CN114872210A - Wafer scribing machine for processing intelligent electrical product - Google Patents
Wafer scribing machine for processing intelligent electrical product Download PDFInfo
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- CN114872210A CN114872210A CN202210543869.5A CN202210543869A CN114872210A CN 114872210 A CN114872210 A CN 114872210A CN 202210543869 A CN202210543869 A CN 202210543869A CN 114872210 A CN114872210 A CN 114872210A
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- air pipe
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- 239000012528 membrane Substances 0.000 claims description 26
- 230000005389 magnetism Effects 0.000 claims description 21
- 238000001179 sorption measurement Methods 0.000 claims description 14
- 210000003437 trachea Anatomy 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 14
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000009471 action Effects 0.000 description 16
- 230000000903 blocking effect Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 229920006302 stretch film Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor processing, and discloses a wafer scribing machine for processing intelligent electrical products, which comprises a fixed seat, wherein the bottom end of the fixed seat is fixedly connected with a workbench, a fixed cavity is formed in the fixed seat, the top end of the workbench positioned in the fixed cavity is fixedly connected with a sucker, the lower side of the side surface of the sucker is fixedly connected with the lower side of the inner wall of the fixed seat, the bottom end in the sucker is fixedly connected with an air pump, and an air channel is formed in the sucker positioned at the top end of the air pump. According to the wafer positioning device, the fixed cavity is formed between the fixed seat and the sucker, the movable column and parts of the movable column are obliquely arranged above the inner part of the fixed cavity, and the rotating piece is always in contact with the side surface of the wafer in the process of placing the wafer on the top end of the sucker, so that the periphery of the wafer is driven to be subjected to uniform driving force, the wafer is effectively and accurately placed in the center of the sucker, the alignment efficiency of the wafer is improved, the subsequent scribing precision of the wafer is enhanced, and the processing quality of a product is guaranteed.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a wafer scribing machine for processing intelligent electrical products.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it is circular in shape, and a process of dividing a whole wafer into individual crystal grains in a chip size is called wafer dicing. The wafer dicing machine is an indispensable device in the wafer dicing process flow, and the main structure of the wafer dicing machine is divided into a dicing driving part and a workbench part, the conventional dicing tool is a grinding wheel, the workbench part mainly comprises a sucking disc, the dicing process comprises the steps of adsorbing and fixing the wafer on the surface of the sucking disc, cutting the wafer by utilizing the high-speed rotation of the grinding wheel, and finally processing the wafer into a semiconductor chip meeting the requirements.
However, the existing wafer dicing saw has some defects in the use process: firstly, the randomness of the position of a wafer initially placed on the surface of a sucking disc is large, the wafer has influence on the subsequent work of aligning, scribing and the like of the wafer, and the work efficiency and the production quality of products are reduced; meanwhile, when the wafer is scribed, chips generated by friction between the grinding wheel and the wafer are easily adhered to the wafer, so that secondary friction between the wafer and the grinding wheel is increased, the dividing precision is reduced, and serious influence is caused on scribing work.
Disclosure of Invention
Aiming at the defects of the existing wafer scribing machine in the use process in the background technology, the invention provides the wafer scribing machine for processing the intelligent electrical product, which has the advantages of improving the wafer placement precision, improving the alignment efficiency, removing slag on the surface of the wafer and avoiding secondary dividing friction, and solves the technical problems in the background technology.
The invention provides the following technical scheme: a wafer scribing machine for processing intelligent electrical products comprises a fixed seat, wherein the bottom end of the fixed seat is fixedly connected with a workbench, a fixed cavity is formed in the fixed seat, the top end of the workbench positioned in the fixed cavity is fixedly connected with a sucker, the lower side of the side surface of the sucker is fixedly connected with the lower side of the inner wall of the fixed seat, the inner bottom end of the sucker is fixedly connected with an air pump, an air channel is formed in the sucker positioned at the top end of the air pump, a wafer is placed at the top end of the sucker, two side walls of an inclined space of the fixed cavity are movably connected with a movable block, the bottom end of the movable block is connected with the inner wall of the fixed seat through a large spring, the top end of the movable block is fixedly connected with the bottom end of a movable column, the top end of the movable column is provided with a groove, a central piece is fixedly connected between the front inner wall and the rear wall of the groove, and the surface of the central piece is movably sleeved with the inner ring of a rotating piece, the fixed orifices have been seted up to the outer lane of rotating member, and rotating member passes through fixed orifices and adsorption equipment fixed connection, is located the movable column of rotating member below has been seted up and has been held the chamber, the inside that holds the chamber sets up thrust unit.
