TWI640058B - Level adjusting apparatus of substrate processing apparatus and level adjusting method using the same - Google Patents

Abstract

The invention relates to a level adjusting device of a substrate processing device and uses the same. Leveling method of leveling device. The level adjustment device of the substrate processing device of the present invention is a device provided below the chamber and adjusts the level of a support plate connected to a substrate on which a substrate is mounted. The level adjustment device of the substrate processing device is characterized in that: A first adjustment unit that moves the support plate up and down a certain distance; and a second adjustment unit that prevents the support plate from moving upward due to negative pressure inside the chamber.

Description

Level adjustment device for substrate processing device and use of this level adjustment Level adjustment method of joint device

The invention relates to a level adjustment device of a substrate processing device and a level adjustment method using the same.

When a thin film is formed on a substrate such as a semiconductor wafer (hereinafter referred to as a "substrate"), a wafer holder for mounting the substrate is provided inside a chamber in which a specific space is formed, and a supply is provided above the chamber. A gas supply unit of various process gases and / or purge gases is used to deposit a thin film on the substrate.

FIG. 12 shows a thin film deposition apparatus 10 having a conventional leveling device. Referring to FIG. 12, a wafer holder 16 including a gas supply portion 14 and a mounting substrate W is provided inside the chamber 12. An extension portion 18 extending downward from the wafer holder 16 is connected to a lower lift plate 20. In this case, the lifting plate 20 is provided so as to be movable up and down along the support bar 30. For example, it is provided as follows: A motor 32 is provided below, and the lifting plate 20 can be moved up and down along the support rod 30 by a ball screw (not shown) or the like driven by driving of the motor 32.

The support rod 30 is fixed to a support plate 40 connected below the chamber 12. Here, the support plate 40 is provided below the chamber 12 in a horizontally adjustable manner. That is, it may include: a fixed connection portion 50 that connects and fixes the support plate 40 and the chamber 12; and at least one lifting connection portion 60 that can perform minute lifting adjustment of the support plate 40. The lifting connection portion 60 may include a fastening rod 62 extending downward from the cavity 12 and one or more nuts 64 fastened to the fastening rod 62. Therefore, in the conventional structure, one side of the support plate 40 is raised and lowered slightly by tightening and loosening the nut 64, thereby performing level adjustment of the support plate 40.

However, in the configuration as described above, the distance between the upper surface of the substrate W and the gas supply portion 14 may have a great influence on the quality of the thin film deposited on the surface of the substrate W. That is, if the wafer holder 16 supporting the substrate W is not kept horizontal and the distance between the upper surface of the substrate W and the gas supply portion 14 becomes uneven, it is impossible to make vapor deposition onto the substrate W The thickness of the film on the surface is fixed and the quality of the film is significantly reduced.

In order to solve such a problem, as described above, in the conventional configuration, when the level of the support plate 40 connected to the crystal base 16 is adjusted, an operator manually rotates the nut 64, and This adjusts the level of the support plate 40. However, since this method operates manually, there is a problem in that the level of adjustment is different depending on the skill of the operator and the work technique. In addition, the In the conventional method, the adjustment is performed manually by the operator directly, so there is a problem that it is difficult to achieve a small adjustment and the accuracy of the horizontal adjustment is very low.

In order to solve the problems described above, an object of the present invention is to provide a level adjustment device that can adjust the level of the support plate very accurately and simply.

Furthermore, an object of the present invention is to provide a level adjustment device that can achieve minute adjustment very precisely when adjusting the level of the support plate.

The object of the present invention as described above is achieved by a level adjustment device for a substrate processing apparatus, which is a device provided below a chamber and adjusts the level of a support plate connected to a substrate on which a substrate is mounted. The level adjustment device of SKF includes: a first adjustment unit that moves the support plate up and down by a certain distance; and a second adjustment unit that prevents the support plate from going upward due to the negative pressure inside the chamber. mobile.

