CN219418976U - Bonded wafer separating device - Google Patents

Abstract

The utility model provides a bonded wafer separating device, which comprises a turnover module and an adsorption module connected with the turnover module; the turnover module comprises a turnover disc and a first driving piece which is connected with the turnover disc and used for driving the adsorption module to rotate by 180 degrees; the adsorption module comprises a plurality of sucker groups which are arranged at intervals and used for adsorbing the wafer slide, a support bracket connected with each sucker group, and a flexible support plate connected with the support bracket, wherein a second driving piece is arranged on one side, far away from the flexible support plate, of the support bracket, and a force sensor is arranged between the second driving piece and the support bracket so as to acquire a pulling force signal of the second driving piece on the wafer slide in real time; the utility model can monitor the pulling force in real time without adjustment; the adhesive surface of the slide glass is turned upwards after the slide glass is separated from the wafer, so that the pollution of the adhesive surface of the slide glass to equipment is reduced.

Description

Bonded wafer separating device

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a bonding wafer separating device.

Background

In order to meet the demands of semiconductor wafer processing for reduced feature size and 3D integration requirements, thinned wafers are fragile and require a stable substrate support to assist in the completion of the relevant process, providing rigid support to the wafer through the bonding process. The device wafer to be processed in the process is adhered to the glass carrier by an adhesive composed of laser release materials to form a bonding wafer, after thinning and a series of processing on the device wafer side, the device side surface of the bonding wafer is usually adhered to a standard wafer Frame with an adhesive film, at the moment, the glass carrier is sequentially provided with the bonding adhesive layer, the device wafer and an adhesive tape with an iron ring fixed on the outer side towards the lower side, the material combination is called as the Frame bonding wafer, and then the bonding wafer is required to be subjected to photochemical reaction by laser irradiation of the laser through the glass release materials to decompose the bonding wafer and the temporary bonding materials to lose adhesion, and then the carrier is removed.

The existing slide glass separating device mostly adopts a plurality of suckers to directly vertically pull up or has a certain height difference to enable the slide glass separating device to be opened from one end for stripping through setting up the telescopic suckers, the whole process is uncontrollable and has no good tension monitoring, the wafer is easy to break under the condition that the suction nozzle height difference is not good or the wafer is very thin, and the release layer is not fully bonded, and the wafer is easy to break. There is a need for an apparatus that protects the wafer and prevents contamination of the slide.

Disclosure of Invention

The utility model aims to provide a bonded wafer separating device, which can monitor pulling force in real time without adjusting on one hand, prevent damage to a wafer caused by hard pulling when the wafer and a carrier are adhered, and on the other hand, the adhesive surface of a slide sheet is turned upwards after the slide sheet is separated from the wafer, so that pollution of the adhesive surface of the slide sheet to equipment is reduced, and the cleanliness of the equipment is improved.

In order to achieve the above purpose, the utility model provides a bonded wafer separating device, which comprises a turnover module and an adsorption module connected with the turnover module; the turnover module comprises a turnover disc and a first driving piece which is connected with the turnover disc and used for driving the adsorption module to rotate by 180 degrees; the adsorption module comprises a plurality of sucking disc groups which are arranged at intervals and used for adsorbing the wafer slide, a support bracket connected with each sucking disc group, and a flexible support plate connected with the support bracket, wherein one side, away from the flexible support plate, of the support bracket is provided with a second driving piece, and a force sensor is arranged between the second driving piece and the support bracket so as to collect the pulling force signals of the second driving piece on the wafer slide in real time.

Optionally, the device further comprises a floating joint, wherein the floating joint is arranged between the second driving piece and the force sensor and is used for connecting the second driving piece with the force sensor.

Optionally, the device further comprises a supporting needle vertically arranged in the movable hole of the flexible supporting plate.

Optionally, the turnover device further comprises a supporting seat for installing the turnover disc, wherein the driving end of the first driving piece is installed at the middle part of one side of the turnover disc, which is located in the supporting seat, and the first driving piece is fixed in the supporting seat.

