CN208100058U - A kind of silicon wafer double treatment device - Google Patents

Abstract

The utility model discloses a kind of silicon wafer double treatment devices, including pedestal, first servo motor, lead screw, feed nut, slide, lower template, upper die holder, transition strips, slide draw frame machine, inlet channel, air inlet pipe, bracket, straight line mould group, vertical plate, speed regulating motor, elastic mechanism, bistrique, bracket, shaft, second servo motor, first gear, second gear, gripping body, cleaning mechanism, silicon wafer is placed directly in locating slot, sliding draw frame machine sucks silicon wafer, first servo motor drives upper die holder Forward, speed regulating motor band rotary bistrique rotates, straight line mould group band rotary bistrique is mobile, it completes to wear away when silicon wafer " scanning ", second servo motor drives 180 ° of silicon wafer turnover, to carry out wearing away processing to silicon wafer lower surface.The apparatus structure is simple, can carry out wearing away processing automatically to the tow sides of silicon wafer, and be worn away by " scanning " formula, can place each to silicon chip surface uniformly worn away, raising surface treatment quality.

Description

A kind of silicon wafer double treatment device

Technical field

The utility model relates to a kind of mechanical device more particularly to a kind of silicon wafer double treatment devices.

Background technique

Silicon wafer must be cleaned strictly in semiconductor devices production, and micropollution also results in component failure, the purpose of cleaning It is to remove surface contamination impurity, the method for removing pollution has physical cleaning and chemical cleaning, and physical cleaning is mainly using brush The method washed or cleaned removes impurities on surface of silicon chip, and mainly by manual hand manipulation, production efficiency is low, and manually Scrub or scouring uniformity are poor.In view of disadvantages described above, it is really necessary to design a kind of silicon wafer double treatment device.

Utility model content

The purpose of this utility model is to provide a kind of silicon wafer double treatment devices, which can be to silicon The tow sides progress of piece wears away processing automatically, and wears away by " scanning " formula, can local progress each to silicon chip surface It is even to wear away, surface treatment quality is improved, meanwhile, silicon chip clamping, convenient disassembly are quick, high-efficient.

In order to solve the above technical problems, the technical solution of the utility model is：A kind of silicon wafer double treatment device, including bottom Seat, first servo motor, lead screw, feed nut, slide, lower template, upper die holder, transition strips, sliding draw frame machine, air inlet are logical Road, air inlet pipe, bracket, straight line mould group, vertical plate, speed regulating motor, elastic mechanism, bistrique, bracket, shaft, the second servo motor, One gear, second gear, gripping body, cleaning mechanism, the first servo motor are located on the left of pedestal upper end, and described the One servo motor is connected with pedestal by bolt, and the lead screw is located on the right side of first servo motor and is located at pedestal upper end, institute The lead screw stated is connected with first servo motor key and is connected with base rotation, and the lead screw through feeds nut, it is described into Be connected to nut with threads of lead screw, the slide is located on the outside of feed nut and is located at pedestal upper end, the slide with into It is connected to nut by bolt and is connected with pedestal sliding, the lower template is located at slide upper end, the lower template and cunning Seat is connected by bolt, and the upper die holder is located at lower template upper end, and the upper die holder is connected with lower template by bolt, institute The transition strips stated are located on the right side of upper die holder, and the transition strips are connected with upper die holder by bolt, the sliding draw frame machine Through upper die holder and run through lower template, the sliding draw frame machine can be slided up and down along upper die holder, and the upper die holder is also Equipped with inlet channel, not through upper die holder main body, the air inlet pipe is located on the outside of upper die holder the inlet channel, described Air inlet pipe is connected with upper die holder screw thread, and the cavity intercommunication of the cavity and inlet channel of the air inlet pipe, the bracket is located at bottom Seat upper end, the bracket are connected with pedestal by bolt, and the straight line mould group is located at bracket upper end, the straight line mould group It is connected with bracket by bolt, the vertical plate is located at straight line mould group lower end, and the vertical plate passes through bolt phase with straight line mould group Even, the speed regulating motor is located at vertical plate lower end, and the speed regulating motor is connected with vertical plate by bolt, the elastic mechanism Positioned at speed regulating motor lower end, the elastic mechanism is connected with speed regulating motor key, and the bistrique is located at elastic mechanism lower end, institute The bistrique stated is connected with elastic mechanism screw thread, and the bracket is located on the right side of pedestal upper end, and the bracket and pedestal pass through spiral shell Bolt is connected, and the shaft is located at pedestal upper end, and the shaft is connected with holder pivots, and second servo motor is located at Pedestal upper end, second servo motor are connected with bracket by bolt, and the first gear is located at the second servo motor Left side, the first gear are connected with the second servo motor key, and the second gear is located at first gear lower end and is located at On the left of shaft, the second gear is engaged with first gear to be connected and is connected with shaft key, and the gripping body, which is located at, to be turned On the left of axis, the gripping body is connected with shaft thread, and the cleaning mechanism is located on the left of bracket and is located at gripping body Lower end, the cleaning mechanism are connected with bracket by bolt.

