CN113571453A - Wafer scribing device for machining and using method thereof - Google Patents
Wafer scribing device for machining and using method thereof Download PDFInfo
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- CN113571453A CN113571453A CN202110845990.9A CN202110845990A CN113571453A CN 113571453 A CN113571453 A CN 113571453A CN 202110845990 A CN202110845990 A CN 202110845990A CN 113571453 A CN113571453 A CN 113571453A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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Abstract
The invention discloses a wafer scribing device for machining and a using method thereof. According to the invention, the wafer alignment function can be realized through the transverse movement of the longitudinal linear slide rail pair, the longitudinal movement of the transverse linear slide rail pair and the matching of the alignment equipment body, the arrangement of the annular scale and the abdication hole facilitates the initial placement of the wafer, and further facilitates the alignment work of the wafer; can fix and drive the wafer rotation through clamping component to the quick completion of synchronous movement's scribing subassembly is cut the two-sided wafer about the cooperation, has not only improved the efficiency of scribing, can also guarantee that the degree of depth of positive and negative scribing is the same.
Description
Technical Field
The invention relates to the technical field of machining, in particular to a wafer scribing device for machining and a using method thereof.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the wafer is called a wafer because the shape of the wafer is circular, various circuit element structures can be manufactured on the silicon wafer to form an IC product with a specific electric function, the original material of the wafer is silicon, the surface of the earth crust has inexhaustible silicon dioxide, the silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon, and the wafer needs to be scribed during the processing process, so the existing wafer scribing equipment has the following defects: 1. the initial placement randomness of the wafer is larger, and the alignment work of the subsequent wafer is influenced; 2. scribing treatment can be carried out on only one surface of the wafer at each time, so that the scribing depth of the front side and the back side is difficult to control, and the later polishing work is increased.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a wafer dicing apparatus for machining and a method of using the same.
The invention realizes the purpose through the following technical scheme:
a wafer scribing device for machining comprises a base, wherein an adjusting mechanism is arranged in the center of the top of the base, a control panel is connected to one side of the front end of the top of the base through screws, the adjusting mechanism comprises a longitudinal linear slide rail pair, a transverse linear slide rail pair and a placing disc, the transverse linear slide rail pair is arranged at the top of the longitudinal linear slide rail pair, the placing disc is connected to the top of the transverse linear slide rail pair through bolts, a step-down hole is formed in the center of the top of the placing disc, a plurality of annular scales concentric with the step-down hole are etched on the top of the placing disc, a step-down groove penetrating through the placing disc is formed in one side of the placing disc, the step-down groove is communicated with the step-down hole, and transverse movement of the longitudinal linear slide rail pair, longitudinal movement of the transverse linear slide rail pair and matching alignment of a device body are achieved, the wafer alignment function is realized, the arrangement of the annular scale and the abdicating hole facilitates the initial placement of the wafer, and further facilitates the wafer alignment work, the clamping mechanism is arranged at the rear part of the adjusting mechanism, the clamping mechanism comprises a first supporting plate, the first supporting plate is welded at the rear end of the top of the base, the front end of the vertical plate of the first supporting plate is provided with a clamping component for driving the wafer to rotate, the alignment equipment body is arranged below the top plate of the first supporting plate, one side of the adjusting mechanism is provided with a scribing mechanism, the scribing mechanism comprises a second supporting plate, a cylinder, a push plate and a second stabilizing rod, the second supporting plate is welded at one side of the top of the base, one side of the second supporting plate, which is far away from the adjusting mechanism, is connected with the cylinder through a bolt, the output end of the cylinder penetrates through the second supporting plate and is connected with the push plate through a bolt, the push pedal is close to there is the second stabilizer bar at one side top of cylinder through bolted connection, the second stabilizer bar is kept away from the one end of push pedal is passed the second backup pad, and with second backup pad sliding connection, the push pedal is close to one side of guiding mechanism is provided with synchronous motion's scribing subassembly from top to bottom, sets up like this and can fix and drive the wafer rotation through clamping component to the quick completion of synchronous motion's scribing subassembly is to the two-sided scribing of wafer about the cooperation, has not only improved the efficiency of scribing, can also guarantee that the degree of depth of positive and negative scribing is the same.
Preferably, the clamping assembly comprises a first bidirectional cylinder, an upper clamping plate, a connecting pipe, an upper clamping block, a lower clamping plate, a connecting rod, a lower clamping block and a rotating motor, the first bidirectional cylinder is connected in front of a vertical plate of the first supporting plate through a bolt, an output end above the first bidirectional cylinder is connected with the upper clamping plate through a bolt, one end of the upper clamping plate, which is far away from the first bidirectional cylinder, is provided with a first mounting hole, the inner side of the first mounting hole is connected with the connecting pipe through a bearing, the lower end of the connecting pipe extends to the lower part of the upper clamping plate, the lower part of the connecting pipe is connected with the upper clamping block with an annular structure through a bolt, an output end below the first bidirectional cylinder is connected with the lower clamping plate through a bolt, one end of the lower clamping plate, which is far away from the first bidirectional cylinder, is provided with a second mounting hole, and the inner side of the second mounting hole is connected with the connecting rod, just connecting rod upper end extends to the lower plate top, there is lower clamp splice at the connecting rod top through the screw connection, the connecting rod lower extreme pass through the key-type connect in the output that rotates the motor, it passes through bolted connection to rotate the motor the lower plate below sets up like this and can drive punch holder and lower plate synchronous motion through first two-way cylinder, and the punch holder drives the connecting pipe and descends, and the connecting pipe drives the punch holder and descends, and the lower plate drives the connecting rod and rises, and the connecting rod drives the lower clamp splice and rises, has realized the function of fixed wafer, can also drive the connecting rod through rotating the motor and rotate, and the connecting rod drives the lower clamp splice and rotates for the wafer takes place to rotate.
