JPH08335624A - Rotary type wafer treating apparatus - Google Patents

Rotary type wafer treating apparatus

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Publication number
JPH08335624A
JPH08335624A JP16466095A JP16466095A JPH08335624A JP H08335624 A JPH08335624 A JP H08335624A JP 16466095 A JP16466095 A JP 16466095A JP 16466095 A JP16466095 A JP 16466095A JP H08335624 A JPH08335624 A JP H08335624A
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Prior art keywords
substrate
member
regulating member
outer peripheral
peripheral edge
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JP16466095A
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Japanese (ja)
Inventor
Manabu Yabe
学 矢部
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Dainippon Screen Mfg Co Ltd
大日本スクリーン製造株式会社
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Abstract

PURPOSE: To position a substrate carried into a rotary substrate treating apparatus by a simple constitution.
CONSTITUTION: A motor-driven turn table 3 has a pin-like member 11 for supporting the back side of a substrate W and members 12 for regulating the horizontal position of the substrate W. Each regulating member 12 is rotatable round the center axis PJ and capable of oscillating round the oscillation support point YS and normally pressed toward the outer marginal edge of the substrate W by a compression coil spring 15. Below the table 3 an annular lift member 16 having a slope to displace the lower end 12b of the regulating member 12 is liftable disposed to switch the return and release of each regulating member 12 as it goes up and down. Specific regulating member 12 is driven to rotate round the axis PJ by a drive arm whereby the substrate W is rotated, relative to the regulating member 12 and any regulating member 12 is point-contacted with the original flat of the substrate W to position it.
COPYRIGHT: (C)1996,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、オリエンテーションフラットやノッチなどの切り欠き部を有する半導体基板の裏面を支持するとともに、切り欠き部を含む複数個所で基板の外周端縁に点接触して基板の水平方向の位置を規制した状態で基板を所定の回転中心周りで回転させながらその基板に処理液の塗布や、洗浄、現像などの処理を施すための、例えば、スピンコーター(基板回転式のフォトレジスト塗布装置)、スピンスクラバー(基板回転式のブラシ洗浄装置)、スピンデベロッパー(基板回転式の現像装置)などを含む回転式基板処理装置に関する。 The present invention relates, to support the back surface of the semiconductor substrate having a notch portion such as an orientation flat or a notch, in point contact with the outer peripheral edge of the substrate at a plurality of locations including a cutout portion substrate the coating or of the treatment liquid on the substrate while rotating the substrate at a predetermined rotation around the center in a state of restricting the horizontal position, cleaning, for performing processing such as development, for example, a spin coater (substrate rotating photoresist coating apparatus), a spin scrubber (substrate rotating brush cleaning device), relates to rotary substrate processing apparatus including a spin developer (developing device substrate rotating).

【0002】 [0002]

【従来の技術】従来のこの種の回転式基板処理装置は、 BACKGROUND OF THE INVENTION this type of conventional rotary substrate processing apparatus,
支持部材と規制部材とを設けた回転台と、回転台を所定の回転軸周りで回転させるモータなどを備えて構成されている。 A turntable provided with the support member and the regulating member is configured to include a motor or the like for rotating the turntable around a predetermined rotation axis.

【0003】切り欠き部を有する半導体基板は、その基板の回転中心を回転台の回転軸に略一致させて回転台上方から搬入され、回転台に設けられた支持部材に水平状態に載置され支持される。 [0003] notched portion semiconductor substrate having is carried rotation center of the substrate from substantially matched so turntable upward to turntable rotation axis, is placed in a horizontal position to a support member provided on the turntable It is supported. この状態で回転台を回転させると、基板は水平方向に変位するが、この回転中の基板の水平方向の位置を規制するのが規制部材である。 Rotating the turntable in this state, the substrate is displaced in the horizontal direction, a regulating member to regulate the horizontal position of the substrate during the rotation. すなわち、規制部材は、例えば、複数個のピン状の部材で構成され、これらピン状の規制部材が、搬入され支持部材に支持された状態で回転される基板の外周端縁の複数個所に点接触するように回転台に配設固定されている。 That is, the regulating member is formed of, for example, a plurality of pin-like members, these pin-shaped regulating member, a point at a plurality of locations of the outer peripheral edge of the substrate rotated while being supported by the carried-support member It is arranged fixed to the turntable in contact. この規制部材によって支持部材に支持された基板は、回転台が回転されると水平方向への変位が規制され基板は所定の回転中心周りに回転される。 Substrate supported on the support member by the restricting member, the substrate turntable is regulated displacement to when it is rotated horizontally is rotated in a predetermined rotation center around.

【0004】なお、上記規制部材の全てが基板の切り欠き部以外の円弧部分に点接触するように各規制部材が配設固定されていると、回転台を回転させても基板と規制部材とがスリップして回転台の回転が基板に有効で伝達されない。 [0004] Incidentally, when the restricting member so that all the regulating member contacts a point on the arc portion other than the cutout portion of the substrate is disposed fixed, and the substrate be rotated turntable and regulating member There rotation of the turntable is not transmitted effective substrate slip. 従って、規制部材の少なくとも1つは基板の切り欠き部に点接触し、この切り欠き部に点接触された規制部材に基板が押し出されることで、回転台の回転を基板に有効に伝達させている。 Thus, at least one of the regulating member is in point contact to the notch portion of the substrate, that substrate the regulating member which is a point contact with the notches is pushed out, by effectively transmitting the rotation of the turntable to the substrate there. このため、各規制部材は、基板の外周端縁の円弧部分と切り欠き部とを含む形状を模した形状に沿って配設固定され、かつ、少なくとも1本の規制部材は切り欠き部に対応する位置に配置され、また、基板の搬入においては、基板の切り欠き部に点接触される規制部材の位置に基板の切り欠き部が位置されるように位置合わせされて搬入される。 Thus, the restricting member has a shape including a cutout portion and the outer peripheral end arc part of the edge of the substrate along the shape imitating the arrangement and fixation, and at least one restricting member corresponding to the notches It is disposed at a position, and in the loading of the substrate, the cutout portion of the substrate at the position of the regulating member to be in point contact with the notch portion of the substrate is carried in alignment so as to be positioned.

【0005】ところで、基板が搬入され支持部材に支持されているが回転されていないという状態において、全ての規制部材が基板の外周端縁に点接触するように各規制部材が配設されていると、搬入時に基板の外周端縁と規制部材とが擦れて粉塵(パーティクル)が発生するので好ましくない。 Meanwhile, in a state that although the substrate is supported by the support member is carried not rotated, the restricting members so that all of the regulating member contacting point on the outer peripheral edge of the substrate is disposed If, undesirable dust outer peripheral edge of the substrate during loading and the regulating member rubbing with (particles) occurs. また、所定の処理が施された基板を搬出する場合には、基板を回転台上方に搬送するが、この場合にも搬入時と同様に基板の外周端縁と規制部材とが擦れる。 Furthermore, when unloading the substrate which the predetermined processing has been performed is to transfer the substrate to the turntable above and an outer peripheral edge of the substrate in the same manner as when carried in this case and the regulating member rubs.

【0006】そこで、従来装置では、例えば、基板が搬入され支持部材に支持された状態で、基板の外周端縁と規制部材との間に若干の隙間(遊び)が形成されるように、すなわち、基板の外周端縁の形状より一周り大きな形状に沿って、各規制部材が配設固定され、搬入・搬出時の基板の外周端縁と規制部材との接触を防止するように構成されている。 [0006] Therefore, in the conventional apparatus, for example, in a state where the substrate is supported by the supporting member is carried, so a slight gap between the outer peripheral edge and the regulating member of the substrate (play) is formed, i.e. , along a circumference shape larger than the shape of the outer peripheral edge of the substrate, the restricting member is disposed fixed, and is configured to prevent contact of the outer peripheral edge of the substrate during loading and unloading and the regulating member there.

【0007】 [0007]

【発明が解決しようとする課題】しかしながら、このような構成を有する従来例の場合には、次のような問題がある。 However [0007], in the case of the conventional example having the above construction has the following problems. すなわち、上記従来装置の構成では、基板の回転中心を回転台の回転軸に略一致させるとともに、基板の切り欠き部に点接触される規制部材の位置に基板の切り欠き部が位置されるように位置合わせして基板を搬入しなければならず、搬入動作が複雑になるし、また、この位置合わせを行うための特別の位置合わせ機構を回転式基板処理装置の外部に設けなければならず、装置構成も複雑、かつ、コスト高を招くという問題がある。 That, in the configuration of the conventional apparatus, causes substantially match the rotation center of the substrate to the turntable rotation axis, so that the notches of the substrate is positioned in the position of the regulating member to be in point contact with the notch portion of the substrate must load the substrate and aligned with, to carry operation is complicated, also, it is necessary to provide a special positioning mechanism for the alignment outside the rotary substrate processing apparatus also apparatus configuration complicated, and there is a problem that the cost is high.

