CN117712015B - Wafer supporting disc of single wafer cleaning device with clamping function - Google Patents
Wafer supporting disc of single wafer cleaning device with clamping function Download PDFInfo
- Publication number
- CN117712015B CN117712015B CN202311694859.2A CN202311694859A CN117712015B CN 117712015 B CN117712015 B CN 117712015B CN 202311694859 A CN202311694859 A CN 202311694859A CN 117712015 B CN117712015 B CN 117712015B
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- cleaning device
- single wafer
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- 238000004140 cleaning Methods 0.000 title claims abstract description 42
- 230000007246 mechanism Effects 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 230000008961 swelling Effects 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 79
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to a wafer supporting disc of a single wafer cleaning device with a clamping function, and belongs to the technical field of wafer manufacturing equipment. When the wafer supporting disc with the clamping function of the single wafer cleaning device is used, the driving rod is shifted through the driving device, so that the connecting rod moves towards the center of the disc body against the tensile force of the elastic piece to drive the bottom of the clamping column to move towards the center of the disc body, the top of the clamping column moves towards the center far away from the disc body, then the wafer is placed on the supporting rod through the mechanical arm, the driving of the driving rod is released through the driving device, the connecting rod is reset under the action of the elastic piece, the top of the clamping column is folded towards the center of the disc body, and therefore the wafer is fixed in the concave part of the clamping column, and the wafer is fixed. The wafer supporting disc of the single wafer cleaning device with the clamping function has the advantage of firm fixation of the wafer, and reduces the risk of crushing the wafer.
Description
Technical Field
The application belongs to the technical field of wafer manufacturing equipment, and particularly relates to a wafer supporting disc of a single wafer cleaning device with a clamping function.
Background
A single wafer cleaning apparatus is an apparatus for cleaning wafers one by one. The method has the advantages that the process operation and the cleaning are sequentially carried out on the wafer through a plurality of cleaning fluids (usually three types) on one rotating wafer supporting disc, the quality is stable, and the process requirements are met.
The chinese patent document CN113113328B discloses a single wafer cleaning device cleaning disc structure and a single wafer cleaning device, in which the wafer is directly placed on the support column, and the fixing of the wafer is not very firm.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to solve the defects in the prior art, the wafer supporting disc of the single wafer cleaning device with the clamping function is provided.
The technical scheme adopted for solving the technical problems is as follows:
a wafer support tray for a single wafer cleaning apparatus having a chucking function, comprising:
the tray body comprises a top surface and a bottom surface arranged at the bottom of the top surface, and an installation space is formed between the top surface and the bottom surface;
The support rod is arranged at the top of the tray body and is used for supporting the wafer;
The wafer clamping device comprises a plurality of clamping columns, a plurality of clamping plates and a plurality of clamping plates, wherein each clamping column comprises a bottom, a middle section positioned on the bottom and a top section positioned at the top end, wherein the top section is provided with a concave part, and the concave part is used for clamping a wafer;
the clamping mechanism comprises a driving rod, a first limiting block, a connecting rod, a mounting block, a connecting block and an elastic piece;
one end of the connecting rod is a driving rod, and the driving rod is used for being connected with the driving device and pulling the driving rod along the axial direction;
the first limiting block is arranged in the disc body and used for the driving rod to pass through so as to limit the driving rod to move only along the axial direction;
the other end of the connecting rod is provided with the mounting block, the clamping column is hinged to the mounting block, and the clamping column penetrates out of a mounting hole in the tray body;
The connecting block is arranged on the connecting rod, and the elastic piece is connected with the connecting block and used for providing acting force opposite to the pulling force direction of the driving device pulling the driving rod.
Preferably, the wafer supporting disc with the clamping function is provided with two connecting blocks, the two connecting blocks are respectively positioned at two sides of the connecting rod, the two elastic pieces are also provided with two, one ends of the two elastic pieces are respectively connected with the two connecting blocks, and the other ends of the two elastic pieces are respectively connected with the fixing columns fixed on the disc body.
Preferably, the wafer supporting plate of the single wafer cleaning device with clamping function of the present invention has a curved surface with a diameter gradually decreasing from bottom to top, and the wafer is supported by the curved surface.
Preferably, in the wafer supporting disc of the single wafer cleaning device with the clamping function, the opening of the mounting hole is provided with the plugging sheet.
Preferably, the wafer supporting disc of the single wafer cleaning device with the clamping function is provided with the mounting hole, and the opening of the mounting hole is a stepped hole.
