CN115547883A - Semiconductor wafer cleaning and recycling equipment - Google Patents
Semiconductor wafer cleaning and recycling equipment Download PDFInfo
- Publication number
- CN115547883A CN115547883A CN202210990867.0A CN202210990867A CN115547883A CN 115547883 A CN115547883 A CN 115547883A CN 202210990867 A CN202210990867 A CN 202210990867A CN 115547883 A CN115547883 A CN 115547883A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cleaning
- cantilever
- water tank
- threaded rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application discloses semiconductor wafer cleaning and recycling equipment which comprises a supporting frame, a water tank, a wafer fixing device, a cantilever, a cleaning device, an air drying device and a driving device, wherein the supporting frame is vertically arranged relative to the ground; the wafer fixing device is detachably arranged on the water tank, the cantilever is erected above the wafer fixing device, and the wafer fixing device comprises a tank body, a supporting assembly, a first driving mechanism and an adsorption mechanism, wherein the tank body is detachably arranged on the water tank, an opening is formed in the top wall of the tank body, and a drain pipe is arranged at the bottom side of the tank body; the supporting component is rotatably arranged in the box body; one end of the first driving mechanism is connected with the box body, and the other end of the first driving mechanism is connected with the supporting component; the adsorption mechanism is arranged on the supporting component. From this, can effectively reduce the waste of washing liquid, avoid remaining the drop of water on the wafer and adsorb impurity, effectively promote the drying efficiency of wafer.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a semiconductor wafer cleaning and recycling device.
Background
The wafer cleaning process is very important for the electronic industry, especially the semiconductor industry, almost every process involves cleaning in the manufacturing process of semiconductor devices and integrated circuits, wafer cleaning mainly removes various impurity ions such as particles, organic matters, inorganic metal ions and the like adsorbed on the surface of a wafer, so that the surface cleanliness of the wafer reaches certain process requirements, and along with the development of the semiconductor wafer process, in order to meet the requirements of the electrical characteristics of the wafer, the requirements on the cleanliness of the cleaned wafer are higher and higher.
At present, a related cleaning device is low in cleaning efficiency, a cleaned wafer is slow to dry, water drops on the surface of the cleaned wafer are prone to adsorbing impurities again, and the cleaned cleaning liquid is directly discharged, so that a large amount of waste of the cleaning liquid is caused.
Disclosure of Invention
The present application is directed to solving, at least to some extent, one of the technical problems in the related art.
Therefore, an object of the present application is to provide a semiconductor wafer cleaning and recycling apparatus, which can effectively reduce the waste of the cleaning solution, avoid the water drops remained on the wafer from adsorbing impurities, and effectively improve the drying efficiency of the wafer.
In order to achieve the above object, an embodiment of the first aspect of the present application provides a semiconductor wafer cleaning and recycling apparatus, including a support frame, a water tank, a wafer fixing device, a cantilever, a cleaning device, an air drying device, and a driving device, wherein the support frame is vertically disposed with respect to the ground, the water tank is disposed on the support frame, and a water inlet pipe is disposed at a bottom side of the water tank; the wafer fixing device is detachably arranged on the water tank, the cantilever is erected above the wafer fixing device, and the wafer fixing device comprises a box body, a supporting component, a first driving mechanism and an adsorption mechanism, wherein the box body is detachably arranged on the water tank, an opening is formed in the top wall of the box body, and a drain pipe is arranged at the bottom side of the box body; the supporting component is rotatably arranged in the box body; one end of the first driving mechanism is connected with the box body, and the other end of the first driving mechanism is connected with the supporting component and used for driving the supporting component to rotate; the adsorption mechanism is arranged on the support assembly and used for fixing the wafer to be cleaned; the cleaning device is movably arranged on the cantilever and is connected with the water tank through a pipeline and used for extracting cleaning liquid in the water tank so as to clean the wafer to be cleaned; the air drying device is movably arranged on the cantilever and used for air drying the cleaned wafer; one end of the driving device is connected with the cantilever, and the other end of the driving device is respectively connected with the cleaning device and the air drying device and used for driving the cleaning device and the air drying device to move on the cantilever.
The semiconductor wafer cleaning and recycling equipment can effectively reduce the waste of cleaning liquid, avoids water drops remained on the wafer from adsorbing impurities, and effectively improves the drying efficiency of the wafer.
