CN108682636A - A kind of wafer etching device - Google Patents

A kind of wafer etching device Download PDF

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Publication number
CN108682636A
CN108682636A CN201810468778.3A CN201810468778A CN108682636A CN 108682636 A CN108682636 A CN 108682636A CN 201810468778 A CN201810468778 A CN 201810468778A CN 108682636 A CN108682636 A CN 108682636A
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China
Prior art keywords
wafer
fixed
plate
atmospheric pressure
module
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Granted
Application number
CN201810468778.3A
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Chinese (zh)
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CN108682636B (en
Inventor
汪玉洁
张云鹤
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Jiangsu AISI Semiconductor Technology Co.,Ltd.
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汪玉洁
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Priority to CN201810468778.3A priority Critical patent/CN108682636B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention belongs to semiconductor process technique field, specifically a kind of wafer etching device, including mobile module, fixed plate, vibrations unit, dedusting module, Fastener and controller, mobile module are fixedly mounted on by fixed link on the bottom plate of closed bin；Fixed plate is fixedly mounted on the top surface of dedusting module by shaking unit；Mobile module is for shifting wafer；Metal sucker is installed in fixed plate, metal sucker is for being fixed the bottom surface of wafer；Dedusting module is for clearing up the impurity of crystal column surface；Fastener is for limiting dedusting module；Present invention is mainly used for being performed etching to wafer, the etching precision of wafer can be improved, can be performed etching to being clamped the position that component blocks in wafer；Improve the etching efficiency of wafer.

Description

A kind of wafer etching device
Technical field
The invention belongs to semiconductor process technique field, specifically a kind of wafer etching device.
Background technology
The process of conventional etch processes is to be exposed development then plasma etching to required etachable material.Its is medium It is real using the boiling characteristics of the reaction products, such as AlCl3, SiF4 of etachable materials such as Al, Si etc. in plasma etching step Existing.When being gripped to wafer in traditional etching technics, it can cause the surface that wafer is blocked that can not etch, while wafer The impurity of post-etch residue is difficult to remove in time, causes crystal column surface untidy, while to the subsequent sputter coating process of wafer It impacts.
Also occur a kind of technical solution of etching device in the prior art, such as application No. is 201410356255.1 one Chinese patent discloses a kind of etching device and lithographic method.Wherein etching device includes：Reaction chamber；Wafer mounting apparatus, Wafer mounting apparatus is used to wafer being fixed on the top of reaction chamber and the bottom to be etched facing towards reaction chamber of wafer；Gas Inlet, gas inlet are arranged in reaction chamber bottom, for being passed through etching gas to reaction chamber；Excitation coil, excitation coil It is arranged around reaction chamber, for etching gas to be excited into plasma；And bias provides device, bias provides device and crystalline substance Circle fixing device is connected, for being biased to the wafer in wafer mounting apparatus.Although the technical solution can be to wafer table Face performs etching, and can detach the impurity after etching；But the technical solution wafer can not be clamped the position blocked into Row etching；Wafer is not easy to fix in the technical solution simultaneously, affects wafer etching precision；So that the invention receives limit System.
Invention content
In order to make up for the deficiencies of the prior art, the present invention proposes a kind of wafer etching device, and present invention is mainly used for right Wafer performs etching, and can improve the etching precision of wafer, can be performed etching to being clamped the position that component blocks in wafer； The present invention coordinates that wafer is fixed by mobile module and fixed plate, by shake unit and dedusting module cooperation come pair The impurity of crystal column surface is detached；Improve the etching efficiency of wafer.
