CN215069887U

CN215069887U - Edge searching mechanism suitable for wafer of photoetching machine

Info

Publication number: CN215069887U
Application number: CN202120296512.2U
Authority: CN
Inventors: 钟敏
Original assignee: Shanghai Lieth Precision Equipment Co ltd
Current assignee: Shanghai Lieth Precision Equipment Co ltd
Priority date: 2021-02-02
Filing date: 2021-02-02
Publication date: 2021-12-07
Anticipated expiration: 2031-02-02

Abstract

The utility model discloses an edge-seeking mechanism who is adapted to lithography machine wafer relates to semiconductor technical field, comprising a base plate, a pedestal, the supporting sleeve, wafer supporting platform, the lift ring, wafer stop gear, first wafer wiper mechanism, second wafer wiper mechanism, actuating mechanism and wafer detecting element, wherein, the base is located on the bottom plate, the upper end of base is equipped with the supporting sleeve, the upper end of supporting sleeve is equipped with wafer supporting platform, be equipped with first wafer wiper mechanism on the wafer supporting platform, the outer fringe of supporting sleeve is equipped with the lift ring, the outer fringe of lift ring is equipped with a plurality of wafer stop gear, wafer supporting platform is located the region that forms between a plurality of wafer stop gear, the outer fringe of base is equipped with actuating mechanism, the last wafer detecting element that is equipped with of actuating mechanism, one side of base is equipped with second wafer wiper mechanism. The wafer edge-searching device can realize the positioning and edge-searching operation of wafers with different sizes under the condition that the wafers do not rotate, and can also clean the upper and lower surfaces of the wafers.

Description

Edge searching mechanism suitable for wafer of photoetching machine

Technical Field

The utility model relates to the semiconductor technology field especially involves an edge finding mechanism who is adapted to lithography machine wafer.

Background

The semiconductor industry often determines the position of a silicon wafer through notches (notch) to realize the opposite sides of the silicon wafer. Notch refers to a Notch intentionally formed in a wafer (wafer).

The existing positioning edge-searching device is generally placed on a vacuum chuck, the wafer is controlled to rotate through the vacuum chuck, the edge-searching purpose is achieved, however, vibration is easily generated in the wafer rotating process, the wafer is damaged, and then when the wafer is transmitted to the positioning edge-searching device, the wafer needs to be subjected to multiple transmission procedures, so that impurities, particles and the like are easily adhered to the surface of the wafer, and the subsequent wafer treatment is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an edge finding mechanism who is adapted to lithography machine wafer for solve above-mentioned technical problem.

The utility model adopts the technical scheme as follows:

an edge searching mechanism suitable for a wafer of a photoetching machine comprises a bottom plate, a base, a supporting sleeve, a wafer supporting platform, a lifting ring, a wafer limiting mechanism, a first wafer cleaning mechanism, a second wafer cleaning mechanism, a driving mechanism and a wafer detection unit, wherein the base is arranged on the bottom plate, the upper end of the base is provided with the supporting sleeve, the upper end of the supporting sleeve is provided with the wafer supporting platform, the first wafer cleaning mechanism is arranged on the wafer supporting platform, the lifting ring is arranged on the outer edge of the supporting sleeve, the outer edge of the lifting ring is provided with a plurality of wafer limiting mechanisms, the wafer supporting platform is positioned in an area formed among the wafer limiting mechanisms, the outer edge of the base is provided with the driving mechanism, the driving mechanism is provided with the wafer detection unit, and one side of the base is provided with the second wafer cleaning mechanism.

Preferably, each wafer limiting mechanism comprises a first telescopic rod and a second telescopic rod, wherein one end of the first telescopic rod is connected with the outer edge of the lifting ring, one end of the second telescopic rod is connected with the other end of the first telescopic rod, the first telescopic rod is perpendicular to the second telescopic rod, and the second telescopic rod is located at the upper end of the first telescopic rod.