Here, at least one of the first adjustment unit and the second adjustment unit may include: a cam member that applies a force in a vertical direction to the support plate; and a driving unit that includes a rotation shaft, the rotation shaft The cam member is rotated by being connected to the cam member so as to be spaced apart from the center of rotation of the cam member by a specific distance.

In addition, the level adjustment device of the substrate processing apparatus may further include a bearing portion provided between the cam member and the support plate to cover the projection. The outer periphery of the wheel member reduces friction with the cam member. The level adjustment device of the substrate processing apparatus may further include a push rod, and one end of the push rod is in contact with the outer periphery of the bearing portion, and the support plate is raised and lowered by the rotation of the bearing portion. The level adjustment device of the substrate processing apparatus may further include a linear bush that guides the vertical movement of the push rod.

On the other hand, in a case where the first adjustment unit and the second adjustment unit each include the cam member and the driving portion, the driving portion of the first adjustment unit and the driving portion of the second adjustment unit can be synchronized The lifting of the supporting plate. In addition, any one of the first adjustment unit and the second adjustment unit may include a spring member.

On the other hand, in a case where the second adjustment unit includes the spring member, the spring force of the spring member is greater than the force removed from the support plate by being pulled upward due to the negative pressure inside the chamber. The load-bearing external force of the level adjustment device is smaller than a force that moves the support plate upward by the first adjustment unit. In addition, in a case where the first adjustment unit includes the spring member, an elastic force of the spring member is greater than a load of the horizontal adjustment device, and less than that the support plate is directed downward by the second adjustment unit Force of movement.

On the other hand, the object of the present invention as described above is achieved by a level adjustment method of a substrate processing apparatus, which includes a support plate connected to a wafer holder on which a substrate is mounted, a cam member that applies a specific force to the support plate, and A horizontal adjustment method including a horizontal adjustment device of a drive unit of a rotary shaft connected to the cam member to rotate the cam member so as to be spaced apart from the center of rotation of the cam member by a specific distance. Method, the level adjustment method of the above-mentioned level adjustment device is characterized by including the steps of: setting the case where the rotation axis and the rotation center of the cam member are horizontal by the rotation of the rotation axis; The shaft rotates in the forward direction or the reverse direction at the reference height, and the range of the rotation angle of the rotation shaft is less than 180 °; The support plate is lifted.

Here, the range of height adjustment of the support plate formed by the rotation of the rotation shaft may be less than twice the distance between the rotation shaft and the rotation center of the cam member.

On the other hand, before the step of setting the reference height, the method may further include mounting the substrate on an upper surface of the crystal base and rising to a process height.

According to the level adjustment device of the present invention having the above configuration, the level of the support plate can be adjusted very accurately and simply.

Furthermore, according to the present invention, when the level of the support plate is adjusted, fine adjustment can be realized very precisely.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

10‧‧‧ thin film evaporation device

12‧‧‧ chamber

14‧‧‧Gas Supply Department

16‧‧‧ Crystal Block

17‧‧‧ jacking pin

18, 42, 420‧‧‧ extension

20‧‧‧ Lifting plate

30‧‧‧ support bar

32‧‧‧ Motor

40‧‧‧ support plate

46‧‧‧through hole

50‧‧‧Fixed connection

60‧‧‧Lifting connection

62‧‧‧ Fastening rod

64‧‧‧ Nut

100, 200, 300‧‧‧ level adjustment device

102, 1020‧‧‧ first adjustment unit

104, 1040‧‧‧Second adjustment unit

110‧‧‧shell

112‧‧‧Groove section

114‧‧‧ opening

120, 1200‧‧‧Driver

122‧‧‧Rotary shaft

124‧‧‧ Reducer

130, 1300‧‧‧ cam members

132‧‧‧ center of rotation

140, 1400‧‧‧bearing department

150‧‧‧Push rod

160‧‧‧ Linear Bushing

180‧‧‧Fixed lever

190, 1900‧‧‧ spring member

d‧‧‧distance

W‧‧‧ substrate

FIG. 1 shows a horizontal adjustment device according to an embodiment of the present invention. The diagram below.