Optionally, the lifting device further comprises a connecting piece, wherein the connecting piece comprises a lifting arm used for connecting the second driving piece and a third driving piece connected with the lifting arm, the third driving piece is connected to one side of the turnover disc, which is located in the supporting seat, and the lifting arm is movably arranged in the through hole of the turnover disc.

Optionally, the both sides of lifting arm all are equipped with the stabilizer blade.

Optionally, the device further comprises a traversing module, the traversing module comprises a sliding block for supporting the supporting seat to slide, and a guide rail for supporting the sliding block to slide, a nut is arranged on the sliding block, a screw rod is inserted into the nut through internal threads, one end of the screw rod is connected with a fourth driving piece, and the fourth driving piece is fixedly arranged on the guide rail.

Optionally, the sucking disc group is equipped with three, and three sucking disc group is in the interval setting of horizontal direction, in order to realize adsorbing to the wafer slide multi-position.

Optionally, the wafer carrier comprises a supporting module, wherein the supporting module comprises a sucker for adsorbing and supporting a wafer and a bearing table for installing the sucker, and the sucker group and the sucker are adsorbed and pulled to opposite directions from the upper side and the lower side respectively so as to separate the wafer from the carrier.

Optionally, a supporting block is further arranged on one side of the bearing table, on which the sucker is mounted.

The beneficial effects of the utility model are as follows:

the force sensor is arranged between the second driving piece and the support bracket, and the force sensor is directly arranged on a force transmission path, so that the pulling force can be directly monitored in real time, and the force sensor does not need to be regulated in the monitoring process, so that the high efficiency of the monitoring process can be ensured, and meanwhile, the problem of inaccurate monitoring caused by operation errors in the regulating process can be avoided.

After the slide glass is separated from the wafer, the first driving piece can rotate 180 degrees through the adsorption module to enable the adhesive surface of the slide glass to turn over to the upper side, so that the adhesive surface of the slide glass can be prevented from being directly conveyed into the material box downwards, and meanwhile, the adhesive surface of the slide glass can be prevented from being contacted with a carrier, so that pollution of the adhesive surface of the slide glass to equipment can be reduced, and the cleanliness of the equipment is improved.

Drawings

FIG. 1 is a schematic diagram of a turnover module according to the present utility model;

FIG. 2 is a schematic diagram of an adsorption module according to the present utility model;

FIG. 3 is a schematic diagram of a traversing module according to the present utility model;

FIG. 4 is a schematic view of a support module according to the present utility model.

Reference numerals

100. A carrying platform;

102. a suction cup;

108. a support block;

201. a traversing module; 2011. a guide rail; 2012. a screw rod; 2013. a fourth driving member;

202. a support base;

203. a turn-over disc; 2031. a lifting arm;

205. a support leg;

206. a second driving member; 2061. a support frame;

209. a suction cup group;

212. a force sensor;

213. a support needle;

214. a flexible support plate;

215. a floating joint;

216. and a support bracket.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.

In view of the problems in the prior art, an embodiment of the present utility model provides a bonded wafer separating device, which includes a turnover module and an adsorption module connected to the turnover module, as shown in fig. 1 and fig. 2.

In the prior art of wafer separation equipment, a separated slide glass can only move in the vertical direction by being carried by the wafer separation equipment, and the adhesive surface of the slide glass is always at the lower side, so that on one hand, the adhesive surface of the slide glass is directly transmitted into a material box to pollute the material box, on the other hand, the adhesive surface of the slide glass is contacted with a carrier in the conveying process to cause the carrier to be polluted, so that the cleanliness of the equipment is reduced, in order to solve the problems, in the embodiment of fig. 1, the turnover module comprises a turnover disc 203, and a first driving part (not shown) which is connected with the turnover disc 203 and is used for driving the adsorption module to rotate 180 degrees, the first driving part is preferably a motor, but is not limited to a motor, after the slide glass is separated from a wafer, the slide glass is carried by the turnover module to rotate 180 degrees to enable the adhesive surface to be upward, the adhesive surface is prevented from being transmitted into the material box in the downward direction, and pollution caused by the adhesive surface equipment in the conveying process is prevented. The turnover module further comprises a supporting seat 202 for installing the turnover disc 203, as shown in fig. 1, the driving end of the first driving member is installed in the middle of one side of the turnover disc 203 located in the supporting seat 202, and the first driving member is fixed in the supporting seat 202, so that the turnover disc 203 can rotate along the central axis through the first driving member.