Preferably, adsorption equipment comprises flexible membrane, push pedal and gag lever post, the one end surface of flexible membrane is fixed cup joints with the fixed orifices of rotating member, the other end fixed connection push pedal of flexible membrane, the gag lever post has been run through at the both ends of push pedal, and the one end of gag lever post and the inner circle inner wall fixed connection of rotating member, the other end of gag lever post and the outer lane inner wall fixed connection of rotating member.
Preferably, thrust unit comprises mounting, fly leaf, side opening and interior trachea, outer trachea, the outer wall of mounting and the front and back inner wall fixed connection who holds the chamber keep away from side opening has been seted up to mounting one side below of wafer, the inside activity of mounting cup joints the fly leaf, and through erecting spring coupling between the bottom of fly leaf and the mounting bottom, is located the mounting inner wall fixedly connected with of fly leaf top hinders the piece, is located the fixed trachea in cup jointing in mounting one side of hindering the piece top, and the fixed trachea of cup jointing of opposite side of mounting, interior trachea and outer tracheal inside all is equipped with the gas valve door.
Preferably, the air valve consists of a limiting ring, a baffle plate, a baffle rod and a transverse spring, the limiting ring is fixedly sleeved with the inner air pipe and the outer air pipe, the baffle plate is movably sleeved inside the limiting ring, one side of the baffle plate penetrates through the small-opening end of the limiting ring to be fixedly connected with the baffle rod, and the baffle rod is connected with the limiting ring through the transverse spring.
Preferably, the cross section of the gas channel is in a cross shape, the vertical channel is communicated with the middle part of the top end of the sucking disc, the transverse channel is communicated with the vertical space of the fixed cavity, and the transverse channels of the gas channel correspond to the movable columns in number one by one.
Preferably, the central member is composed of four limit blocks with different magnetism and magnetic quantity, the limit block at the top end of the central member on the central line of the movable column has model magnetism, the limit block at the bottom end of the central member corresponding to the limit block has model magnetism, the limit block at the top end of the central member has the same magnetic quantity as the limit block at the bottom end of the central member, the limit block at the middle part of the central member close to the wafer has model magnetism, the limit block corresponding to the limit block has model magnetism, the two limit blocks at the middle part of the central member have the same magnetic quantity, and the limit block at the top end of the central member is twice the magnetic quantity of the limit block at the middle part of the central member.
Preferably, the flexible membrane is elastic rubber material, the push pedal has type magnetism, one the rotating member has four adsorption equipment, and evenly encircles the setting of center part, and a sucking disc has four rotating members, and evenly encircles the setting of sucking disc.
Preferably, the side opening sets up for the slant of interior height outside low, the fly leaf sets up for the slope, and inclination is the same with the side opening.
Preferably, the inner air pipe and the outer air pipe correspond in position, the inner air pipe is located on one side of the fixing part close to the wafer, the outer air pipe is located on one side of the fixing part far away from the wafer, the angle of the inner air pipe is set to be low inside and high outside, and the angle of the outer air pipe is set to be high inside and low outside.
Preferably, the large-opening end of the limiting ring positioned in the inner air pipe is close to the inside of the fixing part, and the large-opening end of the limiting ring positioned in the outer air pipe is close to the outside of the fixing part.