In addition, the semiconductor wafer cleaning and recycling device proposed by the application can also have the following additional technical characteristics:
in one embodiment of the present application, a plurality of filter holes are formed in the bottom wall of the box body, and a plurality of filter holes are provided with filter cotton, wherein the plurality of filter holes are used for filtering used cleaning liquid into the water tank.
In one embodiment of the present application, a tapered table is disposed on a bottom wall of the box body, a groove is disposed on the bottom wall of the tapered table, the first driving mechanism is detachably disposed in the groove, the supporting assembly includes a plurality of balls, a supporting plate and a plurality of columns, wherein the plurality of balls are respectively rotatably disposed on the tapered table, and the plurality of balls are disposed around the groove; the bottom wall of the supporting plate is provided with an annular sliding groove, the supporting plate is movably connected with the plurality of balls through the annular sliding groove respectively, and the bottom wall of the supporting plate is connected with the first driving mechanism; the plurality of upright posts are respectively vertically arranged on the supporting plate.
In one embodiment of the application, the adsorption mechanism comprises a support plate and an air cylinder, wherein the support plate is detachably arranged on the plurality of upright posts, and the support plate is provided with a plurality of suckers, wherein the suckers are connected with the air cylinder through hoses; the cylinder detachably sets up in the backup pad for it is a plurality of to control the sucking disc adsorbs fixedly treat abluent wafer.
In an embodiment of the present application, two parallel sliding grooves are formed in a bottom wall of the suspension arm, the driving device includes a first threaded rod, a second threaded rod, a belt transmission mechanism and a second driving mechanism, wherein the first threaded rod and the second threaded rod are respectively rotatably disposed in the corresponding sliding grooves, a first sliding block is sleeved on the first threaded rod, a second sliding block is sleeved on the second threaded rod, and the first sliding block and the second sliding block are respectively slidably disposed in the corresponding sliding grooves; one end of the second driving mechanism is connected with the cantilever; one end of the belt transmission mechanism is connected with the end parts of the first threaded rod and the second threaded rod respectively, and the other end of the belt transmission mechanism is connected with the other end of the second driving mechanism.
In one embodiment of the application, the cleaning device comprises a water pump and a spray head, wherein the water pump is detachably arranged on the cantilever, and one end of the water pump is connected with the bottom of the water tank through a pipeline; shower nozzle detachably sets up on the diapire of first slider, just the shower nozzle pass through the hose with the other end of water pump links to each other.
In one embodiment of the present application, the seasoning device is detachably disposed on the second slider, and the seasoning device is a micro fan.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a semiconductor wafer cleaning and recycling apparatus according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a semiconductor wafer cleaning and recycling apparatus according to another embodiment of the present application;
FIG. 3 is a schematic structural diagram of a semiconductor wafer cleaning and recycling apparatus according to another embodiment of the present application;
fig. 4 is a schematic structural diagram of a semiconductor wafer cleaning and recycling apparatus according to another embodiment of the present disclosure.
As shown in the figure: 10. a support frame; 20. a water tank; 21. a water inlet pipe; 30. a wafer fixing device; 31. a box body; 32. a support assembly; 321. a ball bearing; 322. a support plate; 323. a column; 33. a first drive mechanism; 34. an adsorption mechanism; 341. a support disc; 342. a cylinder; 311. an opening; 312. a sewage discharge pipe; 313. a filtration pore; 314. draining cotton; 315. a conical table; 316. a groove; 317. an annular chute; 3411. a suction cup; 40. a cantilever; 41. a chute; 50. a cleaning device; 51. a water pump; 52. a spray head; 60. an air drying device; 70. a drive device; 71. a first threaded rod; 72. a second threaded rod; 73. a belt drive mechanism; 74. a second drive mechanism; 711. a first slider; 721. and a second slider.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. On the contrary, the embodiments of the application include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
The semiconductor wafer cleaning and recycling apparatus according to the embodiment of the present application will be described with reference to the accompanying drawings.
As shown in fig. 1 and 2, the semiconductor wafer cleaning and recycling apparatus according to the embodiment of the present invention may include a support frame 10, a water tank 20, a wafer fixing device 30, a cantilever 40, a cleaning device 50, an air drying device 60, and a driving device 70.