It is worth noting that through the turnover module in this application, the slide glass can be made 360 degrees of rotation adjustment in the vertical direction, and of course, the adjustment is performed by the worker in the field according to actual needs, and the description is omitted here.

In the existing wafer separating apparatus, the suction cups for the adsorption of the carrier are all of an integral structure, all parts of the carrier are stressed simultaneously during the adsorption, when the wafer is adhered to the carrier, the wafer adhesion parts are easily damaged due to the simultaneous stress of all parts, in order to solve the above problems, in the example of fig. 2, the adsorption module comprises a plurality of suction cup groups 209 which are arranged at intervals and are used for adsorbing the wafer carrier; the sucking disc group 209 is equipped with three, and the three sucking disc group 209 is in the interval setting on the horizontal direction, so that the realization is right the absorption of many positions of wafer slide glass, during the use, the sucking disc group 209 on the rightmost side upwards moves earlier, make slide glass and wafer peel off the opening earlier from the rightmost side, then make middle sucking disc group 209 in proper order, and the sucking disc group 209 upwards move on the leftmost side, peel off the middle part of slide glass and wafer in proper order, and slide glass and the left side of wafer, until slide glass and wafer are completely separated, through a plurality of in this embodiment sucking disc group 209's setting, when slide glass and wafer separation, can make the wafer gradually adapt to the pulling force, avoid the damage that takes place when all positions of wafer atress simultaneously.

Of course, in other examples, the number of the suction cup sets 209 may be four or more, and the suction cup sets 209 sequentially start to work from left or right to gradually separate the carrier and the wafer, which is not described herein.

In the example of fig. 2, three suction cup groups 209 are equidistantly arranged in the horizontal direction, wherein three suction cups which are annularly arranged are respectively arranged in the left suction cup group 209 and the right suction cup group 209, and the middle suction cup group 209 comprises three suction cups which are arranged in a straight line, so that when the suction cup groups are arranged in a separating way, the pulling force applied to a slide can be uniform, and meanwhile, the slide and a wafer can be better adapted to the pulling force.

In the example of fig. 2, there is further included a support bracket 216 connected to each of the suction cup sets 209, the support bracket 216 is preferably, but not limited to, a steel frame, and a flexible support plate 214 connected to the support bracket 216, the flexible support plate 214 is preferably, but not limited to, a flexible steel plate, and the flexible support plate 214 and the support bracket 216 are fixedly connected by screws. Each suction cup included in the suction cup group 209 comprises a suction cup body and a connecting pipe which are connected with each other, the connecting pipe movably passes through a movable hole on the flexible support plate 214 and is fixedly connected with the support bracket 216 through threads, and the suction cup body and the support bracket 216 are respectively arranged on two sides of the flexible support plate 214, wherein the support bracket 216 plays a role in supporting. The side of the support bracket 216 away from the flexible support plate 214 is provided with a second driving member 206, the driving end of the second driving member 206 is connected with the support bracket 216, the second driving member 206 is preferably an electric cylinder, but not limited to the electric cylinder, and the flexible support plate 214 has a certain flexible deformation to adapt to the pulling of the second driving member 206 while fixing each suction cup group 209. The force sensor 212 is arranged between the second driving member 206 and the support bracket 216, so that the pulling force signal of the second driving member 206 to the wafer slide is collected in real time, the force sensor 212 is electrically and/or communicatively connected with an external controller, the pulling force signal collected in real time is transmitted to the external controller by the force sensor 212, the external controller analyzes the pulling force signal and then controls the pulling force of the second driving member 206 in a feedback manner, and the pulling force monitoring device can achieve the effect of real-time monitoring on the pulling force and realize real-time regulation and control on the pulling force of the second driving member 206, so that the wafer is protected better.

