CN117712015A

CN117712015A - Wafer supporting disc of single wafer cleaning device with clamping function

Info

Publication number: CN117712015A
Application number: CN202311694859.2A
Authority: CN
Inventors: 钱诚; 郭亚飞; 黄典礼; 彭竹云
Original assignee: Jiangsu Asia Electronics Technology Co Ltd
Current assignee: Jiangsu Asia Electronics Technology Co Ltd
Priority date: 2023-12-12
Filing date: 2023-12-12
Publication date: 2024-03-15
Anticipated expiration: 2043-12-12
Also published as: CN117712015B

Abstract

The application relates to a wafer supporting disc of a single wafer cleaning device with a clamping function, and belongs to the technical field of wafer manufacturing equipment. The utility model provides a have monolithic wafer belt cleaning device's of chucking function wafer supporting disk is when using, stirs through drive arrangement the actuating lever, makes the connecting rod resist the pulling force of elastic component towards disk body center motion, drives chucking post bottom towards disk body center motion, and the top of chucking post is towards keeping away from disk body center motion, later is arranged the wafer on the bracing piece by the manipulator, is released the drive to the actuating lever by drive arrangement, and under the effect of elastic component, the connecting rod resets, and the top of chucking post is drawn in towards disk body center to fix the wafer in the concave part of chucking post, form the fixation to the wafer. The wafer supporting disc of the single wafer cleaning device with the clamping function has the advantage of firm fixation of the wafer, and reduces the risk of crushing the wafer.

Description

Wafer supporting disc of single wafer cleaning device with clamping function

Technical Field

The application belongs to the technical field of wafer manufacturing equipment, and particularly relates to a wafer supporting disc of a single wafer cleaning device with a clamping function.

Background

A single wafer cleaning apparatus is an apparatus for cleaning wafers one by one. The method has the advantages that the process operation and the cleaning are sequentially carried out on the wafer through a plurality of cleaning fluids (usually three types) on one rotating wafer supporting disc, the quality is stable, and the process requirements are met.

Chinese patent document CN113113328B discloses a single wafer cleaning device cleaning disc structure and a single wafer cleaning device, in which a wafer is directly placed on a support column, and the fixing of the wafer is not very firm.

Disclosure of Invention

The invention aims to solve the technical problems that: in order to solve the defects in the prior art, the wafer supporting disc of the single wafer cleaning device with the clamping function is provided.

The technical scheme adopted for solving the technical problems is as follows:

a wafer support tray for a single wafer cleaning apparatus having a chucking function, comprising:

the tray body comprises a top surface and a bottom surface arranged at the bottom of the top surface, and an installation space is formed between the top surface and the bottom surface;

the support rod is arranged at the top of the tray body and is used for supporting the wafer;

the wafer clamping device comprises a plurality of clamping columns, a plurality of clamping plates and a plurality of clamping plates, wherein each clamping column comprises a bottom, a middle section positioned on the bottom and a top section positioned at the top end, wherein the top section is provided with a concave part, and the concave part is used for clamping a wafer;

the clamping mechanism comprises a driving rod, a first limiting block, a connecting rod, a mounting block, a connecting block and an elastic piece;

one end of the connecting rod is a driving rod, and the driving rod is used for being connected with the driving device and pulling the driving rod along the axial direction;

the first limiting block is arranged in the disc body and used for the driving rod to pass through so as to limit the driving rod to move only along the axial direction;

the other end of the connecting rod is provided with the mounting block, the clamping column is hinged to the mounting block, and the clamping column penetrates out of a mounting hole in the tray body;

the connecting block is arranged on the connecting rod, and the elastic piece is connected with the connecting block and used for providing acting force opposite to the pulling force direction of the driving device pulling the driving rod.

Preferably, the wafer supporting disc with the clamping function is provided with two connecting blocks, the two connecting blocks are respectively positioned at two sides of the connecting rod, the two elastic pieces are also provided with two, one ends of the two elastic pieces are respectively connected with the two connecting blocks, and the other ends of the two elastic pieces are respectively connected with the fixing columns fixed on the disc body.