FIG. 2 is a perspective view of the level adjustment device.

FIG. 3 is a cross-sectional view taken along a line III-III in FIG. 2.

4 and 5 are cross-sectional views showing a leveling device according to a different embodiment.

FIG. 6 is a graph showing a rotation angle of a rotation shaft of the leveling device and a lifting distance of the support plate.

7 to 9 are diagrams showing a relationship between the rotation shaft and a rotation center of the cam member, which are formed according to a rotation angle of the rotation shaft.

FIG. 10 is a graph showing a state where the reference height in FIG. 6 is out of 90 ° with the phase of the rotation axis.

11 (A) and 11 (B) are schematic diagrams of a substrate processing apparatus for explaining a horizontal adjustment method of the present invention.

FIG. 12 is a diagram showing a substrate processing apparatus including a leveling apparatus having a conventional structure.

Hereinafter, referring to the drawings, a level adjustment device according to various embodiments of the present invention will be described in detail.

FIG. 1 is a schematic view showing a level adjustment device 100 according to an embodiment of the present invention provided below the chamber 12, and FIG. 2 is a perspective view of the level adjustment device 100. In FIG. 1, the description of the connection structure of the chamber 12, the support plate 40, the support rod 30, the crystal holder 16, and the like has been described in detail in the background art, and thus repeated descriptions are omitted.

Referring to FIGS. 1 and 2, the level adjustment device 100 may include: a first adjustment unit 102 that moves the support plate 40 up and down by a certain distance; and a second adjustment unit 104 that prevents the support plate 40 from moving due to accidents. The negative pressure inside the chamber 12 moves upward.

That is, the first adjustment unit 102 moves up and down toward the support plate 40 in order to perform horizontal adjustment of the support plate 40 as described below. Wherein, the supporting plate 40 is connected to the crystal base 16 through a supporting rod 30, and the crystal base 16 is located inside the cavity 12. In this case, if the inside of the chamber 12 is maintained in a specific vacuum state for a vapor deposition process or the like, a negative pressure is generated in the inside of the chamber 12 and the crystal seat 16 is caused by the The negative pressure rises upward. Such a rising effect changes the distance between the crystal base 16 and the gas supply portion 14 inside the chamber 12. Therefore, in the event that a negative pressure is generated inside the chamber 12, the second adjustment unit 104 prevents the support plate 40 from rising, thereby preventing the crystal holder 16 connected to the support plate 40 from rising and The distance between the crystal base 16 and the gas supply portion 14 is maintained.

As shown in FIGS. 1 and 2, the first adjustment unit 102 includes a housing 110 connected to a lower portion of the chamber 12. The casing 110 is fixed to the lower portion of the chamber 12 to form a groove portion 112 into which one side of the support plate 40 is inserted. In a state where one side of the support plate 40 is inserted in the groove portion 112, the support plate 40 is moved slightly up and down by the first adjustment unit 102, or prevented by the second adjustment unit 104 The support plate 40 rises to fix the height of the support plate 40.

FIG. 3 is a cross-sectional view taken along a line III-III in FIG. 2.

Referring to FIG. 3, the first adjustment unit 102 includes a cam member 130 that applies a specific force to the support plate 40, and a driving unit 120 that includes a rotation shaft 122 that communicates with the cam The rotation center of the member 130 is connected to the cam member 130 so as to be spaced apart by a specific distance, and the cam member 130 is rotated.

The housing 110 includes a driving portion 120 such as a motor, and a rotation shaft 122 extending from the driving portion 120 is connected to the cam member 130. At this time, the rotation center of the cam member 130 and the rotation shaft 122 of the driving portion 120 are connected to each other at a certain distance d. In Figure 3, The line is an imaginary line extending from the center of the rotation shaft 122 of the driving part 120, The line corresponds to an imaginary line extending from the rotation center of the cam member 130.

