CN108190505A - It is a kind of can automatic turning silicon chip placement mechanism - Google Patents
It is a kind of can automatic turning silicon chip placement mechanism Download PDFInfo
- Publication number
- CN108190505A CN108190505A CN201810021336.4A CN201810021336A CN108190505A CN 108190505 A CN108190505 A CN 108190505A CN 201810021336 A CN201810021336 A CN 201810021336A CN 108190505 A CN108190505 A CN 108190505A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- mold
- bottom plate
- automatic turning
- shaped frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 51
- 239000010703 silicon Substances 0.000 title claims abstract description 51
- 230000007246 mechanism Effects 0.000 title claims abstract description 23
- 238000007789 sealing Methods 0.000 claims abstract description 37
- 238000010521 absorption reaction Methods 0.000 claims description 12
- 241000252254 Catostomidae Species 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000005611 electricity Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/917—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers control arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses it is a kind of can automatic turning silicon chip placement mechanism, mounting base, bottom plate, mold, sealing shroud, slide draw frame machine, inlet channel, air inlet pipe, fixed seat, cylinder, sliding panel, bearing, servo motor, first gear, shaft, second gear, gripping body, first close switch, second close switch, silicon chip is placed directly in locating slot, it slides draw frame machine and silicon chip is drawn into completion positioning clamping, during overturning, compressed air enters in sliding cavity, promotion is moved up with piston, cylinder pushes bearing Forward, silicon chip is extend on the inside of gripping body, electromagnet dead electricity is by silicon wafer clamping, cylinder resets, servo motor drives shaft to rotate 180 °, cylinder pushes bearing Forward, electromagnet obtains electric, silicon chip is fallen on draw frame machine is slided.The apparatus structure is simple, and silicon chip can be positioned, sucked, automatic material jacking and automatic turning, improves production efficiency, and pass through Integration Design, effectively reduces manufacture cost.
Description
Technical field
The present invention relates to a kind of mechanical device more particularly to it is a kind of can automatic turning silicon chip placement mechanism.
Background technology
Silicon chip must be through strictly cleaning in semiconductor devices production, and micropollution also results in component failure, the purpose of cleaning
It is to remove surface contamination impurity, the method for removing pollution has physical cleaning and chemical cleaning, and physical cleaning is mainly using brush
The method washed or cleaned removes impurities on surface of silicon chip, needs to be positioned silicon chip in cleaning process, clamp, meanwhile, it is
Convenient for silicon chip extracting be additionally provided with ejecting mechanism, due to positioning, clamp, ejecting mechanism is independently arranged more, it is not only complicated and
And manufacture is of high cost, simultaneously as being needed during Wafer Cleaning by 180 ° of silicon wafer turnover, conventional method is mostly to turn over manually
Turn, it is less efficient.In view of disadvantages described above, it is really necessary to design it is a kind of can automatic turning silicon chip placement mechanism.
Invention content
The purpose of the present invention is to provide it is a kind of can automatic turning silicon chip placement mechanism, this can the silicon chip of automatic turning put
It puts mechanism and silicon chip can be positioned, sucked, automatic material jacking and automatic turning, production efficiency is improved, and by integrated
Design effectively reduces manufacture cost.
