th conductive material layer of 102 corresponding position of material layer 13 and the second window is collapsed into window and by broken hole, can be led by first
Material layer 13 is laminated on the first insulation material layer 11, the 4th conductive material layer 20 is laminated on third insulation material layer 18
Before, be put into a movable block 04 in the first window 101 and the second window 102, in subsequent lamination process to the first conduction material
The bed of material 13 and the 4th conductive material layer 20 are played a supporting role, and conductive material layer is avoided to collapse into broken hole in window.And in order to make
Movable block 04 is conveniently taken out, and generally can be the depth greater than window by the thickness design of movable block 04, be put into window 10 in movable block 04
After interior, the upper end of movable block 04 can protrude window 10, and staff or manipulator clamping movable block 04 protrude the position of window 10
Easily movable block 04 is taken out out of window.But after the protrusion window of movable block 04 certainly will will lead to the lamination of the first conductive material layer 13,
The height of first conductive material layer of 101 corresponding position of the first window is higher than the first conductive material layer at other positions, the
The edge of one window, 101 corresponding position forms the first groove 021 (as shown in figure 15).Same 4th conductive material layer also can be
The edge of second window, 102 corresponding position forms the second groove 022 (as shown in figure 15).
B, it as shown in figure 16, is drilled on substrate 1 using mechanical drilling process or laser drilling process, formation is led from first
Material layer 13 extends to the first hole 2 of the 4th conductive material layer 20.Carbon dioxide laser or UV can be selected in laser drilling process
Laser.Preferred embodiment is to be drilled on substrate 1 using laser drilling process.
C, electroless copper plating at least once as shown in figure 17, is carried out to substrate 1 to handle, and metallic copper 3 is made to cover the interior of the first hole 2
The surface of wall and the first conductive material layer 13, the 4th conductive material layer 20.Metallic copper 3 on first hole, 2 inner wall is conductive by first
Material layer 13 is connected to the 4th conductive material layer 20.
As shown in figure 18, if after completing the procedure, i.e., carrying out resin filling processing to the first hole 2, generally guaranteeing
Hole can achieve 100% filling rate, and resin 6 can be made to fill up the first hole 2 and overflow the first hole 2, if the first hole 2 is located in substrate
The opening on surface is located at the first groove 021, the second groove 022 nearby (as shown in figure 17), the resin meeting overflowed from the first hole 2
Remain in the first groove 021 and the second groove 022.Because resin is embedded in the first groove 021 and the second groove 022, even if right
Substrate surface, which carries out nog plate processing, not can be removed remaining resin (as shown in figure 19) in groove yet.Remaining resin coating in groove
Cover the surface in the metallic copper 3 of groove corresponding position, thus further to metallic copper 3 cover the first conductive material layer 13,
4th conductive material layer 20 generates covering.It is subsequent that pattern transfer is carried out to the first conductive material layer 13 and the 4th conductive material layer 20
Processing etches when etching solution such as use to etch the first conductive material layer 13 and the 4th conductive material layer 20 to form conducting wire
Liquid can be stopped by the cull in groove and can not etch into quilt on the first conductive material layer 13 and the 4th conductive material layer 20
The region of resin covering, therefore can make the corresponding region that resin covers on the first conductive material layer and the 4th conductive material layer should
The region being etched can not be etched, and the quality for generating short circuit so as to cause the conducting wire formed after pattern transfer is asked
Topic scraps final printed wiring board obtained, and scrappage is up to 8%.
It is topic to avoid conducting wire from generating the quality of above-mentioned short circuit, the processing method of the printed wiring board of the present embodiment,
After completing the electroless copper plating processing of above-mentioned steps c, substrate is handled as follows:
D, after electroless copper plating processing, metallic copper 3, the 4th conductive material that the first conductive material layer 13 and its surface are covered
Layer 20 and its metallic copper 3 of surface covering carry out pattern transfer processing, to form the first conductive circuit layer 41 and the 4th conductor wire
Road floor 42.First conductive circuit layer 41 is connected to the second conductive material layer 42 by the metallic copper 3 covered on 2 inner wall of the first hole.