That is, the rotation shaft 122 of the driving portion 120 is connected at a specific distance away from the rotation center of the cam member 130, instead of being connected to the rotation shaft 122 of the driving portion 120 at the rotation center of the cam member 130. In the structure as described above, when the rotation shaft 122 is rotated by the driving of the driving portion 120, the cam member 130 is also rotated in conjunction with the rotation. In this case, the rotation center of the cam member 130 is positioned to be spaced from the center of the rotation shaft 122. Therefore, when the cam member 130 is rotated, the outer periphery of the cam member 130 and the The distance of the rotation axis 122 changes. That is, when the cam member 130 rotates, the outer periphery of the cam member 130 forms an irregular trajectory in which the distance from the rotation shaft 122 changes, instead of forming a fixed circular trajectory. Therefore, the outer periphery of the cam member 130 and the rotation shaft 122 When the distance is relatively long, the support plate 40 can be raised upward. On the contrary, when the distance between the outer periphery of the cam member 130 and the rotation shaft 122 is relatively short, the support plate 40 drops downward.

At this time, it may further include a bearing portion 140 that is provided between the cam member 130 and the support plate 40 to cover the outer periphery of the cam member 130 and apply a specific force. The bearing portion 140 prevents the cam member 130 from directly contacting a push rod 150 described later and prevents the cam member 130 or the push rod 150 from being worn.

Further, the level adjustment device 100 may further include a push rod 150, one end of which is in contact with the outer periphery of the bearing portion 140, and a specific one is applied to the support plate 40 by the rotation of the bearing portion 140. force.

The push rod 150 is provided so as to be able to move up and down through a linear bush 160. The linear bush 160 penetrates through an opening 114 provided on the other side of the housing 110. When the pushing lever 150 moves up and down by the rotation of the cam member 130, the linear bushing 160 guides the pushing lever 150 up and down. Therefore, when the bearing portion 140 rotates together with the rotation of the cam member 130, the push rod 150 moves up and down to raise and lower the support plate 40.

In addition, the push rod 150 supports the support plate 40 and prevents the support plate 40 from sagging. That is, when the cam member 130 is not rotated, the cam member 130 is fixedly engaged with the rotation shaft 122, so the upper end portion of the push rod 150 is fixed in height and can support the support plate 40 to prevent Sagging.

On the other hand, a speed reducer 124 may be positioned between the cam member 130 and the rotation shaft 122. The speed reducer 124 reduces the rotation force of the rotation shaft 122 and transmits the rotation force to the cam member 130. In this case, the reduction ratio of the speed reducer 124 may be determined corresponding to the maximum distance that the support plate 40 can move up and down.

FIG. 4 shows a level adjustment device 200 according to another embodiment.

Referring to FIG. 4, in this embodiment, the configuration of the push rod 150 of FIG. 3 is omitted, and the bearing portion 140 directly raises and lowers the support plate 40. In this case, the bearing portion 140 supports an extension portion 42 extending from the support plate 40. In the case of this embodiment, there is an advantage that the configuration of the level adjustment device 100 becomes simpler by omitting the configuration of the push rod 150 and the linear bushing 160, and the volume of the level adjustment device 100 can be reduced.

On the other hand, in FIGS. 2 and 3, the second adjustment unit 104 may include a spring member 190.

For example, as shown in FIG. 2 and FIG. 3, the fixing rod 180 may be provided through the groove portion 112 of the housing 110 up and down, and the spring member 190 may be provided above the fixing rod 180. At this time, a through hole 46 through which the fixing rod 180 can penetrate may be formed in the support plate 40, and the spring member 190 may press the support plate 40 downward. The spring member 190 is configured to prevent the crystal holder 16 and the support plate 40 from moving upward when a negative pressure is generated inside the chamber 12 as described above. The above-mentioned configuration is merely an example, and it is a matter of course that the configuration of omitting the fixing rod may be adopted, and the spring member is directly coupled to the housing to press the support plate.