In order to solve the above technical problems, the technical scheme is that：It is a kind of can automatic turning silicon chip placement mechanism, peace
Dress seat, mold, sealing shroud, slides draw frame machine, inlet channel, air inlet pipe, fixed seat, cylinder, sliding panel, bearing, watches bottom plate
Take motor, first gear, shaft, second gear, gripping body, the first close switch, the second close switch, the bottom plate position
In mounting base upper end, the bottom plate is connected with mounting base by bolt, and the mold is located on the right side of bottom plate upper end, described
Mold is connected with bottom plate by bolt, and the sealing shroud runs through bottom plate, and the sealing shroud is connected with base thread, described
Draw frame machine is slided through mold and through sealing shroud, the slip draw frame machine can be slided up and down along mold, the mould
Tool is additionally provided with inlet channel, and not through die main body, the air inlet pipe is located on the outside of mold the inlet channel, described
Air inlet pipe is connected with mold screw thread, and the cavity intercommunication of the cavity and inlet channel of the air inlet pipe, the fixed seating is the bottom of in
On the left of plate upper end, the fixed seat is connected with bottom plate by bolt, and the cylinder is located on the left of fixed seat, the cylinder
It is connected with fixed seat by bolt, the sliding panel is located on the left of bottom plate upper end and on the right side of cylinder, the sliding panel
It is connected with cylinder screw thread, the sliding panel can horizontally slip along bottom plate, and the bearing is located at the top of sliding panel, described
Bearing is connected with sliding panel by bolt, and the servo motor is located on the left of bearing upper end, the servo motor and bearing
It is connected by bolt, the shaft runs through bearing, and the first gear is located on the right side of servo motor, the first gear
Be connected with servo motor key, the shaft is rotatedly connected with bearing, the second gear be located at first gear lower end and by
Shaft runs through, and the second gear is engaged with first gear to be connected and be connected with shaft key, and the gripping body, which is located at, to be turned
On the right side of axis, the gripping body is connected with shaft thread, and described first is located at bottom plate upper center close to switch, described
First is connected close to switch with bottom plate by bolt, described second close to switch through fixed seat, described second close opens
Pass is connected with fixed seat screw thread.
Further improvement of the invention is as follows：
Further, the mold is additionally provided with locating slot, and the locating slot is located at die top, the locating slot
Not through die main body.
Further, the mold is additionally provided with sliding cavity, the cavity intercommunication of the cavity and inlet channel of the sliding cavity.
Further, the sealing shroud is additionally provided with sealing ring, and the sealing ring is located on the inside of sealing shroud, and sealing ring has
The contact surface of effect sealing straight tube and sealing shroud, prevents gas leakage.
Further, the slip draw frame machine further includes straight tube, piston, the first spring, draws block, rubber pad, institute
Through mold and through sealing shroud, the piston is located on the outside of straight tube the straight tube stated, and the piston is connected with cylinder screw thread,
First spring is located on the outside of straight tube and positioned at piston upper end, and the absorption block is located at straight tube upper end, the absorption
Block is connected with straight pipe thread, and the rubber pad, which is located at, draws block upper end, and the rubber pad is Nian Jie with drawing block to be connected.
Further, the straight tube is additionally provided with air-breathing sebific duct, and the air-breathing sebific duct is located at straight tube lower end, the suction
Gas sebific duct is connected with straight tube close-fitting.
Further, the absorption block is additionally provided with several suckers, and the sucker is used through block main body, rubber pad is drawn
In sealing so that when being evacuated through sucker, silicon chip can be sucked.
Further, the gripping body further includes U-shaped frame, electromagnet, guide rod, clamping plate, second spring, the U
Type frame is located on the left of shaft, and the U-shaped frame is connected with shaft thread, and the electromagnet is located at U-shaped frame inner top side, described
Electromagnet be connected with U-shaped frame by bolt, the guide rod runs through U-shaped frame, and the guide rod can slide up and down along U-shaped frame,
The clamping plate is located at lower end of the guide rod, and the clamping plate is connected with guide rod screw thread, the second spring be located on the outside of guide rod and
Between U-shaped frame and clamping plate,
Further, the U-shaped frame is additionally provided with the first backing plate, and first backing plate is located at U-shaped frame inside bottom, institute
The first backing plate stated is Nian Jie with U-shaped frame connected.
Further, the clamping plate is additionally provided with the second backing plate, and second backing plate is Nian Jie with clamping plate to be connected.