The technical solution adopted by the present invention to solve the technical problems is：The present invention proposes a kind of wafer etching device, Including closed bin, excitation variable winding and biasing device, the top plate of closed bin is equipped with gas inlet；Wherein, closed bin, excitation line Circle and biasing device are not the innovations of the present invention, and therefore not to repeat here；Further include mobile module, fixed plate, vibrations unit, Dedusting module, Fastener and controller, the mobile module are fixedly mounted on by fixed link on the bottom plate of closed bin；It is described solid Fixed board is fixedly mounted on the top surface of dedusting module by shaking unit；The mobile module is for shifting wafer；Institute It states and is installed with metal sucker in fixed plate, metal sucker is for being fixed the bottom surface of wafer；The dedusting module It is cleared up for the impurity to crystal column surface；The Fastener is for limiting dedusting module；The controller is used for The work for controlling mobile module, shaking unit, dedusting module and Fastener；
Mobile module by with fixed plate cooperation for wafer to be fixed, vibrations unit there are two types of operating mode, the first Operating mode is shaken to fixed plate；It is that fixed plate is fixed to shake second of operating mode of unit；
The mobile module include No.1 cylinder, No.1 mounting plate, No.1 fixed frame, No. three atmospheric pressure poles, No.1 sliding block and No.1 suction means；The No.1 cylinder is fixedly mounted on by No.1 mounting plate in fixed link；The inner wall of the No.1 cylinder Top is equipped with No.1 sliding rail；The No.1 fixed frame is moved by No.1 sliding block in No.1 sliding rail, and No.1 fixed frame passes through three Number atmospheric pressure pole is fixedly connected with No.1 suction means；The quantity of the No.1 suction means is four, and four No.1s draw dress Cooperation is set for making wafer rotate；No. three atmospheric pressure poles drive No.1 suction means to be in close contact with wafer when stretching, and suction pump is logical It crosses and negative pressure is taken out to No.1 suction means to make No.1 suction means fix wafer adsorption；Wherein, No.1 suction means passes through one Number sliding block can realize the movement of No.1 suction means with the cooperation of No.1 sliding rail；Controller is by controlling four No.1 suction means It works alternatively, is used to make to be exposed by the surface that No.1 suction means blocks in wafer, for preventing wafer segment surface The phenomenon that can not being etched because of being blocked；Improve the efficiency of wafer engraved film.
The No.1 mounting plate is circular ring shape mounting plate, and the inner wall of No.1 mounting plate is equipped with No. two sliding rails；The dedusting Module is equipped with No. two sliding blocks, and No. two sliding blocks make dedusting module rotation by coordinating with No. two sliding rails.Fastener is not to dedusting Module card is next, and dedusting module realizes rotation, to drive wafer to rotate so that the dust of crystal column surface is easier from wafer table Emaciated face from；Under the action of suction pump takes out negative pressure to closed bin, the dust of crystal column surface is pulled out out closed bin.
Preferably, the dedusting module includes No. two cylinders and No. two turntables, and the bottom surface of No. two turntables is equipped with one Number annular groove, the upper end of No. two cylinders is rolled by steel ball to be mounted in No.1 annular groove, and the bottom end of No. two cylinders is solid Dingan County is on the bottom plate of closed bin；No.1 annular groove enables No. two turntables in No. two cylinders by coordinating with No. two cylinders Upper rotation, No. two cylinders are for closing the bottom of No. two turntables；The bottom plate of the closed bin is equipped with suction hole；It is described The top surface of No. two turntables is provided tiltedly with through the No.1 hole of No. two turntables；The suction hole with No.1 hole by coordinating for making No. two turntable rotations.When No. two cylinders of suction pump pair take out negative pressure, under the action of No.1 hole, No. two turntables occur No. two turntables Rotation, to realize the purpose for driving wafer rotation, the efficiency for accelerating crystal column surface dust to be detached from,
Preferably, the No.1 suction means includes No. three mounting plates, sliding extension bar, drawing sucker；Described No. three Mounting plate is fixedly connected by sliding extension bar with drawing sucker, and the outer layer of sliding extension bar is cased with spring；It is described drawing Sucker is used to carry out negative pressure to wafer to fix.When drawing sucker is contacted with crystal column surface, the volume of drawing sucker can be unexpected Increase so that the air pressure in drawing sucker reduces rapidly, for improving the adsorption capacity to wafer；Meanwhile being cased with spring Sliding extension bar is for coordinating drawing sucker to work, when the volume of drawing sucker increases, the length meeting of sliding extension bar Reduce.
Preferably, the drawing sucker includes No. two mounting plates, No. two atmospheric pressure poles, holder, folded tube and fixed ring；Institute It states No. two mounting plates to be fixedly connected with holder by No. two atmospheric pressure poles, holder is for being fixed fixed ring；The fixed ring It is fixedly connected with No. two mounting plates by folded tube；No. two mounting plates are equipped with No. two holes.When fixed ring and crystal column surface When contact, No. two atmospheric pressure poles are stretched, and to which Foldable pipe is stretched, increase the volume of folded tube so that folded tube Interior air pressure quickly reduces, while negative pressure pump takes out negative pressure by No. two holes of hose pair, further improves drawing sucker to crystalline substance Round absorption crystallized ability.