Preferably, when the upper clamping block and the lower clamping block are jointed, the joint face is higher than the top face of the placing disc, so that the wafer is prevented from being abraded due to friction between the wafer and the placing disc when the wafer rotates.
Preferably, clamping assembly still includes first stabilizer bar, first stabilizer bar welding is in the base top, first stabilizer bar upper end passes in proper order the lower plate with the punch holder, and with the lower plate with punch holder sliding connection sets up like this and can lead punch holder and lower plate through first stabilizer bar for more stable when punch holder and lower plate remove.
Preferably, the diameter of the lower clamping block is smaller than that of the abdicating hole, so that the arrangement that the placing disc moves improves enough space.
Preferably, the scribing component moving up and down synchronously comprises a third support plate, a second bidirectional cylinder, a connecting plate and a scribing cutter, the second bidirectional cylinder is connected to one side of the push plate through a bolt, the third support plate is arranged on the upper side and the lower side of the second bidirectional cylinder, the third support plate is also connected to one side of the push plate through a bolt, two output ends of the second bidirectional cylinder penetrate through the third support plate and are connected with the third support plate in a sliding manner and are connected with the connecting plate through bolts, one end, close to one side of the third support plate and far away from the second bidirectional cylinder, of the connecting plate is connected with the scribing cutter through a bolt, the scribing cutter penetrates through the third support plate and is connected with the third support plate in a sliding manner, so that the connecting plate can be driven to move relatively through the second bidirectional cylinder, the connecting plate drives the scribing knife to move relatively, so that the scribing knife performs scribing processing on the wafer.
Preferably, the scribing component capable of moving up and down synchronously comprises two third supporting plates, a scribing cutter, a positive and negative screw rod, an adjusting motor and a moving plate, the three supporting plates are arranged up and down, the third supporting plates are connected to one side of the push plate through bolts, one side, close to the push plate, between the three supporting plates is connected with the positive and negative screw rod through a bearing, the upper ends of the positive and negative screw rod penetrate through the third supporting plates and are connected with the adjusting motor through a coupler, the outer sides of the positive and negative screw rod are in threaded connection with the two moving plates, the moving plates are located between the two third supporting plates, one side, far away from the third supporting plates, of the moving plates is connected with the scribing cutter through bolts, so that the positive and negative screw rod can be driven by the adjusting motor to rotate, the positive and negative screw rod drives the two moving plates to move relatively, and the moving plates drive the scribing cutter to move relatively, so that the scribing knife performs scribing processing on the wafer.
Preferably, push pedal one side still is provided with clean mechanism, clean mechanism includes air pump, exhaust tube, blast pipe, processing case, the inlet end of air pump is connected with through the hose clamp the exhaust tube, be provided with two suction hoods on the exhaust tube, and two suction hoods are located the downward both sides of wafer respectively, the end of giving vent to anger of air pump is connected with through the hose clamp the blast pipe, the blast pipe other end has through the screw connection processing case, just it fixes to handle the case on the base, sets up like this and can produce inside the piece that the air current scribing produced along with the air current enters into the exhaust tube through the start-up of air pump, handles through handling the case at last, prevents that the piece from influencing the quality of wafer.
Preferably, the top of the control panel is provided with a display screen, an operation key, an emergency stop button and a reset button, so that the operation of the whole device is facilitated.
The invention also provides a use method of the wafer scribing device for machining, which comprises the following steps:
the method comprises the following steps: placing the wafer to be scribed on a placing disc, and observing the distance between the wafer and the annular scale to ensure that the wafer is concentric with the placing disc as much as possible;
step two: opening the longitudinal linear slide rail pair and the transverse linear slide rail pair and matching with the alignment equipment body, and moving the positions of the longitudinal linear slide rail pair and the transverse linear slide rail pair to enable the placing disc to drive the wafer to move so as to align the positions of the wafer;
step three: the first bidirectional cylinder is started, the first bidirectional cylinder drives the upper clamping plate and the lower clamping plate to move relatively, the upper clamping plate drives the connecting pipe to drive the upper clamping block to move, the lower clamping plate drives the connecting rod to drive the lower clamping block to move, so that the upper clamping block and the lower clamping block clamp the wafer, the wafer is separated from the constraint of the placing disc, the wafer is prevented from being abraded due to friction with the placing disc when the wafer rotates, then the rotating motor is started, the rotating motor drives the connecting rod to rotate, and the connecting rod drives the lower clamping block to rotate, so that the wafer rotates;
step four: the air cylinder is started, the air cylinder drives the push plate to move, the push plate drives the third support plate, the third support plate and the cleaning mechanism to move, the scribing knife is driven to move after moving to a proper position, the second bidirectional air cylinder and the air pump are started, the second bidirectional air cylinder is started to drive the connecting plate to move relatively, the connecting plate drives the scribing knife to move relatively, the scribing knife performs scribing treatment on the wafer, debris generated by air flow scribing due to starting of the air pump enters the exhaust tube along with air flow and is finally processed by the processing box, or the adjusting motor and the air pump are started, the adjusting motor is started to drive the positive lead screw and the negative lead screw to rotate, the positive lead screw and the negative lead screw drive the two movable plates to move relatively, the movable plates drive the scribing knife to move relatively, the scribing knife performs scribing treatment on the wafer, debris generated by air flow scribing due to starting of the air pump enters the exhaust tube along with air flow and is finally processed by the processing box;
step five: after scribing is completed, firstly, the scribing mechanism resets, then the cleaning mechanism is closed, then the clamping mechanism resets, the wafer returns to the placing disc at the moment, the wafer is taken down, and finally, the reset button is pressed down, so that the longitudinal linear slide rail pair and the transverse linear slide rail pair reset to prepare for aligning the wafer next time.