Preferably, the wafer supporting disc of the single wafer cleaning device with the clamping function is characterized in that the sealing piece is made of PTFE material.
Preferably, in the wafer supporting disc with the clamping function of the single wafer cleaning device, the supporting rod is installed on the disc body through threads, and the top of the supporting rod is conical.
Preferably, the wafer supporting disc of the single wafer cleaning device with the clamping function is characterized in that the clamping column is connected with the mounting block through threads so as to facilitate the mounting of the clamping column.
Preferably, the wafer supporting disc of the single wafer cleaning device with the clamping function further comprises a second limiting block fixed in the disc body, and the second limiting block can abut against the connecting rod to resist the tensile force of the elastic piece.
The beneficial effects of the invention are as follows:
When the wafer supporting disc of the single wafer cleaning device with the clamping function is used, the driving rod is shifted through the driving device, so that the connecting rod moves towards the center of the disc body against the tensile force of the elastic piece to drive the bottom of the clamping column to move towards the center of the disc body, the top of the clamping column moves towards the center far away from the disc body, the wafer is placed on the supporting rod through the mechanical arm, the driving of the driving rod is released through the driving device, the connecting rod is reset under the action of the elastic piece, the top of the clamping column is folded towards the center of the disc body, and therefore the wafer is fixed in the concave part of the clamping column, and the wafer is fixed. The wafer supporting disc of the single wafer cleaning device with the clamping function has the advantage of firm fixation of the wafer, and reduces the risk of crushing the wafer.
Drawings
The technical scheme of the application is further described below with reference to the accompanying drawings and examples.
FIG. 1 is a schematic view of the top surface of a wafer support plate of a single wafer cleaning apparatus with chucking function according to an embodiment of the present application;
Fig. 2 is a schematic view of the structure of the back surface of a wafer support plate of a single wafer cleaning apparatus with chucking function according to an embodiment of the present application;
FIG. 3 is a schematic view of a wafer support plate with a bottom hidden for a single wafer cleaning apparatus with chucking function according to an embodiment of the present application;
FIG. 4 is a schematic view of a chucking mechanism according to an embodiment of the present application;
FIG. 5 is a schematic view of a clamping post according to an embodiment of the present application;
FIG. 6 is a schematic view of the structure of the clamping post and support bar of an embodiment of the present application;
The reference numerals in the figures are:
1. A tray body;
2. A support rod;
3. Clamping the column;
9. a wafer;
11. A middle hole;
12. A bottom surface;
13. A mounting hole;
14. a top surface;
31. A bottom;
32. an intermediate section;
33. A top section;
41. A driving rod;
42. a first limiting block;
43. A connecting rod;
44. A mounting block;
45. A connecting block;
46. An elastic member;
47. Fixing the column;
48. a second limiting block;
310. And (3) a plugging piece.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art in a specific case.
The technical scheme of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.
Examples
The present embodiment provides a wafer supporting plate of a single wafer cleaning device with a clamping function, as shown in fig. 1, including:
the disc body 1, as shown in fig. 1 and 2, a middle hole 11 is formed in the middle of the disc body 1, the middle hole 11 is used for being installed on a rotating shaft through a screw so as to rotate under the driving of the rotating shaft, the disc body 1 comprises a top surface 14 and a bottom surface 12 installed at the bottom of the top surface 14, and an installation space is formed between the top surface 14 and the bottom surface 12;
The support rod 2 is arranged at the top of the tray body 1 and is used for supporting the wafer;
The clamping columns 3 are several, as shown in fig. 5, from the mounting holes 13 on the tray body 1, the clamping columns 3 comprise a bottom 31, a middle section 32 positioned on the bottom 31, a top section 33 positioned at the top end, and the top section 33 is provided with a concave part for clamping a wafer;
The clamping mechanism, as shown in fig. 3 and 4, comprises a driving rod 41, a first limiting block 42, a connecting rod 43, a mounting block 44, a connecting block 45 and an elastic piece 46;
one end of the connecting rod 43 is a driving rod 41, and the driving rod 41 is used for being connected with a driving device and pulling the driving rod 41 along the axial direction;
The first limiting block 42 is arranged in the disc body 1 and used for the driving rod 41 to pass through so as to limit the driving rod 41 to move only along the axial direction;
The other end of the connecting rod 43 is provided with a mounting block 44, and the clamping column 3 is hinged on the mounting block 44; the clamping column 3 penetrates out of the mounting hole 13 on the tray body 1;
A connection block 45 is provided on the connection rod 43, and an elastic member 46 is connected to the connection block 45 for providing a force or a component of force opposite to a pulling force direction in which the driving device pulls the driving lever 41.