Preferably, the wafer detection unit comprises a telescopic arm, a supporting rod and an edge searching sensor, wherein one end of the telescopic arm is connected with the driving mechanism, the supporting rod is connected with the other end of the telescopic arm and perpendicular to the telescopic arm, the edge searching sensor is arranged at the upper end of the supporting rod, and the edge searching sensor is obliquely arranged from top to bottom close to the direction of the wafer supporting platform.

As a further preferred, the inclination angle of the edge-finding sensor is 45 °.

Preferably, the first wafer cleaning mechanism comprises a first nitrogen sprayer and a second nitrogen sprayer, wherein the mounting hole and the mounting groove are formed in the upper surface of the wafer supporting platform, the mounting groove is annular, the mounting groove is formed in the outer edge of the mounting hole, the first nitrogen sprayer is arranged in the mounting hole, and the second nitrogen sprayers are uniformly arranged in the mounting groove.

Preferably, the first nitrogen nozzles are vertically arranged, the plurality of second nitrogen nozzles are obliquely arranged from right to bottom to up in the direction far away from the first nitrogen nozzles, and the inclination angle of each second nitrogen nozzle is 45 degrees.

Preferably, the upper surfaces of the first nitrogen gas showerhead and each of the second nitrogen gas showerheads are flush with the upper surface of the wafer support platform, respectively.

As further preferred, still include the nitrogen gas conveyer pipe, wherein, wafer supporting platform's inside is equipped with nitrogen gas cushion chamber, the nitrogen gas conveyer pipe is located in the support sleeve, just the nitrogen gas conveyer pipe with nitrogen gas cushion chamber intercommunication, the nitrogen gas cushion chamber respectively with first nitrogen gas shower nozzle and a plurality of second nitrogen gas shower nozzle intercommunication.

Preferably, the second wafer cleaning mechanism comprises a nitrogen conveying pipeline and a nozzle mechanism, wherein one end of the nitrogen conveying pipeline is fixedly connected with the bottom plate, the other end of the nitrogen conveying pipeline extends to the upper side of the wafer supporting platform, and the nozzle mechanism is installed at the other end of the nitrogen conveying pipeline.

As a further preferred option, the nozzle mechanism includes a first nitrogen nozzle and a second nitrogen nozzle, wherein the first nitrogen nozzle is disposed in the middle of the nozzle mechanism, and the outer edge of the first nitrogen nozzle is provided with a plurality of second nitrogen nozzles, wherein the first nitrogen nozzle is opposite to the first nitrogen nozzle, and each of the second nitrogen nozzles is opposite to one of the second nitrogen nozzles.

The technical scheme has the following advantages or beneficial effects:

the utility model discloses in, can realize fixing a position, seeking limit operation to not unidimensional wafer under the not pivoted condition of wafer, also can wash the upper and lower surface of wafer simultaneously, can prevent that adhesion such as foreign particles from producing adverse effect to wafer subsequent processing on the wafer surface.

Drawings

FIG. 1 is a schematic structural diagram of an edge finding mechanism for a wafer of a lithography machine according to the present invention;

fig. 2 is a top view of the wafer support platform of the present invention.

In the figure: 1. a base plate; 2. a base; 3. a support sleeve; 4. a wafer support platform; 41. mounting holes; 42. mounting grooves; 5. a lifting ring; 6. a wafer limiting mechanism; 61. a first telescopic rod; 62. a second telescopic rod; 7. a first wafer cleaning mechanism; 71. a first nitrogen gas showerhead; 72. a second nitrogen gas shower nozzle; 8. a second wafer cleaning mechanism; 81. a nitrogen gas delivery pipe; 82. a nozzle mechanism; 83. a first nitrogen gas nozzle; 84. a second nitrogen nozzle; 9. a drive mechanism; 10. a wafer detection unit; 101. a telescopic arm; 102. a strut; 103. an edge-searching sensor.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the indicated orientation or positional relationship thereof is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, but does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