【0008】また、上述したように遊び部分を設けて各規制部材を配設固定していると、回転台(基板)の回転当初においては、基板の外周端縁は規制部材に点接触しておらず、水平方向の位置が固定的に規制されていないので、この回転の開始から基板が安定して回転されるまでの間は、基板は、各規制部材で規制されない範囲内で基板の水平方向の位置が変位し、これにより、基板の外周端縁が規制部材に回転方向に相対変位して摩擦が生じ、基板の外周端縁や規制部材を傷付けたり、パーティクルが発生するなどの問題がある。 Further, when are in by the restricting members provided play portion disposed fixed as described above, at the beginning the rotation of the turntable (substrate), the outer peripheral edge of the substrate is in point contact with the regulating member Orazu, since the position of the horizontal direction is not fixedly regulation, between the start of the rotation until the substrate is rotated stably, the substrate horizontal substrate within a range not regulated by each regulating member direction position is displaced, by this, the outer peripheral edge of the substrate occurs in the rotational direction relative displacement friction regulating member, or damage the outer peripheral edge and the regulating member of the substrate, problems such as particles are generated is there.

【0009】本発明は、このような事情に鑑みてなされたものであって、簡単な構成で基板の位置合わせが行なえ、かつ、基板の搬入・搬出時の基板の外周端縁と規制部材の接触を防止するとともに、基板(回転台)の回転当初における基板の外周端縁と規制部材との摩擦を軽減することもできる回転式基板処理装置を提供することを目的とする。 [0009] The present invention was made in view of such circumstances, perform the alignment of the substrate with a simple structure, and the substrate during loading and unloading of the substrate outer peripheral edge and the regulating member thereby preventing contact, and an object thereof is to provide a rotary substrate processing apparatus which can also reduce the friction between the outer peripheral edge and the regulating member of the substrate rotating the original substrate (turntable).

【0010】 [0010]

【課題を解決するための手段】本発明は、このような目的を達成するために、次のような構成をとる。 SUMMARY OF THE INVENTION The present invention, in order to achieve the above object, the following construction. すなわち、本発明は、オリエンテーションフラットやノッチなどの切り欠き部を有する半導体基板(以下、基板と略す)の裏面を支持するとともに、前記切り欠き部を含む複数個所で前記基板の外周端縁に点接触して前記基板の水平方向の位置を規制した状態で前記基板を所定の回転中心周りで回転させながらその基板に所定の処理を施す回転式基板処理装置であって、回転台と、前記回転台を所定の回転軸周りで回転させる回転駆動手段と、前記回転台に設けられ、前記基板の裏面を支持する支持部材と、前記回転台に設けられ、前記支持部材に支持され回転される前記基板の外周端縁の、少なくとも前記切り欠き部を含む複数個所に点接触して前記基板の水平方向の位置を規制するとともに、それぞれ横断面が略円形で中心軸周りに回転 That is, the present invention includes a semiconductor substrate (hereinafter, referred to as substrate) having a cutout part such as an orientation flat and a notch point to support the rear surface of the outer peripheral edge of said substrate at a plurality of locations including the notch a contact with the rotary substrate processing apparatus for performing predetermined processing said substrate while regulating the horizontal position to the substrate while rotating at a predetermined rotation center around the substrate, and the turntable, the rotation a rotation driving means for rotating the platform about a predetermined rotation axis, is provided in the turntable, and a support member for supporting the back surface of the substrate, provided on said rotary table, said to be rotated is supported by the support member the outer peripheral edge of the substrate, while regulating the horizontal position of the substrate in point contact at a plurality of locations including at least the notch, the rotation around the central axis, respectively cross-section a substantially circular 在に構成された複数個の規制部材と、 A plurality of restricting members configured stationary,
前記各規制部材が前記基板の外周端縁に接触しない前記基板の外周端縁外側の退避位置に前記各規制部材を退避させる退避手段と、前記退避手段による各規制部材の退避が解除された状態で、前記各規制部材を前記基板の外周端縁方向に付勢させる付勢手段と、搬入され前記支持部材に支持された基板と、前記退避手段による退避が解除された各規制部材とを、逆回りの回転方向へ相対回転させる相対回転手段と、を備えたものである。 State in which the retracting means for retracting the respective regulating member to the retracted position of the outer peripheral edge outside of the substrate on which the each regulating member does not contact the outer peripheral edge of the substrate, the retraction of the restricting member by the retracting means is released in a biasing means for biasing the restricting members to the outer peripheral edge direction of the substrate, the substrate supported by the support member is carried, and the restricting members saving has been canceled by the retreating means, relative rotation means for relatively rotating the opposite direction to the rotational direction, in which with a.

【0011】 [0011]

【作用】本発明の作用は次のとおりである。 [Action] operation of the present invention is as follows. まず、基板の搬入について説明する。 It will be described first loading of the substrate. 退避手段は各規制部材を退避位置に退避させる。 Retracting means retracts the restricting members in the retracted position. この各規制部材の退避状態で基板は搬入され、支持部材に支持される。 The substrate in the retracted state of the restriction member is carried, is supported on the support member. このとき、所定の規制部材の位置と基板の切り欠き部の位置とが位置合わせされている必要はないし、基板の回転中心と回転台の回転軸とが若干偏心していてもよい。 At this time, do not need the positions of the notches of the substrate of a predetermined regulating member is aligned with the center of rotation of the substrate and the turntable of the rotational shaft may be eccentric slightly. また、各規制部材は退避位置に退避されているので、搬入される基板が規制部材と擦れるなどの不都合がない。 Further, since the restricting member is retracted to the retracted position, the substrate to be conveyed there is no inconvenience such as rubbing and the regulating member.

【0012】次に、搬入された基板の位置合わせについて説明する。 [0012] Next, a description will be given alignment of the loaded substrate. 退避手段は各規制部材の退避状態を解除する。 Retracting means releases the retracted state of the restriction member. これにより、付勢手段は、各規制部材を基板の外周端縁方向に付勢させる。 Thus, biasing means, each restriction member is urged to the outer peripheral edge direction of the substrate. この結果、各規制部材は基板の外周端縁に点接触される。 As a result, the restricting member is in point contact with the outer peripheral edge of the substrate. なお、基板の回転中心と回転台の回転軸とが若干偏心して搬入された場合には、上記各規制部材が基板の周囲から基板の外周端縁を押すことによって、基板の回転中心と回転台の回転軸とが略一致されるように基板が水平変位される。 In the case where the rotation center of the substrate and the turntable of the rotational shaft is carried eccentrically slightly, by the respective regulating member presses the outer peripheral edge of the substrate from the periphery of the substrate, the turntable and the rotation center of the substrate the substrate is horizontally displaced so that the rotary shaft is substantially coincident. そして、相対回転手段は、搬入され支持部材に支持された基板と、基板の外周端縁に点接触される各規制部材とを、逆回りの回転方向へ相対回転させる。 Then, relative rotation means comprises a substrate supported carried by the support member, and a respective regulating member which is in point contact with the outer peripheral edge of the substrate, the opposite direction to the rotation direction causing relative rotation. この相対回転によって、各規制部材が点接触する基板の外周端縁の位置が変位する。 This relative rotation, the position of the outer peripheral edge of the substrate the restricting member is in point contact is displaced. なお、この点接触位置の変位は、各規制部材が中心軸周りに回転しながら基板の外周端縁を送るようにして行われるので、基板と各規制部材との相対変位はころがり摩擦に変換され、摩擦係数が小さくなり、パーティクルが発生し難い。 Incidentally, the displacement of the point contact position, since the restricting member is carried out to send the outer peripheral edge of the substrate while rotating around the central axis, the relative displacement between the substrate and the restricting member is converted into rolling friction , the friction coefficient becomes small, particles are less likely to occur. そして、基板と各規制部材とが所定角度、相対回転する間に、いずれかの規制部材は、基板の切り欠き部の外周端縁に点接触され、基板と規制部材との位置合わせがなされる。 Then, while the substrate and the restricting members are predetermined angle, relative rotation, one of the regulating member is in point contact with the outer peripheral edge of the notch of the substrate, alignment between the substrate and the regulating member is made .

【0013】次に、回転駆動手段が回転台を回転させることで、位置合わせされた基板が基板の回転中心(回転台の回転軸に略一致)周りに回転される。 [0013] Next, the rotation driving means by rotating the turntable, the substrate in alignment is rotated about (substantially equal to the turntable rotation axis) rotation center of the substrate. なお、各規制部材は、切り欠き部を含む基板の外周端縁に付勢されて点接触されているので、遊び部分がなく、この回転台(基板)回転当初においても基板は水平方向へ変位し難く、基板の外周端縁と規制部材との摩擦が起き難い。 Each regulating member, since the contact point is biased to the outer peripheral edge of the substrate including the notch portion, there is no play portion, the substrate in this turntable (substrate) rotating initially displaced horizontally hardly, rarely occurs friction between the outer peripheral edge and the regulating member of the substrate. また、仮に付勢される規制部材に抗して基板が水平方向へ変位し、基板の外周端縁と規制部材とが回転方向に相対変位しても、この相対変位は規制部材の回転によってころがり摩擦に変換され、摩擦係数が小さくなるので、パーティクルが発生し難い。 Further, if the substrate is displaced in the horizontal direction against the regulating member is biased, even the regulating member and the outer peripheral edge of the substrate is relatively displaced in the rotational direction, the relative displacement is rolling by rotation of the regulating member is converted into frictional, the friction coefficient becomes small, particles are less likely to occur. 基板が安定して回転している状態でこの基板に所定の処理を施し、処理が終了すると、回転台の回転を停止して基板の回転を停止する。 Substrate subjected to stable predetermined processing on the substrate in a state where the rotation, the end of the process, to stop the rotation of the turntable to stop the rotation of the substrate.

