CN111267017A - Support tool for avoiding middle deformation during wafer film coating and working method - Google Patents
Support tool for avoiding middle deformation during wafer film coating and working method Download PDFInfo
- Publication number
- CN111267017A CN111267017A CN202010187763.7A CN202010187763A CN111267017A CN 111267017 A CN111267017 A CN 111267017A CN 202010187763 A CN202010187763 A CN 202010187763A CN 111267017 A CN111267017 A CN 111267017A
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- China
- Prior art keywords
- wafer
- sucker
- coating
- rotating shaft
- cross rod
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a support tool and a working method for avoiding middle deformation of a wafer during film coating. The invention can solve the problem of sinking caused by gravity when the wafer is coated with the film, reduce or eliminate the warping of the coated wafer, and the reduction or elimination of the warping provides convenience for the smooth proceeding of the subsequent process. The settlement caused by gravity can be solved, and the coating quality can be enhanced.
Description
Technical Field
The invention belongs to the field of film coating tools, and particularly relates to a support tool for avoiding middle deformation of a wafer during film coating and a working method.
Background
The existing wafer coating bracket is only in a ring shape with steps. When coating, the wafer is placed on the film, and the wafer glass can freely sink due to the action of gravity. The condition that the wafer sinks can cause the quality problem of the coating film, and the warp which can not be eliminated is formed after the coating film, thereby influencing the post-stage process manufacturing.
Disclosure of Invention
The invention aims to overcome the defects and provides a support tool and a working method for avoiding middle deformation of a wafer during film coating, which can prevent the middle part of the wafer from sinking and eliminate a series of adverse conditions caused by the sinking of the wafer.
In order to achieve the purpose, the wafer coating device comprises a coating support, wherein a wafer placing table is arranged on the coating support, an upper sucker is arranged above the wafer placing table, a plurality of sucker columns are fixed on the upper sucker, an upper sucker vacuum channel is arranged in at least one sucker column, the upper sucker is connected with a vacuum pump through the upper sucker vacuum channel, a side sucker is sleeved on the sucker column, a side sucker vacuum channel is arranged on the side sucker, and the side sucker vacuum channel is connected with the vacuum pump;
when the side sucker works, the sucker column can generate transverse tension.
All the side suction cups are annularly arranged on the periphery of the film coating bracket.
The sucking disc post is connected the horizontal pole, and the horizontal pole is fixed on the rotation axis, and the rotation axis articulates on the fixing base, and the rotation axis can be at the fixing base internal rotation.
The cross rod is connected and locked with the rotating shaft through a screw, and the end part of the screw is provided with a spring nest.
And a notch for moving out the wafer is formed in the side wall of the film coating support.
The wafer placing table and the film coating bracket form an annular step structure.
A working method of a support tool for avoiding middle deformation during wafer coating comprises the following steps:
step one, a wafer is placed on a wafer placing table;
secondly, the upper sucker is contacted with the upper surface of the wafer, and the vacuum pump generates suction force on the wafer through the vacuum channel of the upper sucker to suck the wafer;
and step three, the vacuum pump generates suction through the side sucker vacuum channel, so that the side sucker vacuum channel of the side sucker is tightly attached to the side surface of the coating bracket, the sucker column is pulled, the sucker column drives the upper sucker to generate transverse force, and the wafer is leveled.
The sucker column is connected with a cross rod, the cross rod is fixed on a rotating shaft, the rotating shaft is hinged on a fixed seat, the cross rod and the rotating shaft are connected and locked through a screw, and the end part of the screw is provided with a spring nest;
when wafers with different thicknesses are placed, the screw is rotated, and the cross rod moves up and down under the action of the spring nesting between the screw and the rotating shaft.
Compared with the prior art, the upper sucker is adsorbed on the upper surface of the wafer, the horizontal pulling force is applied to the upper sucker through the side sucker, so that the wafer is pulled flat and does not sink any more during film coating, and a series of bad conditions caused by wafer sinking can be eliminated. The invention can solve the problem of sinking caused by gravity when the wafer is coated with the film, reduce or eliminate the warping of the coated wafer, and the reduction or elimination of the warping provides convenience for the smooth proceeding of the subsequent process. The settlement caused by gravity can be solved, and the coating quality can be enhanced.
Furthermore, the wafer coating device is provided with the rotating shaft, so that the upper sucker can move to the outside of the wafer coating support body from the upper part of the wafer, and a user can conveniently move the wafer.
Furthermore, the cross rod and the rotating shaft are connected and locked through the screw, the end part of the screw is provided with the spring nest, and the height of the upper sucker can be adjusted according to the thickness of the wafer through the screw thread and the spring structure.