FIG. 1 is a schematic structural diagram of an edge finding mechanism for a wafer of a lithography machine according to the present invention; fig. 2 is a top view of a wafer supporting platform of the present invention, please refer to fig. 1 to 2, which illustrate a preferred embodiment, illustrating an edge finding mechanism adapted to a wafer of a lithography machine, including a bottom plate 1, a base 2, a supporting sleeve 3, a wafer supporting platform 4, a lifting ring 5, a wafer limiting mechanism 6, a first wafer cleaning mechanism 7, a second wafer cleaning mechanism 8, a driving mechanism 9, and a wafer detecting unit 10, wherein the base 2 is disposed on the bottom plate 1, the upper end of the base 2 is provided with the supporting sleeve 3, the upper end of the supporting sleeve 3 is provided with the wafer supporting platform 4, the wafer supporting platform 4 is provided with the first wafer cleaning mechanism 7, the outer edge of the supporting sleeve 3 is provided with the lifting ring 5, the outer edge of the lifting ring 5 is provided with a plurality of wafer limiting mechanisms 6, the wafer supporting platform 4 is located in an area formed between the plurality of wafer limiting mechanisms 6, the outer edge of the base 2 is provided with a driving mechanism 9, the driving mechanism 9 is provided with a wafer detection unit 10, and one side of the base 2 is provided with a second wafer cleaning mechanism 8. In this embodiment, the wafer supporting platform 4 is used for placing a wafer, wherein the wafer limiting mechanism 6 is used for fixing the wafer on the wafer supporting platform 4, so as to prevent the wafer from separating from the wafer supporting platform 4. The first wafer cleaning mechanism 7 is used for cleaning the back face of the wafer, the second wafer cleaning mechanism 8 is used for cleaning the front face of the wafer, the first wafer cleaning mechanism 7 and the second wafer cleaning mechanism 8 work simultaneously, nitrogen is sprayed to the front face and the back face of the wafer, and the wafer can be always in a suspension state. The driving mechanism 9 is used for driving the wafer detection unit 10 to rotate around the area formed among the plurality of wafer limiting mechanisms 6, so as to realize edge searching operation. In this embodiment, a corner defect is formed on the wafer, and the wafer inspection unit 10 is used to inspect the corner defect.

Further, as a preferred embodiment, each wafer limiting mechanism 6 includes a first telescopic rod 61 and a second telescopic rod 62, wherein one end of the first telescopic rod 61 is connected to the outer edge of the lifting ring 5, one end of the second telescopic rod 62 is connected to the other end of the first telescopic rod 61, the first telescopic rod 61 is perpendicular to the second telescopic rod 62, and the second telescopic rod 62 is located at the upper end of the first telescopic rod 61. In this embodiment, as shown in fig. 1, the first telescopic rod 61 and the second telescopic rod 62 can be extended and contracted to accommodate wafers with different sizes. The lifting ring 5 may be driven by an external driving device such that the lifting ring 5 may move in the axial direction of the support sleeve 3 for adjusting the height of the wafer stopper mechanism 6.

Further, as a preferred embodiment, the wafer detecting unit 10 includes a telescopic arm 101, a supporting rod 102 and an edge-searching sensor 103, wherein one end of the telescopic arm 101 is connected to the driving mechanism 9, the supporting rod 102 is connected to the other end of the telescopic arm 101 and perpendicular to the telescopic arm 101, the edge-searching sensor 103 is disposed at the upper end of the supporting rod 102, and the edge-searching sensor 103 is disposed in an inclined manner from top to bottom toward the wafer supporting platform 4. In this embodiment, the edge-finding sensor 103 is used for finding an edge of the wafer to detect a position of a corner defect on the wafer.

Further, as a preferred embodiment, the inclination angle of the edge-finding sensor 103 is 45 °.

Further, as a preferred embodiment, the first wafer cleaning mechanism 7 includes a first nitrogen showerhead 71 and a second nitrogen showerhead 72, wherein the upper surface of the wafer supporting platform 4 is provided with a mounting hole 41 and a mounting groove 42, wherein the mounting groove 42 is annular, the mounting groove 42 is disposed at the outer edge of the mounting hole 41, the first nitrogen showerhead 71 is disposed in the mounting hole 41, and the plurality of second nitrogen showers 72 are uniformly disposed in the mounting groove 42.

