CN215815788U

CN215815788U - Cleaning machine for electronic wafer detection

Info

Publication number: CN215815788U
Application number: CN202121660091.3U
Authority: CN
Inventors: 吴熙文; 张梅; 顾卫民; 吴卓鸿
Original assignee: Wuxi Xinqibo Technology Co ltd
Current assignee: Wuxi Xinqibo Technology Co ltd
Priority date: 2021-07-21
Filing date: 2021-07-21
Publication date: 2022-02-11
Anticipated expiration: 2031-07-21

Abstract

The utility model relates to a cleaning machine for electronic wafer detection, which comprises a base, wherein a disc is arranged on the surface of the base, the two side walls of the disc are both connected with side tables, the surface of the disc is obliquely and symmetrically provided with fixed sleeves, a fixed frame is connected inside the fixed sleeve in a sliding way, transverse plates are arranged on the surface of the fixed frame, which is positioned on the upper side of the fixed sleeve, racks are arranged on the opposite surfaces of the two transverse plates, a gear is engaged between the two groups of racks, the cleaning machine for detecting the electronic wafer is good in wafer fixing effect and capable of comprehensively cleaning the surface of the wafer.

Description

Cleaning machine for electronic wafer detection

Technical Field

The utility model relates to the field of wafer detection, in particular to a cleaning machine for electronic wafer detection.

Background

The devices and wires in the integrated circuit are very fine, so that if the integrated circuit is contaminated by dust particles, metals and the like in the manufacturing process, the circuit function is easily damaged, and an open circuit or a short circuit is formed, so that the integrated circuit is failed to influence the formation of geometric features.

The current wafer cleaning machine still has certain disadvantages: firstly, the wafer needs to keep rotating in the cleaning process, the existing partial wafer cleaning machine has the defects of unstable clamping when clamping the wafer, the wafer can fly out due to shaking in the rotating process, or the surface clamping area is large, the cleaning effect is not good, in addition, the existing cleaning structure is difficult to adjust according to the specification of the wafer in the cleaning process, and aiming at the defects and the shortcomings, a novel structure can be designed to solve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a cleaning machine for electronic wafer detection.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a cleaning machine for detecting electronic wafers comprises a base, wherein a disc is arranged on the surface of the base, two side walls of the disc are connected with side tables, fixed sleeves are obliquely and symmetrically arranged on the surface of the disc, fixed frames are slidably connected inside the fixed sleeves, transverse plates are arranged on the surfaces, located on the upper sides of the fixed sleeves, of the fixed frames, racks are arranged on the opposite surfaces of the two transverse plates, gears are meshed between the two groups of racks, the bottoms of the gears are connected with a motor B, the motor B is located on the lower side of the base, fixed seats are arranged on the tops of the two fixed frames, the two fixed seats are oppositely arranged, arc tables are arranged on the surfaces of the fixed seats, clamping grooves are formed in the surfaces of the arc tables, the disc is connected with a motor A through a connecting plate, an L-shaped plate is connected to one side position of the base, and an electric guide rail is installed at the bottom of the L-shaped plate, the output of electronic guide rail is connected with the spray gun, one side of spray gun is connected with the pipeline, the surface mounting of pipeline has the extraction pump, the one end of pipeline is connected with the mixing box, the mixing box is located one side position of base.

Preferably, both side walls of the L-shaped plate are connected with rectification baffles, and the rectification baffles are positioned on the upper sides of the two fixed seats; when motor A drives the wafer through the layer board and rotates, the both sides of wafer are located the inside of draw-in groove, and the wafer just can not deviate from by the atress like this, when the spray gun washs through the extraction pump extraction liquid, the rectification baffle can be protected from the top, avoids liquid to sputter other places and goes, avoids causing the influence to the surrounding environment.

Preferably, the surface of one side of the lower surface of the base is symmetrically provided with two groups of supporting legs in a left-right manner; the supporting leg is used for lifting the base to a proper height, so that the motor B has a set space, and meanwhile, a user can place the wafer between the two fixing seats conveniently.

Preferably, one ends of the two transverse plates, which are opposite to each other, are connected with a baffle plate, and the baffle plates are positioned on one side of the rack; when motor B drove the gear revolve, two diaphragms can remove to opposite direction, in order to avoid rack and gear to break away from the meshing, the structure is provided with the baffle, avoids the gear excessive movement.

Preferably, the rear wall of the mixing box is communicated with two feeding pipes, and the two feeding pipes are arranged in bilateral symmetry; the two feeding pipes are respectively communicated with deionized water and nitrogen, the nitrogen and the deionized water are fully mixed in the mixing box and then are output to the spray gun through a pipeline.

Preferably, a wafer is arranged between the two fixing seats, and the wafer is matched with the clamping groove; the arc-shaped table and the clamping groove are used for limiting the wafer so as to prevent the wafer from flying out due to overlarge stress in the rotating process.