The method of the invention is that when the upper annular sucking disc and the measuring sucking disc both start working, the upper surface of the wafer is adsorbed by the surface of the upper sucking disc contacting with the wafer, the horizontal rod of the side sucking disc is sleeved on the column of the vacuum channel or the vacuum channel of the upper sucking disc, and the side sucking disc adsorbs the outer side surface of the annular bracket main body to generate certain pulling force. Based on this process, the wafer will be pulled flat. When coating, the wafer will not sink any more, thereby eliminating a series of bad conditions caused by the wafer sinking.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the combination of the upper and side suction cups of the present invention;
FIG. 3 is a schematic view of a rotary structure according to the present invention;
FIG. 4 is a schematic view of the upper chuck and the rotating shaft of the present invention;
wherein, 1, coating a film bracket; 2. a wafer placing table; 3. a sucker is arranged; 4. a sucker column; 5. an upper sucker vacuum channel; 6. a side suction cup; 7. a side suction cup vacuum channel; 8. a rotating shaft; 9. a fixed seat; 10. a cross bar; 11. a screw; 12. nesting the spring; 13. and (4) a notch.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Referring to fig. 1 and 2, the wafer coating device comprises a coating support 1, a wafer placing table 2 is arranged on the coating support 1, the wafer placing table 2 and the coating support 1 form an annular step structure, an upper sucker 3 is arranged above the wafer placing table 2, a plurality of sucker columns 4 are fixed on the upper sucker 3, an upper sucker vacuum channel 5 is arranged in at least one sucker column 4, the upper sucker 3 is connected with a vacuum pump through the upper sucker vacuum channel 5, a side sucker 6 is sleeved on the sucker column 4, a side sucker vacuum channel 7 is arranged on the side sucker 6, and the side sucker vacuum channel 7 is connected with the vacuum pump.
When the side suction cups 6 work, the suction cup columns 4 can generate transverse tension. All the side suckers 6 are annularly arranged on the periphery of the film coating bracket 1.
When the upper sucker 3 and the side sucker 6 start working, the surface of the upper sucker 3 contacted with the wafer adsorbs the upper surface of the wafer, the horizontal rod of the side sucker is sleeved on the post of the vacuum channel or the non-vacuum channel of the upper sucker, and the side sucker 6 adsorbs the outer side surface of the main body of the film coating bracket 1 to generate certain pulling force. Based on this process, the wafer will be pulled flat. When coating, the wafer will not sink any more, thereby eliminating a series of bad conditions caused by the wafer sinking.
Referring to fig. 3 and 4, the sucker column 4 is connected with a cross rod 10, the cross rod 10 is fixed on a rotating shaft 8, the rotating shaft 8 is hinged on a fixed seat 9, and the rotating shaft 8 can rotate in the fixed seat 9. The cross rod 10 and the rotating shaft 8 are connected and locked through a screw 11, a spring nesting 12 is arranged at the end part of the screw 11, the height of the upper sucker can be adjusted through threads between the rotating shaft 8 and the cross rod 10 and the spring nesting 12 according to the thickness of a wafer, and a notch 13 for moving the wafer out is formed in the side wall of the film coating support 1.
The action of the rotating shaft 8 can enable the upper suckers 3 to move to the outside of the main body of the wafer film coating support 1 from the upper part of the wafer, notches 13 formed in the side wall of the main body of the film coating support 1 facilitate the movement of the upper suckers 3, and the number of the upper suckers 3 corresponds to the number of the rotating shafts 8.
Claims (8)
1. The support tool for avoiding middle deformation during wafer coating is characterized by comprising a coating support (1), wherein a wafer placing table (2) is arranged on the coating support (1), an upper sucker (3) is arranged above the wafer placing table (2), a plurality of sucker columns (4) are fixed on the upper sucker (3), an upper sucker vacuum channel (5) is arranged in at least one sucker column (4), the upper sucker (3) is connected with a vacuum pump through the upper sucker vacuum channel (5), a side sucker (6) is sleeved on each sucker column (4), a side sucker vacuum channel (7) is arranged on each side sucker (6), and the side sucker vacuum channel (7) is connected with the vacuum pump;
when the side sucker (6) works, the sucker column (4) can generate transverse tension.
2. The support tool for avoiding intermediate deformation during wafer coating according to claim 1, wherein all the side suckers (6) are annularly arranged on the periphery of the coating support (1).
3. The support tool for avoiding intermediate deformation during wafer coating according to claim 1, wherein the chuck column (4) is connected with a cross rod (10), the cross rod (10) is fixed on a rotating shaft (8), the rotating shaft (8) is hinged on a fixed seat (9), and the rotating shaft (8) can rotate in the fixed seat (9).
4. The support tool for avoiding intermediate deformation during wafer coating according to claim 3, wherein the cross rod (10) is connected and locked with the rotating shaft (8) through a screw (11), and a spring nest (12) is arranged at the end of the screw (11).