Further, as a preferred embodiment, the first nitrogen gas nozzle 71 is vertically disposed, the plurality of second nitrogen gas nozzles 72 are disposed in an inclined manner from the right to the top in a direction away from the first nitrogen gas nozzle 71, and the inclination angle of each second nitrogen gas nozzle 72 is 45 °. In this embodiment, the first nitrogen nozzle 71 vertically sprays nitrogen upward, the nitrogen is sprayed to the middle of the back surface of the wafer and diffused to the outer edge of the wafer, and the first nitrogen nozzle and the second nitrogen nozzle 72 cooperate to completely remove the impurity particles on the back surface of the wafer.

Further, as a preferred embodiment, the upper surfaces of the first nitrogen showerhead 71 and each of the second nitrogen showerheads 72 are flush with the upper surface of the wafer support platform 4, respectively.

Further, as a preferred embodiment, the wafer support platform further includes a nitrogen gas delivery pipe, wherein a nitrogen gas buffer chamber is disposed inside the wafer support platform 4, the nitrogen gas delivery pipe is disposed inside the support sleeve 3, and the nitrogen gas delivery pipe is communicated with the nitrogen gas buffer chamber, and the nitrogen gas buffer chamber is respectively communicated with the first nitrogen gas showerhead 71 and the plurality of second nitrogen gas showerheads 72. In this embodiment, the nitrogen delivery pipe is used to connect to an external nitrogen storage device, and is used to provide nitrogen with a constant pressure in the nitrogen buffer cavity.

Further, as a preferred embodiment, the second wafer cleaning mechanism 8 includes a nitrogen gas delivery pipe 81 and a nozzle mechanism 82, wherein one end of the nitrogen gas delivery pipe 81 is fixedly connected to the bottom plate 1, the other end of the nitrogen gas delivery pipe 81 extends to the upper side of the wafer supporting platform 4, and the nozzle mechanism 82 is installed at the other end of the nitrogen gas delivery pipe 81. As shown in fig. 1, a fixing seat is further disposed at one end of the nitrogen gas delivery pipe 81 for fixing the nitrogen gas delivery pipe 81.

Further, as a preferred embodiment, the nozzle mechanism 82 includes a first nitrogen nozzle 83 and a second nitrogen nozzle 84, wherein the first nitrogen nozzle 83 is disposed at the middle of the nozzle mechanism 82, and a plurality of second nitrogen nozzles 84 are disposed at the outer edge of the first nitrogen nozzle 83, wherein the first nitrogen nozzle 83 faces the first nitrogen nozzle 71, and each of the second nitrogen nozzles 84 faces a second nitrogen nozzle 72. In this embodiment, the nitrogen gas sprayed from the first nitrogen gas nozzle 83 and the second nitrogen gas nozzle 84 acts on the front surface of the wafer, so that the impurity particles on the front surface of the wafer can be removed, and the first nitrogen gas nozzle 83, the second nitrogen gas nozzle 84, the first nitrogen gas showerhead 71, and the second nitrogen gas showerhead 72 are matched with each other, so that the wafer can be in a floating state. Wherein the injection air pressure of the first nitrogen gas nozzle 83 and the second nitrogen gas nozzle 84 is smaller than the injection air pressure of the first nitrogen gas shower head 71 and the second nitrogen gas shower head 72.

The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and those skilled in the art should be able to realize the equivalent alternatives and obvious variations of the present invention.

