CN115805207B - Full-automatic wafer cleaning device - Google Patents

Abstract

The invention relates to the related field of wafer cleaning equipment, in particular to a full-automatic wafer cleaning device which comprises a processing box provided with a feed inlet and a discharge outlet, a feed conveyor belt and a discharge conveyor belt, wherein a cleaning platform, a feed mechanism and a cleaning mechanism are arranged in the processing box, a tray and four turntables are arranged on the cleaning platform, the feed mechanism comprises a feed sucker and a discharge sucker, and a pressing piece is also arranged in the processing box. The cleaning equipment is fully-automatically operated, has high cleaning efficiency, can more conveniently realize dust-free operation, is provided with the observation window, and can be timely found and stopped when a machine fails; according to the invention, through the mutual matching of the feeding conveyor belt, the discharging conveyor belt, the feeding sucker, the discharging sucker, the rotating handle, the tray, the cleaning mechanism and the four turntables, a plurality of wafers can be conveyed to the tray for cleaning by the feeding conveyor belt in a stable step and are sent out by the processing conveyor belt.

Description

Full-automatic wafer cleaning device

Technical Field

The invention relates to the related field of wafer cleaning equipment, in particular to a full-automatic wafer cleaning device.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. Domestic wafer lines are mainly 8 inches and 12 inches. The wafer is cleaned in one step which is important in the production process of the wafer, whether the wafer is clean or not has great influence on the quality of the wafer, the cleaning of the wafer is mainly divided into two modes, namely batch cleaning and single cleaning, and the batch cleaning has a cleaning effect on the wafer which is inferior to that of the single cleaning because a plurality of wafers are placed in one cleaning tank for cleaning.

Conventional single clean wafer apparatus have the following disadvantages: firstly, many traditional cleaning equipment still need manual auxiliary operation to go up the unloading to the wafer, the single washing of wafer is just longer with regard to the washing time consuming time of batch relatively, manual auxiliary operation has prolonged the cleaning duration of wafer more, and in order to guarantee the clean of cleaning environment, the workman is for getting into dustless operation space work, time cost and cost of labor have been increased more, secondly, many traditional cleaning equipment is in the wafer cleaning process, to the operation such as placing of wafer, press from both sides tightly, the spraying of washing liquid, most operation that need step by step, many operations that can carry out in step can't realize the synchronization, or realize synchronous operation with higher cost's equipment, the cleaning duration of wafer has further been prolonged.

Disclosure of Invention

Based on this, it is necessary to provide a full-automatic wafer cleaning device for solving the problems in the prior art.

In order to solve the problems in the prior art, the invention adopts the following technical scheme:

the utility model provides a full-automatic wafer belt cleaning device, includes the processing case that is provided with feed inlet and discharge gate and sets up respectively in feed conveyer belt and the ejection of compact conveyer belt of feed inlet and discharge gate department, be provided with the cleaning platform in the processing case, be used for transporting the wafer on the feed conveyer belt in proper order to the feeding mechanism on cleaning platform and the ejection of compact conveyer belt and set up in cleaning platform top and be used for successively spraying cleaning liquid and ultrapure water cleaning mechanism, be provided with on the cleaning platform and can vertical lift and be used for placing the tray of wafer and four along circumferencial direction evenly distributed and can follow the decline of tray and synchronous inwards translation carousel, four carousels inwards translate to extreme position can press from both sides tight wafer and synchronous syntropy rotation, feeding mechanism is including feeding sucking disc and the blowing sucking disc that can synchronous rotation, the feeding sucking disc is used for adsorbing the wafer on the feeding conveyer belt and places on the tray, the blowing sucking disc is used for adsorbing the wafer on the tray and places on the ejection of compact conveyer belt, the feeding sucking disc can jack-up along vertical direction elasticity direction and follow the decline of tray and can follow the decline of tray and synchronous inwards translate, four carousels inwards translate to the extreme position and be used for the feeding sucking disc to press down.

Preferably, the cleaning platform comprises a bottom disc, a lower layer cylinder, a round platform baffle ring and a top ring, wherein the bottom disc is horizontally arranged in the processing box, the lower layer cylinder is coaxially and fixedly connected to the top of the bottom disc, the round platform baffle ring is coaxially and fixedly connected to the top of the lower layer cylinder, the top ring is fixedly connected with the round platform baffle ring, the tray is coaxially arranged in the round platform baffle ring and the top ring in a lifting manner, and the four rotary discs are radially and slidably arranged at the top of the top ring.

Preferably, the first cylinder has been linked firmly on the chassis and the output shaft of tray and first cylinder links firmly, still be provided with first flexible section of thick bamboo and first flexible section of thick bamboo has a flexible vertical shaft of freely stretching out and drawing back on the chassis, the top and the coaxial fixed connection of tray of flexible vertical shaft have linked firmly four second flexible barrels that correspond four turntables one by one on the top ring, every second flexible barrel all has a flexible cross axle along the radial free flexible of top ring, the outer end of every flexible cross axle all points to the inboard of top ring and the outer end of every flexible cross axle all links to each other with corresponding carousel, first flexible barrel passes through the trachea with four second flexible barrels and links to each other.