【0014】次に、退避手段が各規制部材を退避位置に退避させ、この状態で基板は搬出される。 [0014] Next, retracting means retracts the restricting members in the retracted position, the substrate in this state is unloaded. このとき、各規制部材は退避位置に退避されているので、搬出される基板が規制部材と擦れるなどの不都合がない。 At this time, since the restricting member is retracted to the retracted position, the substrate to be unloaded there is no inconvenience such as rubbing and the regulating member.

【0015】 [0015]

【実施例】以下、図面を参照して本発明の一実施例を説明する。 EXAMPLES Hereinafter, a description will be given of an embodiment of the present invention with reference to the drawings. <第1実施例>図1は、本発明の第1実施例に係る回転式基板処理装置の全体概略構成を示す縦断面図であり、 <First Embodiment> FIG 1 is a longitudinal sectional view showing an overall schematic configuration of a rotary substrate processing apparatus according to a first embodiment of the present invention,
図2は、要部の平面図、図3(a)は、要部の縦断面図、図3(b)は、図3(a)のA−A矢視断面図、図4(a)は、駆動アームの概略構成を示す平面図、図4 Figure 2 is a plan view of an essential part, FIG. 3 (a), longitudinal sectional view of an essential part, FIG. 3 (b), A-A sectional view taken along line of FIG. 3 (a), FIGS. 4 (a) is a plan view showing a schematic configuration of a drive arm, FIG 4
(b)は、図4(a)の側面図である。 (B) is a side view of FIG. 4 (a). なお、この実施例では切り欠き部であるオリエンテーションフラット(以下、オリフラと略す)を有する半導体基板(以下、 Incidentally, the orientation flat (hereinafter referred to as the orientation flat) is a cut-away portion in this embodiment a semiconductor substrate having a (hereinafter,
基板と略す)に対してフォトレジストを塗布するためのスピンコーターを例に採って説明する。 A spin coater for applying photoresist against abbreviated to substrate) is described as an example.

【0016】図中、符号1は電動モータであり、この電動モータ1の駆動によって回転支軸2の上端に一体回転可能に連結された回転台3が鉛直方向の回転軸CJ周りで回転される。 [0016] In the figure, reference numeral 1 is an electric motor, are rotated integrally rotatably linked rotary shaft CJ around the rotary table 3 is vertically to the upper end of the rotary shaft 2 by the driving of the electric motor 1 .

【0017】回転台3およびそれによって後述するように搬入され水平姿勢に保持された基板Wの周囲は、昇降駆動機構(図示せず)によって昇降可能な下側の第1のカップ4と、それより上側の第2のカップ5とで覆われている。 The periphery of the turntable 3 and the substrate W held by the carried-horizontal position as described below by it, the first cup 4 elevatable lower by the lifting drive mechanism (not shown), it covered with more and second cup 5 of the upper.

【0018】第2のカップ5の外側には、後述するように位置合わせされた基板W上の回転中心(回転台3の回転軸CJに略一致する)に相当する供給位置と基板W上から離れた待機位置との間で移動可能に構成された液供給ノズル6が設けられ、供給位置において基板Wの表面にフォトレジスト液を供給し、基板Wの回転により基板Wの表面にフォトレジスト液を塗布できるように構成されている。 [0018] On the outside of the second cup 5, from the supply position and the substrate W, which corresponds to the rotational center of the substrate W which is aligned as will be described later (approximately coincides with the rotation axis CJ of the turntable 3) provided the liquid supply nozzle 6 movably configured between the remote standby position, supplying a photoresist solution onto the surface of the substrate W at the feed position, the photoresist solution on a surface of the substrate W by the rotation of the substrate W It is configured to be applied to.

【0019】また、第2のカップ5の外側には、位置合わせされた基板Wの外周端縁上に相当する供給位置と基板W上から離れた待機位置との間で移動可能に構成された溶剤供給ノズル7が設けられ、供給位置において回転中の基板Wの表面の外周端縁に溶剤を供給し、基板Wの外周端縁に付着したフォトレジスト液を洗浄除去できるように構成されている。 Further, on the outer side of the second cup 5, which is configured to be movable between a standby position away from the supply position and the substrate W, which corresponds to the outer peripheral edge of the aligned substrate W solvent supply nozzle 7 is provided, the solvent is supplied to the outer peripheral edge of the surface of the substrate W during rotation at the feed position, it is configured to be washed off the photoresist liquid that has adhered to the outer peripheral edge of the substrate W .

【0020】回転台3の上面には、その周方向に所定間隔を隔てて、例えば樹脂製の複数本(図では3本)のピン状支持部材11が設けられ、搬入された基板Wの裏面に点接触して基板Wを水平姿勢で支持するように構成されている。 [0020] the upper surface of the turntable 3 at a predetermined distance in the circumferential direction, for example, pin-like support member 11 made of resin a plurality of (three in the drawing) is provided, the back surface of the wafer W loaded therein two-point contact with and is configured to support a substrate W in a horizontal attitude.

【0021】また、回転台3の上面のピン状支持部材1 Further, pin-like support member of the upper surface of the turntable 3 1
1よりも外側には、回転台3の周方向に所定間隔を隔てて、セラミックやステンレスで構成される、横断面が略円形の複数本(図では6本)のピン状の規制部材12が設けられ、ピン状支持部材11に支持され回転される基板Wの外周端縁に点接触して基板Wの水平方向の位置を規制するように構成されている。 Outside than 1, at a predetermined distance in the circumferential direction of the turntable 3, constituted by a ceramic or stainless steel, pin-like regulating member 12 of the plurality of cross-section substantially circular (six in the figure) is provided, and is configured to regulate the horizontal position of the substrate W in point contact with the outer peripheral edge of the substrate W being rotated is supported by a pin-like support member 11.

【0022】これら各規制部材12は、それぞれ回転台3を回動自在に貫通され、回転台3内の空孔3a内に設置されたベアリングケース13aに収納されたベアリング13によって中心軸PJ周りに回転可能に構成されている。 [0022] These restricting members 12 are freely penetrate respectively rotating the turntable 3, the central axis PJ around the turntable 3 in the holes 3a in the bearing 13 housed in the installed bearing case 13a in It is rotatably configured. また、各規制部材12には、ベアリング13(ベアリングケース13a)を上方から覆うカバー14が一体的に取り付けられ、フォトレジスト液や溶剤などの処理液がベアリング13の周辺や内部に入り込むのを防止し、処理液によるベアリング13の腐食や湿潤が損なわれるのを防止している。 In addition, each restricting member 12, prevents the bearing 13 (bearing case 13a) cover 14 for covering the upper side is integrally attached to the treatment liquid such as a photoresist liquid or solvent from entering the inside and around the bearing 13 and, in order to prevent the corrosion and wetting of the bearing 13 is damaged by the treatment liquid. また、ベアリング13が有機溶剤蒸気や水系蒸気にさらされてもベアリング13の腐食や湿潤が損なわれ難くするために、さらに、ベアリング13自体を、真空装置用の銀メッキベアリングやセラミック製あるいは樹脂製のノングリスタイプのベアリングで構成してもよい。 Further, in order to bearing 13 is not easily impaired corrosion and wetting of the bearing 13 even when exposed to an organic solvent vapor and water vapor, further bearing 13 itself, silver plated bearings and made ceramic or resin for a vacuum apparatus it may be constituted by a non-grease type of bearing.

【0023】なお、各規制部材12は、横断面が略円形であれば、ピン状に限らず、例えば、棒状(円柱状)などであってもよい。 [0023] Incidentally, the restricting member 12, if substantially a circular cross section is not limited to a pin-shaped, for example, may be a rod-shaped (cylindrical).

【0024】また、各ベアリングケース13aは、それぞれ回転台3内の空孔3aの側壁にYS周りに回動自在に取り付けられた軸13bに支持されることで、各規制部材12は、揺動支点YS周りで揺動自在に回転台3に取り付けられている。 Further, the bearing case 13a, by being supported by a shaft 13b rotatably attached to around YS on the side walls of the holes 3a of each the turntable 3, the restricting member 12 is swung It is attached to swingably turntable 3 around the fulcrum YS. さらに、各規制部材12は、それぞれ揺動支点YSの上方において、付勢手段としての圧縮コイルバネ15によって各規制部材12の揺動支点Y Further, the restricting member 12, above the respective fulcrum YS, rocking fulcrum Y of the restricting member 12 by the compression coil spring 15 as an urging means
Sより上方の部分12aが基板Wの外周端縁方向に付勢されている。 Upper portion 12a is biased to the outer peripheral edge direction of the substrate W from S.