The utility model further improves as follows：

Further, the lower template is additionally provided with sealing shroud, and the sealing shroud is drawn through lower template and by sliding Mechanism runs through, and the sealing shroud is connected with lower template screw thread.

Further, the sealing shroud further includes sleeve, sealing ring, and the sleeve runs through lower template, the set Cylinder is connected with lower template screw thread, and the sealing ring is located on the inside of sleeve, and sealing ring effectively seals sliding draw frame machine and sealing The contact surface of inner room, prevents gas leakage.

Further, the upper die holder is additionally provided with locating slot, and the locating slot is located at the top of upper die holder, and described determines Position slot is not through upper die holder main body.

Further, the upper die holder is additionally provided with sliding cavity, and the cavity of the sliding cavity and the cavity of inlet channel are mutual It is logical.

Further, the sliding draw frame machine further includes straight tube, piston, the first spring, draws block, rubber pad, suction Gas sebific duct, the straight tube is through upper die holder and runs through sealing shroud, and the piston is located on the outside of straight tube, the piston with directly Pipe screw thread is connected, and first spring is located on the outside of straight tube and is located at piston upper end, and the absorption block is located at straight tube upper end, The absorption block is connected with straight pipe thread, and the rubber pad, which is located at, draws block upper end, and the rubber pad and absorption block are viscous It connects connected, described air-breathing sebific duct and is located at straight tube lower end, the air-breathing sebific duct is connected with straight tube close-fitting, silicon wafer is placed directly within It is arranged in the locating slot on upper die holder, straight tube is pumped into negative pressure through air-breathing sebific duct, draws silicon wafer so that drawing block, thus complete It is clamped at positioning, when needing silicon chip extracting, is pumped into compressed air into inlet channel through air inlet pipe, compressed air enters cunning Move it is intracavitary, thus push with piston be connected straight tube move up, and then drive draw block absorption silicon wafer move up, operator By silicon chip extracting, then, stop being pumped into compressed air to air inlet pipe, the first spring reset, falls into upper mold to drive and draw block In seat.

Further, the absorption block is additionally provided with several suckers, and the sucker is used through block main body, rubber pad is drawn In sealing, when so that being evacuated through sucker, silicon wafer can be sucked.

Further, the elastic mechanism further includes axle sleeve, the first guide rod, pressing plate, second spring, the axle sleeve position In speed regulating motor lower end, the axle sleeve is connected with speed regulating motor key, and first guide rod runs through axle sleeve, and described first leads Bar can be slided up and down along axle sleeve, and the pressing plate is located at the first lower end of the guide rod, and the pressing plate is connected with the first guide rod screw thread, The second spring is located on the outside of the first guide rod and between axle sleeve and pressing plate.

Further, the gripping body further includes U-shaped frame, electromagnet, the second guide rod, clamping plate, third spring, described U-shaped frame be located on the left of shaft, the U-shaped frame is connected with shaft thread, and the electromagnet is located at U-shaped frame inner top side, The electromagnet is connected with U-shaped frame by bolt, and second guide rod runs through U-shaped frame, and second guide rod can be along U-shaped Frame slides up and down, and the clamping plate is located at the second lower end of the guide rod, and the clamping plate is connected with the second guide rod screw thread, the third Spring is located on the outside of the second guide rod and between U-shaped frame and clamping plate, and the U-shaped frame is additionally provided with the first backing plate, and described the One backing plate is located at U-shaped frame inside bottom, and first backing plate is Nian Jie with U-shaped frame to be connected, and the clamping plate is additionally provided with the second pad Plate, second backing plate is Nian Jie with clamping plate to be connected.

