CN115846275B - Semiconductor element cleaning device - Google Patents

Semiconductor element cleaning device Download PDF

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Publication number
CN115846275B
CN115846275B CN202211543094.8A CN202211543094A CN115846275B CN 115846275 B CN115846275 B CN 115846275B CN 202211543094 A CN202211543094 A CN 202211543094A CN 115846275 B CN115846275 B CN 115846275B
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China
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overturning
plate
shaft
turnover
cleaning
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CN115846275A (en
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雷强
陈颺
徐金梅
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Shanghai Zhanzhao Electronic Technology Co ltd
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Shanghai Zhanzhao Electronic Technology Co ltd
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Abstract

The invention relates to the field of semiconductor cleaning devices, in particular to a semiconductor element cleaning device. The first overturning plate and the second overturning plate are symmetrically arranged relative to the first overturning shaft and the second overturning shaft, the first overturning plate is horizontally arranged, and one transverse edge is fixedly connected with the first overturning shaft. The second turnover plate is horizontally arranged, and one transverse edge is fixedly connected with the second turnover shaft; the control part is used for enabling the sucking disc on the first turnover plate to release the element when the second turnover plate is turned over to the upper side of the first turnover plate under the drive of the second turnover shaft, and simultaneously enabling the sucking disc on the second turnover plate to adsorb the element; the cleaning component is used for cleaning the components adsorbed on the first overturning plate or the second overturning plate; the drying component is used for drying the cleaned element. The first overturning plate and the second overturning plate overturn the elements, so that the workpiece can be sufficiently cleaned in the cleaning process, and the cleaning effect is further improved.

Description

Semiconductor element cleaning device
Technical Field
The invention relates to the field of semiconductor cleaning devices, in particular to a semiconductor element cleaning device.
Background
The semiconductor element cleaning equipment is used for cleaning processes in wafer level packaging, is matched with modes of high-pressure water cleaning, normal-pressure water cleaning, megasonic cleaning, brush and organic solvent combined cleaning, back cleaning and the like, and can effectively remove impurities such as particles, organic matters, metal ions and the like on the surface of a wafer.
The existing semiconductor cleaning device generally places a semiconductor element in a cleaning basket for cleaning, and the cleaning basket is in a static state in the cleaning process, so that a cleaning nozzle can only clean one side of the semiconductor element all the time, and the cleaning effect is poor. In this case, some cleaning apparatuses are provided with a holding device for holding the semiconductor element, which holds the semiconductor element by a clamp or the like to turn the semiconductor element over during cleaning, so that both sides of the semiconductor are cleaned. Although such a cleaning method can clean the other surface, the clamping position cannot be cleaned, so that the overall cleaning effect of the semiconductor cannot be ensured, and the cleaning degree of the semiconductor is low.
Disclosure of Invention
The invention provides a semiconductor element cleaning device, which solves the problem that the position clamped by the semiconductor cannot be cleaned by the conventional cleaning device.
The invention relates to a semiconductor element cleaning device, which adopts the following technical scheme:
a semiconductor element cleaning device comprises a cleaning box, a turnover assembly, a cleaning assembly and a drying assembly; the overturning assembly comprises a first overturning plate, a second overturning plate, a first overturning shaft, a second overturning shaft and a control part; the first overturning shaft is horizontal and can be rotatably arranged in the cleaning box; the second turning shaft is coaxial with the first turning shaft and can be rotatably arranged in the cleaning box; the first overturning plate and the second overturning plate are symmetrically arranged about the first overturning shaft and the second overturning shaft; the first turnover plate is horizontally arranged, and one transverse edge is fixedly connected with the first turnover shaft; the upper surface of the first overturning plate is provided with a plurality of suckers; the second turnover plate is horizontally arranged, and one transverse edge is fixedly connected with the second turnover shaft; the upper surface of the second overturning plate is provided with a plurality of suckers; the control part is used for enabling the sucking disc on the first overturning plate to adsorb the element, so that when the second overturning plate overturns to the upper part of the first overturning plate under the drive of the second overturning shaft, the sucking disc on the first overturning plate releases the element, and meanwhile, the sucking disc on the second overturning plate adsorbs the element; the cleaning component is used for cleaning the components adsorbed on the first overturning plate or the second overturning plate; the drying component is used for drying the cleaned element.