Preferably, the first telescopic cylinder further comprises a first cylinder body coaxially fixedly connected with the top of the bottom disc, the telescopic vertical shaft is coaxially and slidably arranged in the first cylinder body and is in dynamic seal connection with the first cylinder body, the bottom of the first cylinder body is provided with a first air vent, the second telescopic cylinder further comprises a second cylinder body fixedly connected with the top ring, one end, close to the outer side of the top ring, of the second cylinder body is provided with a second air vent, the telescopic transverse shaft is coaxially and slidably arranged in the second cylinder body and is in dynamic seal connection with the second cylinder body, the air pipe comprises a five-way pipe in sealing connection with the air vent and four connecting pipes in sealing connection with the four second air vents respectively, and the other ends of the four connecting pipes are in sealing connection with the other four ports of the five-way pipe respectively.

Preferably, the top ring is further provided with four radial sliding grooves which are uniformly distributed along the circumferential direction and are in one-to-one correspondence with the four second cylinder bodies, each second cylinder body is fixedly arranged at the outermost end of the corresponding radial sliding groove, a sliding block is further arranged in each radial sliding groove in a sliding manner, the sliding block is positioned at one end, corresponding to the telescopic transverse shaft, close to the inner side of the top ring, the inner end of the telescopic transverse shaft is fixedly connected with the corresponding sliding block, the sliding block is further provided with a follow-up vertical shaft in a shaft connection manner, the rotary table is coaxially and fixedly connected to the top end of the corresponding follow-up vertical shaft, and the rotary table baffle ring is further provided with a driving mechanism for driving a plurality of follow-up vertical shafts to synchronously rotate in the same direction.

Preferably, the driving mechanism comprises a driving motor fixedly connected with the round table baffle ring, an output shaft of the driving motor is vertically upwards, the bottom end of each follow-up vertical shaft is coaxially and fixedly connected with a synchronous wheel, the output shaft of the driving motor is also coaxially and fixedly connected with the synchronous wheel, a plurality of synchronous wheels are connected through synchronous belt transmission, and a tensioner for keeping the synchronous belt tight is further arranged at the bottom of the top round disc.

Preferably, the feeding mechanism comprises a holding cylinder and a holding box which are fixedly connected with the processing box, a rotary vertical shaft which is vertically connected with the holding cylinder in a shaft mode, a rotary handle which is fixedly connected with the top end of the rotary vertical shaft, a first gear which is coaxially and fixedly connected with the bottom end of the rotary vertical shaft, a second gear which is horizontally connected with the holding box in a shaft mode and meshed with the first gear, a rack which is slidably arranged in the holding box and meshed with the second gear, and a driving cylinder of which the output end is fixedly connected with the rack, wherein the discharging sucker is fixedly connected with one end of the rotary handle, and the feeding sucker is elastically arranged at the other end of the rotary handle.

Preferably, one end sliding connection that rotatory handle was provided with the feeding sucking disc has three lift vertical axis, and the bottom and the feeding sucking disc top end of three lift vertical axes link firmly, and the top of every lift vertical axis is all moulded to have a step portion, and the epaxial both ends of all overlapping in every lift vertical is equipped with spring and spring are contradicted step portion and rotatory handle respectively, the casting die is horizontal platelike structure down, and the processing incasement still hangs the output of having second cylinder and second cylinder vertically downwards, and the casting die is fixed to be set up in the output bottom of second cylinder and be located three lift vertical axes directly over.

Preferably, the cleaning mechanism comprises a lifting frame fixedly connected with the processing box, a lifting arm arranged on the lifting frame and capable of freely lifting, a third cylinder fixedly connected with the lifting frame and a spraying box fixedly arranged on the lifting arm, the output end of the third cylinder vertically lifts and is fixedly connected with the lifting arm, a first feeding pipe and a second feeding pipe which are respectively used for filling cleaning liquid and ultrapure water are arranged on the spraying box, and a plurality of nozzles are further arranged at the bottom of the spraying box.

Preferably, the turntable comprises a lower circular ring coaxially and fixedly connected with the top end of the follow-up vertical shaft, an upper circular ring and an anti-slip check ring, wherein the upper circular ring and the anti-slip check ring are positioned above the lower circular ring, the diameter of the upper circular ring is smaller than that of the lower circular ring, a connecting shaft for fixedly connecting with the upper circular ring is formed at the top of the lower circular ring, and the anti-slip check ring is coaxially sleeved on the connecting shaft.

Compared with the prior art, the invention has the following beneficial effects:

firstly, the cleaning equipment is fully-automatically operated, the cleaning efficiency is high, dust-free operation can be realized more conveniently, and meanwhile, the observation window is arranged to observe the cleaning process in real time, so that the cleaning equipment can be found out and stopped in time when the machine is in fault;

secondly, the invention can realize that a plurality of wafers are stably conveyed to the tray for cleaning by the feeding conveyor belt and are sent out by the processing conveyor belt through the mutual matching of the feeding conveyor belt, the discharging conveyor belt, the feeding sucker, the discharging sucker, the rotating handle, the tray, the cleaning mechanism and the four turntables;

thirdly, the tray is driven to rise or fall by the first telescopic cylinder, and is matched with the five-way pipe, the four connecting pipes and the four second telescopic cylinders to synchronously drive the four sliding blocks to open or close, so that the four turntables are driven to synchronously open or close, a wafer can be conveniently and rapidly loosened or clamped, and the structure is simple and efficient;

fourth, the follow-up vertical shafts on the four sliding blocks are connected through synchronous belt transmission, and the tensioning device is used for keeping tension, so that the four rotary tables are driven by the driving motor to synchronously rotate in the same direction, then the wafer is driven to rotate, and the automatic and rapid cleaning of the upper surface of the wafer is realized by matching with cleaning liquid and ultrapure water sprayed by the cleaning mechanism.

Drawings

Fig. 1 is a schematic perspective view of an embodiment.