Preferably, vibrations unit includes four No.1 atmospheric pressure poles, and the outer layer of four No.1 atmospheric pressure poles is cased with spring, spring Top is fixedly connected with fixed plate, the bottom end of spring and being fixedly connected for dedusting module；It is every in four No.1 atmospheric pressure poles The side of a No.1 atmospheric pressure pole is fixedly arranged in dedusting module, and the other side of No.1 atmospheric pressure pole is not connect with fixed plate. First, the top surface of No.1 suction means and wafer is detached from, and wafer is fixed in fixed plate；When No.1 atmospheric pressure pole stretches, band Dynamic fixed plate moves upwards so that spring is stretched tensioning, and fixed plate cannot generate vertical tremor at this time；When No.1 atmospheric pressure pole is received When contracting, No.1 atmospheric pressure pole is not in contact with fixed plate, and when dedusting module drives fixed plate rotation at this time, fixed plate is in spring It can be shaken under effect, the disengaging efficiency for improving crystal column surface impurity.
Preferably, the Fastener includes No. four atmospheric pressure poles and stripper plate, and the top surface of stripper plate is equipped with wave molding, ripple Line is used to improve the frictional force of stripper plate.When wafer needs to be etched, when No. four atmospheric pressure poles stretch, stripper plate and No. two turntables Bottom surface is in close contact, while the wave molding of stripper plate top surface setting improves the fixed efficiency of No. two turntables of stripper plate pair, So that No. two turntables do not rotate, the precision for improving wafer etching.
The beneficial effects of the invention are as follows：
1. a kind of wafer etching device of the present invention, the present invention includes mobile module, fixed plate, vibrations unit, removes Dirt module, Fastener and controller, the Fastener with dedusting module, vibrations unit matching by being used to consolidate fixed plate Fixed, fixed plate with mobile module by coordinating for driving wafer to shift so that the portion that the surface of wafer is blocked by mobile module Potential energy is enough etched, and dedusting module detaches the impurity of crystal column surface, improves the finish of crystal column surface.
Include that four No.1s are drawn 2. a kind of wafer etching device of the present invention, in mobile module of the present invention Device, controller makes wafer shift by controlling four core No.1 suction means, while No.1 suction means includes drawing Sucker, sliding extension bar and No. three mounting plates, drawing sucker are fixedly connected by sliding extension bar with No. three mounting plates, sliding The outer layer of telescopic rod is cased with spring, and drawing sucker carries out absorption fixation by changing own vol to wafer；It is cased with spring Sliding extension bar for coordinate, it is used to enable drawing sucker to realize the stereomutation of itself.
3. a kind of wafer etching device of the present invention, dedusting module of the present invention includes that No. two cylinders and No. two turn Disk, the No.1 annular groove of No. two turntable bottom surfaces setting, No.1 annular groove is for making No. two turntables be rotated on No. two cylinders, and two No.1 hole is provided tiltedly in number turntable, suction pump makes to have gas flowing in No.1 hole by being evacuated No.1 hole, to make two Number turntable rotates so that fixed disk drives wafer to rotate together, and under the action of shake unit, fixed plate drives wafer work The vibrations of vertical direction, the rate for improving the disengaging of crystal column surface impurity.
Description of the drawings
The invention will be further described below in conjunction with the accompanying drawings.
Fig. 1 is the sectional view of the present invention；
Fig. 2 is A-A sectional views in Fig. 1；
Fig. 3 is the sectional view of the No.1 suction means of the present invention；
In figure：Closed bin 1, biasing device 12, gas inlet 13, mobile module 2, wafer 6, is fixed excitation variable winding 11 Plate 14, vibrations unit 15, dedusting module 3, No. two sliding blocks 31, Fastener 16, fixed link 21, metal sucker 141, No.1 cylinders 22, No.1 mounting plate 23, No.1 fixed frame 24, No. three atmospheric pressure poles 25, No.1 sliding block 26, No.1 suction means 27, No.1 sliding rails 28, No. two 17, No. three cylinder 32, two of sliding rail 29, two turntables 33, No.1 annular groove 34, No.1 hole 35, suction hole mounting plates 51, the sliding extension bar 52, mounting plate 531, two of drawing sucker 53, two atmospheric pressure pole 532, holder 533, folded tube 534, solid Determine 535, No. two holes 536 of ring, No.1 atmospheric pressure pole 151, No. four atmospheric pressure poles 161, stripper plates 162.