Compared with prior art, this can automatic turning silicon chip placement mechanism, during work, silicon chip is placed directly within and is arranged on
In locating slot on mold, straight tube is pumped into negative pressure through air-breathing sebific duct so that draw block and draw silicon chip, so as to complete locating clip
Tightly, during overturning, compressed air is pumped into inlet channel through air inlet pipe, compressed air enters in sliding cavity, is pushed so as to push
It is moved up with the straight tube that piston is connected, and then the silicon chip for drawing block absorption is driven to move up, then, cylinder pushes what is be connected with sliding panel
Bearing moves forward, and when first close to switch triggering, silicon chip is extend on the inside of gripping body, then, electromagnet dead electricity, second spring
It resets and clamping plate is pushed to drive the second gasket to movement at the first backing plate, thus by silicon wafer clamping, then, cylinder resets, when second
During close to switch triggering, servo motor drives the shaft being connected with second gear to rotate 180 ° by first gear, so as to drive
The gripping body for being clamped with silicon chip overturns 180 °, and then, cylinder pushes bearing Forward, when first close to switch triggering, electromagnetism
Iron obtain it is electric, silicon chip fall slide draw frame machine on, stop being pumped into compressed air, the first spring reset, so as to drive to air inlet pipe
Block is drawn to fall into die holder.The apparatus structure is simple, and silicon chip can be positioned, sucked, automatic material jacking and automatic turning, carried
High efficiency, and by Integration Design, effectively reduce manufacture cost.
Description of the drawings
Fig. 1 shows front view of the present invention
Fig. 2 shows the present invention to slide draw frame machine structure diagram
Fig. 3 shows that the present invention draws block vertical view
Fig. 4 shows gripping body structure diagram of the present invention
In figure：Mounting base 1, mold 3, sealing shroud 4, slides draw frame machine 5, inlet channel 6, air inlet pipe 7, fixes bottom plate 2
Seat 8, cylinder 9, sliding panel 10, bearing 11, servo motor 12, first gear 13, shaft 14, second gear 15, gripping body 16,
First close to switch 17, second close to switch 18, locating slot 301, sliding cavity 302, sealing ring 401, straight tube 501, piston 502,
Spring 503 draws block 504, rubber pad 505, air-breathing sebific duct 506, sucker 507, U-shaped frame 1601, electromagnet 1602, guide rod
1603rd, clamping plate 1604, second spring 1605, the first backing plate 1606, the second backing plate 1607.
Specific embodiment
As shown in Figure 1, Figure 2, Figure 3, Figure 4, it is a kind of can automatic turning silicon chip placement mechanism, mounting base 1, bottom plate 2, mold
3rd, sealing shroud 4, slip draw frame machine 5, inlet channel 6, air inlet pipe 7, fixed seat 8, cylinder 9, sliding panel 10, bearing 11, servo
Motor 12, first gear 13, shaft 14, second gear 15, gripping body 16, first switch 18 close to switch 17, second is close,
The bottom plate 2 is located at 1 upper end of mounting base, and the bottom plate 2 is connected with mounting base 1 by bolt, and the mold 3 is located at bottom
On the right side of 2 upper end of plate, the mold 3 is connected with bottom plate 2 by bolt, and the sealing shroud 4 runs through bottom plate 2, the sealing
Set 4 is connected with 2 screw thread of bottom plate, and the slip draw frame machine 5 is through mold 3 and through sealing shroud 4, the slip suction machine
Structure 5 can be slided up and down along mold 3, and the mold 3 is additionally provided with inlet channel 6, and the inlet channel 6 is led not through mold 3
Body, the air inlet pipe 7 are located at 3 outside of mold, and the air inlet pipe 7 is connected with 3 screw thread of mold, the cavity of the air inlet pipe 7
With the cavity intercommunication of inlet channel 6, the fixed seat 8 is located on the left of 2 upper end of bottom plate, and the fixed seat 8 passes through with bottom plate 2
Bolt is connected, and the cylinder 9 is located at 8 left side of fixed seat, and the cylinder 9 is connected with fixed seat 8 by bolt, the cunning
Movable plate 10 is located on the left of 2 upper end of bottom plate and positioned at 9 right side of cylinder, and the sliding panel 10 is connected with 9 screw thread of cylinder, the cunning
Movable plate 10 can horizontally slip along bottom plate 2, and the bearing 11 is located at 10 top of sliding panel, the bearing 11 and sliding panel 10