Therefore, the spring force of the spring member 190 should be configured in such a manner that an external force that removes the load of the level adjustment device 100 is greater than a force that is pulled upward from the support plate 40 due to the negative pressure. In addition, the spring force of the spring member 190 should be smaller than the force of moving the support plate 40 upward by the first adjustment unit 102. The reason is that if the spring force of the spring member 190 is greater than the force that moves the support plate 40 upward by the first adjustment unit 102, the support is pushed upward by the first adjustment unit 102 In the case of the plate 40, the support plate 40 does not move upward due to the elastic force of the spring member 190.

On the other hand, in the above embodiment, the configuration in which the first adjustment unit 102 includes the cam member 130 and the second adjustment unit 104 includes the spring member 190 has been described, but the embodiment of the present invention is not limited to this. this.

That is, at least one of the first adjustment unit 102 and the second adjustment unit 104 may include the configuration of the cam member 130, and any one of the first adjustment unit 102 and the second adjustment unit 104 includes In the case of the configuration of the cam member 130, the other may include the spring member 190.

FIG. 5 shows a horizontal adjustment device 300 according to another embodiment in which the first adjustment unit 1020 includes a spring member 1900 and the second adjustment unit 1040 includes a cam member 1300 and a bearing portion 1400.

In this case, the spring member 1900 of the first adjusting unit 1020 continuously presses the extending portion 420 of the support plate 40 upward to prevent the support plate 40 from sagging. In addition, when the cam member 1300 and the bearing portion 1400 of the second adjustment unit 1040 are not rotated, the support plate 40 is prevented from rising, When the cam member 1300 and the bearing portion 1400 are rotated, the support plate 40 moves up and down. If the center of the cam member 1300 is positioned lower than the rotation axis of the driving portion 1200 by the rotation of the cam member 1300, the support plate 40 is pressed downward by the bearing portion 1400, so that The support plate 40 is lowered against the elastic force of the spring member 1900. On the contrary, if the center of the cam member 1300 is positioned higher than the rotation axis of the driving portion 1200 by the rotation of the cam member 1300, the support plate 40 is raised by the elastic force of the spring member 1900. In this case, the elastic force of the spring member 1900 is greater than the load of the level adjustment device, and less than the force that moves the support plate 40 downward by the second adjustment unit 1040. On the other hand, although not shown in the drawings, in the case where the first adjustment unit 102 and the second adjustment unit 104 each include the cam member 130, the first adjustment unit 102 The driving unit and the driving unit of the second adjustment unit 104 can be synchronized with each other to drive each other.

That is, when both the first adjustment unit 102 and the second adjustment unit 104 include the cam member 130, in order to realize that the first adjustment unit 102 below moves the support plate 40 upward, When the driving unit 120 rotates, the driving unit 120 of the second adjusting unit 104 is synchronized and driven so that the supporting plate 40 can be moved upward. In a case where the driving part 120 of the first adjustment unit 102 is driven to push the support plate 40 upward, if the second adjustment unit 104 is not driven, or the second adjustment unit 104 is pushed downward When the support plate 40 is described, the support plate 40 does not move upward. The same applies when the support plate 40 is moved downward by the first adjustment unit 102. because Here, the first adjustment unit 102 and the second adjustment unit 104 are driven in synchronization with each other to move the support plate 40 up and down, and further, the height of the support plate 40 is fixed after the movement so that the support plate 40 It does not move upward due to the negative pressure inside the chamber 12.