【0025】回転台3の下方には、上面が回転軸CJ側に降下する傾斜面を有する退避手段としての環状の昇降部材16が昇降自在に配備されている。 [0025] below the rotary table 3, the annular lift member 16 as saving means having an inclined surface having an upper surface drops to the rotation axis CJ side is deployed vertically movably. この環状昇降部材16は、ガイド軸にガイドされながらエアシリンダなどの駆動源によって鉛直方向に昇降される。 The annular lifting member 16 is raised and lowered in the vertical direction by a driving source such as an air cylinder while being guided by the guide shaft. 環状昇降部材16が上昇されると、各規制部材12の下端部12b When the annular lifting member 16 is raised, the lower end portion 12b of the restricting member 12
は、図3(a)の想像線に示すように傾斜面に沿って図の右側に変位される結果、各規制部材12は揺動支点Y Is FIGS. 3 (a) along the inclined surface as shown in phantom lines result to be displaced to the right in the figure, the restricting member 12 is rocking fulcrum Y
S周りで揺動され、各規制部材12の揺動支点YSより上方の部分12aが、基板Wの外周端縁に接触しない基板Wの外周端縁外側の退避位置に退避される。 Is swung around S, the upper portions 12a than the rocking fulcrum YS of each regulating member 12 is retracted to the retracted position of the outer peripheral edge outside of the substrate W does not contact the outer peripheral edge of the substrate W. 一方、上記各規制部材12の退避状態において、環状昇降部材1 On the other hand, in the retracted state of the restricting members 12, the annular lift member 1
6が降下されると、環状昇降部材16の傾斜面による各規制部材12の下端部12bの規制が解除され、圧縮コイルバネ15のバネ力により、各規制部材12の揺動支点YSより上方の部分12aが基板Wの外周端縁方向に付勢される。 When 6 is lowered, regulation of the lower end portion 12b of the restricting member 12 by the inclined surface of the annular lifting member 16 is released, by the spring force of the compression coil spring 15, the upper portion than the rocking fulcrum YS of each regulating member 12 12a is urged to the outer peripheral edge direction of the substrate W.

【0026】なお、各規制部材12は、図3(a)の実線で示すように、鉛直方向に直立された状態で、位置合わせされた基板Wの外周端縁の円弧部分に丁度点接触されるように各規制部材12の揺動支点YSが設定されている。 [0026] Incidentally, the restricting member 12, as shown by the solid line in FIG. 3 (a), in a state of being erected vertically, the contact just point the arc portion of the outer peripheral edge of the aligned substrate W rocking fulcrum YS of the restricting member 12 has been configured to.

【0027】上記規制部材12の水平方向外側において、基板Wの外周端縁を全周にわたって覆うように環状部材17が設けられ、かつ、基板Wの外周端縁ならびに規制部材12と環状部材17との内周面との間に、基板Wから遠心力によって流されるドレンを鉛直下方に向かわせるドレン流路18が形成されている。 [0027] In the horizontal direction outside the regulating member 12, the annular member 17 is provided to the outer peripheral edge of the substrate W so as to cover the entire circumference, and the outer peripheral edge and regulating member 12 and the annular member 17 of the substrate W between the inner peripheral surface of the drain passage 18 to direct drain vertically downward flowing by the centrifugal force are formed from the substrate W.

【0028】環状部材17の上面は平坦な水平面に構成され、また、環状部材17の下部はスペーサ(図示せず)を介してドレン排出用の隙間が形成されるように回転台3に取り付けられ、ドレン流路18を通じて流されるフォトレジスト液や溶剤を外部に排出できるように構成されている。 The upper surface of the annular member 17 is constructed on a flat horizontal surface, also mounted on the turntable 3 so that a gap for drainage through the lower portion of the annular member 17 a spacer (not shown) is formed It is configured to be discharged photoresist solution or solvent flowing through the drain passage 18 to the outside. また、ドレン流路18によって、遠心力による基板Wの外周端縁と環状部材17の内周面との間側に向かう気流を環状部材17の内周面で受け止め、その流れに抵抗を与え、気流のほとんどを乱れの無い状態で環状部材17の平坦な上面に沿って流し、ピン状支持部材11や規制部材12によって乱流が生じることを防止できるように構成されている。 Further, the drain passage 18, the air flow toward the side between the inner peripheral surface of the peripheral edge and the annular member 17 of the substrate W by the centrifugal force received by the inner peripheral surface of the annular member 17 provides a resistance to its flow, flow in the absence of turbulence most of the airflow along the flat upper surface of the annular member 17, and is configured to prevent the turbulence caused by the pin-like support member 11 and the regulating member 12.

【0029】また、図4に示すように、特定の規制部材12を中心軸PJ周りに回転駆動させるための相対回転手段としての駆動アーム20が、環状部材17と特定の規制部材12との間において、その規制部材12に接触する駆動位置と、その上方の第2のカップ5の外側の待機位置との間で水平移動および昇降移動可能に設けられている。 Further, as shown in FIG. 4, the drive arm 20 as relative rotation means for rotating the specific regulatory member 12 around the central axis PJ, between the specific regulatory member 12 and the annular member 17 in the driving position in contact with the regulating member 12 is provided so as to be horizontally moved and vertically movable between an outer waiting position of the second cup 5 thereabove. この駆動アーム20は、アーム20に固定された軸KJ周りに回転する駆動ローラ20aと回転ローラ20bと、これらローラ20a、20bに架けられた無端ベルト20cと、回転ローラ20bを規制部材12方向に付勢させる圧縮コイルバネ20dなどを内蔵し、駆動位置において、バネ20dのバネ力で基板Wの円弧部分に点接触される規制部材12に無端ベルト20cの一部が接触されるように構成されている。 The drive arm 20 includes a drive roller 20a that rotates about an axis KJ fixed to the arm 20 and the rotating roller 20b, the rollers 20a, and an endless belt 20c which is hung on 20b, the rollers 20b to the regulating member 12 direction such as a built-in compression coil spring 20d that biases, in the drive position, is configured such that a portion of the spring force regulating member 12 to the endless belt 20c to the arc portion is point contact of the substrate W of the spring 20d is contacted there. なお、本実施例では、この駆動アーム20によって回転駆動される上記特定の規制部材12を、図2に示すように、1個とびの3個の規制部材12(12X)に設定している。 In the present embodiment, the specific regulating member 12 which is rotatably driven by the drive arm 20, as shown in FIG. 2, is set to one Tobino three regulating member 12 (12X).

【0030】回転支軸2は筒状に構成され、その回転支軸2内から回転台3を貫通する状態で洗浄液供給ノズル21が設けられ、基板Wの裏面に洗浄液を供給し、排水用の隙間からドレン搬出用の隙間を通じて外部に排出して基板Wの裏面を洗浄できるように構成されている。 The rotary shaft 2 is configured in a cylindrical shape, the cleaning liquid supply nozzle 21 is provided from the rotating shaft inside 2 while penetrating the turntable 3, the cleaning liquid is supplied to the back surface of the substrate W, the drainage and discharged to the outside and is configured to allow cleaning of the back surface of the substrate W through the gap for drainage out from the gap.

【0031】回転台3の所定の3個所にピン挿通孔22 The pin insertion hole 22 in a predetermined three positions of the turntable 3
が形成され、かつ、回転台3の下方に3本の基板昇降ピン23が昇降可能に設けられ、ロータリー・エンコーダなどにより回転台3を所定位置で停止させ、その状態で基板昇降ピン23をピン挿通孔22を通じて昇降させ、 There is formed, and, three substrate lift pins 23 under the turntable 3 is movable up and down, is stopped at a predetermined position rotary table 3 by such as a rotary encoder, pin substrate lifting pins 23 in this state is moved up and down through the insertion hole 22,
基板Wをピン状支持部材11に支持させる処理位置とそれより上方の受渡し位置との間で昇降ようするように構成されている。 And it is configured to lift between a processing position and the upper than the transfer position for supporting the substrate W to the pin-shaped support member 11.

【0032】次に、上記構成を有する実施例装置の動作を図5ないし図9などを参照して説明する。 A description will now be given mainly with reference to FIGS. 5 to 9 the operation of the embodiment apparatus with the above configuration.

【0033】まず、基板Wの搬入時の動作を説明する。 [0033] First, a description will be given of the operation at the time of loading of the substrate W.
回転台3は所定位置で停止されている。 Turntable 3 is stopped at a predetermined position. まず、環状昇降部材16を上昇させて、図5(a)、(b)の要部縦断面図と要部平面図に示すように、各規制部材12を退避位置に退避させる。 First, raising the annular lift member 16, FIG. 5 (a), the as shown in fragmentary vertical cross-sectional view and a fragmentary plan view of (b), retracting the respective regulating member 12 to the retracted position. 次に、図5(c)に示すように、基板昇降ピン23を上昇させ、図示しない搬送機構によって受渡し位置に搬送されてきた基板Wを基板昇降ピン2 Next, FIG. 5 (c), the raised substrate lift pins 23, the substrate of the substrate W that has been conveyed to the transfer position by the transfer mechanism (not shown) lift pins 2
3上に載置して受け取り、昇降支持ピン23を降下させて受け取った基板Wを処理位置においてピン状支持部材11に載置し、基板昇降ピン23は回転台3の下方にまで降下して基板Wが搬入される。 Receive and placed on the 3, lifting the support pin 23 is lowered and placed on the pin-shaped support member 11 at the processing position the wafer W received, the substrate lifting pins 23 and lowered to below the turntable 3 the substrate W is loaded.