When the wafer supporting disc of the single wafer cleaning device with the clamping function is used, the driving rod 41 is shifted through the driving device, the connecting rod 43 moves towards the center of the disc body 1 against the tensile force of the elastic piece 46, the bottom of the clamping column 3 is driven to move towards the center of the disc body 1, the top of the clamping column 3 moves towards the center far away from the disc body 1, then the wafer 9 is placed on the supporting rod 2 by the manipulator, the driving device stops driving the driving rod 41 and disconnects, the connecting rod 43 resets under the action of the elastic piece 46, the top of the clamping column 3 is folded towards the center of the disc body 1, and accordingly the wafer 9 is fixed in the concave part of the clamping column 3, and the fixation of the wafer 9 is formed. The wafer supporting plate of the single wafer cleaning device with the clamping function of the embodiment has the advantage of firm fixation of the wafer 9, and reduces the risk of crushing the wafer.
It should be noted that in fig. 4, the connection block 45 and the elastic member 46 are not assembled, but are actually connected together, that is, one end of the elastic member 46 is connected with the connection block 45, so as to form a continuous pulling force on the connection block 45.
Further, two connecting blocks 45 are respectively located at two sides of the connecting rod 43, two elastic pieces 46 are also provided, one ends of the two elastic pieces 46 are respectively connected with the two connecting blocks 45, and the other ends of the two elastic pieces 46 are respectively connected with fixing columns 47 fixed on the tray body 1. The elastic member 46 applies a pulling force to both sides of the link 43 so that the pulling force is more balanced.
Further, the concave portion has a curved surface with a diameter gradually decreasing from bottom to top, by which the wafer 9 is supported.
Further, the clamping mechanisms are arranged along the disc body 1, 6 are shown in fig. 3, all the supporting rods 2 are arranged in a common circle, and all the clamping columns 3 are arranged in a common circle.
Further, as shown in fig. 6, a blocking piece 310 is provided at the opening of the mounting hole 13 to prevent water from flowing into the opening.
Further, a stepped hole is provided at the opening of the mounting hole 13 to support the blocking piece 310.
Further, the sealing sheet 310 is preferably made of PTFE material. The PTFE material has a certain elasticity and can adapt to the displacement of the clamping column 3.
Further, the support bar 2 is mounted on the tray body 1 by screw threads, and the top of the support bar 2 is tapered. So as to form a tip at the top to facilitate supporting the wafer 9.
Further, the clamping post 3 is screwed with the mounting block 44 to facilitate the mounting of the clamping post 3.
Further, the clamping mechanism further comprises a second limiting block 48 fixed in the disc body 1, and the second limiting block 48 can abut against the connecting rod 43 to resist the pulling force of the elastic piece 46. That is, when the elastic member 46 is pulled tightly, the second limiting block 48 acts on the connecting rod 43, so that the connecting rod 43 is at the initial position without external force. The link 43 has a swelling portion in the middle (the middle portion is larger than both sides) between the first stopper 42 and the second stopper 48 to restrict the movement position of the link 43, and the second stopper 48 has an upper opening to restrict only both sides of the link 43 to facilitate the installation of the link 43.
The wafer supporting disk with the clamping function of the single wafer cleaning device is used on the single wafer cleaning device, and can process a wafer every time when cleaning. Before placing the wafer, the clamping columns 3 are far away from each other, the wafer can be placed on the supporting rods 2 from top to bottom, the clamping columns 3 are folded to clamp the wafer, and then the wafer can be cleaned. After the wafer is cleaned, the clamping columns 3 are driven to be away from each other, so that the wafer can be taken away. The process of clamping the wafer by mutually moving the clamping posts 3 away from each other and folding the wafer is already described above, and will not be described again here.
With the above-described preferred embodiments according to the present application as a teaching, the worker skilled in the art could make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.