Fig. 2 is a partial perspective view of an embodiment.

Fig. 3 is an enlarged view of a partial structure at a in fig. 2.

Fig. 4 is an enlarged view of a partial structure at B in fig. 2.

Fig. 5 is a partial perspective exploded view of an embodiment.

Fig. 6 is an enlarged view of a partial structure at C in fig. 5.

Fig. 7 is an enlarged view of a partial structure at D in fig. 5.

Fig. 8 is an enlarged view of a partial structure at E in fig. 5.

Fig. 9 is an exploded perspective view of the cleaning mechanism of the embodiment.

Fig. 10 is an enlarged view of a partial structure at F in fig. 9.

Fig. 11 is a schematic perspective view of a cleaning platform according to an embodiment.

Fig. 12 is a partial structure enlarged view at G in fig. 11.

Fig. 13 is an exploded perspective view of the first telescopic cylinder of the embodiment.

Fig. 14 is an enlarged view of a partial structure at H in fig. 13.

The reference numerals in the figures are:

1. a processing box; 2. a feed inlet; 3. a discharge port; 4. a feed conveyor; 5. a discharge conveyor belt; 6. an observation window; 7. cleaning a platform; 8. a wafer; 9. a feeding mechanism; 10. a cleaning mechanism; 11. a tray; 12. a turntable; 13. a feeding sucker; 14. discharging sucking discs; 15. a pressing piece; 16. a bottom disc; 17. a lower layer cylinder; 18. a round table baffle ring; 19. a top ring; 20. a first cylinder; 21. a telescopic vertical shaft; 22. a telescopic cross shaft; 23. a first cylinder; 24. a second cylinder; 25. a five-way pipe; 26. a connecting pipe; 27. radial sliding grooves; 28. a slide block; 29. a follow-up vertical shaft; 30. a synchronizing wheel; 31. a synchronous belt; 32. a tensioner; 33. a receiving cylinder; 34. a housing case; 35. a rotating vertical shaft; 36. a rotating handle; 37. a first gear; 38. a second gear; 39. a rack; 40. driving the electric cylinder; 41. a lifting vertical shaft; 42. a step portion; 43. a spring; 44. a second cylinder; 45. a lifting frame; 46. a lifting arm; 47. a third cylinder; 48. a spray box; 49. a first feed tube; 50. a second feed tube; 51. a lower circular ring; 52. an upper circular ring; 53. an anti-slip retainer ring.

Detailed Description

The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.

Referring to fig. 1 to 14, a full-automatic wafer cleaning device is shown, including processing case 1 that is provided with feed inlet 2 and discharge gate 3 and set up respectively in feed conveyor 4 and the discharge conveyor 5 of feed inlet 2 and discharge gate 3 department, be provided with in the processing case 1 and wash platform 7, be used for transporting the wafer 8 on the feed conveyor 4 to the feed mechanism 9 on wash platform 7 and the discharge conveyor 5 in proper order and set up in wash platform 7 top and be used for successively spraying cleaning solution and ultrapure water wash mechanism 10, be provided with on the wash platform 7 and be provided with the tray 11 that can vertical lift and be used for placing wafer 8 and four along the circumferencial direction evenly distributed and can follow the decline of tray 11 and synchronous inward translation carousel 12, four carousels 12 inwards translate to extreme position and can press from both sides tight wafer 8 and synchronous syntropy rotation, feed mechanism 9 includes the feed chuck 13 and the feed chuck 14 that can synchronous rotation, feed 13 is used for adsorbing and placing wafer 8 on the feed conveyor 4 on tray 11, be used for placing the feed chuck 13 on the end that can be used for holding down the wafer 8 on the feed conveyor 4 and carrying the top of the feed conveyor 13 and the end is located in the vertical carousel 13 top of the feed conveyor 13, and is used for placing the feed chuck 13 and is located in the top of the feed conveyor 1.

The cleaning platform 7 comprises a bottom disc 16 which is horizontally fixedly arranged in the processing box 1, a lower layer barrel 17 which is coaxially and fixedly connected to the top of the bottom disc 16, a round table baffle ring 18 which is coaxially and fixedly connected to the top of the lower layer barrel 17, and a top ring 19 which is arranged above the round table baffle ring 18, wherein the top ring 19 is fixedly connected with the round table baffle ring 18, the tray 11 is arranged in the round table baffle ring 18 and the top ring 19 in a lifting coaxial manner, and the four rotary discs 12 are arranged at the top of the top ring 19 in a sliding manner along the radial direction.

The processing box 1 is further provided with an observation window 6 for observing the cleaning and transferring states of the wafers 8, when the feeding sucking discs 13 are not placed on the tray 11 corresponding to the wafers 8, the tray 11 is located above the top ring 19 and is always horizontal, after the feeding sucking discs 13 place the wafers 8 on the tray 11, the feeding sucking discs 13 start to descend gradually, meanwhile, the four rotating discs 12 synchronously approach along the radial direction of the top ring 19, the tray 11 descends to the position where the wafers 8 are placed on the four rotating discs 12, finally, the four rotating discs 12 approach inwards to the limit position to clamp the wafers 8, then the four rotating discs 12 can synchronously rotate in the same direction, and then the wafers 8 are driven to rotate, meanwhile, the upper cleaning mechanism 10 can spray cleaning liquid and ultrapure water onto the wafers 8 successively, so that the wafers 8 are cleaned, the round table baffle ring 18 is in a hollow structure with small upper and lower parts, liquid which is thrown down is prevented from falling into the round table 18, a liquid collecting groove (the liquid collecting groove in the wafer 8 is not shown in the drawing) is arranged outside the round table 18, and the liquid collecting groove is not shown in the liquid collecting box 1 for processing.