Further, the cleaning mechanism further includes L-type support plate, cylinder, guide holder, third guide rod, connecting plate, nothing Woven fabric brush, the L-type support plate are located on the left of bracket, and the L-type support plate is connected with bracket by bolt, the gas Cylinder is located on the left of L-type support plate, and the cylinder is connected with L-type support plate by bolt, and the guide holder is located at L-type support On the left of plate, the guide holder is connected with L-type support plate by bolt, and the third guide rod is through guide holder, and described the Three guide rods can be located at cylinder upper end along guide holder slide downward, the connecting plate and be located at third guide rod upper end, described Connecting plate is connected with cylinder screw thread and is connected with third guide rod screw thread, and the non-woven fabric brush is located at connecting plate upper end, described Non-woven fabric brush is connected with connecting plate by bolt.

Compared with prior art, the silicon wafer double treatment device when work, silicon wafer is placed directly within and is arranged on upper die holder Locating slot in, sliding draw frame machine sucks silicon wafer, and then, first servo motor is driven connected with feed nut by lead screw Slide move to right, so that the silicon wafer that is placed in upper die holder be driven to move to right, after transition strips and bistrique contact, with the first servo Motor works on, and transition strips generate thrust to bistrique, the second spring compression in elastic mechanism, to move up with rotary bistrique micro- Small distance, so that bistrique and upper die holder completely attach to, since second spring reacts on bistrique, so that bistrique has been kept with silicon wafer Full connected, then, speed regulating motor band rotary bistrique rotate, meanwhile, straight line mould group drive vertical plate be moved forward and backward, and then with rotary bistrique before After move, to complete to wear away when silicon wafer " scanning ", after the completion of silicon wafer upper surface is worn away, first servo motor driving is placed on Silicon wafer in upper die holder is moved to right to gripping body, and the second servo motor drives first gear to rotate set angle, to drive Second gear engaged with the first gear rotates set angle, and then the gripping body being connected with shaft is driven to rotate set angle Degree, then, cleaning mechanism movement, cylinder drive non-woven fabric brush to protrude into the first backing plate and the second pad surfaces in gripping body Dust is drawn, and then, cylinder resets, and the second servo motor resets, and compressed air is pumped into inlet channel through air inlet pipe, is compressed Air enters in sliding cavity, so that the straight tube being connected with piston be pushed to move up, and then the silicon wafer for drawing block absorption is driven to move up, with Afterwards, first servo motor rotates set angle, silicon wafer is sent into gripping body, electromagnet power loss, and third spring reset pushes Clamping plate drives the second gasket to movement at the first backing plate, so that first servo motor inverts set angle and drives by silicon wafer clamping Upper die holder retreats setting length, and then, the second servo motor rotates set angle, so that 180 ° of silicon wafer turnover, the first servo electricity Machine rotates forward set angle, and sliding draw frame machine is driven to be moved to immediately below silicon wafer, electromagnet obtain it is electric so that silicon wafer entirely falls within cunning Dynamic draw frame machine upper end, sliding draw frame machine resets after silicon wafer is drawn clamping, so that silicon wafer is driven to fall in locating slot, first Servo motor rotates backward, and speed regulating motor band rotary bistrique rotation carries out silicon wafer lower surface to wear away processing.The apparatus structure is simple, The tow sides of silicon wafer can be carried out wearing away processing automatically, and be worn away by " scanning " formula, it can be to each place of silicon chip surface It is uniformly worn away, improves surface treatment quality, meanwhile, silicon chip clamping, convenient disassembly are quick, high-efficient.