Has the advantages that:
1. the device can realize the function of aligning the wafer by the transverse movement of the longitudinal linear slide rail pair, the longitudinal movement of the transverse linear slide rail pair and the matching of the alignment equipment body, and the arrangement of the annular scale and the abdicating hole facilitates the initial placement of the wafer, thereby facilitating the alignment work of the wafer;
2. the device can fix the wafer and drive the wafer to rotate through the clamping assembly, and the scribing assembly which synchronously moves up and down is matched to rapidly complete the scribing of the two sides of the wafer, so that the scribing efficiency is improved, and the same depth of front and back scribing can be ensured.
Additional features of the invention and advantages thereof will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of a wafer scribing apparatus for machining according to the present invention;
FIG. 2 is a front view of a wafer scribing apparatus for machining according to the present invention;
FIG. 3 is a schematic structural diagram of a placing tray of the wafer scribing device for mechanical processing according to the present invention;
fig. 4 is a schematic structural diagram of a clamping mechanism of the wafer scribing device for mechanical processing according to the present invention;
fig. 5 is a cross-sectional view of a clamping mechanism of the wafer scribing apparatus for machining according to the present invention;
FIG. 6 is a schematic structural diagram of a scribing mechanism of the wafer scribing device for machining according to the present invention;
fig. 7 is a cross-sectional view of a first embodiment of a dicing mechanism of the wafer dicing apparatus for machining according to the present invention;
fig. 8 is a cross-sectional view of a second embodiment of a dicing mechanism of the wafer dicing apparatus for machining according to the present invention.
The reference numerals are explained below:
1. a base; 2. an adjustment mechanism; 3. a clamping mechanism; 4. a scribing mechanism; 5. a cleaning mechanism; 6. a control panel; 7. aligning the equipment body; 201. a longitudinal linear slide rail pair; 202. a transverse linear slide rail pair; 203. placing a tray; 2031. annular scales; 2032. a hole of abdication; 2033. a yielding groove; 301. a first support plate; 302. a first bidirectional cylinder; 303. an upper splint; 304. a connecting pipe; 305. an upper clamping block; 306. a lower splint; 307. a connecting rod; 308. a lower clamping block; 309. rotating the motor; 310. a first stabilizer bar; 401. a second support plate; 402. a cylinder; 403. pushing the plate; 404. a second stabilizer bar; 405. a third support plate; 406. a second bidirectional cylinder; 407. a connecting plate; 408. a scribing knife; 41. a positive lead screw and a negative lead screw; 42. adjusting the motor; 43. moving the plate; 501. an air pump; 502. an air exhaust pipe; 503. an exhaust pipe; 504. a treatment tank; 601. a display screen; 602. operating a key; 603. an emergency stop button; 604. a reset button.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example 1
As shown in fig. 1-7, a wafer scribing apparatus for machining comprises a base 1, an adjusting mechanism 2 is arranged in the center of the top of the base 1, a control panel 6 is connected to one side of the front end of the top of the base 1 through a screw, the adjusting mechanism 2 comprises a longitudinal linear slide rail pair 201, a transverse linear slide rail pair 202 and a placing plate 203, the transverse linear slide rail pair 202 is arranged on the top of the longitudinal linear slide rail pair 201, the placing plate 203 is connected to the top of the transverse linear slide rail pair 202 through a bolt, an abdicating hole 2032 is arranged in the center of the top of the placing plate 203, a plurality of annular scales 2031 concentric with the abdicating hole 2032 are etched on the top of the placing plate 203, an abdicating groove 2033 penetrating the placing plate 203 up and down is arranged on one side of the placing plate 203, and the abdicating groove 2033 is communicated with the abdicating hole 2032, so that the transverse movement of the longitudinal linear slide rail pair 201, the longitudinal movement of the transverse linear slide rail pair 202 and the alignment device body 7 are matched, the function of wafer alignment is realized, the arrangement of the ring-shaped scale 2031 and the abdicating hole 2032 facilitates the initial placement of the wafer, and further facilitates the wafer alignment work, the rear part of the adjusting mechanism 2 is provided with the clamping mechanism 3, the clamping mechanism 3 comprises a first supporting plate 301, the first supporting plate 301 is welded at the rear end of the top of the base 1, the front end of the vertical plate of the first supporting plate 301 is provided with a clamping component for driving the wafer to rotate, the aligning device body 7 is arranged below the top plate of the first supporting plate 301, one side of the adjusting mechanism 2 is provided with the scribing mechanism 4, the scribing mechanism 4 comprises a second supporting plate 401, an air cylinder 402, a push plate 403 and a second stabilizer bar 404, the second supporting plate 401 is welded at one side of the top of the base 1, one side of the second supporting plate 401 far away from the adjusting mechanism 2 is connected with the air cylinder 402 through a bolt, the output end of the air cylinder 402 passes through the second supporting plate 401 and is connected with the push plate 403 through a bolt, the top of one side of the push plate 403 close to the cylinder 402 is connected with a second stabilizer bar 404 through a bolt, one end of the second stabilizer bar 404 far away from the push plate 403 passes through the second support plate 401 and is connected with the second support plate 401 in a sliding manner, one side of the push plate 403 close to the adjusting mechanism 2 is provided with a scribing component which moves up and down synchronously, the arrangement can fix the wafer