Hereinafter, a level adjustment method for moving the support plate 40 up and down in order to adjust the level of the support plate 40 by the level adjustment device 100 having the configuration of FIG. 3 will be observed. FIG. 6 shows the rotation angle of the rotation shaft 122 of the driving part 120 included in the first adjustment unit 102 of the level adjustment device 100 and the lifting distance of the support plate 40, and FIGS. 7 to 9 show the rotation shaft 122 according to the rotation shaft 122. The relationship between the rotation shaft 122 and the rotation center 132 of the cam member 130 formed by the rotation angle of. In FIG. 6, the horizontal axis represents the rotation angle (°) of the rotation shaft 122, and the vertical axis represents the lifting distance (mm) of the support plate 40. FIG. 7 shows a case where the phase of the rotation shaft 122 is rotated 0 ° clockwise in FIG. 6, and FIG. 8 shows a case where the phase of the rotation shaft 122 is rotated 90 ° clockwise in FIG. 6, FIG. 9 A case where the phase of the rotation shaft 122 is rotated 180 ° clockwise in FIG. 6 is shown. In FIGS. 7 to 9, for convenience, the case where the rotation shaft 122 rotates in the clockwise direction will be described, but it is of course possible to rotate in the opposite direction.

Referring to FIG. 6 and FIGS. 7 to 9, the level adjustment method includes the steps of setting a case where the rotation axis 122 and the rotation center of the cam member 130 are horizontal by the rotation of the rotation axis 122 as a reference. Height; the step of rotating the rotation shaft 122 in the forward or reverse direction at the reference height, and the range of the rotation angle of the rotation shaft 122 is less than 180 °; and making the rotation shaft 122 square The support plate 40 is raised and lowered by rotating in any one of the directions.

First, a case where the rotation center of the rotation shaft 122 and the rotation center of the cam member 130 are horizontal by the rotation of the rotation shaft 122 is set as a reference height. FIG. 8 shows a state where the rotation shaft 122 and the rotation center 132 of the cam member 130 are horizontal to each other. In this case, the height of the support plate 40 formed by the cam member 130 is set as a reference. height.

On the other hand, in FIG. 7, the rotation shaft 122 and the rotation center 132 of the cam member 130 are aligned perpendicular to each other, and the rotation center 132 is located below the rotation shaft 122. In this case, the outer periphery of the cam member 130 that is in contact with the support plate 40 is located below the reference height. In this case, the support plate 40 is located below the reference height. At this time, the distance between the support plate 40 and the reference height is the same as the separation distance d between the rotation shaft 122 and the rotation center.

In this state, if the rotation shaft 122 is further rotated 90 ° clockwise to reach the state of FIG. 8, the rotation shaft 122 and the rotation center 132 are horizontally aligned with each other, and the rotation center 132 and The rotation shafts 122 are located at the same height. In this case, the outer periphery of the cam member 130 that is in contact with the support plate 40 is at the reference height and the support plate 40 is at the reference height.

In this state, if the rotation shaft 122 is further rotated 90 ° clockwise to reach the state of FIG. 9, the rotation shaft 122 and the rotation center 132 are aligned perpendicular to each other, and the rotation center 132 is located at Above the rotation shaft 122. In this case, the outer portion of the cam member 130 that is in contact with the support plate 40 When the circumference exceeds the reference height, the support plate 40 moves upward. At this time, the distance between the support plate 40 and the reference height is the same as the separation distance d between the rotation shaft 122 and the rotation center 132.

As described above, a case where the rotation shaft 122 and the rotation center of the cam member 130 are horizontal by the rotation of the rotation shaft 122 (the phase of the rotation shaft at 90 ° or 270 ° in FIG. 6 Case) The reason for setting the reference height is that when the support plate 40 is moved up and down, the height adjustment range of the support plate 40 formed by the rotation of the rotation shaft 122 is within the range of the support plate 40. Between the highest point and the lowest point.