Detailed description of the invention

Fig. 1 shows the utility model main view

Fig. 2 shows the utility model sealing shroud structural schematic diagrams

Fig. 3 shows the utility model sliding draw frame machine structural schematic diagram

Fig. 4 shows the utility model and draws block top view

Fig. 5 shows the utility model elastic mechanism structural schematic diagram

Fig. 6 shows the utility model gripping body structural schematic diagram

Fig. 7 shows the utility model cleaning mechanism structural schematic diagram

In figure：Pedestal 1, first servo motor 2, lead screw 3, feed nut 4, slide 5, lower template 6, upper die holder 7, transition strips 8, draw frame machine 9, inlet channel 10, air inlet pipe 11, bracket 12, straight line mould group 13, vertical plate 14, speed regulating motor 15, elasticity are slided Mechanism 16, bistrique 17, bracket 18, shaft 19, the second servo motor 20, first gear 21, second gear 22, gripping body 23, Cleaning mechanism 24, sealing shroud 601, sleeve 602, sealing ring 603, locating slot 701, sliding cavity 702, straight tube 901, piston 902, First spring 903 draws block 904, rubber pad 905, air-breathing sebific duct 906, sucker 907, axle sleeve 1601, the first guide rod 1602, pressure Plate 1603, second spring 1604, U-shaped frame 2301, electromagnet 2302, the second guide rod 2303, clamping plate 2304, third spring 2305, First backing plate 2306, the second backing plate 2307, L-type support plate 2401, cylinder 2402, guide holder 2403, third guide rod 2404, connection Plate 2405, non-woven fabric brush 2406.