Preferably, the wafer supporting plate of the single wafer cleaning device with clamping function of the present invention has a curved surface with a diameter gradually decreasing from bottom to top, and the wafer is supported by the curved surface.

Preferably, in the wafer supporting disc of the single wafer cleaning device with the clamping function, the opening of the mounting hole is provided with the plugging sheet.

Preferably, the wafer supporting disc of the single wafer cleaning device with the clamping function is provided with the mounting hole, and the opening of the mounting hole is a stepped hole.

Preferably, the wafer supporting disc of the single wafer cleaning device with the clamping function is characterized in that the sealing piece is made of PTFE material.

Preferably, in the wafer supporting disc with the clamping function of the single wafer cleaning device, the supporting rod is installed on the disc body through threads, and the top of the supporting rod is conical.

Preferably, the wafer supporting disc of the single wafer cleaning device with the clamping function is characterized in that the clamping column is connected with the mounting block through threads so as to facilitate the mounting of the clamping column.

Preferably, the wafer supporting disc of the single wafer cleaning device with the clamping function further comprises a second limiting block fixed in the disc body, and the second limiting block can abut against the connecting rod to resist the tensile force of the elastic piece.

The beneficial effects of the invention are as follows:

when the wafer supporting disc of the single wafer cleaning device with the clamping function is used, the driving rod is shifted through the driving device, so that the connecting rod moves towards the center of the disc body against the tensile force of the elastic piece to drive the bottom of the clamping column to move towards the center of the disc body, the top of the clamping column moves towards the center far away from the disc body, the wafer is placed on the supporting rod through the mechanical arm, the driving of the driving rod is released through the driving device, the connecting rod is reset under the action of the elastic piece, the top of the clamping column is folded towards the center of the disc body, and therefore the wafer is fixed in the concave part of the clamping column, and the wafer is fixed. The wafer supporting disc of the single wafer cleaning device with the clamping function has the advantage of firm fixation of the wafer, and reduces the risk of crushing the wafer.

Drawings

The technical scheme of the application is further described below with reference to the accompanying drawings and examples.

Fig. 1 is a schematic structural view of a top surface of a wafer support plate of a single wafer cleaning apparatus with chucking function according to an embodiment of the present application;

fig. 2 is a schematic structural view of the back surface of a wafer support plate of the single wafer cleaning apparatus with chucking function according to the embodiment of the present application;

FIG. 3 is a schematic view of a wafer support plate with a bottom hidden for a single wafer cleaning apparatus with chucking function according to an embodiment of the present application;

FIG. 4 is a schematic view of the structure of the clamping mechanism according to the embodiment of the present application;

FIG. 5 is a schematic view of the structure of a clamping post according to an embodiment of the present application;

FIG. 6 is a schematic view of the structure of the clamping post and support bar of the embodiment of the present application;

the reference numerals in the figures are:

1. a tray body;

2. a support rod;

3. clamping the column;

9. a wafer;

11. a middle hole;

12. a bottom surface;

13. a mounting hole;

14. a top surface;

31. a bottom;

32. an intermediate section;

33. a top section;

41. a driving rod;

42. a first limiting block;

43. a connecting rod;

44. a mounting block;

45. a connecting block;

46. an elastic member;

47. fixing the column;

48. a second limiting block;

310. and (3) a plugging piece.

Detailed Description

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application can be understood by those of ordinary skill in the art in a specific context.

The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.

Examples

The present embodiment provides a wafer supporting plate of a single wafer cleaning device with a clamping function, as shown in fig. 1, including:

the disc body 1, as shown in fig. 1 and 2, a middle hole 11 is formed in the middle of the disc body 1, the middle hole 11 is used for being installed on a rotating shaft through a screw so as to rotate under the driving of the rotating shaft, the disc body 1 comprises a top surface 14 and a bottom surface 12 installed at the bottom of the top surface 14, and an installation space is formed between the top surface 14 and the bottom surface 12;

the support rod 2 is arranged at the top of the tray body 1 and is used for supporting the wafer;