That is, when the rotation shaft 122 is rotated in the forward or reverse direction at the reference height, if the range of the rotation angle of the rotation shaft 122 is set to be less than 180 °, or if the rotation shaft 122 is set to be less than the rotation, The height adjustment range of the support plate 40 formed by the rotation of the rotation shaft 122 is set to twice the distance between the shaft 122 and the rotation center 142 of the cam member 130, as shown in FIG. 6, the The height adjustment range of the support plate 40 is located between the highest point and the lowest point of the support plate 40.

For example, when the distance between the rotation shaft 122 and the rotation center 142 of the cam member 130 in FIG. 6 is 1.5 mm, the distance between the highest point and the lowest point of the support plate 40 is equivalent to The separation distance is 3.0 mm twice, and the height adjustment range can be set to 2.0 mm. On both sides of the height adjustment range, a margin of 0.5 mm is provided up to the highest point and the lowest point. .

However, in the case where the reference height is set, it is practically difficult to level the rotation shaft 122 and the rotation center of the cam member 130 in reality (the phase of the rotation shaft is located at 90 ° or 270 in FIG. 6). In the case of °), the reference height is accurately set. Therefore, as shown in FIG. 10, if the phase of the rotation shaft 122 is deviated from 90 ° as the reference height and the range of the rotation angle of the rotation shaft 122 is set to 180 °, the The height adjustment range is separated from the highest point and the lowest point of the support plate 40. That is, when the rotation shaft 122 is rotated in order to maximize the support plate 40, the range of the rotation angle of the rotation shaft 122 exceeds 180 ° that the support plate 40 reaches the highest point. In this case, even if the phase of the rotation shaft 122 is rotated by 180 ° or more, the support plate 40 does not rise further, but starts to fall at the moment when the phase of the rotation shaft 122 exceeds 180 °. Therefore, in a case where the level of the support plate 40 is adjusted by controlling the driving of the rotation shaft 122 to adjust the height of the support plate 40, the level adjustment cannot be properly implemented.

After the rotation angle range of the rotation shaft 122 or the height adjustment range of the support plate 40 is set as described above, the rotation shaft 122 is rotated in either of a forward direction or a reverse direction to make the support The board 40 is raised and lowered. When the support plate 40 is raised or lowered by the rotation of the rotation shaft 122, the distance between the crystal base 16 and the gas supply unit 14 is measured using a measuring tool such as a calibration jig or the like. The distance between the crystal holder 16 and the gas supply portion 14 is fixedly maintained.

11 (A) and 11 (B) are for explaining the present invention. A schematic view of a substrate processing apparatus for a level adjustment method.

FIG. 11 (A) shows a so-called “lift position” in which the substrate W enters the inside of the chamber 12 and the substrate W is mounted on the upper end of the lifting pin 17, and FIG. 11 (B) shows the above-mentioned “lift position” The substrate W is mounted on the upper surface of the pedestal 16 and is raised to a so-called “process position” state of a process position.

In the case where the wafer base 16 is moved up and down between the jacking position and the processing position, the substrate W can be accurately mounted on the jacking pin 17 only by accurately moving in the vertical direction. If the horizontal adjustment method is performed in the lifting position, that is, in a state where the substrate W is mounted on the upper end portion of the lifting pin 17, the crystal base 16 is moved upward in a skewed state without Will accurately rise in the vertical direction. Therefore, the position of the substrate W rises in a skewed state, and subsequent processes cannot be performed smoothly. Therefore, before the step of setting the reference height, a step of mounting the substrate W on the upper surface of the crystal base 16 and rising to the process height may be included. That is, the level adjustment method may be performed with the substrate W at the processing position.

In addition, in a case where the horizontal adjustment method is performed at the processing position and a subsequent process is ended, before the substrate is lowered to the jacking position, the crystal holder 16 needs to be restored to the position before the horizontal adjustment method is performed. Horizontal state. The reason is that only when the state of the crystal base 16 is restored to the original state as described above, the crystal base 16 can be accurately lowered in the vertical direction and the substrate W can be accurately mounted on the jack pin 17. .