through a clamping component and drive the wafer to rotate, and the double sides of the wafer are rapidly scribed by matching with the scribing component which moves up and down synchronously, so that scribing efficiency is improved, and the depths of front and back scribing can be ensured to be the same, the clamping component comprises a first bidirectional cylinder 302, an upper clamping plate 303, a connecting pipe 304, an upper clamping block 305, a lower clamping plate 306, a connecting rod 307, a lower clamping block 308 and a rotating motor 309, the first bidirectional cylinder 302 is connected in front of a vertical plate of the first support plate 301 through a bolt, an output end above the first bidirectional cylinder 302 is connected with the upper clamping plate 303 through a bolt, one end of the upper clamp plate 303, which is far away from the first bidirectional cylinder 302, is provided with a first mounting hole, the inner side of the first mounting hole is connected with a connecting pipe 304 through a bearing, the lower end of the connecting pipe 304 extends to the lower part of the upper clamp plate 303, the lower part of the connecting pipe 304 is connected with an upper clamp block 305 with an annular structure through a screw, the output end below the first bidirectional cylinder 302 is connected with a lower clamp plate 306 through a bolt, one end of the lower clamp plate 306, which is far away from the first bidirectional cylinder 302, is provided with a second mounting hole, the inner side of the second mounting hole is connected with a connecting rod 307, the upper end of the connecting rod 307 extends to the upper part of the lower clamp plate 306, the top of the connecting rod 307 is connected with a lower clamp block 308 through a screw, the lower end of the connecting rod 307 is connected with the output end of a rotating motor 309 through a key, the rotating motor 309 is connected to the lower part of the lower clamp plate 306 through a bolt, so that the first bidirectional cylinder 302 can drive the upper clamp plate 303 and the lower clamp plate 306 to synchronously move, and the upper clamp plate 303 can drive the connecting pipe 304 to descend, the connecting pipe 304 drives the upper clamping block 305 to descend, the lower clamping plate 306 drives the connecting rod 307 to ascend, the connecting rod 307 drives the lower clamping block 308 to ascend, the function of fixing the wafer is realized, the connecting rod 307 can also drive the connecting rod 307 to rotate through the rotating motor 309, the connecting rod 307 drives the lower clamping block 308 to rotate, the wafer is enabled to rotate, the joint surface when the upper clamping block 305 and the lower clamping block 308 are jointed is higher than the top surface of the placing disc 203, the arrangement is that the wafer is prevented from rubbing with the placing disc 203 when rotating, and abrasion of the wafer is caused, the clamping assembly further comprises a first stabilizing rod 310, the first stabilizing rod 310 is welded on the top of the base 1, the upper end of the first stabilizing rod 310 sequentially penetrates through the lower clamping plate 306 and the upper clamping plate 303 and is connected with the lower clamping plate 306 and the upper clamping plate 303 in a sliding manner, the arrangement can guide the upper clamping plate 303 and the lower clamping plate 306 through the first stabilizing rod 310, and the upper clamping plate 303 and the lower clamping plate 306 are enabled to be more stable when moving, the diameter of the lower clamping block 308 is smaller than that of the abdicating hole 2032, so that enough space is provided for the movement of the placing tray 203, the scribing assembly capable of moving up and down synchronously comprises a third supporting plate 405, a second bidirectional cylinder 406, a connecting plate 407 and a scribing blade 408, the second bidirectional cylinder 406 is connected to one side of the push plate 403 by a bolt, the third supporting plate 405 is arranged on the upper and lower sides of the second bidirectional cylinder 406, the third supporting plate 405 is also connected to one side of the push plate 403 by a bolt, two output ends of the second bidirectional cylinder 406 pass through the third supporting plate 405 and are connected with the third supporting plate 405 in a sliding manner, and are connected with the connecting plate 407 by a bolt, one end of the connecting plate 407 close to one side of the third supporting plate 405 and far from the second bidirectional cylinder 406 is connected with the scribing blade 408 by a bolt, the scribing blade 408 passes through the third supporting plate 405 and is connected with the third supporting plate 405 in a sliding manner, so that the connecting plate 407 can be driven by the second bidirectional cylinder 406 to move relatively, the connecting plate 407 drives the scribing blade 408 to move relatively, so that the scribing blade 408 performs scribing treatment on the wafer, a cleaning mechanism 5 is further arranged on one side of the push plate 403, the cleaning mechanism 5 comprises an air pump 501, an exhaust pipe 502, an exhaust pipe 503 and a treatment box 504, an air inlet end of the air pump 501 is connected with the exhaust pipe 502 through a hose clamp, two air suction covers are arranged on the exhaust pipe 502 and are respectively located on two downward sides of the wafer, an air outlet end of the air pump 501 is connected with the exhaust pipe 503 through a hose clamp, the other end of the exhaust pipe 503 is connected with the treatment box 504 through a screw, and the treatment box 504 is fixed on the base 1, so that debris generated by scribing by air flow generated by starting the air pump 501 enters the exhaust pipe 502 along with air flow and is finally treated by the treatment box 504, the debris is prevented from affecting the quality of the wafer, a display screen 601, an operation key 602 and an emergency stop button 603 are arranged on the top of the control panel 6, The reset button 604, which is provided to facilitate the operation of the entire device.