It is connected by bolt, the servo motor 12 is located on the left of 11 upper end of bearing, and the servo motor 12 passes through with bearing 11
Bolt is connected, and the shaft 14 runs through bearing 11, and the first gear 13 is located on the right side of servo motor 12, and described first
Gear 13 is connected with 12 key of servo motor, and the shaft 14 is rotatedly connected with bearing 11, and the second gear 15 is located at the
One gear, 13 lower end and run through by shaft 14, the second gear 15 engaged with first gear 13 be connected and with 14 key phase of shaft
Even, the gripping body 16 is located at 14 right side of shaft, and the gripping body 16 is connected with 14 screw thread of shaft, and described first
It is located at 2 upper center of bottom plate close to switch 17, described first 17 is connected close to switch with bottom plate 2 by bolt, and described the
Two are connected through fixed seat 8, described second close to switch 18 close to switch 18 with 8 screw thread of fixed seat, and the mold 3 is also set
There is locating slot 301, the locating slot 301 is located at 3 top of mold, and the locating slot 301 is described not through 3 main body of mold
Mold 3 be additionally provided with sliding cavity 302, the cavity of the sliding cavity 302 and the cavity intercommunication of inlet channel 6, the sealing shroud 4
Sealing ring 401 is additionally provided with, the sealing ring 401 is located at 4 inside of sealing shroud, the effectively sealing straight tube 501 of sealing ring 401 and sealing
The contact surface of set 4, prevents gas leakage, and the slip draw frame machine 5 further includes straight tube 501, piston 502, the first spring 503, inhales
Block 504, rubber pad 505 are taken, for the straight tube 501 through mold 3 and through sealing shroud 4, the piston 502 is located at straight tube
501 outsides, the piston 502 are connected with 9 screw thread of cylinder, and first spring 503 is located at 501 outside of straight tube and positioned at work
502 upper ends are filled in, the absorption block 504 is located at 501 upper end of straight tube, and the absorption block 504 is connected with 501 screw thread of straight tube, institute
The rubber pad 505 stated, which is located at, draws 504 upper end of block, and the rubber pad 505 is Nian Jie with drawing block 504 to be connected, the straight tube
501 are additionally provided with air-breathing sebific duct 506, and the air-breathing sebific duct 506 is located at 501 lower end of straight tube, the air-breathing sebific duct 506 and straight tube
501 close-fittings are connected, and the absorption block 504 is additionally provided with several suckers 507, and the sucker 507, which runs through, draws 504 main body of block,
Rubber pad 505 is used to seal so that when being evacuated through sucker 507, can suck silicon chip, the gripping body 16 further includes U-shaped
Frame 1601, electromagnet 1602, guide rod 1603, clamping plate 1604, second spring 1605, it is left that the U-shaped frame 1601 is located at shaft 14
Side, the U-shaped frame 1601 are connected with 14 screw thread of shaft, and the electromagnet 1602 is located at U-shaped 1601 inner top side of frame, described
Electromagnet 1602 be connected with U-shaped frame 1601 by bolt, the guide rod 1603 run through U-shaped frame 1601, the guide rod
1603 can slide up and down along U-shaped frame 1601, and the clamping plate 1604 is located at 1603 lower end of guide rod, the clamping plate 1604 and guide rod
1603 screw threads are connected, and the second spring 1605 is located at 1603 outside of guide rod and between U-shaped frame 1601 and clamping plate 1604,
The U-shaped frame 1601 is additionally provided with the first backing plate 1606, and first backing plate 1606 is located at U-shaped 1601 inside bottom of frame, institute
The first backing plate 1606 stated is Nian Jie with U-shaped frame 1601 to be connected, and the clamping plate 1604 is additionally provided with the second backing plate 1607, and described the
Two backing plates 1607 and clamping plate 1604 is Nian Jie to be connected, this can automatic turning silicon chip placement mechanism, during work, silicon chip is placed directly within
It is arranged in the locating slot 301 on mold 3, straight tube 501 is pumped into negative pressure through air-breathing sebific duct 506 so that draw block 504 by silicon chip
It draws, is clamped so as to complete positioning, during overturning, compressed air is pumped into inlet channel 6 through air inlet pipe 7, compressed air enters