The first cylinder 20 is fixedly connected to the bottom disc 16, the tray 11 is fixedly connected to an output shaft of the first cylinder 20, the first telescopic cylinder is further arranged on the bottom disc 16 and is provided with a freely telescopic vertical shaft 21, the top of the telescopic vertical shaft 21 is fixedly connected to the tray 11 in a coaxial mode, four second telescopic cylinders corresponding to the four rotary tables 12 one by one are fixedly connected to the top ring 19, each second telescopic cylinder is provided with a telescopic transverse shaft 22 freely telescopic along the radial direction of the top ring 19, the outer end of each telescopic transverse shaft 22 points to the inner side of the top ring 19, the outer end of each telescopic transverse shaft 22 is connected with the corresponding rotary table 12, and the first telescopic cylinders are connected with the four second telescopic cylinders through air pipes.

The first telescopic cylinders are connected with the four second telescopic cylinders through air pipes, after the first air cylinder 20 drives the tray 11 to lift, the telescopic vertical shafts 21 can be driven to synchronously lift, when the telescopic vertical shafts 21 descend, air in the first telescopic cylinders can be pressed into the four second telescopic cylinders, the outer end of each telescopic transverse shaft 22 points to the inner side of the top ring 19, namely after the air is pressed into the second telescopic cylinders and the corresponding telescopic transverse shafts 22 are ejected out, the telescopic transverse shafts 22 move towards the axis direction of the top ring 19, the four telescopic transverse shafts 22 synchronously move towards the axis of the top ring 19, so that the four rotary plates 12 can be driven to synchronously move towards the axis of the top ring 19, namely, the four rotary plates 12 are driven to synchronously move inwards, so that after the tray 11 supports the wafer 8 to descend, the four rotary plates 12 synchronously move inwards and gradually support the wafer 8, finally the wafer 8 is clamped and the wafer 8 is driven to rotate, and conversely, after the tray 11 is gradually lifted, the four rotary plates 12 synchronously move outwards, and finally the tray 11 is enabled to jack up the wafer 8, and the wafer 8 is placed next, and the sucker 14 is sucked.

The first telescopic cylinder further comprises a first cylinder body 23 coaxially fixedly connected with the top of the bottom disc 16, the telescopic vertical shaft 21 is coaxially and slidably arranged in the first cylinder body 23 and is in dynamic seal connection with the first cylinder body 23, a first air vent is formed in the bottom of the first cylinder body 23, the second telescopic cylinder further comprises a second cylinder body 24 fixedly connected with the top ring 19, a second air vent is formed in one end, close to the outer side of the top ring 19, of the second cylinder body 24, the telescopic horizontal shaft 22 is coaxially and slidably arranged in the second cylinder body 24 and is in dynamic seal connection with the second cylinder body 24, the air pipe comprises a five-way pipe 25 in seal connection with the air vent and four connecting pipes 26 in seal connection with the four second air vents respectively, and the other ends of the four connecting pipes 26 are in seal connection with the other four ports of the five-way pipe 25 respectively.

The end of the telescopic vertical shaft 21 in the first cylinder 23 is fixedly connected with a piston (not shown in the figure) sliding in the first cylinder 23, the piston is in dynamic seal connection with the first cylinder 23, the piston divides the inner space of the first cylinder 23 into a rod cavity and a rodless cavity (one end of the piston, which is close to the telescopic vertical shaft 21, is provided with the rod cavity, the other end of the piston is provided with the rodless cavity and is communicated with the outside atmosphere), when the telescopic vertical shaft 21 is contracted inwards in the first cylinder 23, the volume of the rod cavity is increased, the volume of the rodless cavity is reduced, and the end of the telescopic vertical shaft 21 is in dynamic seal connection with the first cylinder 23, so that the air pressure of the rod cavity is reduced, the air pressure of the rodless cavity is increased, and the air in the rodless cavity is pressed out of the first cylinder 23 through a five-way pipe 25, and is pressed into four second cylinders 24 through four connecting pipes 26, the telescopic horizontal shaft 22 can be ejected out of the second cylinders 24 in the same way, and accordingly the horizontal shaft 22 can be automatically stretched out and pulled upwards along with the telescopic vertical shaft 21, namely the horizontal shaft 22 can be automatically stretched upwards along with the second trays 11 and automatically stretched upwards along with the second trays 11.

The top ring 19 is further provided with four radial sliding grooves 27 which are uniformly distributed along the circumferential direction and correspond to the four second cylinder bodies 24 one by one, each second cylinder body 24 is fixedly arranged at the outermost end of the corresponding radial sliding groove 27, a sliding block 28 is further arranged in each radial sliding groove 27 in a sliding manner, the sliding block 28 is positioned at one end, close to the inner side of the top ring 19, of the corresponding telescopic transverse shaft 22, the inner end of the telescopic transverse shaft 22 is fixedly connected with the corresponding sliding block 28, the sliding block 28 is further provided with a follow-up vertical shaft 29 in a shaft connection manner, the rotary table 12 is coaxially and fixedly connected to the top end of the corresponding follow-up vertical shaft 29, and the round table baffle ring 18 is further provided with a driving mechanism for driving the plurality of follow-up vertical shafts 29 to synchronously rotate in the same direction.