Further, the cleaning assembly comprises a first spraying part, a second spraying part and a water storage tank; the first spraying part is arranged in the cleaning box and is positioned above the first overturning plate and used for spraying cleaning liquid onto the first overturning plate; the second spraying part is arranged in the cleaning box and is positioned above the second overturning plate and used for spraying cleaning liquid onto the second overturning plate; the water storage tank is arranged on the cleaning tank and is respectively communicated with the first spraying part and the second spraying part.
Further, the drying assembly comprises a first drying box and a second drying box; the side walls of the cleaning box, which are positioned on the corresponding sides of the first overturning plate and the second overturning plate, are respectively provided with a plurality of vent holes which are connected with the cleaning box; the first drying box is arranged on the side wall of the first overturning plate, which is positioned at one side of the cleaning box; the second stoving case sets up on the lateral wall that the second upset board is located washs case one side.
Further, the side walls of the cleaning boxes corresponding to the two ends of the first turning shaft and the second turning shaft are respectively provided with a lifting groove; the lifting groove is vertically arranged; one end of the first turnover shaft or one end of the second turnover shaft can be inserted into the lifting groove and can slide up and down in the corresponding lifting groove; the first overturning shaft or the second overturning shaft is connected with a lifting assembly; the lifting assembly is used for driving the first turnover shaft and the second turnover shaft to slide downwards for a preset distance when the first turnover plate and the second turnover plate need to be turned.
Further, the lifting assembly comprises a lifting shaft; the lifting shaft is of a hydraulic telescopic structure and is vertically arranged in the lifting groove; the lower end of the lifting shaft is connected with the bottom of the lifting groove, and the upper end of the lifting shaft is connected with the first overturning shaft or the second overturning shaft.
Further, the first overturning shaft is connected with a first overturning motor; the second overturning shaft is connected with a second overturning motor; the first turnover motor and the second turnover motor are used for enabling the first turnover plate and the second turnover plate to rotate downwards by a preset angle when elements are arranged on the first turnover plate, and further enabling the first turnover plate and the second turnover plate to rotate to a horizontal state and enabling the second turnover plate to rotate to the upper portion of the first turnover plate when one surface of the elements is cleaned.
Further, the bottom of the cleaning box is provided with a water collecting tank; a baffle plate is horizontally arranged above the water collecting tank; the baffle is located the below of first upset board and second upset board, and is equipped with the groove that runs through from top to bottom on the baffle.
Further, a pulley is provided at the other lateral edge of the first and second turn plates, respectively, so that the pulley is in contact with the partition plate after the first and second turn plates are rotated downward by a predetermined angle.
Further, the first spraying part and the second spraying part are both arranged in a sliding manner along the horizontal direction; the first spraying part and the second spraying part are connected with a sliding rod; the sliding rod can be inserted on the cleaning box in a left-right sliding manner; each sliding rod is connected with a sliding component; the sliding component is used for driving the sliding rod to slide in a reciprocating manner.
Further, the sliding assembly comprises a sliding motor, a sliding gear and a sliding toothed ring; the sliding rod is a threaded rod; the sliding toothed ring is sleeved on the sliding rod and can be rotatably arranged on the cleaning box; the sliding toothed ring is matched with threads on the sliding rod, so that the sliding rod is driven to slide left and right when the sliding toothed ring rotates; the sliding gear is meshed with the sliding toothed ring; the sliding motor is connected with the sliding gear and is used for driving the sliding gear to rotate in a reciprocating manner.