The invention has the following beneficial effects:
1. according to the wafer positioning device, the fixed cavity is formed between the fixed seat and the sucker, the movable column and parts of the movable column are obliquely arranged above the inner part of the fixed cavity, and the rotating piece is always in contact with the side surface of the wafer in the process of placing the wafer on the top end of the sucker, so that the periphery of the wafer is driven to be subjected to uniform driving force, the wafer is effectively and accurately placed in the center of the sucker, the alignment efficiency of the wafer is improved, the subsequent scribing precision of the wafer is enhanced, and the processing quality of a product is guaranteed.
2. According to the invention, the central part is arranged in the rotating part, and the central part is divided into four limiting blocks with different magnetism and magnetic quantity, so that the telescopic film and the parts thereof correspond to different limiting blocks in the rotating process of the rotating part, the telescopic film generates different telescopic effects, and then the chips attached to the surface of the wafer are effectively sucked into the telescopic film and then collected into the accommodating cavity of the movable column, so that the amount of the chips on the surface of the wafer is reduced, the secondary friction fault on the wafer is prevented, the dividing precision of the grinding wheel is improved, and the processing quality of the wafer is ensured.
3. According to the invention, the cross-shaped gas channel is arranged in the sucker, so that the bottom end of the wafer is subjected to gas adsorption force, the working stability of the wafer is effectively improved, meanwhile, the fixing part, the inner gas pipe, the outer gas pipe and parts of the inner gas pipe are arranged in the accommodating cavity of the movable column, when the push plate is positioned above the accommodating cavity, the push plate pushes the telescopic membrane to compress under the action of magnetic repulsion force between the push plate and the lower limiting block, taking the rotary part on the left side as an example, the movable plate moves up and down under the action of air flow generated by telescopic membrane expansion and self gravity of scraps, the change of the space above the fixing part causes the inner gas pipe and the outer gas pipe to be opened and closed alternately, the rotary part is effectively pushed to rotate anticlockwise, the anticlockwise rotation of the rotary part applies downward extrusion force to the wafer, and the stability of the wafer positioned at the top end of the sucker is further ensured.
Drawings
FIG. 1 is a schematic diagram of an overall front view structure of a wafer in a state where no wafer is placed according to the present invention;
FIG. 2 is a schematic view of an overall front cross-sectional structure of a wafer of the present invention;
FIG. 3 is an enlarged view of a portion of the structure shown in FIG. 2;
FIG. 4 is an enlarged view of a portion of the structure shown at B in FIG. 3 according to the present invention;
FIG. 5 is an enlarged view of a portion of the structure of FIG. 4 at C according to the present invention;
FIG. 6 is a schematic top view of a fixing base at a rotating member according to the present invention.
In the figure: 1. a fixed seat; 11. a work table; 12. a fixed cavity; 2. a suction cup; 21. an air pump; 22. a gas channel; 3. a movable post; 31. a movable block; 4. a rotating member; 5. a center piece; 6. a stretch film; 61. pushing the plate; 62. a limiting rod; 7. a fixing member; 71. a movable plate; 711. blocking; 72. a side hole; 8a, an inner air pipe; 8b, an outer trachea; 81. a limiting ring; 82. blocking the plate; 83. a blocking rod; 9. and (5) a wafer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, a wafer scribing machine for processing intelligent electrical products includes a fixing base 1, a worktable 11 is fixedly connected to the bottom end of the fixing base 1, a fixed cavity 12 is formed inside the fixing base 1, a suction cup 2 is fixedly connected to the top end of the worktable 11 inside the fixed cavity 12, an air pump 21 is fixedly connected to the bottom end inside the suction cup 2, an air channel 22 is formed inside the suction cup 2 at the top end of the air pump 21, the cross-sectional shape of the air channel 22 is cross-shaped, the vertical channel leads to the middle of the top end of the suction cup 2, the horizontal channel leads to the vertical space of the fixed cavity 12, the number of the horizontal channels of the air channel 22 corresponds to the number of the movable columns 3 one by one, so that the bottom end of the wafer 9 is fully adsorbed by the air flow inside the vertical channel of the air channel 22, the stability of the wafer 9 is improved, and the air flow of the horizontal channel has an adsorption effect on the movable columns 3 and the parts thereof, effectively kept the clamping action of swivel becket 4 to wafer 9 side, ensured that wafer 9 is in 2 top positive central positions of sucking disc, improved wafer 9's scribing quality, wafer 9 is placed on the top of sucking disc 2, is located fixing base 1, 2 lateral walls of sucking disc and the movable block 31 swing joint of 12 oblique spaces in fixed chamber, through big spring coupling between the bottom of movable block 31 and the inner wall of fixing base 1, the top of movable block 31 and the bottom fixed connection of activity post 3.