For each second telescopic cylinder, the second cylinder 24 is located at one end of the radial chute 27 close to the outer side of the top ring 19 relative to the telescopic cross shaft 22, and the sliding block 28 is located at one end of the telescopic cross shaft 22 close to the inner side of the top ring 19, so that after the telescopic cross shaft 22 stretches out or retracts into the second cylinder 24, the sliding block 28 can be driven to move close to or away from the axis of the top ring 19, and thus the four turntables 12 are driven to be inwards closed or outwards opened through the four follow-up vertical shafts 29.

The driving mechanism comprises a driving motor fixedly connected with the round table baffle ring 18, an output shaft of the driving motor is vertically upwards, a synchronizing wheel 30 is coaxially and fixedly connected to the bottom end of each follow-up vertical shaft 29, a synchronizing wheel 30 is coaxially and fixedly connected to the output shaft of the driving motor, a plurality of synchronizing wheels 30 are connected through a synchronous belt 31 in a transmission mode, and a tensioner 32 for keeping the synchronous belt 31 tight is further arranged at the bottom of the top round disc.

The driving motor is not shown in the figure, and by arranging the tensioner 32, the four follower vertical shafts 29 can be driven to synchronously rotate in the same direction by ensuring that the tightening of the synchronous belt 31 is always kept after the four synchronous wheels 30 are driven to move along with the radial translation of the four follower vertical shafts 29, and then the four turntable 12 is driven to synchronously rotate in the same direction after the output shaft of the driving motor rotates.

The feeding mechanism 9 comprises a containing cylinder 33 and a containing box 34 which are fixedly connected with the processing box 1, a rotary vertical shaft 35 which is vertically and axially connected with the inside of the containing cylinder 33, a rotary handle 36 which is fixedly connected with the top end of the rotary vertical shaft 35, a first gear 37 which is coaxially and fixedly connected with the bottom end of the rotary vertical shaft 35, a second gear 38 which is horizontally and axially connected with the inside of the containing box 34 and meshed with the first gear 37, a rack 39 which is slidably arranged in the containing box 34 and meshed with the second gear 38, and a driving electric cylinder 40 which is fixedly connected with the rack 39 at the output end, wherein the discharging sucker 14 is fixedly connected with one end of the rotary handle 36, and the feeding sucker 13 is elastically arranged at the other end of the rotary handle 36.

The wafer 8 processing and loading platform is provided with a controller (not shown in the figure) electrically connected with a driving electric cylinder 40, when an output shaft of the driving electric cylinder 40 is translated, the rack 39 can be driven to translate, and then the second gear 38 is driven to rotate, so that the rotating vertical shaft 35 is driven to rotate through the first gear 37, and then the rotating handle 36 is driven to rotate, the rotating handle 36 has the structure shown in fig. 5, the feeding conveyor belt 4 and the discharging conveyor belt 5 are symmetrically arranged at one side of the cleaning platform 7, when the feeding sucker 13 is positioned right above the tail end of the feeding conveyor belt 4, the discharging sucker 14 can be positioned right above the tray 11, when the feeding sucker 13 is positioned right above the tray 11 (the unwashed wafer 8 is moved from the head end to the tail end of the feeding conveyor belt 4 and sucked up by the feeding sucker 13 at the tail end, meanwhile, the cleaned wafer 8 on the tray 11 is sucked up by the discharging sucker 14 and placed at the head end of the discharging conveyor belt 5, and then is moved to the tail end of the discharging conveyor belt 5 for collection), the feeding sucker 13 can be accurately moved to the position above the tail end of the feeding conveyor belt 4 and the position above the tray 11 successively by controlling the telescopic distance of the output end of the driving cylinder 40 (the rotation angle of the rotary handle 36 can be controlled by programming a specific program and accurately controlling the telescopic distance of the output end of the driving cylinder 40 by a controller, then the feeding sucker 13 can be moved to a specified position by matching with a sensor, which is the mature prior art and is not repeated, and the discharging sucker 14 can be positioned between the cleaning platform 7 and the discharging conveyor belt 5 by the same reason, so as not to interfere with the spraying of the cleaning liquid and the ultrapure water by the cleaning mechanism 10);

the feeding suction cup 13 is located directly above the tail end of the feeding conveyor belt 4, the discharging suction cup 14 is located directly above the tray 11, this state is defined as a first state, the feeding suction cup 13 is located directly above the tray 11, the discharging suction cup 14 is located directly above the head end of the discharging conveyor belt 5, this state is defined as a second state, the feeding suction cup 13 is located between the feeding conveyor belt 4 and the cleaning platform 7, and the discharging suction cup 14 is located between the cleaning platform 7 and the discharging conveyor belt 5, this state is defined as a third state.

The one end sliding connection that rotatory handle 36 was provided with feeding sucking disc 13 has three lift vertical axis 41, and the bottom and the feeding sucking disc 13 top of three lift vertical axis 41 link firmly, and the step portion 42 has all been formed on the top of every lift vertical axis 41, all overlaps on every lift vertical axis 41 to be equipped with spring 43 and the both ends of spring 43 are contradicted step portion 42 and rotatory handle 36 respectively, the casting die 15 is horizontal platy structure, still hangs in the processing case 1 and has had second cylinder 44 and the output of second cylinder 44 is vertical down, and casting die 15 is fixed to be set up in the output bottom of second cylinder 44 and be located directly over three lift vertical axes 41.