the clamping columns 3 are several, as shown in fig. 5, from the mounting holes 13 on the tray body 1, the clamping columns 3 comprise a bottom 31, a middle section 32 positioned on the bottom 31, a top section 33 positioned at the top end, and the top section 33 is provided with a concave part for clamping a wafer;

the clamping mechanism, as shown in fig. 3 and 4, comprises a driving rod 41, a first limiting block 42, a connecting rod 43, a mounting block 44, a connecting block 45 and an elastic piece 46;

one end of the connecting rod 43 is a driving rod 41, and the driving rod 41 is used for being connected with a driving device and pulling the driving rod 41 along the axial direction;

the first limiting block 42 is arranged in the disc body 1 and used for the driving rod 41 to pass through so as to limit the driving rod 41 to move only along the axial direction;

the other end of the connecting rod 43 is provided with a mounting block 44, and the clamping column 3 is hinged on the mounting block 44; the clamping column 3 penetrates out of the mounting hole 13 on the tray body 1;

a connection block 45 is provided on the connection rod 43, and an elastic member 46 is connected to the connection block 45 for providing a force or a component of force opposite to a pulling force direction in which the driving device pulls the driving lever 41.

When the wafer supporting disc of the single wafer cleaning device with the clamping function is used, the driving rod 41 is shifted through the driving device, the connecting rod 43 moves towards the center of the disc body 1 against the tensile force of the elastic piece 46, the bottom of the clamping column 3 is driven to move towards the center of the disc body 1, the top of the clamping column 3 moves towards the center far away from the disc body 1, then the wafer 9 is placed on the supporting rod 2 by the manipulator, the driving device stops driving the driving rod 41 and disconnects, the connecting rod 43 resets under the action of the elastic piece 46, the top of the clamping column 3 is folded towards the center of the disc body 1, and accordingly the wafer 9 is fixed in the concave part of the clamping column 3, and the fixation of the wafer 9 is formed. The wafer supporting plate of the single wafer cleaning device with the clamping function of the embodiment has the advantage of firm fixation of the wafer 9, and reduces the risk of crushing the wafer.

It should be noted that in fig. 4, the connection block 45 and the elastic member 46 are not assembled, but are actually connected together, that is, one end of the elastic member 46 is connected with the connection block 45, so as to form a continuous pulling force on the connection block 45.

Further, two connecting blocks 45 are respectively located at two sides of the connecting rod 43, two elastic pieces 46 are also provided, one ends of the two elastic pieces 46 are respectively connected with the two connecting blocks 45, and the other ends of the two elastic pieces 46 are respectively connected with fixing columns 47 fixed on the tray body 1. The elastic member 46 applies a pulling force to both sides of the link 43 so that the pulling force is more balanced.

Further, the concave portion has a curved surface with a diameter gradually decreasing from bottom to top, by which the wafer 9 is supported.

Further, the clamping mechanisms are arranged along the disc body 1, 6 are shown in fig. 3, all the supporting rods 2 are arranged in a common circle, and all the clamping columns 3 are arranged in a common circle.

Further, as shown in fig. 6, a blocking piece 310 is provided at the opening of the mounting hole 13 to prevent water from flowing into the opening.

Further, a stepped hole is provided at the opening of the mounting hole 13 to support the blocking piece 310.

Further, the sealing sheet 310 is preferably made of PTFE material. The PTFE material has a certain elasticity and can adapt to the displacement of the clamping column 3.

Further, the support bar 2 is mounted on the tray body 1 by screw threads, and the top of the support bar 2 is tapered. So as to form a tip at the top to facilitate supporting the wafer 9.

Further, the clamping post 3 is screwed with the mounting block 44 to facilitate the mounting of the clamping post 3.

Further, the clamping mechanism further comprises a second limiting block 48 fixed in the disc body 1, and the second limiting block 48 can abut against the connecting rod 43 to resist the pulling force of the elastic piece 46. That is, when the elastic member 46 is pulled tightly, the second limiting block 48 acts on the connecting rod 43, so that the connecting rod 43 is at the initial position without external force. The link 43 has a swelling portion in the middle (the middle portion is larger than both sides) between the first stopper 42 and the second stopper 48 to restrict the movement position of the link 43, and the second stopper 48 has an upper opening to restrict only both sides of the link 43 to facilitate the installation of the link 43.