Referring to fig. 2-3 and 6, further, a groove is formed at the top end of the movable column 3, a central member 5 is fixedly connected between the front and rear inner walls of the groove, the central member 5 is composed of four limit blocks with different magnetism and magnetic quantity, the limit block at the top end of the central member 5 on the center line of the movable column 3 has S-type magnetism, the limit block at the bottom end of the central member 5 corresponding to the limit block has N-type magnetism, the magnetic quantity of the limit block at the top end of the central member 5 is the same as that of the limit block at the bottom end of the central member 5, the limit block at the middle part of the central member 5 near the wafer 9 has S-type magnetism, the limit block corresponding to the S-type magnetism, the magnetic quantity of the two limit blocks at the middle part of the central member 5 is the same, the limit block at the top end of the central member 5 is twice as that of the limit block at the middle part of the central member 5, when the rotary member 4 drives the adsorption device to approach different limit blocks, the push plate 61 drives the telescopic membrane 6 to contract or expand under the action of magnetic force, thereby effectively adsorb and collect the piece on the wafer 9, improve the scribing quality of wafer 9, the surface of centre piece 5 cup joints with the inner circle activity of rotating member 4, and to sum up a sucking disc 2 has four rotating members 4, and evenly encircles the setting of sucking disc 2, can effectively fix around wafer 9, improves the stability of wafer 9 scribing during operation.
Referring to fig. 3-4 and 6, further, a fixing hole is formed in an outer ring of the rotating member 4, the rotating member 4 is fixedly connected to one end of the flexible film 6 made of elastic rubber material through the fixing hole, and can effectively contract and expand to change an inner space thereof, so that the dust on the surface of the wafer 9 is adsorbed by the air flow movement therein, the other end of the flexible film 6 is fixedly connected to the push plate 61 with N-type magnetism, the flexible film 6 is expanded when the push plate 61 is close to the stopper with S-type magnetism, the dust is sucked into the flexible film 6, the flexible film 6 is contracted when the push plate 61 is close to the stopper with N-type magnetism, and the dust is put into the accommodating cavity, thereby the surface of the wafer 9 is continuously cleaned by the rotation of the rotating member 4, the stoppers 62 penetrate through two ends of the push plate 61, and one end of the stopper 62 is fixedly connected to an inner wall of the inner ring of the rotating member 4, The other end of gag lever post 62 and the outer lane inner wall fixed connection of rotating member 4 to sum up flexible membrane 6, push pedal 61, gag lever post 62, 63 and constitute adsorption equipment, and a rotating member 4 has four adsorption equipment, and evenly encircles the setting of centre piece 5, and four adsorption equipment can produce adsorption affinity and repulsion force at the flexible in-process of flexible membrane 6 to effectively collect the piece on wafer 9 surface.