In sliding cavity 302, so as to which the straight tube 501 that promotion is pushed to be connected with piston 502 moves up, and then drive and draw the silicon that block 504 is drawn
Piece moves up, and then, cylinder 9 pushes the bearing 10 being connected with sliding panel 10 to move forward, and when first close to during 17 triggering of switch, silicon chip is stretched
Enter to 16 inside of gripping body, then, 1602 dead electricity of electromagnet, second spring 1605, which resets, pushes clamping plate 1604 to drive the second pad
To movement at the first backing plate 1606, thus by silicon wafer clamping, then, cylinder 9 resets piece 1607, is triggered when second close to switch 18
When, servo motor 12 drives the shaft 14 being connected with second gear 15 to rotate 180 ° by first gear 13, so as to drive clamping
The gripping body 16 for having silicon chip overturns 180 °, and then, cylinder 9 pushes bearing 10 to move forward, when first triggers close to switch 17, electricity
Magnet 1602 must be electric, and silicon chip is fallen on draw frame machine 5 is slided, and stops being pumped into compressed air to air inlet pipe 7, the first spring 503 is multiple
Position, so as to which absorption block 504 be driven to fall into die holder 5.The apparatus structure is simple, and silicon chip can be positioned, sucked, automatic material jacking
And automatic turning, production efficiency is improved, and by Integration Design, effectively reduce manufacture cost.
The present invention is not limited to above-mentioned specific embodiment, those of ordinary skill in the art from above-mentioned design,
Without performing creative labour, the various transformation made are within the scope of the present invention.
Claims (10)
1. it is a kind of can automatic turning silicon chip placement mechanism, it is characterised in that including mounting base, bottom plate, mold, sealing shroud, slip
Draw frame machine, inlet channel, air inlet pipe, fixed seat, cylinder, sliding panel, bearing, servo motor, first gear, shaft, second
Close to switch, second close to switch, the bottom plate is located at mounting base upper end for gear, gripping body, first, the bottom plate and
Mounting base is connected by bolt, and the mold is located on the right side of bottom plate upper end, and the mold is connected with bottom plate by bolt, institute
The sealing shroud stated runs through bottom plate, and the sealing shroud is connected with base thread, and the slip draw frame machine is through mold and passes through
Wear sealing shroud, the slip draw frame machine can be slided up and down along mold, and the mold is additionally provided with inlet channel, it is described into
Gas channel is not through die main body, and the air inlet pipe is located on the outside of mold, and the air inlet pipe is connected with mold screw thread, described
The cavity intercommunication of the cavity and inlet channel of air inlet pipe, the fixed seating on the left of the bottom plate upper end, the fixed seat with
Bottom plate is connected by bolt, and the cylinder is located on the left of fixed seat, and the cylinder is connected with fixed seat by bolt, described
Sliding panel be located on the left of bottom plate upper end and on the right side of cylinder, the sliding panel is connected with cylinder screw thread, the slip
Plate can horizontally slip along bottom plate, and the bearing is located at the top of sliding panel, and the bearing is connected with sliding panel by bolt,
The servo motor is located on the left of bearing upper end, and the servo motor is connected with bearing by bolt, and the shaft is passed through
Perforating branches seat, the first gear are located on the right side of servo motor, and the first gear is connected with servo motor key, and described turns
Axis is rotatedly connected with bearing, and the second gear is located at first gear lower end and is run through by shaft, the second gear with
First gear engagement is connected and is connected with shaft key, and the gripping body is located on the right side of shaft, and the gripping body is with turning
Axle thread is connected, and described first is located at bottom plate upper center close to switch, and described first passes through spiral shell close to switch with bottom plate
Bolt is connected, and described second is connected through fixed seat, described second close to switch close to switch with fixed seat screw thread.
2. as described in claim 1 can automatic turning silicon chip placement mechanism, it is characterised in that it is fixed that the mold is additionally provided with
Position slot, the locating slot are located at die top, and the locating slot is not through die main body.