Pattern transfer processing includes one of etching, laser cutting, machine cuts or arbitrarily several.The present embodiment preferred embodiment, figure
Shape transfer processing selects etch process.Specific step is as follows for etch process: firstly, as shown in figure 20, providing photoresist film 5
2 corresponding region of metallic copper 3 and the first hole, the 4th conductive material layer 20 and its surface for covering 13 surface of the first conductive material layer are covered
The metallic copper 3 of lid.Then, as shown in figure 21, processing is exposed to photoresist film 5, makes to need on the first conductive material layer 13
The photoresist film 51 for the region overlay to be etched away is uncured, covers the region for not needing to etch away on the first conductive material layer
The photoresist film 52 of lid solidifies.Then, as shown in figure 22, substrate 1 is immersed in the K that mass concentration is 0.8%-1.2%2CO3
In solution, 1-2min is impregnated, uncured photoresist film 51 is made to fall off from the surface of the first conductive material layer.Followed by such as
Shown in Figure 23, HCl and CuCl are used2Mixed solution to not covered on the first conductive material layer 13, the 4th conductive material layer 20
The region of photoresist film is corroded, and photoresist film is covered on the first conductive material layer 13, the 4th conductive material layer 20
Region avoids being etched corrosion under the protection of photoresist film, to form the first conductive circuit layer 41, the 4th conductor wire
Road floor 42.Finally, substrate 1 is immersed in 1-2min in the NaOH solution that concentration is 15-30g/L, the first conductive circuit layer 4 is removed
The remaining cured light-sensitive surface 52 of surface covering, finally obtains structure as shown in figure 24.
E, after pattern transfer processing, the chemical treatment of surface metal copper is carried out to substrate 1, is formed with the surface in metallic copper 3
The organic film (not shown) of certain roughness, so that the surface roughness of metallic copper 3 is increased, to increase metallic copper with after
Bond strength between the insulation material layer 15 of subsequent layers pressure, avoids the appearance of lamination, improves the quality of printed wiring board.
F, after the chemical treatment of surface metal copper, resin fill-up hole processing is carried out to substrate: the first hole 2 is clogged using resin 6,
Make the filling rate in the first hole 2 not less than 80%, it is corresponding to avoid the first hole 2 when subsequent lamination insulation material layer or conductive material layer
Place collapses, it is ensured that the quality and using effect of printed wiring board.As shown in figure 25, filling out for the first hole 2 after resin 6 is clogged
Filling rate is 100%.
After the chemical treatment of surface metal copper before resin fill-up hole processing, drying and processing can be carried out to substrate 1, with removal
Steam in first hole 2 avoids cracked or layering etc. after causing resin to be clogged due to the steam presence in the first hole 2 existing
As.
Inner wall of the electroless copper plating processing in the first hole 2 deposits one layer thin metallic copper 3 to realize 13 He of the first conductive material layer
Connection between second conductive material layer 14, the method for then clogging the first hole 2 using resin can both press exhausted to avoid succeeding layer
2 corresponding position of the first hole collapses when edge material layer, relatively reduces the dosage of copper again using the first hole of copper plating process filling 2,
Reduce production cost.