In one embodiment, the attaching-wafer separating apparatus further includes a support frame 2061 for connecting the second driving member 206, as shown in fig. 2, the second driving member 206 is fixed on the support frame 2061, and the driving end of the second driving member 206 can move up and down relative to the support frame 2061. The support frame 2061 mainly supports the second driving member 206, so that the driving end of the second driving member 206 can drive the suction cup set 209 to move up and down through the support bracket 216 and the flexible support plate 214.

In one embodiment, the attaching-wafer separating apparatus further includes a floating joint 215, as shown in fig. 2, where the floating joint 215 is disposed between the second driving member 206 and the force sensor 212, for connecting the second driving member 206 and the force sensor 212, and the floating joint 215 may adapt to the deformation of the flexible supporting plate 214, and in particular, may perform an angular swing and a lateral movement according to the deformation of the flexible supporting plate 214.

In one embodiment, the attaching-wafer separating device further includes a plurality of supporting pins 213 vertically disposed in the movable holes of the flexible supporting plate 214, and as shown in fig. 2, specifically, the supporting pins 213 are fixedly connected to the supporting frame 2061, so that the suction cup group 209 can move up and down relative to the supporting pins 213 when the driving end of the second driving member 206 drives the suction cup group 209 to move up and down. The supporting needle 213 plays a role in supporting the slide, when the slide is used, after the turnover module is rotated 180 degrees, namely, the adhesive surface of the slide faces upwards, the sucker group 209 breaks vacuum, the second driving piece 206 drives the sucker group 209 to move downwards, the slide falls on the supporting needle 213, so that the sucker group 209 is separated from the slide, and a manipulator can extend into the position between the slide and the sucker to discharge the slide.

In one embodiment, the attaching-wafer separating apparatus further includes a connecting member, as shown in fig. 1, where the connecting member includes a lifting arm 2031 for connecting the second driving member 206, specifically, the lifting arm 2031 is connected to the supporting frame 2061, and a third driving member (not shown) connected to the lifting arm 2031, where the third driving member is preferably, but not limited to, a lifting cylinder, and the third driving member is connected to a side of the turntable 203 located in the supporting base 202, and the lifting arm 2031 is movably disposed in a through hole of the turntable 203. The connecting piece is used for driving the adsorption module to move in the vertical direction.

In one embodiment, the lifting arm 2031 is provided with a leg 205 on both sides, and as shown in fig. 1, the leg 205 is used for supporting and positioning.

In one embodiment, the attaching-wafer separating apparatus further includes a traversing module 201, as shown in fig. 3, where the traversing module 201 includes a slider supporting the support base 202 to slide, and a guide rail 2011 for supporting the slider to slide, a nut is disposed on the slider, a screw 2012 is inserted into the slider by internal threads of the nut, one end of the screw 2012 is connected to a fourth driving member 2013, and the fourth driving member 2013 is fixedly disposed on the guide rail 2011, where the fourth driving member is preferably but not limited to a motor. In use, the traversing module 201 moves in a horizontal direction with the flipping module and the adsorbing module.

In one embodiment, the attaching-wafer separating device further includes a supporting module, as shown in fig. 4, where the supporting module includes a chuck 102 that can be used to absorb and support a wafer, the chuck 102 is preferably made of a ceramic material, and a carrying table 100 on which the chuck 102 is installed, where the chuck group 209 and the chuck 102 absorb and pull the wafer slide in opposite directions from the upper and lower sides, respectively, so as to separate the wafer from the slide. In this embodiment, the wafer is sucked from below, specifically, the wafer is sucked onto the susceptor 100 by vacuum suction of the chuck 102.