The beneficial effects of the invention are as follows: the invention relates to a semiconductor element cleaning device, which is provided with a cleaning box, a turnover assembly, a cleaning assembly and a drying assembly, and the element to be cleaned is placed on a first turnover plate. The controller controls the sucking disc on the first overturning plate to adsorb the element, and starts the cleaning assembly to clean the first surface of the element on the first overturning plate. After the cleaning is carried out for a preset time, the second overturning shaft drives the second overturning plate to rotate to the position right above the first overturning plate. The controller enables the sucking disc on the first overturning plate to release the element and controls the sucking disc on the second overturning plate to suck the element. When the sucker of the first turnover plate releases and the sucker on the second turnover plate adsorbs the element, the first turnover plate and the second turnover plate can clamp the element together, and the first turnover plate rotates to the initial position of the second turnover plate along with the second turnover plate so as to prevent the element from falling off from the sucker in the rotation process along with the second turnover plate. After the element finishes turning over on the second turning over plate, the first turning over plate is driven by the first turning over shaft to restore to the initial position, and the cleaning assembly cleans the second surface of the element. The first turnover plate and the second turnover plate turn over the elements, so that the cleaning dead angles of the elements are avoided, the workpieces can be sufficiently cleaned in the cleaning process, and the cleaning effect is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic view showing a structure of an embodiment of a semiconductor device cleaning apparatus according to the present invention;
fig. 2 is a schematic view showing an internal structure of an embodiment of a semiconductor device cleaning apparatus according to the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
fig. 4 is a schematic view showing an initial state structure of an embodiment of a semiconductor device cleaning apparatus according to the present invention;
fig. 5 is a schematic view showing an operation state structure of an embodiment of a semiconductor device cleaning apparatus according to the present invention;
FIG. 6 is a schematic diagram of a second controller position of an embodiment of a semiconductor device cleaning apparatus according to the present invention;
fig. 7 is a schematic view showing a first controller of a semiconductor device cleaning apparatus according to an embodiment of the invention.
The following figures are shown: 100. a cleaning box; 110. a cover plate; 120. a mounting hole; 130. a mounting plate; 131. a lifting groove; 140. a partition plate; 210. a first flipping plate; 211. a first inversion shaft; 212. a first controller; 213. a first turnover motor; 220. a second flipping plate; 221. a second inversion shaft; 222. a second controller; 223. a second overturning motor; 230. a suction cup; 240. a pulley; 310. a first spray section; 320. a second spray section; 330. a water storage tank; 340. a water pipe; 350. a slide bar; 360. a sliding gear; 370. sliding the toothed ring; 380. a slide motor; 410. a first drying box; 420. a second drying box; 510. and a lifting shaft.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
An embodiment of a semiconductor element cleaning apparatus of the present invention, as shown in fig. 1 to 7, includes a cleaning tank 100, a turnover assembly, a cleaning assembly, and a drying assembly; a cleaning chamber is provided inside the cleaning tank 100, and a cover plate 110 is provided above the cleaning tank 100 to close the cleaning tank 100 when cleaning the components.