Referring to fig. 3-5, further, the movable column 3 below the rotary member 4 is provided with an accommodating cavity, the outer wall of the fixing member 7 is fixedly connected to the front and rear inner walls of the accommodating cavity, a side hole 72 is provided below the side of the fixing member 7 away from the wafer 9, the side hole 72 is obliquely disposed with a high inside and a low outside, the movable plate 71 is movably sleeved inside the fixing member 7, the bottom end of the movable plate 71 is connected to the bottom end of the fixing member 7 through a vertical spring, a stop block 711 is fixedly connected to the inner wall of the fixing member above the movable plate 71, that is, the movable plate 71 is obliquely disposed with the same inclination angle as the side hole 72, so that the debris falling onto the movable plate can move toward the side of the movable plate 71 near the side hole 72 according to its own gravity, and thus when the side hole 72 is opened by the movable plate 71, the debris will fall into the accommodating cavity from the side hole 72 to collect the debris, the chips are prevented from scattering, one side of the fixing part 7 positioned above the block 711 is fixedly sleeved with an inner air pipe 8a with a lower inner part and a higher outer part, and the other side of the fixing part 7 is fixedly sleeved with an outer air pipe 8b with a higher inner part and a lower outer part, specifically, the inner air pipe 8a corresponds to the outer air pipe 8b in position, the inner air pipe 8a is positioned at one side of the fixing part 7 close to the wafer 9, the outer air pipe 8b is positioned at one side of the fixing part 7 far away from the wafer 9, when the inner air pipe 8a is opened, the angle of the inner air pipe 8a is set to enable the gas at the outer side of the inner air pipe 8a to generate an oblique downward airflow, so that the rotating part 4 is pushed to rotate anticlockwise, when the outer air pipe 8b is opened, the angle of the outer air pipe 8b enables the gas at the outer side of the outer air pipe 8b to generate an oblique upward airflow, so that the rotating part 4 is pushed anticlockwise, and the rotating part 4 is pushed anticlockwise to continuously rotate anticlockwise, the inner air pipe 8a and the outer air pipe 8b are both provided with air valves, to sum up, taking the left rotary member 4 as an example, when the movable plate 71 moves downwards under the action of the gas flow compressed in the telescopic membrane 6 and the gravity of debris, the air pipe 8a in the air flow on the left side of the accommodating cavity is promoted to enter the fixed member 7 due to the increase of the volume above the movable plate 71, and the generated oblique downward flow drives the rotary member 4 to rotate anticlockwise, when the movable plate 71 moves to contact with the bottom end of the fixed member 7, the side hole 72 is opened at the moment to enable the debris to enter the accommodating cavity, so as to provide a stable environment for debris collection, when the upper portion of the movable plate 71 does not have thrust action and moves upwards, the volume above of the fixed member 7 is reduced, the volume below volume is increased, so that the outer air pipe 8b is opened, the generated oblique upward flow pushes the rotary member 4 to rotate anticlockwise, and the rotary member 4 rotates continuously to drive the telescopic membrane 6 to continuously adsorb, The chips are collected, and the rotating member 4 is urged to push the wafer 9 downwards, so that the stability of the wafer 9 during scribing is further improved.
Referring to fig. 5, the gas valve further includes a limiting ring 81, a blocking plate 82, a blocking rod 83 and a horizontal spring, the limiting ring 81 is fixedly sleeved with the inner gas tube 8a and the outer gas tube 8b, the blocking plate 82 is movably sleeved inside the limiting ring 81, one side of the blocking plate 82 passes through a small opening end of the limiting ring 81 and is fixedly connected with the blocking rod 83, the blocking rod 83 is connected with the limiting ring 81 through the horizontal spring, that is, a large opening end of the limiting ring 81 inside the inner gas tube 8a is close to the inside of the fixing member 7, a large opening end of the limiting ring 81 inside the outer gas tube 8b is close to the outside of the fixing member 7, when the moving plate 71 descends, a space above the moving plate is increased, and gas pressure is decreased, so that the inner gas tube 8a is opened and the outer gas tube 8b is closed, and thus a downward oblique gas flow near one side of the wafer 9 pushes the rotating member 4 to rotate counterclockwise, and when the moving plate 71 ascends, a space above the moving plate 71 is decreased, and a space above the moving plate is decreased, The air pressure increases, whereby the inner air tube 8a is closed and the outer air tube 8b is opened, so that the rotating member 4 is pushed to rotate counterclockwise by the obliquely upward air flow from the side away from the wafer 9.