Preferably, the output end of the motor A is abutted against the bottom of the wafer through a supporting plate; the supporting plate is used for supporting the wafer, so that the supporting plate drives the wafer to synchronously rotate, and the two fixing seats are used for preventing the wafer from separating from the designated position.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, when a worker cleans a wafer, firstly, a whole wafer is placed on the supporting plate of the motor A, then the motor B is started to drive the gear B to rotate, the gear is meshed with the rack, so that two transverse plates connected with the rack can move in opposite directions, the fixing frame slides in the fixing sleeve until the wafer is positioned in the two fixing seats, at the moment, the motor B is closed, the two ends of the wafer are positioned in the arc-shaped platforms of the clamping grooves, the structure can limit the position of the wafer, and the wafer is prevented from being separated by stress in the high-rotation process.

2. According to the utility model, the motor A is started, the motor A drives the wafer to rotate through the supporting plate, then the extraction pump and the electric guide rail are opened, the electric guide rail can drive the spray gun to horizontally move, a mixture of nitrogen and deionized water is stored in the mixing box, the extraction pump sprays cleaning liquid to the surface of the wafer through the spray gun, and dirt particles on the surface of the wafer are cleaned.

Drawings

FIG. 1 is a schematic structural diagram of a cleaning machine for electronic wafer inspection according to the present invention;

FIG. 2 is a schematic view of a partially disassembled structure of a cleaning machine for inspecting an electronic wafer according to the present invention;

fig. 3 is a schematic view of a cleaning machine for electronic wafer inspection according to a second embodiment of the present invention.

In the figure: 1. a base; 2. a side table; 3. a disc; 4. a transverse plate; 5. a rack; 6. a wafer; 7, an L-shaped plate; 8. a pipeline; 9. an electric rail; 10. a pump; 11. a mixing box; 12. a fixed seat; 13. an arc-shaped table; 14. a card slot; 15. fixing a sleeve; 16. a gear; 17. a motor A; 18. a feed pipe; 19. a rectification baffle plate; 20. a motor B; 21. a fixed mount; 22. a spray gun.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

The first embodiment is as follows:

a cleaning machine for electronic wafer detection comprises a base 1, wherein a disc 3 is arranged on the surface of the base 1, two side walls of the disc 3 are connected with side tables 2, fixed sleeves 15 are obliquely and symmetrically arranged on the surface of the disc 3, fixed frames 21 are slidably connected inside the fixed sleeves 15, transverse plates 4 are arranged on the surfaces, located on the upper sides of the fixed sleeves 15, of the fixed frames 21, racks 5 are arranged on the opposite surfaces of the two transverse plates 4, gears 16 are meshed between the two groups of racks 5, the bottoms of the gears 16 are connected with a motor B20, a motor B20 is located on the lower side of the base 1, supporting legs are symmetrically arranged on one side surface of the lower surface of the base 1 in a left-right mode, two groups of the two supporting legs are symmetrically arranged in the left-right mode, one ends, opposite to the two transverse plates 4, of each of the baffle are connected with one side of the corresponding rack 5, the fixed frames 21 are slidably connected with the fixed sleeves 15, when the motor A17 connected with the disc 3 through a connecting plate drives the gear 16 to rotate, the two transverse plates 4 can move towards opposite directions, the arrangement of the baffle plates can prevent the gear 16 from being disengaged from the rack 5, and simultaneously can prevent one end of the fixing frame 21 from being disengaged from the inside of the fixing sleeve 15, the structure is reasonable, and the structure is shown in the attached drawings 1 and 2; the supporting leg is used for lifting base 1 to a suitable height, lets motor B20 have the space of setting, and convenience of customers places wafer 6 between two fixing bases 12 simultaneously, and when motor B20 drove the gear 16 rotatory, two diaphragm 4 can remove to opposite direction, in order to avoid rack 5 and gear 16 to break away from the meshing, the structure is provided with the baffle, avoids gear 16 excessive movement.

Fixing bases 12 are arranged at the tops of the two fixing frames 21, the two fixing bases 12 are arranged oppositely, an arc table 13 is arranged on the surface of each fixing base 12, a clamping groove 14 is formed in the surface of each arc table 13, the disc 3 is connected with a motor A17 through a connecting plate, one side of the base 1 is connected with an L-shaped plate 7, an electric guide rail 9 is arranged at the bottom of the L-shaped plate 7, an output end of the electric guide rail 9 is connected with a spray gun 22, one side of the spray gun 22 is connected with a pipeline 8, an extraction pump 10 is arranged on the surface of the pipeline 8, one end of the pipeline 8 is connected with a mixing box 11, the mixing box 11 is positioned at one side of the base 1, a rear wall of the mixing box 11 is communicated with two feeding pipes 18, the two feeding pipes 18 are arranged in bilateral symmetry, a wafer 6 is arranged between the two fixing bases 12, the wafer 6 is matched with the clamping groove 14, an output end of the motor A17 is abutted to the bottom of the wafer 6 through a supporting plate, the fixing bases 12 are arranged at two sides, the L-shaped plate 7 is arranged between the two fixed seats 12, so that when the spray gun 22 is cleaned, the longitudinal movement of the spray gun 22 does not impact the surfaces of the fixed seats 12, and simultaneously when the wafer 6 rotates, the surfaces of the wafer can be completely cleaned by water flow which moves longitudinally, the cleaning effect is good, see the attached drawings 1 and 2; the two feed pipes 18 are respectively communicated with deionized water and nitrogen, the nitrogen and the deionized water are fully mixed in the mixing box 11 and then are output to the spray gun 22 through the pipeline 8, the arc-shaped table 13 and the clamping groove 14 are used for limiting the wafer 6 so as to prevent the wafer 6 from flying out due to overlarge stress in the rotating process, the supporting plate is used for supporting the wafer 6 and driving the wafer 6 to rotate synchronously, and the two fixed seats 12 are used for preventing the wafer 6 from separating from a specified position.