【0034】このとき、搬入される基板Wは、図5 [0034] At this time, the substrate W to be conveyed, as shown in FIG. 5
(a)、(b)の一点鎖線KLの円の内側の領域IA内であれば、基板Wは、同図の実線や想像線で示すように基板Wの回転中心WCと回転台3の回転軸CJとが若干偏心していてもよいし、基板WのオリフラOF(切り欠き部)の位置がどこにあってもよい。 (A), if the inner area IA of the circle of the dashed line KL of (b), the substrate W, the rotation of the turntable 3 and the rotation center WC of the substrate W as indicated by the solid line and imaginary line in FIG. it and the shaft CJ may be eccentric slightly, may be where the position of the orientation flat oF of the substrate W (notches). すなわち、上記搬送機構は、基板Wの回転中心WCやオリフラOFの位置合わせなどを正確に行った状態で基板支持ピン23に基板Wを受け渡す必要がなく、そのための特別な位置合わせ機構を実施例装置の外部に設ける必要がない。 That is, the transport mechanism, there is no need to pass the substrate W to the substrate support pins 23 in a state of performing such a precise positioning of the rotational center WC and the orientation flat OF of the wafer W, implement a special positioning mechanism therefor there is no need to provide the outside of the example device.

【0035】また、図5(c)に示すように、各規制部材12は退避位置に退避されているので、基板昇降ピン23が降下するとき、基板Wの外周端縁と各規制部材1 Further, as shown in FIG. 5 (c), since the restricting member 12 is retracted to the retracted position, when the substrate lifting pins 23 are lowered, the outer peripheral edge and the restricting member 1 of the substrate W
2とが接触せず、これによるパーティクルの発生が防止される。 2 and does not contact, which due to the occurrence of particles can be prevented.

【0036】次に、搬入された基板Wの位置合わせ時の動作について説明する。 Next, operation will be described during the alignment of the loaded wafer W. まず、環状昇降部材16を降下させて、各規制部材12の退避を解除する。 First, by lowering the annular lift member 16, to release the retraction of the restricting member 12. これにより、圧縮コイルバネ15のバネ力で各規制部材12は基板Wの外周端縁方向に付勢される。 Thus, the restricting member 12 by the spring force of the compression coil spring 15 is biased in an outer peripheral edge direction of the substrate W. このとき、図6 In this case, as shown in FIG. 6
(a)に示すように、規制部材12は基板Wの外周端縁に点接触される。 (A), the regulating member 12 is in point contact with the outer peripheral edge of the substrate W. また、本実施例では、同図の一点鎖線MLで示す地点まで規制部材12が基板Wの外周端縁方向に付勢されるように、圧縮コイルバネ15のバネ力を設定している。 Further, in this embodiment, the regulating member 12 to a point indicated by a chain line in FIG ML has set the spring force of the way, the compression coil spring 15 is biased to the outer peripheral edge direction of the substrate W. オリフラOFを有する基板を処理対象としたとき、多くの場合、全ての規制部材12は、基板W When the substrate having the orientation flat OF and processed, often all of the regulating member 12, the substrate W
の外周端縁に点接触されるので、これら規制部材12によって基板Wは周囲から回転台12の回転軸CJ方向に押されることになり、基板Wの回転中心WCと回転台3 Since the contact point to the outer peripheral edge of the substrate W by these regulating members 12 will be pushed to the rotation shaft CJ direction of the turntable 12 from the surroundings, turntable 3 and the rotation center WC of the substrate W
の回転軸CJとが若干偏心して搬入された場合であってもこの基板Wの回転中心WCと回転台3の回転軸CJとが略一致されるように基板Wが水平変位される。 A case where the the rotary shaft CJ is carried eccentrically slightly substrate W so that the rotational center of WC and the rotation shaft CJ of the turntable 3 is substantially matching the substrate W is horizontally displaced.

【0037】しかしながら、例えば、図6(b)に示すように、基板Wが搬入された場合、オリフラOFに対向する位置に位置する規制部材12は基板Wの外周端縁(オリフラOF)に点接触されない。 [0037] However, for example, as shown in FIG. 6 (b), when the substrate W is carried, the regulating member 12 positioned at the position facing the orientation flat OF is the point on the outer periphery edge of the substrate W (orientation flat OF) not be contacted. このような場合、 In such a case,
5本の規制部材12によって基板Wは周囲から回転台1 5 substrate W by the regulating member 12 of the present is the turntable 1 from the surrounding
2の回転軸CJ方向に押されることになるので、基板W It means that the pushed second rotational axis CJ direction, the substrate W
の回転中心WCと回転台3の回転軸CJとが若干偏心されることになるが、このような場合であっても、次のオリフラOFの位置合わせ動作によって同時に基板Wの回転中心WCと回転台3の回転軸CJとが略一致される。 Of the rotation center of WC and the rotation shaft CJ of the turntable 3 is to be eccentric slightly, even in such a case, at the same time rotating with the rotation center WC of the substrate W by the alignment operation of the next orientation flat OF a rotating shaft CJ pedestal 3 is substantially matched.

【0038】次に、各駆動アーム20が駆動位置まで降下され駆動アーム20内の無端ベルト20cを特定の3 Next, the endless belt 20c certain 3 of each drive arm 20 is lowered to the drive position drive arm 20
本の規制部材12(図2参照)に接触させ、駆動ローラ20aを回転させる。 Contacting this regulating member 12 (see FIG. 2), to rotate the drive roller 20a. これにより、無端ベルト20cを介して特定の規制部材12が中心軸PJ周りに回転駆動される。 Thus, certain of the restriction member 12 is rotated around the central axis PJ via the endless belt 20c. 例えば、図6(b)の状態の場合、この規制部材12の回転により、それに点接触されている基板W For example, if the state of FIG. 6 (b), by the rotation of the regulating member 12, it substrate is point contact W
は、図7(a)に示すように、各規制部材12に対して図の矢印方向に回転される。 As shown in FIG. 7 (a), it is rotated in the arrow direction in FIG respective regulating member 12. すなわち、各規制部材12 That is, the restricting member 12
と基板Wとが逆回りの回転方向に相対回転される。 And the substrate W are relatively rotated in the opposite direction of rotation. この相対回転によって、各規制部材12が点接触する基板W This relative rotation, the substrate W which each regulating member 12 is in point contact
の外周端縁の位置が変位する。 Position of the outer peripheral edge of displaced. なお、この点接触位置の変位は、各規制部材12が中心軸PJ周りに回転しながら基板Wの外周端縁を送るようにして行われるので、基板Wと各規制部材12との相対変位はころがり摩擦に変換され、摩擦係数が小さくなり、パーティクルが発生し難い。 Incidentally, the displacement of the point contact position, since the restricting member 12 is carried out to send the outer peripheral edge of the substrate W while rotating around the central axis PJ, relative displacement between the substrate W and the restricting member 12 is converted into rolling friction, the friction coefficient becomes small, particles are less likely to occur. そして、基板Wと各規制部材12とが所定角度、 Then, the substrate W and the restricting member 12 and a predetermined angle,
相対回転する間に、各規制部材12と基板Wの外周端縁との位置関係が、図7(b)に示すような状態になり、 During the relative rotational position relation between the outer peripheral edge of the restricting member 12 and the substrate W, to the status shown in FIG. 7 (b),
基板WのオリフラOFと規制部材12との位置合わせが行われる。 Positioning of the regulating member 12 and the orientation flat OF of the wafer W is performed. この位置合わせとは、本実施例の場合、後述する回転処理において、回転台3の回転を基板Wに有効に伝達し得るように、互いに隣接する任意の規制部材1 And this alignment, in the present embodiment, in the rotation process described later, the rotation of the turntable 3 so as to effectively transmitted to the substrate W, any restriction member adjacent 1
2がオリフラOFに点接触される状態である。 2 is a state that is in point contact with the orientation flat OF.

【0039】なお、上記動作において、基板Wの裏面とピン状支持部材11とは相対変位することになるが、本実施例では、ピン状支持部材11は基板Wの外周端縁近傍にあり、また、基板Wの裏面とピン状支持部材11とは点接触で接触されており、さらに、ピン状支持部材1 [0039] In the above operation, but it will be relative displacement between the rear surface and the pin-shaped supporting member 11 of the substrate W, in this embodiment, pin-like support member 11 is located on the outer peripheral edge near the substrate W, further, the back surface and the pin-shaped supporting member 11 of the substrate W are in contact with point contact, further, pin-like support 1
1は樹脂製であるので、この相対変位の際の基板Wの裏面とピン状支持部材11との擦れによる裏面パーティクルの発生は大きな問題とはならない。 Since 1 is made of resin, the occurrence of back side particles due to rubbing between the rear surface and the pin-shaped supporting member 11 of the substrate W during the relative displacement is not a big problem. また、基板Wの裏面を支持する支持部材を、図8の要部縦断面図に示すように、上部の開口が大きくなる傾斜を有する気体吹き出し流路30を設けた、ベルヌーイ効果を持たせた小型ノズル31で構成すれば、このノズル31から吹き出される気体によって基板Wの裏面は、このノズル31に非接触で、かつ、安定して支持されるので、上記基板Wの裏面との擦れなどが解消される。 Further, a support member for supporting the back surface of the substrate W, as shown in fragmentary vertical cross-sectional view of FIG. 8, provided with a gas blowoff passage 30 having an inclined upper opening is large, and to have a Bernoulli effect by configuring a small nozzle 31, the back surface of the substrate W by the gas blown out from the nozzle 31, in a non-contact with the nozzle 31, and, since it is stably supported, such as rubbing the back surface of the substrate W There is eliminated. また、気体吹き出し流路30の基端部は、管32を介して図示しない気体供給部に連通接続されている。 The base end portion of the gas blow-out passage 30 is communicatively connected to the gas supply unit (not shown) through the tube 32. なお、これについては、後述する回転台3(基板W)の回転当初における基板Wとピン状支持部材11との相対変位についても同様のことが言える。 Note that this will, the same is true for the relative displacement between the turntable 3 substrate W and the pin-shaped supporting member 11 in the rotation initial (substrate W) to be described later.