The flipping assembly includes a first flipping plate 210, a second flipping plate 220, a first flipping shaft 211, a second flipping shaft 221, and a control portion. The first tilting shaft 211 is horizontal and rotatably installed in the washing tank 100, and the first tilting shaft 211 extends in the front-rear direction. The second overturning shaft 221 and the first overturning shaft 211 are coaxial and can be rotatably installed in the cleaning tank 100, the first overturning shaft 211 and the second overturning shaft 221 are coaxially sleeved, the first overturning shaft 211 is rotatably inserted into the second overturning shaft 221, and the first overturning shaft 211 and the second overturning shaft 221 can rotate freely relatively. The first and second flipping plates 210 and 220 are symmetrically disposed about the first and second flipping shafts 211 and 221, and in particular, the first and second flipping plates 210 and 220 are bilaterally symmetrical about the first and second flipping shafts 211 and 221. The first overturning plate 210 is horizontally disposed, and one lateral edge is fixedly connected with the first overturning shaft 211, specifically, the first overturning plate 210 is in a rectangular plate-shaped structure and is located at the left side of the first overturning shaft 211, and the right edge of the first overturning plate 210 is fixedly connected with the first overturning shaft 211 so as to drive the first overturning plate 210 to rotate with the first overturning shaft 211 as an axis when the first overturning shaft 211 rotates. A plurality of suction cups 230 are provided on the upper surface of the first inversion plate 210, and the suction cups 230 are used to suck the components to be cleaned. The second overturning plate 220 is horizontally arranged, and one transverse edge is fixedly connected with the second overturning shaft 221, specifically, the second overturning plate 220 is of a rectangular plate-shaped structure and is positioned on the right side of the second overturning shaft 221, and the left edge of the second overturning plate 220 is fixedly connected with the second overturning shaft 221 so as to drive the second overturning plate 220 to rotate by taking the second overturning shaft 221 as an axle center when the second overturning shaft 221 rotates.
A plurality of suction cups 230 are provided on the upper surface of the second flipping plate 220. The control part is used for enabling the sucking disc 230 on the first overturning plate 210 to adsorb the element, further enabling the sucking disc 230 on the first overturning plate 210 to release the element when the second overturning plate 220 is overturned above the first overturning plate 210 under the driving of the second overturning shaft 221, and enabling the sucking disc 230 on the second overturning plate 220 to adsorb the element, further enabling the second overturning plate 220 to drive the element to overturne together when the second overturning plate 220 overturns to the initial position, so that the overturning of the element is realized. In particular, when the suction cup 230 of the first flipping plate 210 releases and the suction cup 230 of the second flipping plate 220 sucks the component, the first flipping plate 210 and the second flipping plate 220 can clamp the component together, and the first flipping plate 210 rotates together with the second flipping plate 220 to prevent the component from falling off the suction cup 230 during rotation with the second flipping plate 220. The control part includes a first controller 212 and a second controller 222, the first controller 212 being disposed on the first flipping plate 210 for controlling the suction cup 230 on the first flipping plate 210; the second controller 222 is disposed on the second flipping panel 220 for controlling the suction cup 230 on the second flipping panel 220. The cleaning assembly is used for cleaning the element adsorbed on the first overturning plate 210 or the second overturning plate 220, when the element is adsorbed on the first overturning plate 210, the cleaning assembly cleans the first surface of the element, and after the element passes through the overturning surface of the second overturning plate 220, the cleaning assembly cleans the second surface of the element. The drying component is used for drying the cleaned element.
In this embodiment, as shown in fig. 2, the cleaning assembly includes a first spray portion 310, a second spray portion 320, and a water storage tank 330. The first spraying portion 310 is disposed in the cleaning tank 100 and above the first overturning plate 210, and is used for spraying cleaning liquid onto the first overturning plate 210, in particular, the cleaning liquid adopts water, and the first spraying portion 310 sprays the water onto the first overturning plate 210, so as to wash the first surface of the element. The second spraying portion 320 is disposed in the cleaning tank 100 and located above the second overturning plate 220, and is used for spraying cleaning liquid onto the second overturning plate 220, and the second spraying portion 320 sprays water onto the second overturning plate 220, so as to wash the second surface of the element. The water storage tanks 330 are arranged on the cleaning tank 100 and are respectively communicated with the first spraying part 310 and the second spraying part 320, and specifically, the number of the water storage tanks 330 is two; each water storage tank 330 communicates with the first spray portion 310 or the second spray portion 320 through a water pipe 340. In particular, the first spraying part 310 and the second spraying part 320 are always in an opened state during the cleaning process, and thus when the component is turned over onto the second turning plate 220, the first spraying part 310 washes the upper surface of the first turning plate 210, thereby ensuring the cleaning of the first turning plate 210; conversely, the second shower portion 320 washes the upper surface of the second roll-over plate 220.