Specific implementation mode
In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below Specific implementation mode is closed, the present invention is further explained.
As shown in Figure 1 to Figure 3, a kind of wafer etching device of the present invention, including closed bin 1,11 and of excitation variable winding The top plate of biasing device 12, closed bin 1 is equipped with gas inlet 13；Wherein, closed bin 1, excitation variable winding 11 and biasing device 12 be not the innovation of the present invention, and therefore not to repeat here；Further include mobile module 2, fixed plate 14, vibrations unit 15, dedusting Module 3, Fastener 16 and controller, the mobile module 2 are fixedly mounted on by fixed link 21 on the bottom plate of closed bin 1；Institute State the top surface that fixed plate 14 is fixedly mounted on dedusting module 3 by shaking unit 15；The mobile module 2 is used for wafer 6 It is shifted；Be installed with metal sucker 141 in the fixed plate 14, metal sucker 141 be used for the bottom surface of wafer 6 into Row is fixed；The dedusting module 3 is for clearing up the impurity on 6 surface of wafer；The Fastener 16 is used for dedusting module 3 It is limited；The work that the controller is used to control mobile module 2, shake unit 15, dedusting module 3 and Fastener 16；
Mobile module 2 by with the cooperation of fixed plate 14 for wafer 6 to be fixed, vibrations unit 15 there are two types of operating mode, The first operating mode is shaken to fixed plate 14；Shaking second of the operating mode of unit 15 is consolidated to fixed plate 14 It is fixed；
The mobile module 2 includes 24, No. three No.1 cylinder 22, No.1 mounting plate 23, No.1 fixed frame atmospheric pressure poles 25, one Number sliding block 26 and No.1 suction means 27；The No.1 cylinder 22 is fixedly mounted on by No.1 mounting plate 23 in fixed link 21； No.1 sliding rail 28 is equipped at the top of the inner wall of the No.1 cylinder 22；The No.1 fixed frame 24 is slided by No.1 sliding block 26 in No.1 It is moved in rail 28, No.1 fixed frame 24 is fixedly connected by No. three atmospheric pressure poles 25 with No.1 suction means 27；The No.1 is inhaled It is four to take the quantity of device 27, and four cooperations of No.1 suction means 27 are for making wafer 6 rotate；When No. three atmospheric pressure poles 25 stretch No.1 suction means 27 is driven to be in close contact with wafer 6, suction pump makes No.1 inhale by taking out negative pressure to No.1 suction means 27 It takes device 27 to adsorb wafer 6 to fix；Wherein, No.1 suction means 27 can by No.1 sliding block 26 and the cooperation of No.1 sliding rail 28 Realize the movement of No.1 suction means 27；Controller is worked alternatively by controlling four No.1 suction means 27, is used to make crystalline substance It is exposed by the surface that No.1 suction means 27 blocks in circle 6, for preventing 6 part surface of wafer can not because of being blocked The phenomenon that etching；Improve the efficiency of 6 engraved film of wafer.
The No.1 mounting plate 23 is circular ring shape mounting plate, and the inner wall of No.1 mounting plate 23 is equipped with No. two sliding rails 29；Institute It states dedusting module 3 and is equipped with No. two sliding blocks 31, No. two sliding blocks 31 make 3 rotation of dedusting module by coordinating with No. two sliding rails 29. After Fastener 16 is not to 3 clamping of dedusting module, dedusting module 3 realizes rotation, to drive wafer 6 to rotate so that 6 surface of wafer Dust be easier from 6 surface of wafer be detached from；Under the action of suction pump takes out negative pressure to closed bin 1, the dust quilt on 6 surface of wafer Pull out closed bin 1.