The output ends of the feeding sucker 13 and the discharging sucker 14 are vacuum suckers made of rubber materials, the vacuum suckers can absorb the wafer 8 and cannot damage the wafer 8, but when the discharging sucker 14 needs to absorb the wafer 8, the first air cylinder 20 can drive the tray 11 to jack up and enable the upper surface of the wafer 8 to contact with the bottom of the discharging sucker 14, the discharging sucker 13 can be driven to lift by the output end of the second air cylinder 44, and under normal conditions, the three lifting vertical shafts 41 jack up the feeding sucker 13 at the bottom under the action of the three springs 43, so that the discharging sucker 15 descends and presses down the three lifting vertical shafts 41, the bottom of the feeding sucker 13 can be enabled to abut against the upper surface of the wafer 8, and therefore the wafer 8 is sucked up, when the discharging sucker 14 needs to suck the wafer 8 on the tray 11, the first air cylinder 20 can drive the tray 11 to jack up and enable the upper surface of the wafer 8 to contact with the bottom of the discharging sucker 14, and when the feeding sucker 13 and the discharging sucker 14 discharge the wafer 8, the output ends of the feeding sucker 13 and the discharging sucker 14 only need to be enabled to reversely rotate outwards, and the wafer 8 can be enabled to automatically fall down.

The cleaning mechanism 10 comprises a lifting frame 45 fixedly connected with the processing box 1, a lifting arm 46 which is arranged on the lifting frame 45 and can freely lift, a third air cylinder 47 fixedly connected with the lifting frame 45 and a spraying box 48 fixedly arranged on the lifting arm 46, the output end of the third air cylinder 47 vertically lifts and is fixedly connected with the lifting arm 46, a first feeding pipe 49 and a second feeding pipe 50 which are respectively used for filling cleaning liquid and ultrapure water are arranged on the spraying box 48, and a plurality of nozzles are further arranged at the bottom of the spraying box 48.

The nozzles are not shown in the figure, under the drive of the output end of the third air cylinder 47, the lifting arm 46 can lift, and then drive the spraying box 48 to lift, when the wafer 8 is placed, the spraying box 48 is prevented from being collided with the feeding sucker 13 or the discharging sucker 14, when the wafer 8 needs to be cleaned, the spraying box 48 is placed again, firstly, cleaning liquid is injected into the spraying box 48 through the first feeding pipe 49, the cleaning liquid is sprayed out by a plurality of nozzles and falls onto the wafer 8, along with the continuous rotation of the wafer 8, the cleaning liquid completely covers the upper surface of the wafer 8 (a plurality of nozzles are distributed along the radial direction of the wafer 8 and the sprayed cleaning liquid can completely cover the corresponding side radius length part of the wafer 8), meanwhile, the wafer 8 is thrown out outwards along with the rotation of the wafer 8, ultrapure water is injected into the spraying box 48 through the second feeding pipe 50 after the cleaning, meanwhile, the ultrapure water is used for cleaning the residual cleaning liquid on the wafer 8 together with dirt, and the cleaning liquid can be set on the spraying box 48 to be sprayed into the wafer 8, and the third feeding pipe (the wafer 8 is also used for cleaning the wafer 8) after the wafer 8 is completely dried, and the wafer is dried on the surface after the wafer 8 is completely and the wafer is completely dried.

The turntable 12 comprises a lower circular ring 51 coaxially and fixedly connected with the top end of the follow-up vertical shaft 29, an upper circular ring 52 and an anti-slip retainer ring 53, wherein the upper circular ring 52 and the anti-slip retainer ring 53 are positioned above the lower circular ring 51, the diameter of the upper circular ring 52 is smaller than that of the lower circular ring 51, a connecting shaft for fixedly connecting with the upper circular ring 52 is formed at the top of the lower circular ring 51, and the anti-slip retainer ring 53 is coaxially sleeved on the connecting shaft.

The connecting shaft is not shown in the figure, the diameter of the lower ring 51 is larger, the diameter of the upper ring 52 is smaller, when the telescopic vertical shaft 21 descends and drives the wafer 8 on the tray 11 to descend, the wafer 8 firstly falls on the four lower rings 51, then the tray 11 is separated from the wafer 8 and descends continuously, the four turntables 12 continue to be close and finally clamp the wafer 8 between the four anti-slip check rings 53, the anti-slip check rings 53 are used for increasing the friction force between the turntables 12 and the wafer 8, so that the wafer 8 can be driven to rotate after the four turntables 12 rotate, and the force for inwards clamping the wafer 8 by the four anti-slip check rings 53 is not required to be excessive, so that the wafer 8 is prevented from being damaged.