On the other hand, the level adjustment method may be performed when each substrate W enters the chamber 12 or in any one of a plurality of processing processes for the substrate W. In addition, the level adjustment method can be applied not only to a case where the distance between the crystal base 16 and the gas supply part 14 is fixedly maintained, but also to intentionally make the crystal base 16 and the gas When the distance between the supply units 14 is different, the processing result of the specific area of the said board | substrate W may differ.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

Claims (11)

A level adjustment device for a substrate processing apparatus is provided with a device for adjusting the level of a support plate connected to a substrate on which a substrate is mounted under a chamber. The level adjustment device for the substrate processing device includes: a first adjustment A unit that moves the support plate up and down a specific distance to adjust the support plate horizontally; and a second adjustment unit that prevents the support plate from moving upward due to the negative pressure inside the chamber, wherein At least one of the first adjustment unit and the second adjustment unit includes: a cam member that applies a force in a vertical direction to the support plate; and a driving portion that includes a rotation shaft that communicates with the rotation shaft. The rotation center of the cam member is connected to the cam member so as to be spaced apart from each other by a predetermined distance, so that the cam member is rotated. The level adjustment device of the substrate processing apparatus according to item 1 of the scope of patent application, further comprising a bearing portion provided between the cam member and the support plate to cover an outer periphery of the cam member, The friction with the cam member is reduced. The level adjustment device for a substrate processing apparatus according to item 2 of the patent application scope, further comprising a push rod, one end of which is in contact with the outer periphery of the bearing portion, and the bearing portion is rotated to rotate the bearing portion. The support plate is lifted. The level adjustment device of the substrate processing device according to item 3 of the scope of patent application, further comprising a linear bushing that guides the up and down movement of the push rod. The level adjustment device for a substrate processing apparatus according to item 1 of the scope of patent application, wherein the first adjustment unit and the second adjustment unit each include the cam member and the drive unit. The driving portion of the first adjusting unit is synchronized with the driving portion of the second adjusting unit to raise and lower the support plate. The level adjustment device of the substrate processing apparatus according to item 1 of the scope of patent application, wherein any one of the first adjustment unit and the second adjustment unit includes a spring member. The level adjustment device of the substrate processing apparatus according to item 6 of the scope of patent application, wherein in a case where the second adjustment unit includes the spring member, an elastic force of the spring member is greater than that from the support plate due to the The force of being pulled upward by the negative pressure inside the chamber removes the external force of the load of the level adjustment device, which is smaller than the force of moving the support plate upward by the first adjustment unit. According to the level adjustment device of the substrate processing apparatus according to item 6 of the patent application scope, in a case where the first adjustment unit includes the spring member, an elastic force of the spring member is greater than a load of the level adjustment device, A force smaller than that by which the support plate is moved downward by the second adjustment unit. A horizontal adjustment method of a substrate processing apparatus, comprising a support plate connected to a wafer holder on which a substrate is mounted, a cam member that applies a specific force to the support plate, and a method that is spaced apart from a rotation center of the cam member. A method of adjusting the level of a level adjustment device of a driving portion of a rotating shaft connected to the cam member to rotate the cam member in a distance manner, the method of adjusting the level of the substrate processing device includes: A reference height is set when the rotation shaft is horizontal with the rotation center of the cam member; the rotation shaft rotates in the positive direction or the reverse direction at the reference height, and the rotation angle of the rotation shaft The range is less than 180 °; and the support plate is raised and lowered by rotating the rotation axis in any one of the forward direction or the reverse direction. The horizontal adjustment method of the substrate processing apparatus according to item 9 of the scope of patent application, wherein a height adjustment range of the support plate formed by rotation of the rotation shaft is smaller than the rotation of the rotation shaft and the cam member The distance between the centers is doubled. The horizontal adjustment method of the substrate processing apparatus according to item 9 of the scope of patent application, before setting the reference height, the method further includes mounting the substrate on the upper surface of the wafer base and rising to a process height.