In the present embodiment, as shown in fig. 1 and 2, the drying assembly includes a first drying box 410 and a second drying box 420. The side walls of the washing tank 100 at the corresponding sides of the first and second flipping plates 210 and 220 are each provided with a plurality of ventilation holes connected to the inside of the washing tank 100, and specifically, the left and right sides of the washing tank 100 are each provided with a plurality of ventilation holes. The first drying box 410 and the second drying box 420 are provided with drying fans therein, and the drying fans can blow out hot air. The first drying box 410 is provided on a side wall of the first inversion plate 210 at one side of the washing box 100, so that when the first drying box 410 operates, the first drying box 410 blows hot air into the washing box 100 through the air vent; the second drying box 420 is provided on a side wall of the second overturning plate 220 at one side of the washing box 100 such that the second drying box 420 blows hot air into the washing box 100 through the air vent hole when the second drying box 420 is operated. The first drying box 410 and the second drying box 420 cooperate to dry the components.
In this embodiment, as shown in fig. 1 to 3, a lifting groove 131 is disposed on the side wall of the cleaning box 100 corresponding to two ends of the first and second turning shafts 211 and 221, specifically, a lifting groove 131 is disposed on the front and rear side walls of the cleaning box 100, and the lifting groove 131 is disposed vertically. One end of the first overturning shaft 211 or the second overturning shaft 221 can be inserted into one lifting groove 131, and can slide up and down in the corresponding lifting groove 131, so that when the first overturning shaft 211 and the second overturning shaft 221 slide up and down along the lifting groove 131, the corresponding first overturning plate 210 and the second overturning plate 220 are driven to slide up and down synchronously. The first overturning shaft 211 or the second overturning shaft 221 is connected with a lifting assembly, and the lifting assembly is used for driving the first overturning shaft 211 and the second overturning shaft 221 to slide downwards for a preset distance when the first overturning plate 210 and the second overturning plate 220 need to overturn. Specifically, when the first and second flipping plates 210 and 220 need to be flipped upward, the lifting assembly drives the first and second flipping plates 210 and 220 to move downward by a preset distance through the first and second flipping shafts 211 and 221, and thus, when the first and second flipping plates 210 and 220 rotate, there is enough space for rotation to prevent the cover plate 110 of the washing case 100 from obstructing the rotation of the first and second flipping plates 210 and 220. Specifically, the front and rear side walls of the washing tank 100 are provided with mounting holes 120, and each mounting hole 120 is detachably provided with a mounting plate 130; each of the elevating grooves 131 is vertically provided on one of the mounting plates 130. The lifting assembly includes a lifting shaft 510; the lifting shaft 510 is of a hydraulic telescopic structure, and is specifically a hydraulic cylinder, and is vertically arranged in the lifting groove 131. The lower end of the lifting shaft 510 is connected with the bottom of the lifting groove 131, the upper end of the lifting shaft 510 is connected with the first overturning shaft 211 or the second overturning shaft 221, the number of the lifting shafts 510 can be two, the two lifting shafts 510 are arranged in a synchronous telescopic manner, and each lifting shaft 510 is arranged in one lifting groove 131.