Wherein, the support frame 10 is arranged vertically relative to the ground, the water tank 20 is arranged on the support frame 10, and the bottom side of the water tank 20 is provided with the water inlet pipe 11. The wafer fixing device 30 is detachably disposed on the water tank 20, the cantilever 40 is disposed above the wafer fixing device 30, and the wafer fixing device 30 may include a box 31, a support assembly 32, a first driving mechanism 33, and a suction mechanism 34.
Wherein, the tank body 31 is detachably arranged on the water tank 20, an opening 311 is arranged on the top wall of the tank body 31, and a sewage discharge pipe 312 is arranged at the bottom side of the tank body 31. The supporting component 32 is rotatably disposed in the box 31, one end of the first driving mechanism 33 is connected to the box 31, and the other end of the first driving mechanism 33 is connected to the supporting component 32 for driving the supporting component 32 to rotate. It should be noted that the tank body 31 described in this embodiment is detachably provided on the water tank 20, facilitating the installation and replacement of the tank body 31. For example, tank 31 may be connected to tank 20 by snapping, riveting, or threaded fastener connections.
It should be noted that the first driving mechanism 33 described in this embodiment may be a servo motor.
In the embodiment of the present application, in order to improve the sealing performance between the tank 31 and the water tank 20, a sealing ring (not shown) may be further disposed on the bottom wall of the tank 31. In addition, in order to control the water inlet of the water inlet pipe 11 and the sewage discharge of the sewage discharge pipe 312, valves (not shown) may be respectively disposed on the water inlet pipe 11 and the sewage discharge pipe 312.
A suction mechanism 34 is disposed on the support assembly 32 for holding a wafer to be cleaned. The cleaning device 50 is movably disposed on the cantilever 40, and the cleaning device 50 is connected to the water tank 20 through a pipe for pumping the cleaning liquid in the water tank 20 to clean the wafer to be cleaned. The air drying device 60 is movably disposed on the cantilever 40 for air drying the cleaned wafer.
One end of the driving device 70 is connected to the cantilever 40, and the other end of the driving device 70 is connected to the cleaning device 50 and the air drying device 60, respectively, for driving the cleaning device 50 and the air drying device 60 to move on the cantilever 40.
For clarity of the above embodiment, in an embodiment of the present application, as shown in fig. 1, a plurality of filtering holes 313 are formed in a bottom wall of the box 31, for example, the number of the filtering holes 313 may be 6, 7, 8, 9, 10, etc., and the number of the filtering holes 313 is not limited herein, and a water filtering cotton 314 is disposed on each of the filtering holes 313, wherein the filtering holes 313 are used for filtering used cleaning liquid into the water tank 20, so as to facilitate recycling of the cleaning liquid.
Specifically, when it is necessary to clean the semiconductor wafer, the worker first opens the valve of the inlet pipe 11, injects a sufficient amount of cleaning liquid into the water tank 20 through the inlet pipe 11, and then closes the valve. Then, the worker may place a wafer to be cleaned (a semiconductor wafer) on the adsorption mechanism 34 by controlling the moving mechanism (the moving mechanism may be a moving chuck), and control the adsorption mechanism 34 to adsorb and fix the wafer. Then, the operator controls the first driving mechanism (servo motor) 33 to start, and the started first driving mechanism 33 drives the adsorption mechanism 34 to rotate through the support assembly 32, so as to drive the wafer to be cleaned to rotate in the box 31.
The operator then controls the driving device 70 to move the cleaning device 50 and the air drying device 60 back and forth on the cantilever 40 synchronously and in the same direction. Meanwhile, the operator controls the operation of the cleaning device 50 and the air drying device 60, and at this time, the cleaning device 50 extracts the cleaning liquid in the water tank 20 to clean the wafer to be cleaned. As the cleaning device 50 moves back and forth on the cantilever 40, the wafer in rotation can be rinsed thoroughly. Meanwhile, as the wafer is washed in the rotation process, most of the cleaning liquid washed on the wafer is thrown out into the tank 31, filtered by the filter cotton 314 in the filter holes 313, and discharged into the water tank, so that the cleaning liquid can be recycled, and the waste of the cleaning liquid can be reduced.