Example two:

two side walls of the L-shaped plate 7 are connected with rectification baffles 19, and the rectification baffles 19 are positioned on the upper sides of the two fixed seats 12; when motor A17 passes through the layer board and drives wafer 6 and rotate, the both sides of wafer 6 are located the inside of draw-in groove 14, and wafer 6 just can not be deviate from by the atress like this, when spray gun 22 extracted liquid through extraction pump 10 and washs, rectification baffle 19 can protect from the top, avoids liquid to sputter to other places and goes, avoids causing the influence to the surrounding environment.

The working principle is as follows: when a worker cleans a wafer 6, firstly, a whole wafer 6 is placed on a supporting plate of a motor A17, then a motor B20 is started, the motor B20 drives a gear 16 to rotate, the gear 16 is meshed with a rack 5, so that two transverse plates 4 connected with the rack 5 can move in opposite directions, a fixed frame 12 slides in a fixed sleeve 15 until the wafer 6 is positioned in two fixed seats 12, at the moment, the motor B20 is closed, two ends of the wafer 6 are positioned in arc-shaped tables 13 of clamping grooves 14, the structure can limit the position of the wafer 6, the wafer 6 is prevented from being forced to be separated in the high rotation process, then the motor A17 is started, the motor A17 drives the wafer 6 to rotate through the supporting plate, then, an extraction pump 10 and an electric guide rail 9 are opened, the electric guide rail 9 can drive a spray gun 22 to horizontally move, a mixture of nitrogen and deionized water is stored in a mixing box 11, the pump 10 sprays the cleaning fluid to the surface of wafer 6 through spray gun 22, and the dirty particle on wafer 6 surface is cleared up, because fixing base 12 and arc platform 13 do not fix wafer 6, its surface can obtain comprehensive clearance when wafer 6 rotates, and the clearance is effectual, because electronic guide rail 9 stroke is long, can all wash different specification and dimension's wafer 6.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. The utility model provides a cleaning machine for electronic wafer detection, includes base (1), its characterized in that, base (1) surface is provided with disc (3), the both sides wall of disc (3) all is connected with side platform (2), the surperficial skew symmetry of disc (3) is provided with fixed cover (15), the inside sliding connection of fixed cover (15) has mount (21), the surface that mount (21) is located fixed cover (15) upside is provided with diaphragm (4), two the surface that diaphragm (4) is relative all is provided with rack (5), and two sets of meshing has gear (16) between rack (5), the bottom of gear (16) is connected with motor B (20), motor B (20) are located the downside of base (1), two the top of fixed cover (21) all is provided with fixing base (12), two the surface that fixing base (12) set up relatively and fixing base (12) is provided with arc platform (13), draw-in groove (14) have been seted up on the surface of arc platform (13), disc (3) are connected with motor A (17) through the connecting plate, one side position of base (1) is connected with L template (7), electronic guide rail (9) are installed to the bottom of L template (7), the output of electronic guide rail (9) is connected with spray gun (22), one side of spray gun (22) is connected with pipeline (8), the surface mounting of pipeline (8) has extraction pump (10), the one end of pipeline (8) is connected with mixing box (11), mixing box (11) are located one side position of base (1).

2. The electronic wafer detection cleaning machine according to claim 1, wherein two side walls of the L-shaped plate (7) are connected with rectification baffles (19), and the rectification baffles (19) are positioned on the upper sides of the two fixed seats (12).

3. The cleaning machine for detecting the electronic wafer as claimed in claim 1, wherein the supporting legs are symmetrically arranged on one side surface of the lower surface of the base (1) from left to right, and two groups of the two supporting legs are symmetrically arranged from left to right.

4. The electronic wafer detection cleaning machine as claimed in claim 1, wherein a baffle is connected to each of two opposite ends of the transverse plate (4), and the baffle is located on one side of the rack (5).

5. The electronic wafer detection cleaning machine according to claim 1, wherein the rear wall of the mixing box (11) is communicated with two feed pipes (18), and the two feed pipes (18) are arranged in bilateral symmetry.

6. The electronic wafer detection cleaning machine according to claim 1, wherein a wafer (6) is disposed between the two fixing bases (12), and the wafer (6) is matched with the clamping groove (14).

7. The electronic wafer inspection cleaning machine according to claim 1 or 6, wherein the output end of the motor A (17) is abutted against the bottom of the wafer (6) through a supporting plate.