Specific embodiment

As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, a kind of silicon wafer double treatment device, including pedestal 1, first Servo motor 2, lead screw 3, feed nut 4, slide 5, lower template 6, upper die holder 7, transition strips 8, sliding draw frame machine 9, air inlet are logical Road 10, air inlet pipe 11, bracket 12, straight line mould group 13, vertical plate 14, speed regulating motor 15, elastic mechanism 16, bistrique 17, bracket 18, Shaft 19, the second servo motor 20, first gear 21, second gear 22, gripping body 23, cleaning mechanism 24, described first Servo motor 2 is located at 1 left side of pedestal upper end, and the first servo motor 2 is connected with pedestal 1 by bolt, the lead screw 3 Positioned at the right side of first servo motor 2 and be located at 1 upper end of pedestal, the lead screw 3 be connected with 2 key of first servo motor and with bottom Seat 1 is rotatedly connected, and the lead screw 3 through feeds nut 4, and the feed nut 4 is connected with 3 screw thread of lead screw, the cunning Seat 5 is located at the outside of feed nut 4 and is located at 1 upper end of pedestal, the slide 5 be connected with feed nut 4 by bolt and with bottom 1 sliding of seat is connected, and the lower template 6 is located at 5 upper end of slide, and the lower template 6 is connected with slide 5 by bolt, described Upper die holder 7 be located at 6 upper end of lower template, the upper die holder 7 is connected with lower template 6 by bolt, and the transition strips 8 are located at 7 right side of upper die holder, the transition strips 8 are connected with upper die holder 7 by bolt, and the sliding draw frame machine 9 runs through upper die holder 7 And run through lower template 6, the sliding draw frame machine 9 can slide up and down along upper die holder 7, the upper die holder 7 be additionally provided with into Gas channel 10, for the inlet channel 10 not through 7 main body of upper die holder, the air inlet pipe 11 is located at 7 outside of upper die holder, institute The air inlet pipe 11 stated is connected with 7 screw thread of upper die holder, the cavity intercommunication of the cavity and inlet channel 10 of the air inlet pipe 11, described Bracket 12 be located at 1 upper end of pedestal, the bracket 12 is connected with pedestal 1 by bolt, the straight line mould group 13 be located at support 12 upper end of frame, the straight line mould group 13 are connected with bracket 12 by bolt, and the vertical plate 14 is located at 13 lower end of straight line mould group, The vertical plate 14 is connected with straight line mould group 13 by bolt, and the speed regulating motor 15 is located at 14 lower end of vertical plate, the tune Speed motor 15 is connected with vertical plate 14 by bolt, and the elastic mechanism 16 is located at 15 lower end of speed regulating motor, the elastic machine Structure 16 is connected with 15 key of speed regulating motor, and the bistrique 17 is located at 16 lower end of elastic mechanism, the bistrique 17 and elastic mechanism 16 screw threads are connected, and the bracket 18 is located on the right side of 1 upper end of pedestal, and the bracket 18 is connected with pedestal 1 by bolt, described Shaft 19 be located at 18 upper end of bracket, the shaft 19 and bracket 18 are rotatedly connected, and second servo motor 20 is located at 18 upper end of bracket, second servo motor 20 are connected with bracket 18 by bolt, and the first gear 21 is located at second The left side of servo motor 20, the first gear 21 are connected with 20 key of the second servo motor, and the second gear 22 is positioned at the One gear, 21 lower end and be located at the left side of shaft 19, the second gear 22 engaged with first gear 21 it is connected and with shaft 19 Key is connected, and the gripping body 23 is located at 19 left side of shaft, and the gripping body 23 is connected with 19 screw thread of shaft, described Cleaning mechanism 24 is located at 18 left side of bracket and is located at 23 lower end of gripping body, and the cleaning mechanism 24 and bracket 18 pass through bolt It is connected, the lower template 6 is additionally provided with sealing shroud 601, and the sealing shroud 601 is through lower template 6 and by sliding draw frame machine 9 Run through, the sealing shroud 601 is connected with 6 screw thread of lower template, and the sealing shroud 601 further includes sleeve 602, sealing ring 603, the sleeve 602 runs through lower template 6, and the sleeve 602 is connected with 6 screw thread of lower template, and the sealing ring is located at On the inside of sleeve, contact surface of the sealing ring 603 effectively between sealing sliding draw frame machine 9 and sealing shroud 601 prevents gas leakage, described Upper die holder 7 is additionally provided with locating slot 701, and the locating slot 701 is located at 7 top of upper die holder, the locating slot 701 not through 7 main body of upper die holder, the upper die holder 7 are additionally provided with sliding cavity 702, the cavity of the sliding cavity 702 and the chamber of inlet channel 10 Body intercommunication, the sliding draw frame machine 9 further include straight tube 901, piston 902, the first spring 903, draw block 904, rubber pad 905, air-breathing sebific duct 906, the straight tube 901 is through upper die holder 7 and runs through sealing shroud 601, and the piston 902 is located at straight 901 outside of pipe, the piston 902 are connected with 901 screw thread of straight tube, and first spring 903 is located at 901 outside of straight tube and position In 902 upper end of piston, the absorption block 904 is located at 901 upper end of straight tube, the absorption block 904 and 901 screw thread phase of straight tube Even, the rubber pad 905, which is located at, draws 904 upper end of block, and the rubber pad 905 is Nian Jie with block 904 is drawn to be connected, described Air-breathing sebific duct 906 is located at 901 lower end of straight tube, and the air-breathing sebific duct is connected with straight tube close-fitting, and silicon wafer is placed directly within setting and is existed In locating slot 701 on upper die holder 7, straight tube 901 is pumped into negative pressure through air-breathing sebific duct 906, inhales silicon wafer so that drawing block 904 It takes, is clamped to complete positioning, when needing silicon chip extracting, be pumped into compressed air into inlet channel 10 through air inlet pipe 11, Compressed air enters in sliding cavity 702, so that the straight tube 901 being connected with piston 902 be pushed to move up, and then drives and draws block 904 The silicon wafer of absorption moves up, and operator can stop being pumped into compressed air, the first bullet to air inlet pipe 11 by silicon chip extracting, then Spring 903 resets, and falls into upper die holder 7 to drive and draw block 904, the absorption