As one embodiment of the present invention, the dedusting module 3 includes No. two cylinders 32 and No. two turntables 33, described The bottom surface of No. two turntables 33 is equipped with No.1 annular groove 34, and the upper end of No. two cylinders 32 is rolled by steel ball is mounted on one In number annular groove 34, the bottom end of No. two cylinders 32 is fixedly mounted on the bottom plate of closed bin 1；No.1 annular groove 34 by with No. two Cylinder 32 coordinates that No. two turntables 33 is enable to rotate on No. two cylinders 32, and No. two cylinders 32 are used for the bottom to No. two turntables 33 It is closed in portion；The bottom plate of the closed bin 1 is equipped with suction hole 17；The top surface of No. two turntables 33, which is provided tiltedly with, to be run through The No.1 hole 35 of No. two turntables 33；The suction hole 17 with No.1 hole 35 by coordinating for making No. two turntables 33 rotate.Work as pumping When No. two cylinders 32 of sucking pump pair take out negative pressure, under the action of No.1 hole 35, No. two turntables 33 rotate No. two turntables 33, to Realize the purpose for driving wafer 6 to rotate, the efficiency for accelerating 6 surface dirt of wafer to be detached from,
As one embodiment of the present invention, the No.1 suction means 27 includes No. three mounting plates 51, sliding extensions Bar 52, drawing sucker 53；No. three mounting plates 51 are fixedly connected by sliding extension bar 52 with drawing sucker 53, sliding The outer layer of telescopic rod 52 is cased with spring；The drawing sucker 53 is used to carry out negative pressure to wafer 6 to fix.Drawing sucker 53 with When 6 surface of wafer contacts, the volume of drawing sucker 53 can increase suddenly so that the air pressure in drawing sucker 53 is dropped rapidly It is low, for improving the adsorption capacity to wafer 6；Meanwhile the sliding extension bar 52 of spring is cased with for coordinating drawing sucker 53 Work, when the volume of drawing sucker 53 increases, the length of sliding extension bar 52 can reduce.
As one embodiment of the present invention, the drawing sucker 53 includes 531, No. two atmospheric pressure poles of No. two mounting plates 532, holder 533, folded tube 534 and fixed ring 535；No. two mounting plates 531 pass through No. two atmospheric pressure poles 532 and holder 533 It is fixedly connected, holder 533 is for being fixed fixed ring 535；The fixed ring 535 is installed by folded tube 534 and No. two Plate 531 is fixedly connected；No. two mounting plates 531 are equipped with No. two holes 536.When fixed ring 535 and 6 surface of wafer contact, No. two atmospheric pressure poles 532 are stretched, and to which Foldable pipe 534 is stretched, increase the volume of folded tube 534 so that are folded Air pressure in pipe 534 quickly reduces, while negative pressure pump takes out negative pressure by No. two holes 536 of hose pair, further improves drawing Absorption crystallized ability of the sucker 53 to wafer 6.
As one embodiment of the present invention, vibrations unit 15 includes four No.1 atmospheric pressure poles 151, four No.1 air pressures The outer layer of bar 151 is cased with spring, and the top of spring is fixedly connected with fixed plate 14, the fixation of the bottom end and dedusting module 3 of spring Connection；The side of each No.1 atmospheric pressure pole 151 in four No.1 atmospheric pressure poles 151 is fixedly arranged in dedusting module 3, And the other side of No.1 atmospheric pressure pole 151 is not connect with fixed plate 14.First, No.1 suction means 27 and the top surface of wafer 6 are de- From wafer 6 is fixed in fixed plate 14；When No.1 atmospheric pressure pole 151 stretches, fixed plate 14 is driven to move upwards so that spring Be stretched tensioning, and fixed plate 14 cannot generate vertical tremor at this time；When No.1 atmospheric pressure pole 151 is shunk, No.1 atmospheric pressure pole 151 with Fixed plate 14 is not in contact, and when dedusting module 3 drives fixed plate 14 to rotate at this time, fixed plate 14 under the action of the spring can It shakes, the disengaging efficiency for improving 6 surface impurity of wafer.
As one embodiment of the present invention, the Fastener 16 includes No. four atmospheric pressure poles 161 and stripper plate 162, is squeezed The top surface of pressing plate 162 is equipped with wave molding, and wave molding is used to improve the frictional force of stripper plate 162.When wafer 6 needs to be etched, When No. four atmospheric pressure poles 161 stretch, the bottom surface of stripper plate 162 and No. two turntables 33 is in close contact, while 162 top surface of stripper plate The wave molding of setting improves fixed efficiency of the stripper plate 162 to No. two turntables 33 so that No. two turntables 33 do not rotate, and use In the precision for improving the etching of wafer 6.