A use method of a wafer scribing device for machining comprises the following steps:
the method comprises the following steps: placing the wafer to be diced on the placing disc 203, and observing the distance between the wafer and the annular scale 2031 to ensure that the wafer is concentric with the placing disc 203 as much as possible;
step two: opening the longitudinal linear slide rail pair 201 and the transverse linear slide rail pair 202 and matching with the alignment device body 7, and moving the positions of the longitudinal linear slide rail pair 201 and the transverse linear slide rail pair 202 to enable the placing disc 203 to drive the wafer to move so as to align the positions of the wafer;
step three: the first bidirectional cylinder 302 is started, the first bidirectional cylinder 302 drives the upper clamping plate 303 and the lower clamping plate 306 to move relatively, the upper clamping plate 303 drives the connecting pipe 304 to drive the upper clamping block 305 to move, the lower clamping plate 306 drives the connecting rod 307 to drive the lower clamping block 308 to move, the upper clamping block 305 and the lower clamping block 308 clamp the wafer, the wafer is separated from the constraint of the placing disc 203, the wafer is prevented from rubbing with the placing disc 203 when rotating, the wafer is prevented from being abraded, then the rotating motor 309 is started, the rotating motor 309 drives the connecting rod 307 to rotate, and the connecting rod 307 drives the lower clamping block 308 to rotate, so that the wafer rotates;
step four: the air cylinder 402 is started, the air cylinder 402 drives the push plate 403 to move, the push plate 403 drives the third support plate 405, the third support plate 405 and the cleaning mechanism 5 to move, the second bidirectional air cylinder 406 and the air pump 501 are started after the dicing blade 408 moves to a proper position, the connecting plate 407 is driven to move relatively by starting the second bidirectional air cylinder 406, the connecting plate 407 drives the dicing blade 408 to move relatively, the dicing blade 408 performs dicing processing on the wafer, debris generated by scribing by air flow generated by starting the air pump 501 enters the suction pipe 502 along with air flow, and is processed by the processing box 504 finally;
step five: after scribing is completed, the scribing mechanism 4 is reset firstly, then the cleaning mechanism 5 is closed, then the clamping mechanism 3 is reset, at this time, the wafer returns to the placing disc 203, the wafer is taken down, and finally the reset button 604 is pressed down, so that the longitudinal linear slide rail pair 201 and the transverse linear slide rail pair 202 are reset to prepare for aligning the wafer next time.
Example 2
As shown in fig. 8, embodiment 2 differs from embodiment 1 in that: the scribing component moving up and down synchronously comprises two third supporting plates 405, a scribing knife 408, a positive and negative lead screw 41, an adjusting motor 42 and a moving plate 43, the three supporting plates 405 are arranged up and down, the three supporting plates 405 are connected to one side of a push plate 403 through bolts, one side, close to the push plate 403, between the three supporting plates 405 is connected with the positive and negative lead screw 41 through a bearing, the upper end of the positive and negative lead screw 41 penetrates through the three supporting plates 405 and is connected with the adjusting motor 42 through a coupler, the outer sides of the positive and negative lead screw 41 are in threaded connection with the two moving plates 43, the moving plate 43 is positioned between the two third supporting plates 405, one side, far away from the third supporting plates 405, of the moving plate 43 is connected with the scribing knife 408 through bolts, the adjusting motor 42 can drive the positive and negative lead screw 41 to rotate, the positive and negative lead screw 41 drives the two moving plates 43 to move relatively, and the moving plate 43 drives the scribing knife 408 to move relatively, so that the dicing blade 408 performs a dicing process on the wafer.