In the present embodiment, as shown in fig. 2 to 5, the first flipping shaft 211 is connected with a first flipping motor 213, the second flipping shaft 221 is connected with a second flipping motor 223, and the first flipping motor 213 and the second flipping motor 223 are respectively disposed on the corresponding mounting plates 130. The first and second turnover motors 213 and 223 are used for driving the first and second turnover plates 210 and 220 to rotate downwards by a preset angle through the first and second turnover shafts 211 and 221 when the elements to be cleaned are disposed on the first and second turnover plates 210 and 220, specifically, the first and second turnover plates 210 and 220 are inclined planes inclined downwards, the first and second turnover plates 210 and 220 form an inverted V-shaped structure (as shown in fig. 5), and when the first and second turnover plates 210 and 220 are in an inclined state, water sprayed from the first and second spray parts 310 and 320 can flow downwards along the inclined directions of the turnover plates to prevent water accumulation on the first and second turnover plates 210 and 220 and the elements, and further, when one side of the elements is cleaned, the first and second turnover plates 210 and 220 are rotated to a horizontal state, and the second turnover plate 220 is rotated to an upper side of the first turnover plate 210. Specifically, the first and second flipping plates 210 and 220 are moved downward by the elevating shaft 510 before the second flipping plate 220 is rotated above the first flipping plate 210.
In the present embodiment, as shown in fig. 1 and 2, a water collecting tank is provided at the bottom of the washing tank 100; a partition 140 is horizontally arranged above the water collecting tank; the partition 140 is positioned under the first and second turnover plates 210 and 220, and grooves penetrating up and down are formed in the partition 140 so that water sprayed from the first and second spraying parts 310 and 320 passes downward through the partition 140 and is collected in the water collecting grooves. The other lateral edges of the first and second flipping plates 210 and 220 are respectively provided with a pulley 240 such that the pulley 240 contacts the partition 140 after the first and second flipping plates 210 and 220 are rotated downward by a predetermined angle, the partition 140 contacts the pulley 240 such that the partition 140 has a supporting force to the first and second flipping plates 210 and 220 when being flipped downward, and the arrangement of the pulley 240 reduces a friction force between the edges of the first and second flipping plates 210 and 220 and the partition 140.
In the present embodiment, as shown in fig. 1 to 3, the first shower portion 310 and the second shower portion 320 are each slidably provided in the horizontal direction; a sliding rod 350 is connected to both the first spray part 310 and the second spray part 320; the slide bar 350 is slidably inserted in the cleaning tank 100; one slide assembly is connected to each slide bar 350; the sliding component is used for driving the sliding rod 350 to slide reciprocally, so as to drive the first spraying portion 310 and the second spraying portion 320 to slide reciprocally left and right on the corresponding first turning plate 210 and the second turning plate 220, so as to increase the cleaning efficiency of the first turning plate 210, the second turning plate 220 and the elements. The slide assembly includes a slide motor 380, a slide gear 360, and a slide ring gear 370; the sliding rod 350 is a threaded rod; the sliding toothed ring 370 is sleeved on the sliding rod 350 and is rotatably arranged on the cleaning box 100; the sliding toothed ring 370 cooperates with the threads on the sliding rod 350 to drive the sliding rod 350 to slide left and right when the sliding toothed ring 370 rotates; the sliding gear 360 and the sliding toothed ring 370 mesh; the sliding motor 380 is connected to the sliding gear 360, and is used for driving the sliding gear 360 to reciprocally rotate. In particular, the sliding bar 350 has a tubular shape, one end of which communicates with the first shower part 310 or the second shower part 320, and the other end of which communicates with one end of one water pipe 340.
In operation, the first and second flipping plates 210 and 220 are in a horizontal state in an initial state, the cover plate 110 of the washing tank 100 is opened, the component to be washed is placed on the first flipping plate 210, and the first controller 212 controls the suction cup 230 on the first flipping plate 210 to suck the component.
The first and second flipping motors 213 and 223 are started to respectively drive the first and second flipping shafts 211 and 221 to rotate, so that the first and second flipping plates 210 and 220 are rotated downward by a predetermined angle, thereby forming an inverted V shape. The first and second spraying parts 310 and 320 are opened, and the water storage tank 330 discharges water downwardly from the first and second spraying parts 310 and 320 onto the first and second inversion plates 210 and 220 by pressurization. Simultaneously, the sliding motor 380 is started, the sliding motor 380 drives the sliding toothed ring 370 to rotate in a reciprocating manner through the sliding gear 360, and then drives the sliding rod 350 to slide left and right, and further drives the first spraying part 310 and the second spraying part 320 to slide left and right in a reciprocating manner on the corresponding first overturning plate 210 and second overturning plate 220, so that the cleaning efficiency of the first overturning plate 210, the second overturning plate 220 and the elements can be improved. When the cleaning of the first surface of the component on the first flipping plate 210 is completed, the first flipping motor 213 and the second flipping motor 223 drive the first flipping plate 210 and the second flipping plate 220 to rotate to the initial state through the first flipping shaft 211 and the second flipping shaft 221.