block 904 is additionally provided with several suckers 907, institute Through block main body 904 is drawn, rubber pad 905 when so that being evacuated through sucker 907, can inhale silicon wafer the sucker 907 stated for sealing Tightly, the elastic mechanism 16 further includes axle sleeve 1601, the first guide rod 1602, pressing plate 1603, second spring 1604, the axis Set 1601 is located at 15 lower end of speed regulating motor, and the axle sleeve 1601 is connected with 15 key of speed regulating motor, first guide rod 1602 Through axle sleeve 1601, first guide rod 1602 can be slided up and down along axle sleeve 1601, and the pressing plate 1603 is located at first 1602 lower end of guide rod, the pressing plate 1603 are connected with 1602 screw thread of the first guide rod, and the second spring 1604 is located at first On the outside of guide rod 1602 and between axle sleeve 1601 and pressing plate 1603, the gripping body 23 further includes U-shaped frame 2301, electricity Magnet 2302, the second guide rod 2303, clamping plate 2304, third spring 2305, the U-shaped frame 2301 are located at 19 left side of shaft, institute The U-shaped frame 2301 stated is connected with 19 screw thread of shaft, and the electromagnet 2302 is located at U-shaped 2301 inner top side of frame, the electricity Magnet 2302 is connected with U-shaped frame 2301 by bolt, and second guide rod 2303 runs through U-shaped frame 2301, and described second leads Bar 2303 can be slided up and down along U-shaped frame 2301, and the clamping plate 2304 is located at 2303 lower end of the second guide rod, the clamping plate 2304 It is connected with 2303 screw thread of the second guide rod, the third spring 2305 is located at 2303 outside of the second guide rod and is located at U-shaped frame 2301 Between clamping plate 2304, the U-shaped frame 2301 is additionally provided with the first backing plate 2306, and first backing plate 2306 is located at U-shaped frame 2301 inside bottoms, first backing plate 2306 is Nian Jie with U-shaped frame 2301 to be connected, and the clamping plate 2304 is additionally provided with the second pad Plate 2307, second backing plate 2307 is Nian Jie with clamping plate 2304 to be connected, and the cleaning mechanism 24 further includes L-type support plate 2401, cylinder 2402, guide holder 2403, third guide rod 2404, connecting plate 2405, non-woven fabric brush 2406, the L-type support plate 2401 are located at 18 left side of bracket, and the L-type support plate 2401 is connected with bracket 18 by bolt, 2402, the cylinder In 2401 left side of L-type support plate, the cylinder 2402 is connected with L-type support plate 2401 by bolt, the guide holder 2403 are located at 2401 left side of L-type support plate, and the guide holder 2403 is connected with L-type support plate 2401 by bolt, described Third guide rod 2404 runs through guide holder 2403, and the third guide rod 2404 can be described along 2403 slide downward of guide holder Connecting plate 2405 is located at cylinder upper end and is located at 2404 upper end of third guide rod, the connecting plate 2405 and 2402 screw thread phase of cylinder It is connected even and with 2404 screw thread of third guide rod, the non-woven fabric brush 2406 is located at 2405 upper end of connecting plate, the non-woven fabrics Brush 2406 is connected with connecting plate 2405 by bolt, the silicon wafer double treatment device, and when work, silicon wafer is placed directly within setting In the locating slot 701 on upper die holder 7, sliding draw frame machine 9 sucks silicon wafer, and then, first servo motor 2 passes through lead screw 3 Drive the slide 5 being connected with feed nut 4 to move to right, so that the silicon wafer that is placed in upper die holder 7 be driven to move to right, when transition strips 8 and After bistrique 17 contacts, as first servo motor 2 works on, transition strips 8 generate thrust to bistrique 17, in elastic mechanism 16 Second spring 1604 is compressed, so that slight distance is moved up with rotary bistrique 17, so that bistrique 17 and upper die holder 7 completely attach to, due to Second spring 1604 reacts on bistrique 17, so that bistrique 17 and silicon wafer keep completely attaching to, then, speed regulating motor 15 drives mill First 17 rotation, meanwhile, straight line mould group 13 drives vertical plate 14 to be moved forward and backward, and then is moved forward and backward with rotary bistrique 17, to complete silicon It is worn away when piece " scanning ", after the completion of silicon wafer upper surface is worn away, first servo motor 2 drives the silicon wafer being placed in upper die holder 7 It moves to right to gripping body 23, the second servo motor 20 drives first gear 21 to rotate set angle, to drive and the first tooth The second gear 22 of 21 engagement of wheel rotates set angle, and then the gripping body 23 being connected with shaft 19 is driven to rotate set angle Degree, then, cleaning mechanism 24 act, and cylinder 2402 drives non-woven fabric brush 2406 to protrude into the first backing plate 2306 in gripping body 23 It is drawn with the dust on 2307 surface of the second backing plate, then, cylinder 2402 resets, and the second servo motor 22 resets, through air inlet pipe 11 Compressed air is pumped into inlet channel 10, compressed air enters in sliding cavity 702, to push and connected straight of piston 902 Pipe 901 moves up, and then the silicon wafer for drawing the absorption of block 904 is driven to move up, and then, first servo motor 2 rotates set angle, will Silicon wafer is sent into gripping body 23,2302 power loss of electromagnet, and third spring 2305, which resets, pushes clamping plate 2304 to drive the second gasket 2307 to movement at the first backing plate 2306, so that first servo motor 2 inverts set angle and drives upper die holder 7 by silicon wafer clamping Setting length is retreated, then, the second servo motor 20 rotates set angle, so that 180 ° of silicon wafer turnover, first servo motor 2 Rotate forward set angle, sliding draw frame machine 9 driven to be moved to immediately below silicon wafer, electromagnet 2302 it is electric so that silicon wafer is fallen completely In sliding 9 upper end of draw frame machine, sliding draw frame machine 9 resets after silicon wafer is drawn clamping, so that silicon wafer be driven to fall in locating slot In 701, first servo motor 2 is rotated backward, and speed regulating motor 15 carries out silicon wafer lower surface to wear away processing with the rotation of rotary bistrique 17. The apparatus structure is simple, can carry out wearing away processing automatically to the tow sides of silicon wafer, and wear away by " scanning " formula, can be to silicon The each place in piece surface is uniformly worn away, and surface treatment quality is improved, meanwhile, silicon chip clamping, convenient disassembly are quick, efficiency It is high.