A use method of a wafer scribing device for machining comprises the following steps:
the method comprises the following steps: placing the wafer to be diced on the placing disc 203, and observing the distance between the wafer and the annular scale 2031 to ensure that the wafer is concentric with the placing disc 203 as much as possible;
step two: opening the longitudinal linear slide rail pair 201 and the transverse linear slide rail pair 202 and matching with the alignment device body 7, and moving the positions of the longitudinal linear slide rail pair 201 and the transverse linear slide rail pair 202 to enable the placing disc 203 to drive the wafer to move so as to align the positions of the wafer;
step three: the first bidirectional cylinder 302 is started, the first bidirectional cylinder 302 drives the upper clamping plate 303 and the lower clamping plate 306 to move relatively, the upper clamping plate 303 drives the connecting pipe 304 to drive the upper clamping block 305 to move, the lower clamping plate 306 drives the connecting rod 307 to drive the lower clamping block 308 to move, the upper clamping block 305 and the lower clamping block 308 clamp the wafer, the wafer is separated from the constraint of the placing disc 203, the wafer is prevented from rubbing with the placing disc 203 when rotating, the wafer is prevented from being abraded, then the rotating motor 309 is started, the rotating motor 309 drives the connecting rod 307 to rotate, and the connecting rod 307 drives the lower clamping block 308 to rotate, so that the wafer rotates;
step four: starting the air cylinder 402, driving the push plate 403 to move by the air cylinder 402, driving the third supporting plate 405, the third supporting plate 405 and the cleaning mechanism 5 to move by the push plate 403, so that after the scribing cutter 408 moves to a proper position, starting the adjusting motor 42 and the air pump 501, driving the positive and negative screw rods 41 to rotate by the starting of the adjusting motor 42, driving the two moving plates 43 to move relatively by the positive and negative screw rods 41, driving the scribing cutter 408 to move relatively by the moving plates 43, scribing the wafer by the scribing cutter 408, scribing chips generated by scribing with air flow generated by the starting of the air pump 501 enter the air suction pipe 502 along with the air flow, and finally processing with the processing box 504;
step five: after scribing is completed, the scribing mechanism 4 is reset firstly, then the cleaning mechanism 5 is closed, then the clamping mechanism 3 is reset, at this time, the wafer returns to the placing disc 203, the wafer is taken down, and finally the reset button 604 is pressed down, so that the longitudinal linear slide rail pair 201 and the transverse linear slide rail pair 202 are reset to prepare for aligning the wafer next time.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides a wafer scribing device for machining, includes base (1), base (1) top central authorities are provided with guiding mechanism (2), there is control panel (6), its characterized in that base (1) top front end one side through the screw connection: the adjusting mechanism (2) comprises a longitudinal linear slide rail pair (201), a transverse linear slide rail pair (202) and a placing disc (203), wherein the top of the longitudinal linear slide rail pair (201) is provided with the transverse linear slide rail pair (202), the top of the transverse linear slide rail pair (202) is connected with the placing disc (203) through a bolt, the center of the top of the placing disc (203) is provided with a yielding hole (2032), the top of the placing disc (203) is etched with a plurality of annular scales (2031) concentric with the yielding hole (2032), one side of the placing disc (203) is provided with a yielding groove (2033) which penetrates through the placing disc (203) from top to bottom, the yielding groove (2033) is communicated with the yielding hole (2032), the rear of the adjusting mechanism (2) is provided with a clamping mechanism (3), the clamping mechanism (3) comprises a first supporting plate (301), and the first supporting plate (301) is welded at the rear end of the top of the base (1), the front end of a vertical plate of the first supporting plate (301) is provided with a clamping assembly for driving a wafer to rotate, a centering device body (7) is arranged below a top plate of the first supporting plate (301), one side of the adjusting mechanism (2) is provided with a scribing mechanism (4), the scribing mechanism (4) comprises a second supporting plate (401), an air cylinder (402), a push plate (403) and a second stabilizer bar (404), the second supporting plate (401) is welded on one side of the top of the base (1), one side, far away from the adjusting mechanism (2), of the second supporting plate (401) is connected with the air cylinder (402) through a bolt, the output end of the air cylinder (402) penetrates through the second supporting plate (401) and is connected with the push plate (403) through a bolt, the top of one side, close to the air cylinder (402), of the push plate (403) is connected with the second stabilizer bar (404) through a bolt, one end, far away from the push plate (403), of the second stabilizer bar (404) penetrates through the second support plate (401) and is in sliding connection with the second support plate (401), and a scribing component which moves up and down synchronously is arranged on one side, close to the adjusting mechanism (2), of the push plate (403).
2. The wafer scribing apparatus for machining according to claim 1, wherein: the clamping assembly comprises a first bidirectional cylinder (302), an upper clamping plate (303), a connecting pipe (304), an upper clamping block (305), a lower clamping plate (306), a connecting rod (307), a lower clamping block (308) and a rotating motor (309), wherein the first bidirectional cylinder (302) is connected in front of a vertical plate of the first supporting plate (301) through a bolt, the output end above the first bidirectional cylinder (302) is connected with the upper clamping plate (303) through a bolt, one end, far away from the first bidirectional cylinder (302), of the upper clamping plate (303) is provided with a first mounting hole, the inner side of the first mounting hole is connected with the connecting pipe (304) through a bearing, the lower end of the connecting pipe (304) extends to the lower part of the upper clamping plate (303), the lower part of the connecting pipe (304) is connected with the upper clamping block (305) of an annular structure through a bolt, the output end below the first bidirectional cylinder (302) is connected with the lower clamping plate (306) through a bolt, the one end that the lower plate (306) kept away from first bilateral cylinder (302) has seted up mounting hole two, and this two inboard sides in mounting hole are connected with connecting rod (307), just connecting rod (307) upper end extends to lower plate (306) top, there is lower clamp splice (308) connecting rod (307) top through the screw connection, connecting rod (307) lower extreme pass through the key connection in the output of rotating motor (309), rotating motor (309) pass through bolted connection in lower plate (306) below.