When the processing method of the printed wiring board of the present embodiment is processed above-mentioned Rigid Flex, to the first hole
2 carry out electroless copper plating processing after, first to the metallic copper 3 of the first conductive material layer 13 and its surface, the 4th conductive material layer 20 and
The metallic copper 3 on its surface carries out pattern transfer processing and forms the first conductive circuit layer 41, the 4th conductive circuit layer 42, then right again
First hole 2 carries out resin filling processing, i.e., first production forms the first conductive circuit layer the 41, the 4th and leads before resin filling processing
Electric line layer 42, avoid in groove remaining resin cover the first conductive material layer 13, the 4th conductive material layer 20 and influence the
The route production of one conductive material layer 13, the 4th conductive material layer 20 avoids making because of the covering of resin remaining in groove the
The region that should be etched away on one conductive material layer 13, the 4th conductive material layer 20 can not be etched, to avoid that shape is made
At the first conductive circuit layer 41 and the 4th conductive circuit layer 42 occur short circuit quality problems, make the scrappage of printed wiring board
Control substantially increases the qualification rate of printed wiring board in the range of being lower than 0.5%.Meanwhile to the first conductive material layer 13
After carrying out pattern transfer processing the first conductive circuit layer 4 of formation, then resin fill-up hole processing is carried out to the first hole 2, even if there is tree
Rouge 6 remains in the surface of the first conductive circuit layer 41, the 4th conductive circuit layer 42, because the first conductive circuit layer the 41, the 4th is conductive
The conductive pattern of line layer 42 has been formed, even if the resin 6 of insulation remains in the first conductive circuit layer 41, the 4th conductive circuit layer
In 42 surface or route gap 03 (as shown in figure 25), the quality problems of the short circuit of conducting wire will not be caused, therefore can
The nog plate processing to substrate is saved, manufacturing procedure is simplified, improves production efficiency, while can avoid nog plate and conducting wire is thinned
Thickness degree, it is ensured that the transmission performance of conductive circuit layer, it is ensured that the quality of printed wiring board.
Processing for flexible printed wiring board and soft or hard combination printed wiring board, the processing method of the present embodiment ---
First production forms conductive circuit layer i.e. before resin fill-up hole processing, and more first resin fill-up hole processing makes to form conductor wire again
Road floor, fundamentally avoiding nog plate processing not can be removed the appearance of resin this problem remained in groove, can be obtained wide
General popularization.
In addition, if first carry out resin fill-up hole processing carry out pattern transfer processing again, need to increase nog plate processing to avoid
There are the quality problems of short circuit in the conductive circuit layer that pattern transfer obtains.And the thickness of conductive circuit layer can be thinned in nog plate processing,
So in the identical situation of transmission performance for ensuring final printed wiring board obtained, electricity needed for the processing method of the present embodiment
The thickness that the copper-plated more advanced row resin fill-up hole processing of thickness carries out electro-coppering needed for pattern transfer is handled again reduces not low
In 3um, the consumption of electro-coppering is saved, production cost is reduced, annual savable production cost is up to 7,000,000.
Embodiment in the present invention is only used for that the present invention will be described, and is not construed as limiting the scope of claims limitation,
Other substantially equivalent substitutions that those skilled in that art are contemplated that, all fall in the scope of protection of the present invention.
Claims (9)
1. the processing method of printed wiring board, which comprises the steps of:
A, a substrate is provided；The substrate includes at least one layer of insulation material layer and at least two layers of conductive material layer；Any two layers
The conductive material layer is provided respectively therein the two sides of one layer of insulation material layer, by the insulation material layer insulation every
From；At least one layer of outermost layer of the substrate is the conductive material layer；
B, it drills on the substrate, is formed from positioned at the outermost conductive material layer of the substrate and extend to another layer of conduction material
The hole of the bed of material；
C, electroless copper plating at least once is carried out to the substrate to handle, metallic copper is made to cover the inner wall in the hole；On the inner wall of hole
Metallic copper will be located at the outermost conductive material layer of the substrate and be connected to another layer of conductive material layer；
D, after electroless copper plating processing, pattern transfer processing is carried out to the outermost conductive material layer of the substrate is located at, to be formed
First conductive circuit layer；First conductive circuit layer is connected to another layer of conductive material layer by the metallic copper；