3. as described in claim 1 can automatic turning silicon chip placement mechanism, it is characterised in that the mold is additionally provided with cunning
Dynamic chamber, the cavity intercommunication of the cavity and inlet channel of the sliding cavity.
4. as described in claim 1 can automatic turning silicon chip placement mechanism, it is characterised in that the sealing shroud is additionally provided with
Sealing ring, the sealing ring are located on the inside of sealing shroud.
5. as described in claim 1 can automatic turning silicon chip placement mechanism, it is characterised in that the slip draw frame machine
It further includes straight tube, piston, the first spring, draw block, rubber pad, the straight tube is described through mold and through sealing shroud
Piston is located on the outside of straight tube, and the piston is connected with cylinder screw thread, and first spring is located on the outside of straight tube and positioned at work
It holds beyond the Great Wall, the absorption block is located at straight tube upper end, and the absorption block is connected with straight pipe thread, and the rubber pad, which is located at, to be inhaled
Block upper end is taken, the rubber pad is Nian Jie with drawing block to be connected.
6. as claimed in claim 5 can automatic turning silicon chip placement mechanism, it is characterised in that the straight tube is additionally provided with suction
Gas sebific duct, the air-breathing sebific duct are located at straight tube lower end, and the air-breathing sebific duct is connected with straight tube close-fitting.
7. as claimed in claim 5 can automatic turning silicon chip placement mechanism, it is characterised in that the absorption block is additionally provided with
Several suckers, the sucker is through absorption block main body.
8. as described in claim 1 can automatic turning silicon chip placement mechanism, it is characterised in that the gripping body also wraps
U-shaped frame, electromagnet, guide rod, clamping plate, second spring are included, the U-shaped frame is located on the left of shaft, the U-shaped frame and shaft spiral shell
Line is connected, and the electromagnet is located at U-shaped frame inner top side, and the electromagnet is connected with U-shaped frame by bolt, and described leads
Bar runs through U-shaped frame, and the guide rod can be slided up and down along U-shaped frame, and the clamping plate is located at lower end of the guide rod, and the clamping plate is with leading
Bar screw thread is connected, and the second spring is located on the outside of guide rod and between U-shaped frame and clamping plate.
9. as claimed in claim 8 can automatic turning silicon chip placement mechanism, it is characterised in that the U-shaped frame is additionally provided with
One backing plate, first backing plate are located at U-shaped frame inside bottom, and first backing plate is Nian Jie with U-shaped frame to be connected.
10. as claimed in claim 8 can automatic turning silicon chip placement mechanism, it is characterised in that the clamping plate is additionally provided with
Two backing plates, second backing plate is Nian Jie with clamping plate to be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021336.4A CN108190505B (en) | 2018-01-10 | 2018-01-10 | Silicon wafer placement mechanism capable of automatically overturning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021336.4A CN108190505B (en) | 2018-01-10 | 2018-01-10 | Silicon wafer placement mechanism capable of automatically overturning |
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| Publication Number | Publication Date |
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| CN108190505A true CN108190505A (en) | 2018-06-22 |
| CN108190505B CN108190505B (en) | 2024-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810021336.4A Active CN108190505B (en) | 2018-01-10 | 2018-01-10 | Silicon wafer placement mechanism capable of automatically overturning |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108857585A (en) * | 2018-07-02 | 2018-11-23 | 如皋市力星滚子科技有限公司 | Wind-powered electricity generation large roller automatic turning production line |
| CN109704069A (en) * | 2019-03-07 | 2019-05-03 | 中山市永盛智能自动化设备有限公司 | The bull of dishing distributor draws structure |
| CN109759876A (en) * | 2019-03-22 | 2019-05-17 | 天津职业技术师范大学(中国职业培训指导教师进修中心) | Pressing device |
| CN116588683A (en) * | 2023-07-19 | 2023-08-15 | 常州协创智联电子有限公司 | Suction nozzle assembly for carrying battery cell, carrying mechanism using suction nozzle assembly and carrying method |
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