3. The wafer scribing apparatus for machining according to claim 2, wherein: the joint surface when the upper clamping block (305) and the lower clamping block (308) are jointed is higher than the top surface of the placing tray (203).
4. The wafer scribing apparatus for machining according to claim 2, wherein: the clamping assembly further comprises a first stabilizer bar (310), the first stabilizer bar (310) is welded to the top of the base (1), and the upper end of the first stabilizer bar (310) sequentially penetrates through the lower clamping plate (306) and the upper clamping plate (303) and is connected with the lower clamping plate (306) and the upper clamping plate (303) in a sliding mode.
5. The wafer scribing apparatus for machining according to claim 2, wherein: the diameter of the lower clamping block (308) is smaller than that of the yielding hole (2032).
6. The wafer scribing apparatus for machining according to claim 1, wherein: the scribing assembly capable of moving up and down synchronously comprises a third supporting plate (405), a second bidirectional cylinder (406), a connecting plate (407) and a scribing knife (408), wherein the second bidirectional cylinder (406) is connected to one side of the push plate (403) through a bolt, the third supporting plate (405) is arranged on the upper side and the lower side of the second bidirectional cylinder (406), the third supporting plate (405) is also connected to one side of the push plate (403) through a bolt, two output ends of the second bidirectional cylinder (406) penetrate through the third supporting plate (405) and are connected with the third supporting plate (405) in a sliding mode, the connecting plate (407) is connected through a bolt, the scribing knife (408) is connected to one end, close to one side of the third supporting plate (405) and far away from the second bidirectional cylinder (406), of the scribing knife (408) penetrates through the third supporting plate (405), and is slidably connected to the third support plate (405).
7. The wafer scribing apparatus for machining according to claim 1, wherein: the scribing component moving up and down synchronously comprises a third supporting plate (405), a scribing cutter (408), a positive and negative screw rod (41), an adjusting motor (42) and a moving plate (43), wherein two third supporting plates (405) are arranged, and is arranged up and down, the third supporting plate (405) is connected with one side of the push plate (403) through a bolt, one side of the third supporting plate (405) close to the push plate (403) is connected with the positive and negative screw rod (41) through a bearing, the upper end of the positive and negative lead screw (41) passes through the third supporting plate (405), the adjusting motor (42) is connected through a coupler, the outer side of the positive and negative screw rod (41) is in threaded connection with two moving plates (43), the moving plate (43) is positioned between the two third supporting plates (405), the scribing knife (408) is connected to one side, far away from the third supporting plate (405), of the moving plate (43) through a bolt.
8. The wafer scribing apparatus for machining according to claim 1, wherein: push pedal (403) one side still is provided with clean mechanism (5), clean mechanism (5) include air pump (501), exhaust tube (502), blast pipe (503), handle case (504), the inlet end of air pump (501) is connected with through the larynx hoop exhaust tube (502), be provided with two suction hood on exhaust tube (502), and two suction hood are located the downward both sides of wafer respectively, the end of giving vent to anger of air pump (501) is connected with through the larynx hoop blast pipe (503), blast pipe (503) other end has through screw connection handle case (504), just it fixes to handle case (504) on base (1).
9. The wafer scribing apparatus for machining according to claim 1, wherein: the top of the control panel (6) is provided with a display screen (601), an operation key (602), an emergency stop button (603) and a reset button (604).