Claims (9)
1. A wafer support tray for a single wafer cleaning apparatus having a chucking function, comprising:
The novel rotary disc comprises a disc body (1), wherein a middle hole (11) is formed in the middle of the disc body (1) and is used for being installed on a rotating shaft to rotate under the drive of the rotating shaft, the disc body (1) comprises a top surface (14) and a bottom surface (12) installed at the bottom of the top surface (14), and an installation space is formed between the top surface (14) and the bottom surface (12);
the support rod (2) is arranged at the top of the tray body (1) and is used for supporting the wafer;
the clamping columns (3) are a plurality of, each clamping column (3) comprises a bottom (31), a middle section (32) positioned on the bottom (31), a top section (33) positioned at the top end, and the top section (33) is provided with a concave part for clamping a wafer;
The clamping mechanism comprises a driving rod (41), a first limiting block (42), a connecting rod (43), a mounting block (44), a connecting block (45) and an elastic piece (46);
One end of the connecting rod (43) is a driving rod (41), and the driving rod (41) is used for being connected with a driving device and pulling the driving rod (41) along the axial direction;
The first limiting block (42) is arranged in the disc body (1) and used for the driving rod (41) to pass through so as to limit the driving rod (41) to move only in the axial direction;
the other end of the connecting rod (43) is provided with the mounting block (44), the clamping column (3) is hinged on the mounting block (44), and the clamping column (3) penetrates out of the mounting hole (13) on the disc body (1);
The connecting block (45) is arranged on the connecting rod (43), and the elastic piece (46) is connected with the connecting block (45) and used for providing acting force opposite to the pulling force direction of the driving device for pulling the driving rod (41);
The two connecting blocks (45) are respectively positioned at two sides of the connecting rod (43), the two elastic pieces (46) are also arranged, one ends of the two elastic pieces (46) are respectively connected with the two connecting blocks (45), and the other ends of the two elastic pieces (46) are respectively connected with the fixing columns (47) fixed on the tray body (1).
2. The wafer support tray of the single wafer cleaning apparatus with chucking function as recited in claim 1, wherein said recess has a curved surface with a diameter gradually decreasing from bottom to top, through which the wafer is supported.
3. Wafer support plate of a single wafer cleaning device with clamping function according to claim 1, characterized in that the opening of the mounting hole (13) is provided with a blocking piece (310).
4. A wafer supporting plate of a single wafer cleaning apparatus with a chucking function according to claim 3, characterized in that the opening of the mounting hole (13) is a stepped hole.
5. A wafer support plate for a single wafer cleaning apparatus having a chucking function as recited in claim 3, wherein said blocking tab (310) is made of PTFE material.
6. Wafer supporting disk of a single wafer cleaning device with clamping function according to claim 1, characterized in that the supporting rod (2) is mounted on the disk body (1) by threads, and the top of the supporting rod (2) is conical.
7. Wafer support plate of a single wafer cleaning device with clamping function according to claim 1, characterized in that the clamping column (3) is screwed with a mounting block (44) for facilitating the mounting of the clamping column (3).
8. Wafer support tray of a single wafer cleaning device with clamping function according to claim 1, characterized in that the clamping mechanism further comprises a second stopper (48) fixed in the tray body (1), the second stopper (48) being able to abut against the connecting rod (43) to resist the pulling force of the elastic member (46).
9. The wafer support tray with chucking function of a single wafer cleaning device of claim 8, wherein a swelling portion is provided in the middle of the link (43), the swelling portion being located between the first stopper (42) and the second stopper (48).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311694859.2A CN117712015B (en) | 2023-12-12 | 2023-12-12 | Wafer supporting disc of single wafer cleaning device with clamping function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311694859.2A CN117712015B (en) | 2023-12-12 | 2023-12-12 | Wafer supporting disc of single wafer cleaning device with clamping function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117712015A CN117712015A (en) | 2024-03-15 |
| CN117712015B true CN117712015B (en) | 2024-05-28 |
Family
ID=90158232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311694859.2A Active CN117712015B (en) | 2023-12-12 | 2023-12-12 | Wafer supporting disc of single wafer cleaning device with clamping function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117712015B (en) |
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| CN113113328A (en) * | 2021-03-04 | 2021-07-13 | 亚电科技南京有限公司 | Single wafer cleaning device washs dish structure and single wafer cleaning device |
| CN217943111U (en) * | 2022-08-04 | 2022-12-02 | 四川明泰微电子有限公司 | Wafer clamping tool |
| CN115547883A (en) * | 2022-08-18 | 2022-12-30 | 江苏晶曌半导体有限公司 | Semiconductor wafer cleaning and recycling equipment |
| CN218191398U (en) * | 2022-10-20 | 2023-01-03 | 安徽新芯威半导体有限公司 | Wafer belt cleaning device that cleaning efficiency is high |
| CN115692303A (en) * | 2022-11-16 | 2023-02-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer chuck device |
| CN115662932A (en) * | 2022-12-27 | 2023-01-31 | 泓浒(苏州)半导体科技有限公司 | Monitoring device for wafer position and wafer carrying platform with monitoring device |
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