In one embodiment, a supporting block 108 is further disposed on a side of the carrying platform 100 where the suction cup 102 is mounted, as shown in fig. 4, and the supporting block 108 is disposed in a matching manner with the supporting leg 205, specifically, when the lifting arm 2031 moves downward, the supporting leg 205 contacts with the supporting block 108.

In summary, the force sensor 212 is disposed between the second driving element 206 and the support bracket 216, and the force sensor 212 is directly disposed on the force transmission path, so that the pulling force can be directly monitored in real time, and the force sensor 212 does not need to be adjusted in the monitoring process, so that the high efficiency of the monitoring process can be ensured, and meanwhile, the problem of inaccurate monitoring caused by operation errors in the adjusting process can be avoided.

After the slide glass is separated from the wafer, the first driving piece can rotate 180 degrees through the adsorption module to enable the adhesive surface of the slide glass to turn over to the upper side, so that the adhesive surface of the slide glass can be prevented from being directly conveyed into the material box downwards, and meanwhile, the adhesive surface of the slide glass can be prevented from being contacted with a carrier, so that pollution caused by the adhesive surface of the slide glass to equipment can be reduced, and the cleanliness of the equipment is improved.

While embodiments of the present utility model have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present utility model as set forth in the following claims. Moreover, the utility model described herein is capable of other embodiments and of being practiced or of being carried out in various ways.

Claims (10)

1. The bonding wafer separating device is characterized by comprising a turnover module and an adsorption module connected with the turnover module; the turnover module comprises a turnover disc and a first driving piece which is connected with the turnover disc and used for driving the adsorption module to rotate by 180 degrees; the adsorption module comprises a plurality of sucking disc groups which are arranged at intervals and used for adsorbing the wafer slide, a support bracket connected with each sucking disc group, and a flexible support plate connected with the support bracket, wherein one side, away from the flexible support plate, of the support bracket is provided with a second driving piece, and a force sensor is arranged between the second driving piece and the support bracket so as to collect the pulling force signals of the second driving piece on the wafer slide in real time.

2. The bonded wafer separation apparatus of claim 1, further comprising a floating joint disposed between the second drive member and the force sensor for connection of the second drive member to the force sensor.

3. The bonded wafer separation apparatus of claim 1, further comprising support pins vertically disposed within the movable aperture of the flexible carrier plate.

4. A bonded wafer separation apparatus according to any one of claims 1 to 3, further comprising a support base for mounting the flipping tray, wherein the driving end of the first driving member is mounted in a middle portion of a side of the flipping tray located in the support base, and wherein the first driving member is fixed inside the support base.

5. The bonded wafer separation apparatus of claim 4, further comprising a connecting member, the connecting member comprising a lifting arm for connecting the second driving member, and a third driving member connected to the lifting arm, the third driving member being connected to a side of the flipping tray located in the support base, wherein the lifting arm is movably disposed in the through hole of the flipping tray.

6. The bonded wafer separation apparatus of claim 5, wherein legs are provided on both sides of the lifting arm.

7. The bonded wafer separating device according to claim 4, further comprising a traversing module, wherein the traversing module comprises a slider supporting the support base to slide, and a guide rail for supporting the slider to slide, a nut is provided on the slider, a screw is inserted into the nut through internal threads, one end of the screw is connected to a fourth driving member, and the fourth driving member is fixedly disposed on the guide rail.

8. The bonded wafer separating device of claim 1, wherein three suction cup groups are provided, and the three suction cup groups are arranged at intervals in a horizontal direction so as to realize multi-position suction on the wafer carrier.

9. The bonded wafer separation apparatus of any of claims 5-8, further comprising a support module comprising a suction cup operable to suction and support a wafer and a carrier for suction cup mounting, wherein the suction cup group and the suction cup respectively suction and pull the wafer slide in opposite directions from the upper and lower sides to separate the wafer from the slide.

10. The bonded wafer separation apparatus of claim 9, wherein the carrier on the side on which the suction cup is mounted is further provided with a support block.