【0040】ところで、各駆動アーム20により行われる規制部材12と基板Wとの相対回転は、少なくとも(360/規制部材12の本数)°、すなわち、本実施例では、60°(360/6)だけ行えば、搬入された基板WのオリフラOFがどこに位置されていても、この60°の相対回転の間に必ず、互いに隣接する任意の規制部材12がオリフラOFに点接触される状態(図7 [0040] Incidentally, the relative rotation of the regulating member 12 and the substrate W performed by the drive arm 20, at least (360 / number of the regulating member 12) °, namely, in this example, 60 ° (360/6) by performing only be located where the orientation flat oF of the loaded the substrate W, always during relative rotation of the 60 °, the state (FIG any regulating member 12 adjacent to each other are in point contact with the orientation flat oF 7
(b)参照)になる。 You will see (b)). また、上記60°の相対回転が終了するまでに、図7(b)のような位置合わせ完了状態になったときには、その状態から、上記60°の相対回転が終了するまでの間は、駆動アーム20により規制部材12が回転されていても、オリフラOFに点接触される2本の規制部材12によって規制部材12と基板Wとの相対回転は行われなくなる。 Also, until the relative rotation of the 60 ° is finished, when it becomes the position alignment completion state shown in FIG. 7 (b), during the period from that state, until the relative rotation of the 60 ° is finished, the drive even if the regulating member 12 by the arm 20 is rotated, the relative rotation between the regulating member 12 and the substrate W by the regulating member 12 of the two that are in point contact with the orientation flat oF is not performed. 従って、基板Wと規制部材12との相対回転を無条件に(360/規制部材12 Therefore, unconditionally the relative rotation between the regulating member 12 and the substrate W (360 / regulating member 12
の本数)°だけ行うようにすれば、基板Wと規制部材1 If the number) ° to perform only restricted substrate W member 1
2との位置合わせが行われたかいなかを検出するための特別な検出機構を設けることなく、常に自動的に基板W Without providing a special detection mechanism for positioning between 2 detects whether conducted country, always automatically substrate W
と規制部材12との位置合わせを行うことができる。 It can be aligned with the regulating member 12 and.

【0041】なお、例えば、図7(a)に示すように駆動アーム20により回転駆動される規制部材12の1本が、オリフラOFに点接触しない状態であっても、駆動アーム20により回転駆動される3本の規制部材12は図2に示すように1個とびに設定しているので、駆動アーム20により回転駆動される他の規制部材12は円弧部分に必ず点接触され、上記(360/規制部材12の本数)°の相対回転の間に、図7(b)などの位置合わせの完了状態になる前に上記相対回転が停止することはない。 It should be noted, for example, one of the regulating member 12 which is rotated by a driving arm 20, as shown in FIG. 7 (a), even in a state that does not point contact with the orientation flat OF, the rotary drive by a drive arm 20 the three restriction members 12 that are so is set to one jump as shown in FIG. 2, other regulating member 12 which is rotated by a driving arm 20 is contacted always point to the arc portion, the (360 / during relative rotation number) ° of the regulating member 12, the relative rotation will not be stopped before the completion status of alignment, such as FIG. 7 (b).

【0042】また、ラチェット機構などを用いて、規制部材12の基板Wの外周端縁方向の変位を基板Wの外周端縁方向のみ可能とし、逆方向へ戻れないように規制すれば、一旦、図7(b)に示すような位置合わせ完了状態になると、その位置合わせ完了状態を以降の動作中保持することができる。 Further, by using a ratchet mechanism, the outer peripheral edge direction of displacement of the substrate W of the regulating member 12 to allow only the outer peripheral edge direction of the substrate W, if regulated to not return in the opposite direction, once, when a positional alignment completion state as shown in FIG. 7 (b), it can be held during subsequent operation the positioning completed state.

【0043】基板Wの外周端縁(オリフラOF)の位置合わせが終了すると、駆動アーム20は待機位置に移動される。 [0043] When the alignment of the outer peripheral edge of the substrate W (orientation flat OF) is completed, the drive arm 20 is moved to the standby position.

【0044】次に、基板Wの回転などの動作について説明する。 Next, a description will be given of the operation such as the rotation of the substrate W. 電動モータ1が回転台3を回転させることで、 By the electric motor 1 rotates the turntable 3,
オリフラOFに点接触される規制部材12により回転台3の回転が基板Wに有効に伝達され、位置合わせされた基板Wが回転中心WC(回転台3の回転軸CJに略一致)周りに回転される。 Rotation of the turntable 3 to the orientation flat OF by the regulating member 12 to be point contact is effectively transferred to the substrate W, rotation about aligned substrate W (substantially coincides with the rotation axis CJ of the turntable 3) rotation center WC It is. このとき、各規制部材12は、 At this time, the restricting members 12,
オリフラOFを含む基板Wの外周端縁に付勢されて点接触されているので、基板Wの水平方向の位置がある程度固定的に規制され、この回転台3(基板W)の回転当初においても基板Wは水平方向へ変位し難く、基板Wの外周端縁と規制部材12との摩擦が起き難い。 Since the contact biased by a point on the outer peripheral edge of the substrate W including the orientation flat OF, the horizontal position of the substrate W is fixed to some extent to regulate, even in the initial This rotation of the turntable 3 (substrate W) substrate W hardly occurs friction between the horizontal direction to not easily displaced, the restricting member 12 and the outer peripheral edge of the substrate W. また、仮に付勢されている規制部材12に抗して基板Wが水平方向へ変位し、基板Wの外周端縁と規制部材12とが回転方向に相対変位しても、図9に示すように、この相対変位は規制部材12の中心軸PJ回りの回転によってころがり摩擦に変換され、摩擦係数が小さくなるので、パーティクルが発生し難い。 Moreover, displaced substrate W in the horizontal direction against the regulating member 12 which has been tentatively energized, also the outer peripheral edge of the substrate W and the regulating member 12 is relatively displaced in the rotational direction, as shown in FIG. 9 , this relative displacement is converted into frictional rolling by rotation of the central shaft PJ around the regulating member 12, the friction coefficient becomes small, particles are less likely to occur.

【0045】回転台3の回転を所定のシーケンスで続け、基板Wが所定の回転数で回転されるようになると、 The continued rotation of the turntable 3 in a predetermined sequence, the substrate W is to be rotated at a predetermined rotational speed,
基板Wの表面にフォトレジスト液を供給して基板Wの表面にフォトレジスト液を塗布(スピンコート)したり、 Or coated (spin-coating) a photoresist solution on the photoresist liquid surface of the substrate W by supplying to the surface of the substrate W,
基板Wの外周端縁に溶剤を供給して基板Wの外周端縁に付着したフォトレジスト液を洗浄(エッジリンス)したり、あるいは、基板Wの裏面を洗浄(バックリンス)するなどの処理を回転中の基板Wに施す。 Or washing the photoresist solution adhering to the outer peripheral edge of the substrate W (edge ​​rinsing) by supplying the solvent to the outer peripheral edge of the substrate W, or a process such as the back surface of the substrate W washing (back rinse) It applied to the substrate W in the rotation. 所定の処理が終了すると、回転台3の回転を所定位置で停止して基板W When a predetermined processing is completed, the substrate W to stop the rotation of the turntable 3 at a predetermined position
の回転を停止させ、処理済基板Wの搬出を行う。 The rotation is stopped, perform the unloading of the processed substrate W.

【0046】処理済基板Wの搬出は、まず、環状昇降部材16を上昇させて各規制部材12を退避位置に退避させ、この状態で基板昇降ピン23を上昇させて処理済基板Wをピン状支持部材11から受け取り、回転台3上方の受渡し位置まで上昇させ、図示しない搬送機構に処理済基板Wを引渡すことで行われる。 The unloading of the processed substrate W is first to raise the annular lift member 16 retracts the respective regulating member 12 to the retracted position, the pin-shaped the processed substrate W is raised to a substrate lift pin 23 in this state receiving from the support member 11, is raised to the turntable 3 above the transfer position, it is carried out by passing the processed substrate W to the transport mechanism (not shown). 従って、この搬出の際も、各規制部材12は退避位置に退避されているので、搬出される基板Wが規制部材12と擦れるなどの不都合がない。 Therefore, even when the carry-out, since the restricting member 12 is retracted to the retracted position, the substrate W to be unloaded there is no inconvenience such as rubbing and the regulating member 12. ラチェット機構などを用いて、規制部材1 By using a ratchet mechanism, the regulating member 1
2の変位を基板Wの外周端縁方向のみ可能とした場合には、上記各規制部材12の退避動作に先立って、このラチェット機構による規制部材12のラッチ状態を解除する。 The second displacement when possible only the outer peripheral edge direction of the substrate W, prior to the retraction operation of the restricting members 12, to release the latched state of the regulating member 12 by the ratchet mechanism.