The utility model is not limited to above-mentioned specific embodiment, and those skilled in the art visualize from above-mentioned Hair, without creative labor, the various transformation made are all fallen within the protection scope of the utility model.

Claims (10)

1. a kind of silicon wafer double treatment device, it is characterised in that including pedestal, first servo motor, lead screw, feed nut, cunning Seat, lower template, upper die holder, transition strips, sliding draw frame machine, inlet channel, air inlet pipe, bracket, straight line mould group, vertical plate, speed regulation Motor, elastic mechanism, bistrique, bracket, shaft, the second servo motor, first gear, second gear, gripping body, cleaner Structure, the first servo motor are located on the left of pedestal upper end, and the first servo motor is connected with pedestal by bolt, institute The lead screw stated is located on the right side of first servo motor and is located at pedestal upper end, the lead screw be connected with first servo motor key and with Base rotation is connected, and the lead screw through feeds nut, and the feed nut is connected with threads of lead screw, the slide position On the outside of feed nut and it is located at pedestal upper end, the slide is connected by bolt with feed nut and slides phase with pedestal Even, the lower template is located at slide upper end, and the lower template is connected with slide by bolt, under the upper die holder is located at Template upper end, the upper die holder are connected with lower template by bolt, and the transition strips are located on the right side of upper die holder, the mistake It crosses item and is connected with upper die holder by bolt, the sliding draw frame machine is through upper die holder and runs through lower template, the sliding Draw frame machine can be slided up and down along upper die holder, and the upper die holder is additionally provided with inlet channel, the inlet channel not through Upper die holder main body, the air inlet pipe are located on the outside of upper die holder, and the air inlet pipe is connected with upper die holder screw thread, the air inlet pipe Cavity and inlet channel cavity intercommunication, the bracket is located at pedestal upper end, and the bracket passes through bolt phase with pedestal Even, the straight line mould group is located at bracket upper end, and the straight line mould group is connected with bracket by bolt, and the vertical plate is located at Straight line mould group lower end, the vertical plate are connected with straight line mould group by bolt, and the speed regulating motor is located at vertical plate lower end, described Speed regulating motor be connected with vertical plate by bolt, the elastic mechanism is located at speed regulating motor lower end, the elastic mechanism with Speed regulating motor key is connected, and the bistrique is located at elastic mechanism lower end, and the bistrique is connected with elastic mechanism screw thread, described Bracket is located on the right side of pedestal upper end, and the bracket is connected with pedestal by bolt, and the shaft is located at pedestal upper end, described Shaft be connected with holder pivots, second servo motor is located at pedestal upper end, second servo motor and bracket It is connected by bolt, the first gear is located on the left of the second servo motor, the first gear and the second servo motor Key is connected, and the second gear is located at first gear lower end and is located on the left of shaft, the second gear and first gear Engagement is connected and is connected with shaft key, and the gripping body is located on the left of shaft, the gripping body and shaft thread phase Even, the cleaning mechanism is located on the left of bracket and is located at gripping body lower end, and the cleaning mechanism and bracket pass through bolt It is connected.