When work, No. four atmospheric pressure poles 161 stretch, No.1 atmospheric pressure pole 151 stretches, fixed plate 14 cannot rotate at this time； Wafer 6 is positioned in fixed plate 14, wafer 6 is fixed in the metal sucker 141 in fixed plate 14, and then, controller is logical It crosses four No.1 suction means 27 wafer 6 is fixed and is shifted；Then wafer 6 is positioned over metal sucker 141, metal is inhaled Disk 141 fixes wafer 6, at this point, suction pump makes the air pressure in metal sucker 141 increase, wafer 6 is detached from metal sucker 141； Etching gas is flowed by gas inlet 13 in closed bin 1, under the collective effect of excitation variable winding 11 and biasing device 12, Etching gas performs etching the surface of wafer 6, while controller controls four No.1 suction means 27 makes 6 rotation of wafer, So that 6 surface of wafer is etched by the position that No.1 suction means 27 blocks；Suction pump simultaneously carries out pumping negative pressure to closed bin 1, By the gas discharge in closed bin 1.
After wafer 6 etches, wafer 6 is positioned in fixed plate 14 by controller by No.1 suction means 27, fixed Metal sucker 141 on plate 14 carries out negative pressure to wafer 6 and fixes；At this point, No. four atmospheric pressure poles 161 are shunk, No.1 atmospheric pressure pole 151 is received Contracting；Excitation variable winding 11 and biasing device 12 are stopped；Nitrogen is flowed into closed bin 1 by gas inlet 13 come to wafer 6 surfaces are cleared up, while suction pump makes No. two turntables 33 rotate by taking out negative pressure to No. two cylinders 32, at this point, fixed plate 14 drive wafer 6 to rotate, while fixed plate 14 drives 6 vertical tremor of wafer, the impurity on 6 surface of wafer to be arranged by suction pump Go out.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe the originals of the present invention Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle It is fixed.

Claims (6)

1. a kind of wafer etching device, including closed bin (1), excitation variable winding (11) and biasing device (12), the top of closed bin (1) Plate is equipped with gas inlet (13)；It is characterized in that：Further include mobile module (2), fixed plate (14), vibrations unit (15), Dedusting module (3), Fastener (16) and controller, the mobile module (2) are fixedly mounted on closed bin by fixed link (21) (1) on bottom plate；The fixed plate (14) is fixedly mounted on the top surface of dedusting module (3) by shaking unit (15)；It is described Mobile module (2) is for shifting wafer (6)；It is installed with metal sucker (141), metal on the fixed plate (14) Sucker (141) is for being fixed the bottom surface of wafer (6)；The dedusting module (3) is used for the impurity to wafer (6) surface It is cleared up；The Fastener (16) is for limiting dedusting module (3)；The controller is for controlling mobile module (2), the work of vibrations unit (15), dedusting module (3) and Fastener (16)；Wherein,
The mobile module (2) includes No.1 cylinder (22), No.1 mounting plate (23), No.1 fixed frame (24), No. three atmospheric pressure poles (25), No.1 sliding block (26) and No.1 suction means (27)；The No.1 cylinder (22) is pacified by the way that No.1 mounting plate (23) is fixed In fixed link (21)；No.1 sliding rail (28) is equipped at the top of the inner wall of the No.1 cylinder (22)；The No.1 fixed frame (24) movement in the No.1 sliding rail (28) by No.1 sliding block (26), No.1 fixed frame (24) by No. three atmospheric pressure poles (25) come with No.1 suction means (27) is fixedly connected；The quantity of the No.1 suction means (27) is four, four No.1 suction means (27) cooperation is for making wafer (6) rotate；
The No.1 mounting plate (23) is circular ring shape mounting plate, and the inner wall of No.1 mounting plate (23) is equipped with No. two sliding rails (29)； The dedusting module (3) is equipped with No. two sliding blocks (31), and No. two sliding blocks (31) make dedusting by coordinating with No. two sliding rails (29) Module (3) rotation.