Claims

1. The edge searching mechanism suitable for the wafer of the photoetching machine is characterized by comprising a bottom plate, a base, a supporting sleeve, a wafer supporting platform, a lifting ring, a wafer limiting mechanism, a first wafer cleaning mechanism, a second wafer cleaning mechanism, a driving mechanism and a wafer detection unit, wherein the base is arranged on the bottom plate, the supporting sleeve is arranged at the upper end of the base, the wafer supporting platform is arranged at the upper end of the supporting sleeve, the first wafer cleaning mechanism is arranged on the wafer supporting platform, the lifting ring is arranged at the outer edge of the supporting sleeve, the wafer limiting mechanisms are arranged at the outer edge of the lifting ring, the wafer supporting platform is positioned in an area formed between the wafer limiting mechanisms, the driving mechanism is arranged at the outer edge of the base, and the wafer detection unit is arranged on the driving mechanism, and one side of the base is provided with the second wafer cleaning mechanism.

2. The edge finder mechanism as claimed in claim 1, wherein each wafer position limiting mechanism comprises a first telescopic rod and a second telescopic rod, wherein one end of the first telescopic rod is connected to the outer edge of the lifting ring, one end of the second telescopic rod is connected to the other end of the first telescopic rod, the first telescopic rod is perpendicular to the second telescopic rod, and the second telescopic rod is located at the upper end of the first telescopic rod.

3. The edge-searching mechanism for a wafer of a lithography machine as claimed in claim 1, wherein the wafer detecting unit comprises a telescopic arm, a supporting rod and an edge-searching sensor, wherein one end of the telescopic arm is connected to the driving mechanism, the supporting rod is connected to the other end of the telescopic arm and perpendicular to the telescopic arm, the edge-searching sensor is disposed at the upper end of the supporting rod, and the edge-searching sensor is disposed in an inclined manner from top to bottom towards the direction close to the wafer supporting platform.

4. An edge-seeking mechanism for a wafer of a lithography machine according to claim 3, wherein the angle of inclination of said edge-seeking sensor is 45 °.

5. The edge finder mechanism as claimed in claim 1, wherein the first wafer cleaning mechanism comprises a first nitrogen nozzle and a second nitrogen nozzle, wherein the wafer supporting platform has a mounting hole and a mounting groove formed on an upper surface thereof, the mounting groove is annular and is formed on an outer edge of the mounting hole, the first nitrogen nozzle is formed in the mounting hole, and the second nitrogen nozzles are uniformly formed in the mounting groove.

6. The edge finding mechanism for a wafer of a lithography machine according to claim 5, wherein the first nitrogen showerhead is vertically disposed, the plurality of second nitrogen showers are disposed in an inclined manner from bottom to top in a direction away from the first nitrogen showerhead, and the inclination angle of each of the second nitrogen showers is 45 °.

7. The edge finder mechanism for lithography wafers of claim 6, wherein the upper surface of each of said first and second nitrogen showerheads is flush with the upper surface of said wafer support platform.

8. The edge finding mechanism for a wafer of a lithography machine as claimed in claim 5, further comprising a nitrogen gas delivery pipe, wherein a nitrogen gas buffer chamber is disposed inside the wafer supporting platform, the nitrogen gas delivery pipe is disposed inside the supporting sleeve, the nitrogen gas delivery pipe is communicated with the nitrogen gas buffer chamber, and the nitrogen gas buffer chamber is respectively communicated with the first nitrogen gas nozzle and the plurality of second nitrogen gas nozzles.

9. The edge finder mechanism as claimed in claim 5, wherein the second wafer cleaning mechanism comprises a nitrogen gas delivery pipe and a showerhead mechanism, wherein one end of the nitrogen gas delivery pipe is fixedly connected to the base plate, the other end of the nitrogen gas delivery pipe extends to the upper side of the wafer support platform, and the showerhead mechanism is mounted at the other end of the nitrogen gas delivery pipe.

10. The edge finder mechanism as claimed in claim 9, wherein the showerhead mechanism comprises a first nitrogen nozzle and a second nitrogen nozzle, wherein the first nitrogen nozzle is disposed at a middle portion of the showerhead mechanism, and a plurality of the second nitrogen nozzles are disposed at an outer edge of the first nitrogen nozzle, wherein the first nitrogen nozzle faces the first nitrogen nozzle, and each of the second nitrogen nozzles faces one of the second nitrogen nozzles.