2. silicon wafer double treatment device as described in claim 1, it is characterised in that the lower template is additionally provided with sealing shroud, institute The sealing shroud stated is run through through lower template and by sliding draw frame machine, and the sealing shroud is connected with lower template screw thread.

3. silicon wafer double treatment device as claimed in claim 2, it is characterised in that the sealing shroud further includes sleeve, sealing Circle, the sleeve run through lower template, and the sleeve is connected with lower template screw thread, and the sealing ring is located on the inside of sleeve.

4. silicon wafer double treatment device as described in claim 1, it is characterised in that the upper die holder is additionally provided with locating slot, institute The locating slot stated is located at the top of upper die holder, and the locating slot is not through upper die holder main body.

5. silicon wafer double treatment device as described in claim 1, it is characterised in that the upper die holder is additionally provided with sliding cavity, institute State the cavity intercommunication of the cavity and inlet channel of sliding cavity.

6. silicon wafer double treatment device as described in claim 1, it is characterised in that the sliding draw frame machine further includes straight Pipe, the first spring, draws block, rubber pad, air-breathing sebific duct at piston, and the straight tube is through upper die holder and runs through sealing shroud, described Piston be located on the outside of straight tube, the piston is connected with straight pipe thread, and first spring is located at straight tube outside and is located at Piston upper end, the absorption block are located at straight tube upper end, and the absorption block is connected with straight pipe thread, and the rubber pad is located at Block upper end is drawn, the rubber pad is Nian Jie with block is drawn to be connected, and the air-breathing sebific duct is located at straight tube lower end, the air-breathing Sebific duct is connected with straight tube close-fitting.

7. silicon wafer double treatment device as claimed in claim 6, it is characterised in that the absorption block is additionally provided with several suckers, The sucker is through absorption block main body.

8. silicon wafer double treatment device as described in claim 1, it is characterised in that the elastic mechanism further includes axle sleeve, One guide rod, pressing plate, second spring, the axle sleeve are located at speed regulating motor lower end, and the axle sleeve is connected with speed regulating motor key, institute The first guide rod stated runs through axle sleeve, and first guide rod can be slided up and down along axle sleeve, and the pressing plate is located at the first guide rod Lower end, the pressing plate are connected with the first guide rod screw thread, the second spring be located on the outside of the first guide rod and be located at axle sleeve and Between pressing plate.

9. silicon wafer double treatment device as described in claim 1, it is characterised in that the gripping body further include U-shaped frame, Electromagnet, the second guide rod, clamping plate, third spring, the U-shaped frame are located on the left of shaft, the U-shaped frame and shaft thread phase Even, the electromagnet is located at U-shaped frame inner top side, and the electromagnet is connected with U-shaped frame by bolt, and described second leads Bar runs through U-shaped frame, and second guide rod can be slided up and down along U-shaped frame, and the clamping plate is located at the second lower end of the guide rod, described Clamping plate is connected with the second guide rod screw thread, and the third spring is located on the outside of the second guide rod and between U-shaped frame and clamping plate, institute The U-shaped frame stated is additionally provided with the first backing plate, and first backing plate is located at U-shaped frame inside bottom, first backing plate and U-shaped frame Bonding is connected, and the clamping plate is additionally provided with the second backing plate, and second backing plate is Nian Jie with clamping plate to be connected.

10. silicon wafer double treatment device as described in claim 1, it is characterised in that the cleaning mechanism further includes L-type branch Fagging, cylinder, guide holder, third guide rod, connecting plate, non-woven fabric brush, the L-type support plate are located on the left of bracket, the L Type support plate is connected with bracket by bolt, and the cylinder is located on the left of L-type support plate, the cylinder and L-type support plate It is connected by bolt, the guide holder is located on the left of L-type support plate, and the guide holder passes through bolt phase with L-type support plate Even, the third guide rod runs through guide holder, and the third guide rod can be along guide holder slide downward, the connecting plate position In cylinder upper end and it is located at third guide rod upper end, the connecting plate is connected with cylinder screw thread and is connected with third guide rod screw thread, The non-woven fabric brush is located at connecting plate upper end, and the non-woven fabric brush is connected with connecting plate by bolt.