Working principle: the first cylinder 20, the second cylinder 44, the third cylinder 47, the driving motor, the driving cylinder 40, the feeding conveyor belt 4 and the discharging conveyor belt 5 are all electrically connected with the controller, during initial cleaning, a plurality of wafers 8 which are arranged at equal intervals are placed on the feeding conveyor belt 4, the tray 11 and the discharging conveyor belt 5 are not provided with the wafers 8, the feeding sucker 13 and the discharging sucker 14 are in a first state by rotating the rotating handle 36, the pressing piece 15 is then lowered by the second cylinder 44, the bottom of the feeding sucker 13 is abutted against the upper surface of the corresponding wafer 8 at the tail end of the feeding conveyor belt 4, the wafers 8 are sucked up, the pressing piece 15 is then lifted and separated from the three lifting vertical shafts 41, the rotating handle 36 is then rotated, the feeding sucker 13 and the discharging sucker 14 are in a second state, the tray 11 is positioned right below the wafers 8 on the feeding sucker 13, the wafer 8 on the feed chuck 13 is then lowered to the tray 11, the feed chuck 13 and the discharge chuck 14 are then moved to the third state, the telescopic vertical shaft 21 is lowered by the first air cylinder 20, the tray 11 and the wafer 8 thereon are driven to descend after the telescopic vertical shaft 21 is lowered, the four turntables 12 are simultaneously driven to draw in, and finally the wafer 8 is clamped, the rotating handle 36 is rotated, the feed chuck 13 and the discharge chuck 14 are in the third state, the cleaning box is lowered to clean the wafer 8, the driving motor is started to drive the four turntables 12 to rotate, the wafer 8 is driven to rotate, after the wafer 8 is cleaned, the rotation of the driving motor is stopped, the telescopic vertical shaft 21 is lifted (how to sequentially control the driving motor, the first air cylinder 20, the third air cylinder 47 and the like are started and stopped in the mature prior art, namely, by controlling the rotation time of the output shaft of the driving motor and the time of spraying the cleaning liquid and the ultrapure water by the spraying box 48, and controlling the stop of the driving motor, the operation of the first air cylinder 20 and the operation of the third air cylinder 47 by the controller, the specific principle is not repeated), the rotating handle 36 is rotated again, so that the feeding suction cup 13 and the discharging suction cup 14 are in the first state, and the feeding suction cup 13 and the discharging suction cup 14 respectively adsorb the corresponding wafer 8 (each time the wafer 8 on the tray 11 is sucked up, the feeding conveyor belt 4 and the discharging conveyor belt 5 synchronously follow up movement, for example, the subsequent wafer 8 on the feeding conveyor belt 4 synchronously moves into the processing box 1, so that the subsequent wafer 8 moves to the position where the previous wafer 8 is located), when the discharging suction cup 14 adsorbs the wafer 8 on the tray 11, a small amount of output ends of the first air cylinder 20 need to stretch out, the top of the wafer 8 on the tray 11 is abutted against the bottom of the discharging sucker 14 to assist the discharging sucker 14 to absorb the wafer 8, the tray 11 is lowered a little after the discharging sucker 14 absorbs the wafer 8 to prevent the subsequent wafer 8 from colliding with the tray 11 when moving, after the feeding sucker 13 and the discharging sucker 14 absorb the corresponding wafer 8 respectively, the rotating handle 36 is rotated again to make the feeding sucker 13 and the discharging sucker 14 in the second state, the wafer 8 on the feeding sucker 13 is placed on the tray 11, the wafer 8 on the discharging sucker 14 is placed above the tail end of the discharging conveyor belt 5, then the rotating handle 36 is rotated again to make the feeding sucker 13 and the discharging sucker 14 in the third state to clean the wafer 8 on the tray 11, then the feeding sucker 13 and the discharging sucker 14 are continuously switched from the first state to the second state according to the above flow, the second state is switched to the third state, and the third state is switched back to the first state, and the cycle is continuously carried out, so that each wafer 8 is moved onto the tray 11 by the feeding conveyor belt 4 for cleaning, and the wafer 8 on the tray 11 is moved onto the discharging conveyor belt 5 for carrying out.

The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (6)

1. The full-automatic wafer cleaning device comprises a processing box (1) provided with a feed inlet (2) and a discharge outlet (3), and a feed conveyor belt (4) and a discharge conveyor belt (5) which are respectively arranged at the feed inlet (2) and the discharge outlet (3), and is characterized in that a cleaning platform (7) is arranged in the processing box (1), a feeding mechanism (9) for sequentially conveying wafers (8) on the feed conveyor belt (4) to the cleaning platform (7) and the discharge conveyor belt (5), and a cleaning mechanism (10) which is arranged above the cleaning platform (7) and is used for sequentially spraying cleaning liquid and ultrapure water, a tray (11) which can be vertically lifted and is used for placing the wafers (8) and four turntables (12) which are uniformly distributed along the circumferential direction and can be synchronously and internally translated along with the descending of the tray (11) are arranged on the cleaning platform (7), the four turntables (12) are internally translated to limit positions and synchronously rotated, the feeding mechanism (9) comprises a sucking disc (13) which can be synchronously rotated and is used for sucking the wafers (8) on the feeding tray (13) and sucking the wafers (4) on the suction disc (13), the discharging sucker (14) is used for adsorbing and placing a wafer (8) on the tray (11) on the discharging conveyor belt (5), the feeding sucker (13) can be elastically jacked along the vertical direction, a pressing piece (15) which is positioned right above the tail end of the feeding conveyor belt (4) and used for pressing down the feeding sucker (13) is further arranged in the processing box (1), the cleaning platform (7) comprises a bottom disc (16) which is fixedly arranged in the processing box (1) in a horizontal state from bottom to top, a lower layer cylinder (17) which is coaxially and fixedly connected to the top of the bottom disc (16), a round table baffle ring (18) which is coaxially and fixedly connected to the top of the lower layer cylinder (17) and a top round table baffle ring (19) which is arranged above the round table baffle ring (18), the top round table baffle ring (19) is fixedly connected with the round table baffle ring (18), the tray (11) can be lifted and coaxially arranged in the round table baffle ring (18) and the top round table (19), four rotary discs (12) are radially and slidably arranged on the bottom disc (16) in a first telescopic cylinder (20) which is fixedly connected to the top of the first telescopic cylinder (21) and is fixedly connected to the first telescopic cylinder (20), four second telescopic cylinders corresponding to the four turntables (12) one by one are fixedly connected to the top circular ring (19), each second telescopic cylinder is provided with a telescopic transverse shaft (22) which stretches freely along the radial direction of the top circular ring (19), the outer end of each telescopic transverse shaft (22) points to the inner side of the top circular ring (19), the outer end of each telescopic transverse shaft (22) is connected with the corresponding turntables (12), the first telescopic cylinder is connected with the four second telescopic cylinders through air pipes, the first telescopic cylinder further comprises a first cylinder body (23) coaxially fixedly connected with the top of the bottom circular disc (16), the telescopic vertical shaft (21) is coaxially and slidably arranged in the first cylinder body (23) and is connected with the first cylinder body (23) in a sealing manner, the bottom of the first cylinder body (23) is provided with a first air port, one end, close to the outer side of the top circular ring (19), of the second cylinder body (24) is provided with a second air port, the first telescopic transverse shaft (22) is coaxially and slidably arranged in the second cylinder body (24) and is fixedly connected with the fourth air port (25) in a sealing manner, the other end of the second cylinder body (24) is fixedly connected with the fifth air port (25) in a sealing manner, the other end of the fifth cylinder body (25) is fixedly connected with the fifth air port (25) respectively, four radial sliding grooves (27) which are uniformly distributed along the circumferential direction and correspond to the four second cylinder bodies (24) one by one are formed in the top circular ring (19), each second cylinder body (24) is fixedly arranged at the outermost end of the corresponding radial sliding groove (27), a sliding block (28) is arranged in each radial sliding groove (27) in a sliding mode, the sliding block (28) is located at one end, close to the inner side of the top circular ring (19), of the corresponding telescopic transverse shaft (22), the inner end of the telescopic transverse shaft (22) is fixedly connected with the corresponding sliding block (28), a follow-up vertical shaft (29) is further connected onto the sliding block (28) in a shaft mode, the rotary table (12) is coaxially and fixedly connected to the top end of the corresponding follow-up vertical shaft (29), and a driving mechanism used for driving a plurality of follow-up vertical shafts (29) to synchronously rotate in the same direction is further arranged on the round table baffle ring (18).