Meanwhile, the air drying device 60 synchronously air-dries the cleaning solution remaining on the cleaned wafer, so that the whole wafer is synchronously air-dried in sections in the process of cleaning in sections. For example, the wafer is divided into three circles for cleaning, the first circle is the outermost circle of the wafer, the third circle is the innermost circle of the wafer, when the cleaning device 50 cleans the second circle of the wafer in the moving process, the air-drying device 60 synchronously air-dries the residual cleaning solution of the first circle of the cleaned wafer, when the cleaning device 50 cleans the innermost circle of the wafer, the air-drying device 60 air-dries the second circle of the wafer, and so on, thereby effectively improving the drying efficiency of the wafer and avoiding the water drops remained on the wafer from adsorbing impurities.
In addition, when it is desired to drain the cleaning solution from the tank 20, the worker may open the inlet pipe 21 by opening the valve on the inlet pipe 21 and drain the cleaning solution from the tank 20. When the interior filterable impurity of box needs clearance, staff's accessible is opened blow off pipe 312 with the valve on opening blow off pipe 312 to inside the box 31 is washed to the water pipe, washed away the interior filterable impurity of box 31 from the blow off pipe.
In one embodiment of the present application, as shown in fig. 3, a tapered table 315 is disposed on a bottom wall of the box 31, a groove 316 is disposed on a bottom wall of the tapered table 315, the first driving mechanism 33 is detachably disposed in the groove 316, and the supporting assembly 32 may include a plurality of balls 321, a supporting plate 322 and a plurality of pillars 323.
Wherein, a plurality of balls 321 are respectively rotatably disposed on the tapered platforms 315, and the plurality of balls 321 are disposed around the groove 316. For example, the number of the balls 321 may be 6, 7, 8, 9, 10, etc., and the specific number is not limited herein. An annular sliding groove 317 is formed in the bottom wall of the supporting plate 322, the supporting plate 322 is movably connected with the plurality of balls 321 through the annular sliding groove 317, and the bottom wall of the supporting plate 322 is connected with the first driving mechanism 33. The plurality of columns 323 are vertically disposed on the supporting plate 322, for example, the number of columns 323 may be 3, 4, 5, etc., and the specific number is not limited herein.
Further, in one embodiment of the present application, the adsorption mechanism 34 may include a support plate 341 and a cylinder 342.
The supporting plate 341 is detachably disposed on the plurality of columns 323, and the supporting plate 341 is provided with a plurality of suction cups 3411, for example, the number of the suction cups 3411 is 3, 4, 5, and the like, and the specific number is not limited herein, where the suction cups 3411 are connected to the cylinder 342 through a hose. It will be appreciated that the support tray 341 described in this embodiment is removably disposed on a plurality of posts 323 to facilitate installation and replacement of the support tray 341. For example, the support plate 341 may be connected to the plurality of columns 323 by snap-fit, rivet, or threaded fastener connections.
The air cylinder 342 is detachably disposed on the supporting plate 322, and is used for controlling the plurality of suction cups 3411 to suck and fix the wafer to be cleaned.
It should be noted that the suction cup 3411 described in this embodiment may be an elastically deformable rubber cup, and the top end of the suction cup 3411 may extend out of a portion of the top wall of the support plate 341, and the extended portion may be locked back under the self-gravity of the wafer and be flush with the top wall of the support plate 341.
Specifically, when a semiconductor wafer needs to be cleaned, an operator may control the moving mechanism to place the wafer to be cleaned on the support plate 341, and then the operator controls the cylinder 342 to move, the cylinder 342 sucks air through the hose to the suction cup 3411, so as to perform vacuum pumping, and the vacuum pumping suction cup 3411 fixes the wafer to be cleaned on the support plate 341.
Then, the related staff controls the first driving mechanism (servo motor) 33 to start movement, the moving first driving mechanism drives the supporting plate 322 to rotate, and simultaneously along with the rotation of the supporting plate 322, the plurality of balls 321 are driven to rotate, and the plurality of rotating balls 321 play a supporting role for the supporting plate 322.
Meanwhile, the rotating support plate 322 drives the absorption mechanism 24 to rotate through the plurality of columns 323, so as to drive the wafer to be cleaned to rotate, so that the cleaning device 50 can clean the wafer to be cleaned.
In one embodiment of the present application, as shown in fig. 3 and 4, the bottom wall of the cantilever 40 is provided with two parallel sliding slots 41, and the driving device 70 may include a first threaded rod 71, a second threaded rod 72, a belt transmission mechanism 73 and a second driving mechanism 74.