Fig. 4 and 5 are specific structural diagrams of the inside of the accommodating cavity of the movable column 3, and at this time, the movable plate 71 moves downward under the action of the instant airflow impact force generated by the telescopic membrane 6, and the moving distance is from the bottom end of the blocking block 711 to the bottom end of the inside of the fixing member 7, at this time, the blocking plate 82 in the inner air tube 8a does not contact with the limiting ring 81, the air passage of the inner air tube 8a is opened, and the blocking plate 82 in the outer air tube 8b is tightly attached to the limiting ring 81, so that the air passage of the outer air tube 8b is closed.
The using method of the invention has the following working principle:
when the wafer 9 is not placed at the top end of the sucker 2, the movable columns 3, the rotating pieces 4 and other parts move upwards under the action of large spring force to extend out of the fixed seat 1, in the process of placing the wafer 9, the side face of the wafer 9 is contacted with the side face of the rotating piece 4, the wafer 9 moves downwards under the action of uniform pressure of the four rotating pieces 4 to be contacted with the top end of the sucker 2, therefore, the wafer 9 is placed at the center of the sucker 2, meanwhile, the air pump 21 is started, so that air in the air channel 22 is sucked away to form a negative pressure environment, air flow in the vertical channel of the air channel 22 has adsorption force on the bottom end of the wafer 9, the stability of the scribing process of the wafer 9 is effectively improved, air flow in the transverse channel of the air channel 22 drives the air in the fixed cavity 12 to flow towards the direction of the air flow 21, so that the movable blocks 31, the movable columns 3 and other parts move downwards under the action of air pump suction force of the air flow, and the four rotating pieces 4 are always contacted and extruded with the side face of the wafer 9, so that the wafer 9 is always positioned at the central position of the sucking disc 2 and does not move due to the division of the grinding wheel, in the scribing process of the wafer 9, taking the left rotating piece 4 as an example, the push plate 61 at the top end position inside the rotating piece 4 moves downwards towards the central piece 5 under the action of the magnetic attraction of the S-shaped limit block, the internal space of the telescopic membrane 6 is expanded in a short time, so that an inclined airflow moving towards the telescopic membrane 6 is generated, the airflow flows across the surface of the wafer 9 and adsorbs and cleans debris, the debris is collected in the telescopic membrane 6, due to the increase of the weight inside the telescopic membrane 6, the originally inclined telescopic membrane 6 drives the rotating piece 4 to rotate anticlockwise, when the push plate 61 rotates to the bottom end of the rotating piece 4, the push plate 61 moves towards the accommodating cavity fixing piece of the movable column 3 under the action of the magnetic repulsion of the N-shaped limit block, the internal space of the telescopic membrane 6 is compressed in a short time, the debris in the telescopic membrane 6 enters the accommodating cavity 7, the debris is effectively collected, meanwhile, the instant airflow impact force generated by the telescopic membrane 6 when the telescopic membrane 6 contracts and the self gravity of the debris jointly push the movable plate 71 to move downwards from the bottom end of the block 711, the process enables the upper space of the fixing member 7 to be enlarged and the air pressure to be reduced, the block 82 in the inner air pipe 8a is pushed to move and open the air valve, so that the oblique downward airflow is generated above the right accommodating cavity of the fixing member 7, the rotating member 4 is pushed to rotate anticlockwise, the outer air pipe 8b is closed, no air enters the fixing member 7 from the outer air pipe 8b, when the movable plate 71 continuously moves downwards until the movable plate 71 contacts the bottom of the fixing member 7, the movable plate 71 communicates the upper space of the movable plate 71 with the outer space of the fixing member 7 through the side hole 72, the whole air pressure of the accommodating cavity is balanced, and meanwhile, the debris falls into the accommodating cavity outside the fixing member 7 through the movable plate 71 and the side hole 72 in the oblique direction, ensures that the debris is collected in a relatively stable space, avoids the escape of the debris at four positions, when the debris gravity and other thrust influences above the movable plate 71 are avoided and the internal and external air pressures of the fixing part 7 are balanced, the movable plate 71 moves upwards reversely