E, pattern transfer processing after, the substrate is chemically treated, make the surface roughness of the metallic copper on the inner wall of hole with
And the surface roughness of first conductive circuit layer increases, and the surface of the metallic copper on the inner wall of hole and described first leads
The surface of electric line layer forms organic film；
F, after the chemical treatment of surface metal copper, resin fill-up hole processing is carried out to substrate, the hole is clogged using resin；
G, at least one layer of insulation material layer and at least one layer of conductive material layer are sequentially laminated in the first conductive circuit layer；And it repeats
The step b-e forms the printed wiring board for having multilayer conductive route layer stackup and interconnecting；In the step e, pattern transfer
Processing includes one of etching, laser cutting, machine cuts or arbitrarily several, and the method for etching is specifically: firstly, providing sense
Light protective film covers metallic copper and the hole corresponding region of conductive material layer surface；Then, processing is exposed to photoresist film,
Keep the photoresist film for the region overlay for needing to etch away on conductive material layer uncured, makes not needing to etch on conductive material layer
The photoresist film of the region overlay fallen solidifies；Then, substrate is immersed in the K that mass concentration is 0.8%-1.2%2CO3Solution
It is interior, 1-2min is impregnated, uncured photoresist film is made to fall off from the surface of conductive material layer；Followed by, using HCl and
CuCl2Mixed solution the region for not covering photoresist film on conductive material layer is corroded, covered on conductive material layer
The region of photoresist film avoids being etched corrosion under the protection of photoresist film, to form conductive circuit layer；Finally,
Substrate is immersed in 1-2min in the NaOH solution that concentration is 15-30g/L, removal conducting wire layer surface covers remaining solid
The light-sensitive surface of change.
2. the processing method of printed wiring board according to claim 1, which is characterized in that after electroless copper plating processing, figure
Before shape transfer processing, Copper treatment is electroplated to the substrate at least once, makes the metallic copper on electro-coppering covering hole inner wall
And positioned at the surface of the outermost conductive material layer of the substrate；The electro-coppering of the copper surface will be located at the substrate
Outermost conductive material layer is connected to another layer of conductive material layer；First conductive circuit layer and another layer of conductive material layer
It is connected to by the metallic copper with the electro-coppering positioned at the copper surface.
3. the processing method of printed wiring board according to claim 1, which is characterized in that at the surface metal copper chemistry
Before clogging resin after reason and into the hole, drying and processing is carried out to the substrate, to remove the steam in the hole.
4. the processing method of printed wiring board according to claim 1, which is characterized in that the filling rate in the hole be greater than etc.
In 80%.
5. the processing method of printed wiring board according to claim 1, which is characterized in that after clogging the hole using resin
And be sequentially laminated in the first conductive circuit layer before at least one layer of insulation material layer and at least one layer of conductive material layer, it uses
Polyethylene film or oil-Absorbing Sheets are rolled or are caught up with pressure, and the resin of the first conducting wire layer surface is removed.
6. the processing method of printed wiring board according to claim 5, which is characterized in that by first conductive circuit layer
At least one layer of insulation material layer and at least one layer are sequentially laminated after the resin removal on surface and in the first conductive circuit layer
Before conductive material layer, by the substrate 100-150 DEG C at a temperature of toast 15-40min.
7. the processing method of wiring board according to claim 1, which is characterized in that in the step b, using machine drilling
Technique or laser drilling process drill to the substrate；The laser drilling process selects carbon dioxide laser or UV to swash
Light.
8. the processing method of printed wiring board according to claim 1, which is characterized in that at least one layer of insulation material layer is
Soft board.
9. the processing method of printed wiring board according to claim 1, which is characterized in that at least one layer of insulation material layer is
Hardboard.
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| CN107124826B (en) * | 2017-06-20 | 2019-08-23 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN109152225A (en) * | 2018-10-18 | 2019-01-04 | 莆田市涵江区依吨多层电路有限公司 | A kind of buried via hole method for plugging of holes on high density interconnected printed circuit board |
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| US5106454A (en) * | 1990-11-01 | 1992-04-21 | Shipley Company Inc. | Process for multilayer printed circuit board manufacture |
| CN101720167A (en) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
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