The first threaded rod 71 and the second threaded rod 72 are respectively rotatably disposed in the corresponding sliding grooves 41, the first threaded rod 71 is sleeved with a first sliding block 711, the second threaded rod 72 is sleeved with a second sliding block 721, and the first sliding block 711 and the second sliding block 721 are respectively slidably disposed in the corresponding sliding grooves 41.
One end of the second driving mechanism 74 is connected to the cantilever 40, one end of the belt transmission mechanism 73 is connected to the ends of the first threaded rod 71 and the second threaded rod 72, respectively, and the other end of the belt transmission mechanism 73 is connected to the other end of the second driving mechanism 74. It should be noted that the second drive mechanism 74 described in this embodiment may be a bi-directional motor.
It should be noted that the belt drive 73 described in this embodiment may be composed of two double-grooved driven pulleys (not specifically shown) and two single-grooved drive pulleys (not specifically shown), one of which is connected to the end of the first threaded rod 71, the other of which is connected to the end of the second threaded rod 72, and the two double-grooved driven pulleys are connected in series by a belt. And one of the single-groove driving pulleys is connected with the rotating shaft of the two-way motor (second driving mechanism 74), and the other single-groove driving pulley is connected with the end of the first threaded rod 71 or the second threaded rod 72.
For clarity of the above embodiment, in one embodiment of the present application, as shown in fig. 3, the cleaning device 50 may include a water pump 51 and a spray head 52.
Wherein, the water pump 51 is detachably provided on the cantilever 40, and one end of the water pump 51 is connected with the bottom of the water tank 20 through a pipe. The head 52 is detachably provided on the bottom wall of the first slider 711, and the head 52 is connected to the other end of the water pump 51 through a hose.
Further, the airing device 60 may be detachably disposed on the second slider 721, and the airing device 60 may be a micro fan.
Specifically, when the bidirectional motor is started, the rotating shaft of the bidirectional motor intermittently rotates in a forward direction (clockwise) or a reverse direction (counterclockwise), the bidirectional motor can synchronously drive the first threaded rod 71 and the second threaded rod 72 to rotate through the belt transmission mechanism 73, and the rotating first threaded rod 71 drives the spray head 52 to move back and forth on the cantilever 40 through the first sliding block 711. Meanwhile, the worker controls the water pump 51 to start, the water pump 51 in operation supplies the cleaning liquid in the water tank 20 to the spray head 52 through a pipeline, and the spray head moves back and forth on the cantilever 40 to comprehensively wash the wafer to be cleaned.
Meanwhile, the rotating second threaded rod 72 drives the micro-fan (air drying device 60) to move back and forth on the cantilever synchronously with the spray head 52 through the second slide block 721, so as to dry the cleaning solution left on the surface of the cleaned wafer. Therefore, the drying efficiency of the cleaned wafer can be effectively improved, water drops remained on the wafer are prevented from adsorbing impurities, and the cleaning quality of the wafer is improved.
In addition, the first driving mechanism 33, the second driving mechanism 74, the air cylinder 342 and the air dryer 60 described in this embodiment are all connected to a controller (not shown), and an operator can control the first driving mechanism 33, the second driving mechanism 74, the air cylinder 342 and the air dryer 60 respectively through the controller.
To sum up, the semiconductor wafer cleaning and recycling device can effectively reduce the waste of cleaning liquid, avoid the water drops remained on the wafer to adsorb impurities, and effectively improve the drying efficiency of the wafer.
In the description of the present specification, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
While embodiments of the present application have been shown and described above, it should be understood that they have been presented by way of example only, and not limitation, and that various changes, modifications, substitutions and alterations can be made by those skilled in the art without departing from the scope of the present application.