The wafer supporting disk with the clamping function of the single wafer cleaning device is used on the single wafer cleaning device, and can process a wafer every time when cleaning. Before placing the wafer, the clamping columns 3 are far away from each other, the wafer can be placed on the supporting rods 2 from top to bottom, the clamping columns 3 are folded to clamp the wafer, and then the wafer can be cleaned. After the wafer is cleaned, the clamping columns 3 are driven to be away from each other, so that the wafer can be taken away. The process of clamping the wafer by mutually moving the clamping posts 3 away from each other and folding the wafer is already described above, and will not be described again here.

With the above-described preferred embodiments according to the present application as a teaching, the related workers can make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.

Claims

1. A wafer support tray for a single wafer cleaning apparatus having a chucking function, comprising:

the novel rotary disc comprises a disc body (1), wherein a middle hole (11) is formed in the middle of the disc body (1) and is used for being installed on a rotating shaft to rotate under the drive of the rotating shaft, the disc body (1) comprises a top surface (14) and a bottom surface (12) installed at the bottom of the top surface (14), and an installation space is formed between the top surface (14) and the bottom surface (12);

the support rod (2) is arranged at the top of the tray body (1) and is used for supporting the wafer;

the clamping columns (3) are a plurality of, each clamping column (3) comprises a bottom (31), a middle section (32) positioned on the bottom (31), a top section (33) positioned at the top end, and the top section (33) is provided with a concave part for clamping a wafer;

the clamping mechanism comprises a driving rod (41), a first limiting block (42), a connecting rod (43), a mounting block (44), a connecting block (45) and an elastic piece (46);

one end of the connecting rod (43) is a driving rod (41), and the driving rod (41) is used for being connected with a driving device and pulling the driving rod (41) along the axial direction;

the first limiting block (42) is arranged in the disc body (1) and used for the driving rod (41) to pass through so as to limit the driving rod (41) to move only in the axial direction;

the other end of the connecting rod (43) is provided with the mounting block (44), the clamping column (3) is hinged on the mounting block (44), and the clamping column (3) penetrates out of the mounting hole (13) on the disc body (1);

the connecting block (45) is arranged on the connecting rod (43), and the elastic piece (46) is connected with the connecting block (45) and used for providing acting force opposite to the pulling force direction of the driving device pulling the driving rod (41).

2. The wafer supporting plate with the clamping function of the single wafer cleaning device according to claim 1, wherein two connecting blocks (45) are respectively positioned at two sides of the connecting rod (43), two elastic pieces (46) are also arranged, one ends of the two elastic pieces (46) are respectively connected with the two connecting blocks (45), and the other ends of the two elastic pieces (46) are respectively connected with fixing columns (47) fixed on the plate body (1).

3. The wafer support tray of the single wafer cleaning apparatus with chucking function as recited in claim 1, wherein said recess has a curved surface with a diameter gradually decreasing from bottom to top, through which the wafer is supported.

4. Wafer support plate of a single wafer cleaning device with clamping function according to claim 1, characterized in that the opening of the mounting hole (13) is provided with a blocking piece (310).

5. The wafer support tray of the single wafer cleaning apparatus with chucking function according to claim 4, characterized in that the opening of the mounting hole (13) is a stepped hole.

6. The wafer support tray of the single wafer cleaning apparatus with chucking function of claim 4, wherein said blocking piece (310) is made of PTFE material.

7. Wafer supporting disk of a single wafer cleaning device with clamping function according to claim 1, characterized in that the supporting rod (2) is mounted on the disk body (1) by threads, and the top of the supporting rod (2) is conical.

8. Wafer support plate of a single wafer cleaning device with clamping function according to claim 1, characterized in that the clamping column (3) is screwed with a mounting block (44) for facilitating the mounting of the clamping column (3).

9. Wafer support tray of a single wafer cleaning device with clamping function according to claim 1, characterized in that the clamping mechanism further comprises a second stopper (48) fixed in the tray body (1), the second stopper (48) being able to abut against the connecting rod (43) to resist the pulling force of the elastic member (46).