10. A use method of a wafer scribing device for machining is characterized in that: the method comprises the following steps:
the method comprises the following steps: placing the wafer to be diced on the placing disc (203), and observing the distance between the wafer and the annular scale (2031) to ensure that the wafer is concentric with the placing disc (203) as much as possible;
step two: opening the longitudinal linear slide rail pair (201) and the transverse linear slide rail pair (202) and matching with the alignment equipment body (7), and moving the positions of the longitudinal linear slide rail pair (201) and the transverse linear slide rail pair (202) to enable the placing disc (203) to drive the wafer to move so as to align the positions of the wafer;
step three: the method comprises the following steps that a first bidirectional cylinder (302) is started, the first bidirectional cylinder (302) drives an upper clamping plate (303) and a lower clamping plate (306) to move relatively, the upper clamping plate (303) drives a connecting pipe (304) to drive an upper clamping block (305) to move, the lower clamping plate (306) drives a connecting rod (307) to drive a lower clamping block (308) to move, the upper clamping block (305) and the lower clamping block (308) clamp a wafer, the wafer is separated from the constraint of a placing disc (203), the wafer is prevented from being abraded due to friction with the placing disc (203) when rotating, then a rotating motor (309) is started, the rotating motor (309) drives the connecting rod (307) to rotate, and the connecting rod (307) drives the lower clamping block (308) to rotate, so that the wafer rotates;
step four: the air cylinder (402) is started, the air cylinder (402) drives the push plate (403) to move, the push plate (403) drives the third supporting plate (405), the third supporting plate (405) and the cleaning mechanism (5) to move, the scribing knife (408) moves to a proper position, the second bidirectional air cylinder (406) and the air pump (501) are started, the second bidirectional air cylinder (406) is started to drive the connecting plate (407) to move relatively, the connecting plate (407) drives the scribing knife (408) to move relatively, the scribing knife (408) performs scribing treatment on the wafer, debris generated by scribing of air flow generated by starting the air pump (501) enters the air exhaust pipe (502) along with air flow, and is finally treated by the treatment box (504), or the adjusting motor (42) and the air pump (501) are started, the forward and reverse lead screw (41) is driven to rotate by starting the adjusting motor (42), the forward and reverse lead screw (41) drives the two moving plates (43) to move relatively, the moving plate (43) drives the scribing knife (408) to move relatively, the scribing knife (408) performs scribing treatment on the wafer, debris generated by scribing due to airflow generated by starting the air pump (501) enters the air suction pipe (502) along with the airflow, and is finally treated by the treatment box (504);
step five: after scribing is finished, firstly the scribing mechanism (4) is reset, then the cleaning mechanism (5) is closed, then the clamping mechanism (3) is reset, at the moment, the wafer returns to the placing disc (203), the wafer is taken down, and finally the reset button (604) is pressed down, so that the longitudinal linear slide rail pair (201) and the transverse linear slide rail pair (202) are reset to prepare for aligning the wafer next time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110845990.9A CN113571453A (en) | 2021-07-26 | 2021-07-26 | Wafer scribing device for machining and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110845990.9A CN113571453A (en) | 2021-07-26 | 2021-07-26 | Wafer scribing device for machining and using method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113571453A true CN113571453A (en) | 2021-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110845990.9A Withdrawn CN113571453A (en) | 2021-07-26 | 2021-07-26 | Wafer scribing device for machining and using method thereof |
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| Country | Link |
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| CN (1) | CN113571453A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114352704A (en) * | 2022-01-14 | 2022-04-15 | 深圳特斯特半导体设备有限公司 | Blade main shaft structure of dicing saw |
| CN114714101A (en) * | 2022-04-22 | 2022-07-08 | 利瑞宝运动器材(吴江)有限公司 | Automatic rounding and cutting equipment for basketry |
| CN114872210A (en) * | 2022-05-19 | 2022-08-09 | 扬州森源电气有限公司 | Wafer scribing machine for processing intelligent electrical product |
| CN116387223A (en) * | 2023-05-04 | 2023-07-04 | 无锡翔域半导体有限公司 | Wafer notch positioning structure for ion implanter |
| CN116652787A (en) * | 2023-07-31 | 2023-08-29 | 沈阳和研科技股份有限公司 | Grinding wheel scribing machine |
| CN116921877A (en) * | 2023-09-14 | 2023-10-24 | 四川富乐华半导体科技有限公司 | Copper-clad ceramic carrier plate cutting and coding device |
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- 2021-07-26 CN CN202110845990.9A patent/CN113571453A/en not_active Withdrawn
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114352704A (en) * | 2022-01-14 | 2022-04-15 | 深圳特斯特半导体设备有限公司 | Blade main shaft structure of dicing saw |
| CN114352704B (en) * | 2022-01-14 | 2024-03-15 | 深圳特斯特半导体设备有限公司 | Blade spindle structure of dicing saw |
| CN114714101A (en) * | 2022-04-22 | 2022-07-08 | 利瑞宝运动器材(吴江)有限公司 | Automatic rounding and cutting equipment for basketry |
| CN114714101B (en) * | 2022-04-22 | 2023-04-18 | 利瑞宝运动器材(吴江)有限公司 | Automatic rounding and cutting-off equipment for basketry |
| CN114872210A (en) * | 2022-05-19 | 2022-08-09 | 扬州森源电气有限公司 | Wafer scribing machine for processing intelligent electrical product |
| CN114872210B (en) * | 2022-05-19 | 2022-12-23 | 扬州森源电气有限公司 | Wafer scribing machine for processing electronic products |
| CN116387223A (en) * | 2023-05-04 | 2023-07-04 | 无锡翔域半导体有限公司 | Wafer notch positioning structure for ion implanter |
| CN116387223B (en) * | 2023-05-04 | 2023-10-10 | 无锡翔域半导体有限公司 | Wafer notch positioning structure for ion implanter |
| CN116652787A (en) * | 2023-07-31 | 2023-08-29 | 沈阳和研科技股份有限公司 | Grinding wheel scribing machine |
| CN116652787B (en) * | 2023-07-31 | 2023-10-20 | 沈阳和研科技股份有限公司 | Grinding wheel scribing machine |
| CN116921877A (en) * | 2023-09-14 | 2023-10-24 | 四川富乐华半导体科技有限公司 | Copper-clad ceramic carrier plate cutting and coding device |
| CN116921877B (en) * | 2023-09-14 | 2023-12-01 | 四川富乐华半导体科技有限公司 | Copper-clad ceramic carrier plate cutting and coding device |
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Application publication date: 20211029 |