5. The support tool for avoiding intermediate deformation during wafer coating according to claim 1 or 3, wherein the side wall of the coating support (1) is provided with a notch (13) for removing the wafer.
6. The support tool for avoiding intermediate deformation of a wafer during film coating according to claim 1, wherein the wafer placing table (2) and the film coating support (1) form an annular step structure.
7. The working method of the bracket tool for avoiding the middle deformation of the wafer during film coating of the claim 1 is characterized by comprising the following steps:
firstly, a wafer is placed on a wafer placing table (2);
secondly, the upper sucker (3) is contacted with the upper surface of the wafer, and the vacuum pump generates suction force on the wafer through the upper sucker vacuum channel (5) to suck the wafer;
and thirdly, generating suction force by the vacuum pump through the side sucker vacuum channel (7), enabling the side sucker vacuum channel (7) of the side sucker (6) to be tightly attached to the side surface of the coating bracket (1), and pulling the sucker column (4) to enable the sucker column (4) to drive the upper sucker (3) to generate transverse force so as to flatten the wafer.
8. The working method of the support tool for avoiding the intermediate deformation of the wafer during film coating according to claim 7, wherein the chuck column (4) is connected with a cross rod (10), the cross rod (10) is fixed on a rotating shaft (8), the rotating shaft (8) is hinged on a fixed seat (9), the cross rod (10) and the rotating shaft (8) are connected and locked through a screw (11), and the end part of the screw (11) is provided with a spring nest (12);
when wafers with different thicknesses are placed, the screw (11) is rotated, and the cross rod (10) moves up and down under the action of the spring nest (12) between the screw (11) and the rotating shaft (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010187763.7A CN111267017B (en) | 2020-03-17 | 2020-03-17 | Support tool for avoiding middle deformation during wafer film coating and working method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010187763.7A CN111267017B (en) | 2020-03-17 | 2020-03-17 | Support tool for avoiding middle deformation during wafer film coating and working method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111267017A true CN111267017A (en) | 2020-06-12 |
| CN111267017B CN111267017B (en) | 2022-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010187763.7A Active CN111267017B (en) | 2020-03-17 | 2020-03-17 | Support tool for avoiding middle deformation during wafer film coating and working method |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5649220B2 (en) * | 2011-03-18 | 2015-01-07 | 東京エレクトロン株式会社 | Substrate transport apparatus and substrate transport method |
| US20170287771A1 (en) * | 2016-04-02 | 2017-10-05 | Intel Corporation | Stretching retention plate for electronic assemblies |
| CN107414706A (en) * | 2017-05-25 | 2017-12-01 | 重庆市尚益实业有限公司 | Cell phone mainboard assembles special fixture |
| CN108682636A (en) * | 2018-05-16 | 2018-10-19 | 汪玉洁 | A kind of wafer etching device |
| CN109273398A (en) * | 2018-09-28 | 2019-01-25 | 上海微松工业自动化有限公司 | A kind of smooth fixed device of wafer |
| CN109599352A (en) * | 2017-10-02 | 2019-04-09 | 株式会社迪思科 | With expanding unit and with extended method |
| CN208854500U (en) * | 2018-10-25 | 2019-05-14 | 洛阳博格机械设备有限公司 | It is a kind of for processing the fixture of gear pump body bottom surface |
| US10479619B2 (en) * | 2018-02-15 | 2019-11-19 | Toyota Jidosha Kabushiki Kaisha | Separator suction device with rotary actuator |
-
2020
- 2020-03-17 CN CN202010187763.7A patent/CN111267017B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5649220B2 (en) * | 2011-03-18 | 2015-01-07 | 東京エレクトロン株式会社 | Substrate transport apparatus and substrate transport method |
| US20170287771A1 (en) * | 2016-04-02 | 2017-10-05 | Intel Corporation | Stretching retention plate for electronic assemblies |
| CN107414706A (en) * | 2017-05-25 | 2017-12-01 | 重庆市尚益实业有限公司 | Cell phone mainboard assembles special fixture |
| CN109599352A (en) * | 2017-10-02 | 2019-04-09 | 株式会社迪思科 | With expanding unit and with extended method |
| US10479619B2 (en) * | 2018-02-15 | 2019-11-19 | Toyota Jidosha Kabushiki Kaisha | Separator suction device with rotary actuator |
| CN108682636A (en) * | 2018-05-16 | 2018-10-19 | 汪玉洁 | A kind of wafer etching device |
| CN109273398A (en) * | 2018-09-28 | 2019-01-25 | 上海微松工业自动化有限公司 | A kind of smooth fixed device of wafer |
| CN208854500U (en) * | 2018-10-25 | 2019-05-14 | 洛阳博格机械设备有限公司 | It is a kind of for processing the fixture of gear pump body bottom surface |
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| Publication number | Publication date |
|---|---|
| CN111267017B (en) | 2022-05-13 |
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