【0047】なお、駆動アーム20で回転駆動する規制部材12は、少なくとも2個以上であり、いずれかの規制部材12が必ず基板Wの円弧部分に点接触する状態になるのであれば、上記図2の設定に限らず適宜設定してもよい。 [0047] Incidentally, the regulating member 12 for rotating the driving arm 20 is at least 2 or more, as long as a state of point contact with the arc portion of any of the regulating member 12 is always the substrate W, FIG 2 may be set as appropriate not only to the setting.

【0048】<第2実施例>図10は、第2実施例装置の要部の概略構成を示す平面図である。 [0048] <Second Embodiment> FIG. 10 is a plan view showing a schematic configuration of a main part of the second embodiment device. 上記第1実施例では、駆動アーム20で特定の規制部材12を回転させるように構成したが、この第2実施例では、規制部材1 In the first embodiment, it has been configured to rotate the specific regulation member 12 by the driving arm 20, in this second embodiment, the regulating member 1
2を積極的に回転させることに代えて、上記第1実施例の駆動アーム20の無端ベルト20cの一部を基板Wの外周端縁の例えば、対向する2個所に接触させるように構成したことを特徴とする。 2 instead of rotating positively that, configured so as to contact with the example part of the outer peripheral edge of the substrate W in the endless belt 20c of the drive arm 20 of the first embodiment, the opposing two points the features. それ以外の構成は、上記第1実施例と同様であるので詳述は省略する。 The other construction details are omitted because it is same as the first embodiment.

【0049】このように基板W側を、回転台3の回転とは別に回転駆動させることでも、基板Wと、回転台3とともに停止されている規制部材12とを逆回りの回転方向に相対回転させることができ、これにより、上記第1 The relative rotation thus the substrate W side, the rotation of the turntable 3 also be separately rotationally driven, and the substrate W, and a regulating member 12 which is stopped together with the turntable 3 in the reverse rotational direction around It can be, thereby, the first
実施例と同様に、基板Wの位置合わせを自動で行うことができる。 Similar to the embodiment, it is possible to align the substrate W automatically.

【0050】なお、この第2実施例では、駆動アーム2 [0050] In this second embodiment, the drive arm 2
0内の圧縮コイルバネ20dのバネ力により無端ベルト20cが基板Wの外周端縁方向に押される力に比べて、 By the spring force of the compression coil spring 20d in 0 endless belt 20c is compared to the force pushed to the outer peripheral edge direction of the substrate W,
規制部材12が基板Wの外周端縁を押す力の方が大きくなるようにして、駆動アーム20の押圧力に起因する基板Wの水平変位を防止するようにしている。 Regulating member 12 as towards the force pressing the outer peripheral edge of the substrate W becomes larger, so as to prevent horizontal displacement of the substrate W due to the pressing force of the drive arm 20.

【0051】<第3実施例>この第3実施例では、上記第1、第2実施例のように特定の規制部材12や基板W [0051] <Third Embodiment> The third embodiment, the first, specific restriction member 12 and the substrate W as in the second embodiment
を回転駆動するための駆動アーム20のような特別の機構を備えていない。 The does not have a special mechanism such as the drive arm 20 to rotate. それ以外の構成は、上記第1実施例と同様であるので詳述は省略する。 The other construction details are omitted because it is same as the first embodiment.

【0052】例えば、基板Wが上記図6(b)のように搬入されたとすると、基板WのオリフラOFには、いずれの規制部材12も点接触していないので、回転台3を回転させたとしても、この回転台3の回転が基板Wに有効に伝達されず、また、回転台3の回転当初においては、基板Wに慣性力が働くので、この基板Wと、回転台3とともに回転台3(基板W)の回転方向に回転される各規制部材12とは、逆回りの回転方向に相対回転されることになる。 [0052] For example, when the substrate W is transported as FIG 6 (b), the orientation flat OF of the substrate W, since any of the regulating member 12 is also not in point contact, rotating the turntable 3 as well, the rotation of the turntable 3 is not effectively transmitted to the substrate W, also, at the beginning the rotation of the turntable 3, inertial force acts on the substrate W, and this the substrate W, the turntable together with the turntable 3 3 and each regulating member 12 is rotated in the rotating direction of the (substrate W), so that the reverse rotation direction around are relatively rotated. 従って、この回転台3の回転当初の基板Wに働く慣性力を利用して、上記第1実施例で説明した基板Wの位置合わせを行うことができる。 Therefore, it is possible to utilize the inertial forces acting on the rotating initial substrate W of the rotary table 3, the alignment of the substrate W as described in the first embodiment. この第3実施例では、回転台3の回転当初の基板Wに働く慣性力によって、基板Wと規制部材12との相対回転が(360/ In the third embodiment, the inertial force acting on the rotation initial substrate W of the turntable 3, the relative rotation between the regulating member 12 and the substrate W (360 /
規制部材12の本数)°以上行われる条件で、回転台3 In conditions performed restricting the number of members 12) ° or more, the turntable 3
の回転の開始を制御する。 To control the start of the rotation. この位置合わせのための回転台3の回転は、基板Wに処理を施すために行う回転シーケンスの一部として行ってもよいし、それとは別に、搬入された基板Wの位置合わせのために行うようにしてもよい。 Rotation of the turntable 3 for this alignment may be performed as a part of the rotation sequence performed in order to perform the processing on a substrate W, performed separately for alignment of the wafer W loaded therein from that it may be so. この第3実施例においては、回転台3を回転させる回転駆動手段としての電動モータ1が、本発明における相対回転手段を兼ねることになる。 In the third embodiment, the electric motor 1 as a rotation driving means for rotating the turntable 3, also serves as a relative rotation means of the present invention.

【0053】また、基板Wが例えば、図6(a)や図7 [0053] The substrate W, for example, and FIGS. 6 (a) Figure 7
(b)のようにオリフラOFが位置合わせされた状態で搬入されたとき以外の状態では、回転台3の回転が基板Wに有効に伝達され難く、回転台3を回転させると、基板Wと規制部材12とは相対回転し、最終的に図6 In states other than when the orientation flat OF is carried in a state of being aligned as in (b), however, difficult to rotation of the turntable 3 is effectively transferred to the substrate W, when the rotary table 3, and the substrate W relatively rotating the regulating member 12, and finally 6
(a)や図7(b)のように、互いに隣接する任意の2 (A) and as shown in FIG. 7 (b), the two arbitrary adjacent to each other
本の規制部材12が基板WのオリフラOFに点接触した位置合わせ完了状態になる。 Regulating member 12 of the present is in the position alignment completion state of point contact with the orientation flat OF of the substrate W.

【0054】なお、上記各実施例では、規制部材12を6本設けているが、この本数は、基板WやオリフラOF [0054] In each of the above embodiments, is provided with the regulating member 12 six, the number, the substrate W and the orientation flat OF
の寸法などに応じて、適切な本数設ければよい。 Depending on, for example, to the dimensions, it may be provided an appropriate number.

【0055】また、上記各実施例では、オリフラOFを有する基板Wを処理対象とした装置を示したが、ノッチ(切り欠き部)Nを有する基板Wを処理対象とした装置にも本発明は同様に適用することができる。 [0055] In the above-described embodiments, although the apparatus processed the substrate W with the orientation flat OF, also the present invention to an apparatus and process target substrate W having a notch (notched portion) N is it can be similarly applied. この場合の搬入基板の位置合わせの状態の概略を図11に示す。 It shows a schematic of a state of alignment of the carrying substrate in this case is shown in FIG. なお、図11(a)は、ノッチNを有する基板Wが搬入された状態を、同図(b)は、この基板Wの位置合わせ中の状態を、同図(c)は、この基板Wが位置合わせされた状態をそれぞれ示す。 Incidentally, FIG. 11 (a), a state where the substrate W is transported with a notch N, the (b) shows the state during positioning of the substrate W, FIG. (C), the substrate W There shown aligned state respectively.

【0056】さらに、上記各実施例では、本発明をスピンコーターに適用した場合を説明したが、例えば、スピンスクラバーやスピンデベロッパーなどの各種の回転式基板処理装置にも本発明は同様に適用することができる。 [0056] Further, in the above embodiments, the present invention has been described is applied to a spin coater, for example, the present invention is also applicable to various rotary substrate processing apparatus such as a spin scrubber or spin developers similarly applied to be able to.

【0057】 [0057]

【発明の効果】以上の説明から明らかなように、本発明によれば、横断面が略円形で中心軸周りに回転自在の規制部材を基板の外周端縁方向に付勢させた状態で、この規制部材と基板とを逆回りの回転方向に相対回転させることで、基板の規制部材に対する位置合わせを行えるように構成したので、基板の搬入前に、基板の位置合わせを予め行う必要がなく、このための特別な位置合わせ機構を省くことができるので、基板搬入時の動作や装置構成が簡単にでき、コストの低減を図ることもできる。 As apparent from the foregoing description, according to the present invention, in a state where the cross section was biasing the rotatable regulating member on the outer peripheral edge direction of the substrate around the central axis in a substantially circular shape, by relatively rotating the the regulating member and the substrate in the opposite rotational direction around, since it is configured to allow the alignment with respect to the regulating member of the substrate, prior to loading of the substrate, it is not necessary to perform alignment of a substrate in advance , it is possible to omit special alignment mechanism for this, operation or device configuration during substrate loading is easy, it is also possible to reduce the cost.