under the thrust action of the vertical spring, when the movable plate 71 isolates the side hole 72 from the space above the fixing part 7, because the rotating part 4 rotates continuously, the outer wall of the rotating part 4 and the space above the fixing part 7 form a closed space, at the moment, the space above the fixing part 7 is continuously reduced and the air pressure is continuously increased, and the air pressure is greater than the deformation elastic force of the transverse spring connected with the blocking rod 83, so that the inner air pipe 8a is closed, no air is blown out of the fixing part 7 from the inner air pipe 8a, the outer air pipe 8b is opened, the air in the fixing part 7 is blown out from the outer air pipe 8b, and an oblique upward air flow is generated above the left accommodating cavity of the fixing part 7, and the rotating part 4 is pushed to rotate anticlockwise, to sum up, interior trachea 8a and outer trachea 8b provide the motive force to the anticlockwise rotation of rotating member 4, and existing effect promotes flexible membrane 6 and lasts rotatory absorption, collects the piece, has prevented 9 surfaces on the wafer from producing the secondary friction, makes four rotating member 4 have decurrent motive force to wafer 9 again, further makes wafer 9 and sucking disc 2 adsorb the laminating, has improved the work steadiness of wafer 9.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a wafer scriber for processing of intelligence electrical products, includes fixing base (1), the bottom fixedly connected with workstation (11) of fixing base (1), its characterized in that: a fixed cavity (12) is formed in the fixed seat (1), a sucker (2) is fixedly connected to the top end of a workbench (11) positioned in the fixed cavity (12), the side surface lower portion of the sucker (2) is fixedly connected with the inner wall lower portion of the fixed seat (1), an air pump (21) is fixedly connected to the bottom end of the sucker (2) positioned at the top end of the air pump (21), an air channel (22) is formed in the sucker (2) positioned at the top end of the air pump (21), a wafer (9) is placed at the top end of the sucker (2), two side walls of an inclined space positioned in the fixed cavity (12) are movably connected with a movable block (31), the bottom end of the movable block (31) is connected with the inner wall of the fixed seat (1) through a large spring, the top end of the movable block (31) is fixedly connected with the bottom end of a movable column (3), a groove is formed in the top end of the movable column (3), and a central piece (5) is fixedly connected between the front inner wall and the rear wall of the groove, the surface of the central part (5) is movably sleeved with the inner ring of the rotating part (4), the outer ring of the rotating part (4) is provided with a fixing hole, the rotating part (4) is fixedly connected with the adsorption device through the fixing hole, the movable column (3) below the rotating part (4) is provided with a containing cavity, and a pushing device is arranged inside the containing cavity.
2. The wafer dicing saw for intelligent electrical product processing according to claim 1, wherein: adsorption equipment comprises flexible membrane (6), push pedal (61) and gag lever post (62), the one end surface of flexible membrane (6) is fixed cup joints with the fixed orifices of rotating member (4), the other end fixed connection push pedal (61) of flexible membrane (6), the both ends of push pedal (61) are run through there are gag lever post (62), and the outer lane inner wall fixed connection of the one end of gag lever post (62) and the inner circle inner wall fixed connection of rotating member (4), the other end of gag lever post (62) and rotating member (4).
3. The wafer dicing saw for intelligent electrical product processing according to claim 1, wherein: the pushing device consists of a fixing piece (7), a movable plate (71), a side hole (72), an inner air pipe (8 a) and an outer air pipe (8 b), the outer wall of the fixing part (7) is fixedly connected with the front inner wall and the rear inner wall of the containing cavity, a side hole (72) is arranged below one side of the fixing part (7) far away from the wafer (9), a movable plate (71) is movably sleeved in the fixing part (7), the bottom end of the movable plate (71) is connected with the bottom end of the fixing piece (7) through a vertical spring, a block (711) is fixedly connected with the inner wall of the fixing piece above the movable plate (71), one side of the fixing piece (7) above the block (711) is fixedly sleeved with an inner air pipe (8 a), and the other side of the fixing piece (7) is fixedly sleeved with an outer air pipe (8 b), and air valves are arranged inside the inner air pipe (8 a) and the outer air pipe (8 b).