2. a kind of wafer etching device according to claim 1, it is characterised in that：The dedusting module (3) includes No. two The bottom surface of cylinder (32) and No. two turntables (33), No. two turntables (33) is equipped with No.1 annular groove (34), No. two circles The upper end of cylinder (32) is rolled by steel ball and is mounted in No.1 annular groove (34), and the bottom end of No. two cylinders (32) is fixedly mounted on On the bottom plate of closed bin (1)；The bottom plate of the closed bin (1) is equipped with suction hole (17)；The top table of No. two turntables (33) Face is provided tiltedly with through the No.1 hole (35) of No. two turntables (33)；The suction hole (17) with No.1 hole (35) cooperation by being used for Make No. two turntable (33) rotations.
3. a kind of wafer etching device according to claim 2, it is characterised in that：The No.1 suction means (27) includes No. three mounting plates (51), sliding extension bar (52), drawing sucker (53)；No. three mounting plates (51) pass through sliding extension bar (52) it is fixedly connected with drawing sucker (53), the outer layer of sliding extension bar (52) is cased with spring；The drawing sucker (53) It is fixed for carrying out negative pressure to wafer (6).
4. a kind of wafer etching device according to claim 3, it is characterised in that：The drawing sucker (53) includes two Number mounting plate (531), No. two atmospheric pressure poles (532), holder (533), folded tube (534) and fixed ring (535)；No. two installations Plate (531) is fixedly connected by No. two atmospheric pressure poles (532) with holder (533), and holder (533) is used to carry out fixed ring (535) It is fixed；The fixed ring (535) is fixedly connected by folded tube (534) with No. two mounting plates (531)；No. two mounting plates (531) No. two holes (536) are equipped with.
5. a kind of wafer etching device according to claim 4, it is characterised in that：It includes four No.1s to shake unit (15) The outer layer of atmospheric pressure pole (151), four No.1 atmospheric pressure poles (151) is cased with spring, and the top of spring is fixedly connected with fixed plate (14), The bottom end of spring is fixedly connected with dedusting module (3)；Each No.1 atmospheric pressure pole in four No.1 atmospheric pressure poles (151) (151) side is fixedly arranged in dedusting module (3), and the other side of No.1 atmospheric pressure pole (151) not with fixed plate (14) Connection.
6. a kind of wafer etching device according to claim 1, it is characterised in that：The Fastener (16) includes No. four gas The top surface of compression bar (161) and stripper plate (162), stripper plate (162) is equipped with wave molding, and wave molding is for improving stripper plate (162) frictional force.
CN201810468778.3A 2018-05-16 2018-05-16 Wafer etching device Active CN108682636B (en)

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CN111267017A (en) * 2020-03-17 2020-06-12 华天慧创科技（西安）有限公司 Support tool for avoiding middle deformation during wafer film coating and working method
CN117712015A (en) * 2023-12-12 2024-03-15 江苏亚电科技股份有限公司 Wafer supporting disc of single wafer cleaning device with clamping function

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CN103730318A (en) * 2013-11-15 2014-04-16 中微半导体设备(上海)有限公司 Wafer edge protection ring and method for reducing particles at wafer edge
CN105321813A (en) * 2014-05-26 2016-02-10 松下知识产权经营株式会社 Plasma processing method and apparatus

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US7033444B1 (en) * 1999-06-21 2006-04-25 Tokyo Electron Limited Plasma processing apparatus, and electrode structure and table structure of processing apparatus
US20040194799A1 (en) * 2001-01-08 2004-10-07 Kim Jeong-Ho Apparatus and method for surface cleaning using plasma
CN103730318A (en) * 2013-11-15 2014-04-16 中微半导体设备(上海)有限公司 Wafer edge protection ring and method for reducing particles at wafer edge
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Publication number Priority date Publication date Assignee Title
CN111267017A (en) * 2020-03-17 2020-06-12 华天慧创科技（西安）有限公司 Support tool for avoiding middle deformation during wafer film coating and working method
CN117712015A (en) * 2023-12-12 2024-03-15 江苏亚电科技股份有限公司 Wafer supporting disc of single wafer cleaning device with clamping function
CN117712015B (en) * 2023-12-12 2024-05-28 江苏亚电科技股份有限公司 Wafer supporting disc of single wafer cleaning device with clamping function

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