Claims (7)
1. A semiconductor wafer cleaning and recycling device is characterized by comprising a support frame (10), a water tank (20), a wafer fixing device (30), a cantilever (40), a cleaning device (50), an air drying device (60) and a driving device (70),
the support frame (10) is vertically arranged relative to the ground, the water tank (20) is arranged on the support frame (10), and a water inlet pipe (21) is arranged at the bottom side of the water tank (20);
the wafer fixing device (30) is detachably arranged on the water tank (20), the cantilever (40) is erected above the wafer fixing device (30), the wafer fixing device (30) comprises a box body (31), a supporting component (32), a first driving mechanism (33) and an adsorption mechanism (34), wherein,
the box body (31) is detachably arranged on the water tank (20), an opening (311) is formed in the top wall of the box body (31), and a sewage discharge pipe (312) is arranged on the bottom side of the box body (31);
the supporting component (32) is rotatably arranged in the box body (31);
one end of the first driving mechanism (33) is connected with the box body (31), and the other end of the first driving mechanism (33) is connected with the supporting component (32) and used for driving the supporting component (32) to rotate;
the adsorption mechanism (34) is arranged on the support assembly (32) and used for fixing a wafer to be cleaned;
the cleaning device (50) is movably arranged on the cantilever (40), and the cleaning device (50) is connected with the water tank (20) through a pipeline and used for extracting cleaning liquid in the water tank (20) so as to clean the wafer to be cleaned;
the air drying device (60) is movably arranged on the cantilever (40) and is used for drying the cleaned wafer in air;
one end of the driving device (70) is connected with the cantilever (40), and the other end of the driving device (70) is respectively connected with the cleaning device (50) and the air drying device (60) and used for driving the cleaning device (50) and the air drying device (60) to move on the cantilever (40).
2. The semiconductor wafer cleaning and recycling device according to claim 1, wherein a plurality of filtering holes (313) are formed in a bottom wall of the box body (31), and a plurality of filtering holes (313) are provided with filtering cotton (314), wherein the plurality of filtering holes (313) are used for filtering used cleaning liquid into the water tank (20).
3. The semiconductor wafer cleaning and recycling apparatus of claim 1, wherein a tapered table (315) is disposed on a bottom wall of the box body (31), a groove (316) is disposed on a bottom wall of the tapered table (315), the first driving mechanism (33) is detachably disposed in the groove (316), the supporting assembly (32) comprises a plurality of balls (321), a supporting plate (322) and a plurality of columns (323),
the balls (321) are respectively and rotatably arranged on the conical tables (315), and the balls (321) are arranged around the groove (316);
an annular sliding groove (317) is formed in the bottom wall of the supporting plate (322), the supporting plate (322) is movably connected with the balls (321) through the annular sliding groove (317), and the bottom wall of the supporting plate (322) is connected with the first driving mechanism (33);
the plurality of upright columns (323) are respectively vertically arranged on the support plates (322).
4. The semiconductor wafer cleaning and recycling apparatus of claim 3, wherein the suction mechanism (34) comprises a support plate (341) and a cylinder (342), wherein,
the supporting disc (341) is detachably arranged on the plurality of upright columns (323), and a plurality of sucking discs (3411) are arranged on the supporting disc (341), wherein the plurality of sucking discs (3411) are connected with the air cylinder (342) through hoses;
the air cylinder (342) is detachably arranged on the supporting plate (322) and is used for controlling the plurality of suckers (3411) to adsorb and fix the wafer to be cleaned.
5. The semiconductor wafer cleaning and recycling apparatus of claim 1, wherein the bottom wall of the cantilever (40) is provided with two parallel sliding slots (41), and the driving device (70) comprises a first threaded rod (71), a second threaded rod (72), a belt transmission mechanism (73) and a second driving mechanism (74), wherein,
the first threaded rod (71) and the second threaded rod (72) are respectively and rotatably arranged in the corresponding sliding grooves (41), a first sliding block (711) is sleeved on the first threaded rod (71), a second sliding block (721) is sleeved on the second threaded rod (72), and the first sliding block (711) and the second sliding block (721) are respectively and slidably arranged in the corresponding sliding grooves (41);
one end of the second driving mechanism (74) is connected with the cantilever (40);
one end of the belt transmission mechanism (73) is connected with the end parts of the first threaded rod (71) and the second threaded rod (72), and the other end of the belt transmission mechanism (73) is connected with the other end of the second driving mechanism (74).
6. The semiconductor wafer cleaning and recycling apparatus according to claim 5, wherein the cleaning device (50) comprises a water pump (51) and a shower head (52), wherein,
the water pump (51) is detachably arranged on the cantilever (40), and one end of the water pump (51) is connected with the bottom of the water tank (20) through a pipeline;
the spray head (52) is detachably arranged on the bottom wall of the first sliding block (711), and the spray head (52) is connected with the other end of the water pump (51) through a hose.