4. The wafer dicing saw for intelligent electrical product processing according to claim 3, wherein: the air valve comprises a limiting ring (81), a resistance plate (82), a resistance rod (83) and a transverse spring, wherein the limiting ring (81) is fixedly sleeved with an inner air pipe (8 a) and an outer air pipe (8 b), the resistance plate (82) is movably sleeved inside the limiting ring (81), one side of the resistance plate (82) penetrates through a small opening end of the limiting ring (81) and is fixedly connected with the resistance rod (83), and the resistance rod (83) is connected with the limiting ring (81) through the transverse spring.
5. The wafer dicing saw for intelligent electrical product processing according to claim 1, wherein: the cross-sectional shape of the gas channel (22) is cross-shaped, the vertical channel is communicated with the middle part of the top end of the sucking disc (2), the transverse channel is communicated with the vertical space of the fixed cavity (12), and the transverse channels of the gas channel (22) are in one-to-one correspondence with the number of the movable columns (3).
6. The wafer dicing saw for intelligent electrical product processing according to claim 1, wherein: the central part (5) is composed of four limit blocks with different magnetism and magnetic quantity, the limit block at the top end of the central part (5) on the central line of the movable column (3) is provided with S-shaped magnetism, the limit block at the bottom end of the central part (5) corresponding to the central part is provided with N-shaped magnetism, the limit block at the top end of the central part (5) is the same as the magnetic quantity at the bottom end of the central part (5), the limit block at the middle part of the central part (5) close to the wafer (9) is provided with S-shaped magnetism, the limit block corresponding to the central part is provided with N-shaped magnetism, the magnetic quantities at the two limit blocks at the middle part of the central part (5) are the same, and the limit block at the top end of the central part (5) is twice the magnetic quantity at the limit block at the middle part of the central part (5).
7. The wafer dicing saw for intelligent electrical product processing according to claim 2, wherein: the flexible membrane (6) is elastic rubber material, push pedal (61) have N type magnetism, one revolving part (4) have four adsorption equipment, and evenly encircle central part (5) and set up, and sucking disc (2) have four revolving parts (4), and evenly encircle sucking disc (2) and set up.
8. The wafer dicing saw for intelligent electrical product processing according to claim 3, wherein: the side hole (72) is the slant setting of interior height outside low, fly leaf (71) is the slope setting, and inclination is the same with side hole (72).
9. The wafer dicing saw for intelligent electrical product processing according to claim 3, wherein: interior trachea (8 a) and outer trachea (8 b) position correspond, and interior trachea (8 a) are located and are close to fixing piece (7) one side of wafer (9), and outer trachea (8 b) are located and keep away from fixing piece (7) one side of wafer (9), the angle of interior trachea (8 a) sets up to interior low outer height, the angle of outer trachea (8 b) sets up to interior high outer low.
10. The wafer dicing saw for intelligent electrical product processing according to claim 4, wherein: the large-opening end of the limiting ring (81) positioned in the inner air pipe (8 a) is close to the inside of the fixing piece (7), and the large-opening end of the limiting ring (81) positioned in the outer air pipe (8 b) is close to the outside of the fixing piece (7).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210543869.5A CN114872210B (en) | 2022-05-19 | 2022-05-19 | Wafer scribing machine for processing electronic products |
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| CN202210543869.5A CN114872210B (en) | 2022-05-19 | 2022-05-19 | Wafer scribing machine for processing electronic products |
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| CN114872210B CN114872210B (en) | 2022-12-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117995722A (en) * | 2024-01-23 | 2024-05-07 | 江苏协鑫特种材料科技有限公司 | Wafer dicing saw for semiconductor processing |
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| CN114872210B (en) | 2022-12-23 |
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