When the first and second flipping plates 210 and 220 are in the horizontal state again, the lifting shaft 510 is started, and the lifting shaft 510 is contracted to drive the first and second flipping plates 211 and 221 to slide downward by a preset distance, so that when the first and second flipping plates 210 and 220 are flipped upward, there is enough rotation space to prevent the cover plate 110 of the washing case 100 from obstructing the upward flipping of the first and second flipping plates 210 and 220. When the first and second flipping plates 210 and 220 are stationary, the second flipping motor 223 is started, the second flipping motor 223 drives the second flipping plate 220 to flip directly above the first flipping plate 210 through the second flipping shaft 221, and the suction cup 230 of the second flipping plate 220 contacts the first surface of the component. The second controller 222 controls the suction cups 230 on the second flipping plate 220 to suck the components while the first controller 212 controls the suction cups 230 on the first flipping plate 210 to release the components.
The first and second flipping motors 213 and 223 are simultaneously started again, so that the first and second flipping plates 210 and 220 commonly clamp the element to rotate toward the initial direction of the second flipping plate 220, and when the second flipping plate 220 is restored to the initial state, the first flipping motor 213 drives the first flipping plate 210 to restore the position. The lifting shaft 510 will again lift the first and second flipping panels 210 and 220 to the original height. The first and second turn motors 213 and 223 again drive the first and second turn plates 210 and 220 to rotate downward to the inverted V-shaped structure, the second spraying part 320 washes the second surface of the component, and the first spraying part 310 washes the upper surface of the first turn plate 210. The washed sewage is discharged into the sump through the partition 140.
After the cleaning is completed, the cleaning assembly is closed, and the first and second inversion plates 210 and 220 are restored to the original state. The first drying box 410 and the second drying box 420 are driven to perform a drying process on the components.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.

Claims (6)

1. A semiconductor element cleaning apparatus, characterized in that: comprising the following steps:
a cleaning box;
the overturning assembly comprises a first overturning plate, a second overturning plate, a first overturning shaft and a second overturning shaft
A turning shaft and a control part; the first overturning shaft is horizontal and can be rotatably arranged in the cleaning box; the second turning shaft is coaxial with the first turning shaft and can be rotatably arranged in the cleaning box; the first overturning plate and the second overturning plate are symmetrically arranged about the first overturning shaft and the second overturning shaft; the first turnover plate is horizontally arranged, and one transverse edge is fixedly connected with the first turnover shaft; the upper surface of the first overturning plate is provided with a plurality of suckers; the second turnover plate is horizontally arranged, and one transverse edge is fixedly connected with the second turnover shaft; the upper surface of the second overturning plate is provided with a plurality of suckers; the control part is used for enabling the sucking disc on the first overturning plate to adsorb the element, so that when the second overturning plate overturns to the upper part of the first overturning plate under the drive of the second overturning shaft, the sucking disc on the first overturning plate releases the element, and meanwhile, the sucking disc on the second overturning plate adsorbs the element;
the cleaning assembly is used for cleaning the components adsorbed on the first overturning plate or the second overturning plate;
the drying component is used for drying the cleaned element; the side walls of the cleaning box corresponding to the two ends of the first turning shaft and the second turning shaft are respectively provided with a lifting groove; the lifting groove is vertically arranged; one end of the first turnover shaft or one end of the second turnover shaft can be inserted into the lifting groove and can slide up and down in the lifting groove; the first overturning shaft or the second overturning shaft is connected with a lifting assembly; the lifting assembly is used for driving the first turnover shaft and the second turnover shaft to slide downwards for a preset distance when the first turnover plate and the second turnover plate need to be turned; the