【0058】また、規制部材を横断面が略円形で中心軸周りに回転自在に構成するとともに、基板の回転時この規制部材を基板の外周端縁方向に付勢させるように構成したので、回転台(基板)の回転当初においても基板と規制部材との相対変位が起き難く、仮に、基板と規制部材との相対変位が起きたとしてもその相対変位は規制部材のころがり摩擦に変換されるので、回転台(基板)の回転当初における基板の外周端縁と規制部材との回転方向への相対変位によるパーティクルの発生を軽減させることができる。 [0058] Further, the cross section of the regulating member is rotatably constructed around the central axis in a substantially circular shape, since the regulating member during rotation of the substrate was configured to urge the outer peripheral edge direction of the substrate, the rotation stand hardly occurs relative displacement between the substrate and the regulating member even at the beginning rotation (substrate), if, since the relative displacement as a relative displacement between the substrate and the regulating member has occurred is converted into rolling friction of the regulating member , it is possible to reduce the turntable generation of particles due to the relative displacement in the rotational direction between the outer peripheral edge and the regulating member of the substrate rotating the original (substrate).

【0059】さらに、基板の搬入・搬出時には規制部材を退避位置に退避するように構成したので、基板の搬入・搬出時に基板と規制部材とが擦れるなどの不都合が防止できる。 [0059] Further, at the time of loading and unloading of the substrate and then, is retracted regulating member to the retracted position, thereby preventing disadvantages such as the substrate and the regulating member during loading and unloading of the substrate is rubbed.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の第1実施例に係る回転式基板処理装置の全体概略構成を示す縦断面図である。 1 is a longitudinal sectional view showing an overall schematic configuration of a rotary substrate processing apparatus according to a first embodiment of the present invention.

【図2】図1の要部の平面図である。 2 is a plan view of a main part of FIG.

【図3】図1の要部の縦断面図とA−A矢視断面図である。 3 is a longitudinal sectional view and A-A arrow sectional view of a main part of FIG.

【図4】駆動アームの概略構成を示す平面図と側面図である。 4 is a plan view and a side view showing a schematic configuration of the drive arm.

【図5】基板搬入時の動作を説明するための図である。 5 is a diagram for explaining the operation in the substrate carrying.

【図6】搬入基板の位置合わせ時の動作を説明するための図である。 6 is a diagram for explaining the operation in the alignment of the carrying substrate.

【図7】同じく、搬入基板の位置合わせ時の動作を説明するための図である。 [7] Also, a view for explaining the operation at the time of alignment of the carrying substrate.

【図8】支持部材の変形例の概略構成を示す要部側面図である。 8 is a partial side view showing a schematic configuration of a modification of the support member.

【図9】回転台(基板)の回転当初の動作を説明するための図である。 9 is a diagram for explaining a rotation initial operation of the turntable (substrate).

【図10】第2実施例装置の要部の概略構成を示す平面図である。 10 is a plan view showing a schematic configuration of a main part of the second embodiment device.

【図11】ノッチを有する基板の位置合わせ動作を示す図である。 11 is a diagram showing the alignment operation of the substrate with a notch.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 … 電動モータ 2 … 回転支軸 3 … 回転台 6 … 液供給ノズル 7 … 溶剤供給ノズル 11 … ピン状支持部材 12 … 規制部材 13 … ベアリング 15 … 圧縮コイルバネ 16 … 環状昇降部材 20 … 駆動アーム 21 … 洗浄液供給ノズル W … 基板 OF … オリエンテーションフラット(切り欠き部) N … ノッチ(切り欠き部) WC … 基板の回転中心 CJ … 回転台の回転軸 PJ … 規制部材の回転中心軸 1 ... electric motor 2 ... supporting shaft 3 ... turntable 6 ... liquid supply nozzle 7 ... solvent supply nozzle 11 ... pin-like support members 12 ... restricting member 13 ... Bearing 15 ... compression coil spring 16 ... annular lift member 20 ... drive arm 21 ... cleaning liquid supply nozzle W ... substrate oF ... orientation flat (notch portions) N ... notch (notches) WC ... rotation center axis of the rotation center CJ ... turntable rotation axis PJ ... regulating member substrate

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 6識別記号 庁内整理番号 FI 技術表示箇所 H01L 21/30 569C ────────────────────────────────────────────────── ─── front page continued (51) Int.Cl. 6 Docket No. FI technique in identification symbol Agency display portion H01L 21/30 569C

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 オリエンテーションフラットやノッチなどの切り欠き部を有する半導体基板(以下、基板と略す)の裏面を支持するとともに、前記切り欠き部を含む複数個所で前記基板の外周端縁に点接触して前記基板の水平方向の位置を規制した状態で前記基板を所定の回転中心周りで回転させながらその基板に所定の処理を施す回転式基板処理装置であって、 回転台と、 前記回転台を所定の回転軸周りで回転させる回転駆動手段と、 前記回転台に設けられ、前記基板の裏面を支持する支持部材と、 前記回転台に設けられ、前記支持部材に支持され回転される前記基板の外周端縁の、少なくとも前記切り欠き部を含む複数個所に点接触して前記基板の水平方向の位置を規制するとともに、それぞれ横断面が略円形で中心軸周りに回転自在 1. A semiconductor substrate having a notch portion such as an orientation flat or a notch (hereinafter referred to as substrate) to support the back side of point contact with the outer peripheral edge of said substrate at a plurality of locations including the notch a to rotary substrate processing apparatus for performing predetermined processing said substrate while regulating the horizontal position to the substrate while rotating at a predetermined rotation center around the substrate, and the turntable, the turntable a rotation drive means for rotating around a predetermined rotation axis, it is provided in the turntable, and a support member for supporting the back surface of the substrate, provided on the rotary table, the substrate to be rotated is supported by the support member the outer peripheral edge of, as well as restricting the horizontal position of the substrate in point contact at a plurality of locations including at least the notch, rotatable about the center axis, respectively cross-section a substantially circular 構成された複数個の規制部材と、 前記各規制部材が前記基板の外周端縁に接触しない前記基板の外周端縁外側の退避位置に前記各規制部材を退避させる退避手段と、 前記退避手段による各規制部材の退避が解除された状態で、前記各規制部材を前記基板の外周端縁方向に付勢させる付勢手段と、 搬入され前記支持部材に支持された基板と、前記退避手段による退避が解除された各規制部材とを、逆回りの回転方向へ相対回転させる相対回転手段と、 を備えたことを特徴とする回転式基板処理装置。 A plurality of restricting members configured, and retracting means for each said regulating member is retracted the respective regulating member to the retracted position of the outer peripheral edge outside of the substrate not in contact with the outer peripheral edge of the substrate, by the saving means in a state in which retraction of the restricting member is canceled, and the biasing means for biasing the restricting members to the outer peripheral edge direction of the substrate, the substrate supported by the support member is carried, retracted by the retracting means There rotary substrate processing apparatus, characterized in that a respective regulating member is released, with a, relative rotation means for relatively rotating the opposite direction of rotation.
JP16466095A 1995-06-06 1995-06-06 Rotary type wafer treating apparatus Pending JPH08335624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16466095A JPH08335624A (en) 1995-06-06 1995-06-06 Rotary type wafer treating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16466095A JPH08335624A (en) 1995-06-06 1995-06-06 Rotary type wafer treating apparatus

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JPH08335624A true true JPH08335624A (en) 1996-12-17

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JP16466095A Pending JPH08335624A (en) 1995-06-06 1995-06-06 Rotary type wafer treating apparatus

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005055315A1 (en) * 2003-12-04 2005-06-16 Hirata Corporation Substrate positioning system
JP2008177507A (en) * 2007-01-22 2008-07-31 Ulvac Japan Ltd Substrate alignment device
US7547181B2 (en) 2004-11-15 2009-06-16 Dainippon Screen Mfg. Co., Ltd. Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum
JP2010165706A (en) * 2009-01-13 2010-07-29 Yaskawa Electric Corp Alignment device of wafer
KR101395208B1 (en) * 2007-03-30 2014-05-22 주성엔지니어링(주) Substrate transfer apparatus and substrate aligning method using the same
CN104733349A (en) * 2013-12-24 2015-06-24 株式会社迪思科 Rotating means

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005055315A1 (en) * 2003-12-04 2005-06-16 Hirata Corporation Substrate positioning system
US7242204B2 (en) 2003-12-04 2007-07-10 Hirata Corporation Substrate aligning system
JP2009038411A (en) * 2003-12-04 2009-02-19 Hirata Corp Substrate aligning system
JP4713628B2 (en) * 2003-12-04 2011-06-29 平田機工株式会社 Substrate positioning system
US7547181B2 (en) 2004-11-15 2009-06-16 Dainippon Screen Mfg. Co., Ltd. Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum
JP2008177507A (en) * 2007-01-22 2008-07-31 Ulvac Japan Ltd Substrate alignment device
KR101395208B1 (en) * 2007-03-30 2014-05-22 주성엔지니어링(주) Substrate transfer apparatus and substrate aligning method using the same
JP2010165706A (en) * 2009-01-13 2010-07-29 Yaskawa Electric Corp Alignment device of wafer
CN104733349A (en) * 2013-12-24 2015-06-24 株式会社迪思科 Rotating means

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