2. The full-automatic wafer cleaning device according to claim 1, wherein the driving mechanism comprises a driving motor fixedly connected with the round table baffle ring (18), an output shaft of the driving motor is vertically upward, a synchronizing wheel (30) is coaxially and fixedly connected to the bottom end of each follow-up vertical shaft (29), the synchronizing wheels (30) are coaxially and fixedly connected to the output shaft of the driving motor, a plurality of synchronizing wheels (30) are in transmission connection through a synchronous belt (31), and a tensioner (32) for keeping the synchronous belt (31) tight is further arranged at the bottom of the top round ring (19).

3. The full-automatic wafer cleaning device according to claim 1, wherein the feeding mechanism (9) comprises a containing barrel (33) and a containing box (34) which are fixedly connected with the processing box (1), a rotating vertical shaft (35) which is vertically and axially arranged in the containing barrel (33), a rotating handle (36) fixedly connected with the top end of the rotating vertical shaft (35), a first gear (37) coaxially fixedly connected with the bottom end of the rotating vertical shaft (35), a second gear (38) which is horizontally and axially arranged in the containing box (34) and meshed with the first gear (37), a rack (39) which is slidably arranged in the containing box (34) and meshed with the second gear (38), and a driving electric cylinder (40) of which the output end is fixedly connected with the rack (39), wherein the discharging sucker (14) is fixedly connected with one end of the rotating handle (36), and the feeding sucker (13) is elastically arranged at the other end of the rotating handle (36).

4. A full-automatic wafer cleaning device according to claim 3, characterized in that one end of the rotating handle (36) provided with the feeding sucking disc (13) is slidably connected with three lifting vertical shafts (41), the bottom ends of the three lifting vertical shafts (41) are fixedly connected with the top ends of the feeding sucking disc (13), step parts (42) are formed at the top ends of the lifting vertical shafts (41), springs (43) are sleeved on the lifting vertical shafts (41) respectively, two ends of the springs (43) respectively abut against the step parts (42) and the rotating handle (36), the pressing piece (15) is of a horizontal plate-shaped structure, a second cylinder (44) is further suspended in the processing box (1), the output end of the second cylinder (44) faces downwards vertically, and the pressing piece (15) is fixedly arranged at the bottom of the output end of the second cylinder (44) and is located right above the three lifting vertical shafts (41).

5. The full-automatic wafer cleaning device according to claim 1, wherein the cleaning mechanism (10) comprises a lifting frame (45) fixedly connected with the processing box (1), a lifting arm (46) which is arranged on the lifting frame (45) and can freely lift, a third air cylinder (47) fixedly connected with the lifting frame (45) and a spraying box (48) fixedly arranged on the lifting arm (46), the output end of the third air cylinder (47) vertically lifts and is fixedly connected with the lifting arm (46), a first feeding pipe (49) and a second feeding pipe (50) which are respectively used for filling cleaning liquid and ultrapure water are arranged on the spraying box (48), and a plurality of nozzles are further arranged at the bottom of the spraying box (48).

6. The full-automatic wafer cleaning device according to claim 1, wherein the turntable (12) comprises a lower circular ring (51) coaxially and fixedly connected with the top end of the follow-up vertical shaft (29), an upper circular ring (52) which is positioned above the lower circular ring (51) and has a diameter smaller than that of the lower circular ring (51), and an anti-slip retainer ring (53) which has a diameter smaller than that of the lower circular ring (51), a connecting shaft for fixedly connecting with the upper circular ring (52) is formed at the top of the lower circular ring (51), and the anti-slip retainer ring (53) is coaxially sleeved on the connecting shaft.

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