first overturning shaft is connected with a first overturning motor; the second overturning shaft is connected with a second overturning motor; the first overturning motor and the second overturning motor are used for enabling the first overturning plate and the second overturning plate to rotate downwards by a preset angle when the first overturning plate is provided with the element, so that when one surface of the element is cleaned, the first overturning plate and the second overturning plate are rotated to be in a horizontal state, and the second overturning plate is rotated to be above the first overturning plate; the bottom of the cleaning box is provided with a water collecting tank; a baffle plate is horizontally arranged above the water collecting tank; the partition plate is positioned below the first overturning plate and the second overturning plate, and is provided with a groove penetrating up and down; the other transverse edges of the first overturning plate and the second overturning plate are respectively provided with a pulley, so that after the first overturning plate and the second overturning plate rotate downwards by a preset angle, the pulleys are contacted with the partition plate; the first turnover plate and the second turnover plate are inclined planes which incline downwards, the first turnover plate and the second turnover plate form an inverted V-shaped structure, and when the first turnover plate and the second turnover plate are in an inclined state, water sprayed out by the first spraying part and the second spraying part can flow downwards along the inclined planes of the turnover plates so as to prevent water accumulation on the first turnover plate, the second turnover plate and the elements.
2. A semiconductor element cleaning apparatus according to claim 1, wherein:
the cleaning assembly comprises a first spraying part, a second spraying part and a water storage tank; the first spraying part is arranged in the cleaning box and is positioned above the first overturning plate and used for spraying cleaning liquid onto the first overturning plate; the second spraying part is arranged in the cleaning box and is positioned above the second overturning plate and used for spraying cleaning liquid onto the second overturning plate; the water storage tank is arranged on the cleaning tank and is respectively communicated with the first spraying part and the second spraying part.
3. A semiconductor element cleaning apparatus according to claim 1, wherein:
the drying assembly comprises a first drying box and a second drying box; the side walls of the cleaning box, which are positioned on the corresponding sides of the first overturning plate and the second overturning plate, are respectively provided with a plurality of vent holes which are connected with the cleaning box; the first drying box is arranged on the side wall of the first overturning plate, which is positioned at one side of the cleaning box; the second stoving case sets up on the lateral wall that the second upset board is located washs case one side.
4. A semiconductor element cleaning apparatus according to claim 1, wherein:
the lifting assembly comprises a lifting shaft; the lifting shaft is of a hydraulic telescopic structure and is vertically arranged in the lifting groove; the lower end of the lifting shaft is connected with the bottom of the lifting groove, and the upper end of the lifting shaft is connected with the first overturning shaft or the second overturning shaft.
5. A semiconductor element cleaning apparatus according to claim 2, wherein:
the first spraying part and the second spraying part are both arranged in a sliding manner along the horizontal direction; the first spraying part and the second spraying part are connected with a sliding rod; the sliding rod can be inserted on the cleaning box in a left-right sliding manner; each sliding rod is connected with a sliding component; the sliding component is used for driving the sliding rod to slide in a reciprocating manner.
6. A semiconductor element cleaning apparatus according to claim 5, wherein:
the sliding assembly comprises a sliding motor, a sliding gear and a sliding toothed ring; the sliding rod is a threaded rod; the sliding toothed ring is sleeved on the sliding rod and can be rotatably arranged on the cleaning box; the sliding toothed ring is matched with threads on the sliding rod, so that the sliding rod is driven to slide left and right when the sliding toothed ring rotates; the sliding gear is meshed with the sliding toothed ring; the sliding motor is connected with the sliding gear and is used for driving the sliding gear to rotate in a reciprocating manner.
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