7. The semiconductor wafer cleaning and recycling device of claim 5, wherein the seasoning device (60) is detachably disposed on the second slider (721), and the seasoning device (60) is a micro fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210990867.0A CN115547883A (en) | 2022-08-18 | 2022-08-18 | Semiconductor wafer cleaning and recycling equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210990867.0A CN115547883A (en) | 2022-08-18 | 2022-08-18 | Semiconductor wafer cleaning and recycling equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115547883A true CN115547883A (en) | 2022-12-30 |
Family
ID=84725107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210990867.0A Pending CN115547883A (en) | 2022-08-18 | 2022-08-18 | Semiconductor wafer cleaning and recycling equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115547883A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116174383A (en) * | 2023-04-25 | 2023-05-30 | 保定三晶电子材料有限公司 | Germanium single chip production cleaning equipment with cyclic utilization function |
| CN117712015A (en) * | 2023-12-12 | 2024-03-15 | 江苏亚电科技股份有限公司 | Wafer supporting disc of single wafer cleaning device with clamping function |
| CN118156180A (en) * | 2024-02-27 | 2024-06-07 | 科芯微(江苏)微电子有限公司 | Wet cleaning equipment for semiconductor integrated circuit process |
-
2022
- 2022-08-18 CN CN202210990867.0A patent/CN115547883A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116174383A (en) * | 2023-04-25 | 2023-05-30 | 保定三晶电子材料有限公司 | Germanium single chip production cleaning equipment with cyclic utilization function |
| CN117712015A (en) * | 2023-12-12 | 2024-03-15 | 江苏亚电科技股份有限公司 | Wafer supporting disc of single wafer cleaning device with clamping function |
| CN117712015B (en) * | 2023-12-12 | 2024-05-28 | 江苏亚电科技股份有限公司 | Wafer supporting disc of single wafer cleaning device with clamping function |
| CN118156180A (en) * | 2024-02-27 | 2024-06-07 | 科芯微(江苏)微电子有限公司 | Wet cleaning equipment for semiconductor integrated circuit process |
| CN118156180B (en) * | 2024-02-27 | 2024-10-11 | 科芯微(江苏)微电子有限公司 | Wet cleaning equipment for semiconductor integrated circuit process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115547883A (en) | Semiconductor wafer cleaning and recycling equipment | |
| TW201637741A (en) | Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus | |
| CN112055471B (en) | Integrated circuit production equipment with dust removal function | |
| CN210171733U (en) | Self-cleaning gluing device and wafer bearing tray for same | |
| KR101610739B1 (en) | Cleaning apparatus for dust collecter using water | |
| CN110993524A (en) | Substrate post-processing device and method | |
| CN115458449A (en) | Wafer groove type cleaning machine with mechanical swing arm and groove body in compact fit | |
| CN117102141A (en) | Cleaning device for stainless steel product processing | |
| CN113477599A (en) | Automatic wafer cleaning device | |
| CN116759345B (en) | Wafer single-chip cleaning device with independent spray cleaning function | |
| WO2022262056A1 (en) | Cleaning device with automatic loading and unloading structures, and cleaning method therefor | |
| CN108057666A (en) | A kind of environment-friendly dustless quantitative cleaning equipment | |
| CN219333276U (en) | Fiber ball filter | |
| CN110899282A (en) | Chemical equipment cleaning equipment | |
| CN115346896A (en) | Wafer cutting protection system | |
| KR100871821B1 (en) | Apparatus for treating substrate | |
| KR20120003070U (en) | Easy-Guiding Element Cleaning Machine | |
| CN113399356A (en) | Novel circuit board purger | |
| CN220862214U (en) | Deep groove ball bearing cleaning machine | |
| CN221885066U (en) | Wafer cleaning and spin-drying machine | |
| CN104873158A (en) | Low water polymerization bead and ultrasonic combination full-automatic shoe washing device | |
| CN115582333B (en) | Turnover type cleaning device for semiconductor wafer | |
| CN220128821U (en) | Mechanical arm for mechanical manufacturing | |
| CN115846275B (en) | Semiconductor element cleaning device | |
| CN118156188B (en) | Semiconductor cleaning system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |