CN116116820A - Efficient low-cost chip photoresist removing device and photoresist removing process - Google Patents
Efficient low-cost chip photoresist removing device and photoresist removing process Download PDFInfo
- Publication number
- CN116116820A CN116116820A CN202211543670.9A CN202211543670A CN116116820A CN 116116820 A CN116116820 A CN 116116820A CN 202211543670 A CN202211543670 A CN 202211543670A CN 116116820 A CN116116820 A CN 116116820A
- Authority
- CN
- China
- Prior art keywords
- suction
- fixed
- glue
- sponge
- sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 85
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000000428 dust Substances 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
The invention relates to the technical field of chip processing, in particular to a high-efficiency low-cost chip photoresist removing device and a photoresist removing process, which comprise type guide rails, wherein support panels are fixed at two ends of each type guide rail, a cross beam is fixed between the two support panels, a machine box is connected inside the type guide rail in a sliding mode, a supporting piece is arranged on the top surface of the machine box, one end of the cross beam is fixedly provided with a square tube I, the bottom end of the square tube I is connected with a connecting plate I in a sliding mode, two ends of the connecting plate I are connected with rectangular tubes I in a sliding mode, and a suction column is connected inside the type clamping rail in a sliding mode. According to the invention, the cut spilled glue is moved below the sponge roller, the sponge roller cuts Kong Dijia alcohol into the spilled glue, so that alcohol can be conveniently and finely thrown into the spilled glue, and then the sponge roller and the sponge convex blocks can reciprocate and transversely move while reciprocally rotating, so that the spilled glue after being soaked by alcohol can be rolled and wiped, and the efficiency of spilled glue cleaning can be improved.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a high-efficiency low-cost chip photoresist removing device and a photoresist removing process.
Background
The die bonding is a common chip packaging and mounting process, the mode of fixing the chip and the packaging substrate together by using conductive silver glue or insulating glue and the like is adopted, in the die bonding and mounting process, the dispensing amount of the die bonding glue has great influence on the whole mounting process, the process of strictly controlling the dispensing is required, the automatic dispensing and manual dispensing are adopted at present, the cost of a manual die bonding chip mounter is lower, the operation is flexible, the application is still realized at present, but the glue consumption of the manual dispensing is not easy to control, when the conductive silver glue is too much, the glue overflow is too serious, the short circuit of positive and negative electrodes on the upper end surface and the lower end surface of the chip is directly caused, the defect of slow silver ion migration short circuit failure in the long-term use process is introduced, the long-term service life and the reliability are influenced, the die bonding glue overflowed needs to be cleaned, the mode of cleaning the glue at the periphery of the chip is mainly comprises the use of acetone or ethanol, then the soft cloth (sponge) is used for wiping and cleaning, or the solidified glue is easy to wipe off, the ethanol is used for cleaning through the sponge, the glue overflow is firstly, the glue is wet through the sponge is not easy to be used, the edge is required to be directly cleaned, the chip is directly cut and the wafer is not damaged, the edge is required to be directly cut, the wafer is required to be cleaned, the wafer is cut and the edge is directly is not damaged, and the wafer is required to be cut, the wafer is required to be cleaned, the wafer is required to be cut, and the wafer is directly is required to be cleaned, and the wafer is required to be cleaned, and the chip is used.
Disclosure of Invention
In order to overcome the technical problems, the invention aims to provide the efficient low-cost chip photoresist removing device and the photoresist removing process, wherein a transmission piece is used for carrying a suction pipe on a suction column to be obliquely inserted into photoresist overflow, then the suction pipe is taken out to rotate the photoresist overflow on a chip by 180 degrees to enable the suction pipe to be inserted into the photoresist overflow after the positions of two sides of the chip are interchanged again, the photoresist overflow is cut by inserting and cutting on two sides, a dust collector is used for sucking the cut photoresist block to the suction column to cut and remove the photoresist overflow, the cut photoresist overflow is moved to the lower part of a sponge roller, the sponge roller firstly cuts Kong Dijia alcohol of the photoresist overflow to facilitate alcohol fine polishing, and then the sponge roller and a sponge lug reciprocate and transversely move at the same time to realize rolling and wiping the photoresist overflow after being soaked by alcohol, so that the efficiency of photoresist overflow removing is improved.
The aim of the invention can be achieved by the following technical scheme:
the utility model provides a high-efficient low-cost chip gumming device, includes type guide rail, the both ends of type guide rail all are fixed with the support panel, two be fixed with the crossbeam between the support panel, type guide rail's inside sliding connection organic case, the top surface of machine case is provided with support piece, the one end of crossbeam is fixed with square pipe one, square pipe one's bottom sliding connection has connecting plate one, rectangular pipe one has all been cup jointed in the both ends of connecting plate one, rectangular pipe one's bottom surface is fixed with type clamping rail, type clamping rail's inside sliding connection has the suction column, a plurality of suction pipes have been arranged to the bottom surface slope of suction column, square pipe one's outside is fixed with the guide block, the inside sliding joint of guide block has two movable plates, the one end that the movable plate deviates from the guide block is fixed with the driving medium, square pipe two is fixed with square pipe two to square pipe one's bottom surface, rectangular pipe two's both ends have all been cup jointed in the bottom surface, rectangular pipe two has all been fixed with the square pipe two bottom surfaces of connecting plate two, 3875 type clamping rail's bottom surface has cup jointed the rectangular roller, 78 has rotated the fixed roller.
The method is further characterized in that: the support piece comprises a sleeve and an electric push rod, the sleeve is rotationally connected with the case, the electric push rod is fixedly connected with the case, a sliding rod is connected with the sleeve in a sliding mode, a sucking disc is fixed on the top surface of the sliding rod, a lantern ring fixedly connected with the electric push rod is rotationally sleeved on the outer side of the sliding rod, a first motor is fixed inside the case, and an output end of the first motor is fixedly connected with the sleeve.
The method is further characterized in that: the top surface of connecting plate one is fixed with the stand with square pipe one sliding connection, the driving medium includes the sleeve with movable plate fixed connection, telescopic inside slip joint has with corresponding position suction post fixed connection's piston shaft, square pipe one's top is fixed with the air pump, the one end that the sleeve deviates from the piston shaft is fixed through hose one and the output intercommunication of air pump, the middle part of hose one is accomodate and is deposited inside the movable plate.
The method is further characterized in that: the inside of suction post is offered and is communicated fixed suction cavity with a plurality of suction pipe tops, the top surface of suction post one end is fixed with the dust catcher, the suction port and the suction cavity intercommunication of dust catcher, the bottom of suction pipe is fixed with annular cutter.
The method is further characterized in that: the two sides of the first connecting plate are respectively fixed with a first cylinder, and the output end of the first cylinder is fixedly connected with a first rectangular pipe at a corresponding position.
The method is further characterized in that: the two sides of the connecting plate II are respectively fixedly provided with a cylinder II, the output end of the cylinder II is fixedly connected with a rectangular pipe II at a corresponding position, a cylinder III is arranged at the top of the type frame, the output end of the cylinder III is fixedly connected with the type frame, and the fixed end of the cylinder III is fixedly connected with the rectangular pipe II at the corresponding position.
The method is further characterized in that: one end of the roller is rotatably inserted with a transfusion tube, an alcohol box is fixed on the outer side of the guide rail, the transfusion tube is communicated with the alcohol box through a second hose, and a water pump is fixedly connected with the bottom end of the second hose.
The method is further characterized in that: a plurality of round holes communicated with the roller are formed in one side of the sponge roller at equal intervals, and a plurality of sponge convex blocks are fixed on the other side of the sponge roller at equal intervals.
The method is further characterized in that: the inside of type frame one end is fixed with motor two, the one end of cylinder is rotated with type frame through the axis of rotation and is connected, the axis of rotation is all cup jointed with motor two's output and is fixed with the band pulley, and the transmission is connected with the belt between two band pulleys.
A photoresist removing process of a high-efficiency low-cost chip photoresist removing device comprises the following steps:
step one: step one: placing the substrate and the chip on a sucker, adsorbing and fixing a clamping plate by the sucker, moving the chip to a position between the lower parts of two suction columns, and enabling the glue overflow to correspond to a suction pipe on the suction column;
step two: the air pump transmits air to the hose I to enable the piston shaft in the sleeve to push the suction column along the inclined direction of the suction pipes, and the plurality of suction pipes are inserted into the glue overflow by means of annular cutters at the bottom ends of the suction pipes;
step three: the air pump sucks air into the sleeve, and the piston shaft moves again through the suction column to enable the suction pipes to leave the glue overflow;
step four: the motor rotates with the sleeve to enable the sliding rod to rotate, the sucking disc drives the base plate and the chip to rotate at an angle, and the sheared overflow glue on two sides of the chip is exchanged;
step five: the suction pipe is inserted into the glue overflow after the exchange position again, the dust collector sucks gas into the suction cavity of the suction column to generate negative pressure, and then the cut glue blocks are sucked and removed;
step six: moving the supporting piece to a position between the two sponge rollers to enable the chip to move to a position between the lower parts of the two sponge rollers;
step seven: alcohol in the alcohol box is pumped into the roller through a hose II by a delivery pump and then flows into a hole formed in the overflow glue through a circular hole;
step eight: the motor II rotates with the roller to enable one side of the sponge lug on the sponge roller to rotate to the glue overflow area, and the motor II rotates with the sponge lug in a reciprocating manner;
step nine: the third cylinder moves reciprocally with the type frame to make the sponge bump on the sponge roller rotate reciprocally and laterally and simultaneously make reciprocal movement, so as to clean and remove the glue overflow after being soaked by alcohol.
The invention has the beneficial effects that:
1. the base plate and the chip are supported between the bottoms of the two suction columns through the supporting piece, the bottom ends of the suction pipes face to the glue overflowing area, the air pump transmits air to the first suction pipe to enable the piston shaft in the sleeve to push the suction columns along the inclined direction of the suction pipes, so that the suction pipes are inserted into glue overflowing (short for overflowing glue) by means of the annular cutters at the bottom ends of the suction pipes, then the piston shaft moves to enable the suction pipes to leave the glue overflowing through the suction columns, then the motor in the case rotates to enable the sliding rod to rotate 180 degrees with the sucking disc to enable the sheared glue overflowing to exchange positions on two sides of the chip, the glue overflowing on the same side of the chip is separated from the glue overflowing under the action of the insertion cutting of the suction pipes, the suction pipes sucks air from the suction chamber of the suction columns at the same side of the chip, the cut glue blocks are sucked and removed by suction, the primary removal of the glue is realized, the chip moves to the lower parts of the two sponge rollers and contacts with the round holes on the sponge rollers, the alcohol inside the alcohol box is soaked into the round holes of the sponge rollers through the two suction blocks, the alcohol can be conveniently soaked in the glue overflowing area through the two sponge rollers, the two sponge rollers can be soaked in the air in the mode through the holes of the suction pump, the adhesive can be conveniently soaked in the air inside the two holes on the inner side of the suction roller, and the inside the sponge can be conveniently contacted with the alcohol film can be soaked with the alcohol in the inside the round hole can and the inside the hole can be conveniently rotated to be in the inside the round the hole inside the hole can, meanwhile, the cylinder III carries the type frame to reciprocate so that the sponge lug on the sponge roller reciprocates and transversely moves at the same time, so that the overflow glue soaked by alcohol can be wiped and removed conveniently, wherein the overflow glue on the other two sides of the chip can be removed in the same way, and the efficiency of overflow glue removal is improved by combining the annular blade cutting overflow glue, the alcohol soaking overflow glue and the sponge wiping overflow glue together;
2. the output end of the first cylinder is provided with a rectangular pipe which moves in a direction away from the first connecting plate, so that the two clamping rails move in a direction away from each other synchronously, the distance between the two suction columns is increased, the distance between the two suction pipes which are oppositely arranged is increased, the glue overflowing around chips with different sizes (chips with different lengths and widths) is convenient to clear, the output end of the second cylinder can move in a direction away from the second rectangular pipe, the distance between the two sponge rollers is increased, and the chips with different sizes are coated with alcohol and wiped by the alcohol to clear the glue overflowing.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIGS. 1-2 are schematic views of the overall structure of the present invention from different viewing angles;
FIG. 3 is a schematic view of the support structure of the present invention;
FIG. 4 is a schematic view of the bottom structure of a square tube I and a movable plate according to the present invention;
FIG. 5 is a schematic view of a suction column structure in accordance with the present invention;
FIG. 6 is a schematic view of the suction tube structure of the present invention;
FIG. 7 is a schematic view of an external overall structure of the connecting plate according to the present invention;
FIG. 8 is a schematic view of the overall structure of the bottom of a square tube II according to the present invention;
FIG. 9 is a schematic view of the overall structure of the bottom of a -type stand according to the present invention;
FIG. 10 is a schematic view of a drum construction in accordance with the present invention;
fig. 11 is a schematic diagram of a substrate, glue overflow and chip body structure in the present invention.
In the figure: 100. guide rails; 110. a support panel; 111. a cross beam; 120. an alcohol box; 200. a chassis; 210. a support; 211. a sleeve; 212. an electric push rod; 213. a slide bar; 214. a suction cup; 300. square tube I; 310. an air pump; 320. a moving plate; 400. a first connecting plate; 410. a rectangular tube I; 411. clip rail; 412. a first cylinder; 420. a column; 500. a suction column; 510. a suction tube; 511. a ring-shaped cutter; 520. a suction chamber; 530. a dust collector; 600. a transmission member; 610. a sleeve; 620. a piston shaft; 700. square tube II; 710. a second connecting plate; 711. a rectangular pipe II; 720. a second cylinder; 800. type rack; 810. a belt wheel; 820. a third cylinder; 900. a roller; 910. a sponge roller; 911. a sponge bump; 912. a circular hole; 920. an infusion tube; A. a substrate; B. overflowing glue; C. and a chip body.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-11, an efficient low-cost chip glue removing device includes type guide rails 100, type guide rails 100, support panels 110 are fixed at two ends of each guide rail 100, a cross beam 111 is fixed between two support panels 110, type guide rails 100 are slidably connected with a chassis 200, a supporting member 210 is arranged on the top surface of the chassis 200, a square tube 300 is fixed at one end of the cross beam 111, a connecting plate 400 is slidably connected at the bottom end of the square tube 300, rectangular tubes 410 are slidably sleeved at two ends of the connecting plate 400, a type clamping rail 411 is fixed at the bottom surface of each rectangular tube 410, a suction column 500 is slidably connected inside each type clamping rail 411, a plurality of suction tubes 510 are obliquely arranged at the bottom surface of each suction column 500, a guide block is fixed at the outer side of each square tube 300, two moving plates 320 are slidably clamped at the inner sides of each guide block, a transmission member 600 is fixed at one end of each moving plate 320, a square tube 700 is fixed at one end of each cross beam 111, a connecting plate 710 is fixedly provided with a square tube two 710, a connecting plate two connecting plates are fixedly connected at the bottom surface of each square tube 700, a rectangular tube 800 is fixedly connected at two ends of each connecting plate's bottom surface is fixedly connected with a rectangular tube frame 800, and a rotary drum 900 is fixedly connected at two ends of each connecting plate's bottom surface is connected with a drum frame 800, and a drum 900 is fixedly connected at the drum frame is connected at each end to a drum frame, and has a drum frame 900.
The supporting piece 210 comprises a sleeve 211 and an electric push rod 212, the sleeve 211 is rotationally connected with the case 200, the electric push rod 212 is fixedly connected with the case 200, a slide rod 213 is clamped in the sleeve 211 in a sliding manner, a sucker 214 is fixed on the top surface of the slide rod 213, a lantern ring fixedly connected with the electric push rod 212 is rotationally sleeved on the outer side of the slide rod 213, a first motor is fixed in the case 200, the output end of the first motor is fixedly connected with the sleeve 211, a key slot is arranged between the slide rod 213 and the sleeve 211, the slide rod 213 can slide along the sleeve 211 and synchronously rotate along with the rotation of the sleeve 211, and the electric push rod 212 is convenient for adjusting the height with the sucker 214, so that glue overflows can move to a proper position; the top surface of connecting plate one 400 is fixed with the stand 420 with square pipe one 300 sliding connection, the driving medium 600 includes the sleeve 610 with movable plate 320 fixed connection, the inside slip joint of sleeve 610 has with the piston shaft 620 of corresponding position suction column 500 fixed connection, square pipe one 300's top is fixed with air pump 310, the one end that sleeve 610 deviates from piston shaft 620 is fixed through hose one and air pump 310's output intercommunication, hose one's middle part is accomodate and is deposited in movable plate 320 inside, air pump 310 is to sleeve 610 the inside suction or the blowing makes piston shaft 620 can carry out reciprocating motion along sleeve 610, and then make suction column 500 take a plurality of suction tubes 510 to remove along the direction of slope, realize grafting cutting glue spilling.
The inside of the suction column 500 is provided with a suction chamber 520 which is communicated and fixed with the top ends of a plurality of suction pipes 510, the top surface of one end of the suction column 500 is fixed with a dust collector 530, the suction port of the dust collector 530 is communicated with the suction chamber 520, the bottom end of the suction pipe 510 is fixed with a circular cutter 511, the dust collector 530 can also use an external negative pressure supply device, mainly the suction chamber 520 generates negative pressure, so that glue blocks cut by grafting can be conveniently removed, the volume of glue overflow is reduced, and the later addition of alcohol to the glue overflow is also facilitated; the first cylinder 412 is fixed on two sides of the first connecting plate 400, the output end of the first cylinder 412 is fixedly connected with the first rectangular pipe 410 at the corresponding position, and the first cylinder 412 moves along the first rectangular pipe 410 to adjust the distance between the two suction columns 500; the two sides of the connecting plate II 710 are fixedly provided with a cylinder II 720, the output end of the cylinder II 720 is fixedly connected with a rectangular pipe II 711 at a corresponding position, a cylinder III 820 is arranged at the top of the type frame 800, the output end of the cylinder III 820 is fixedly connected with the type frame 800, the fixed end of the cylinder III 820 is fixedly connected with the rectangular pipe II 711 at a corresponding position, and the cylinder II 720 moves along with the rectangular pipe II 711 to adjust the distance between the two type frames 800.
One end of the roller 900 is rotatably inserted with a transfusion tube 920, the outer side of the type guide rail 100 is fixedly provided with an alcohol box 120, the transfusion tube 920 is communicated with the alcohol box 120 through a second hose, the bottom end of the second hose is fixedly provided with a water pump, and the water pump is convenient for conveying alcohol into a circular hole 912 of the sponge roller 910 through the transfusion tube 920 and then adding the alcohol into the overflow glue from the circular hole 912; a plurality of circular holes 912 communicated with the roller 900 are formed in one side of the sponge roller 910 at equal intervals, a plurality of sponge convex blocks 911 are fixed on the other side of the sponge roller 910 at equal intervals, the circular holes 912 are convenient for dripping alcohol, and the sponge convex blocks 911 are convenient for fully contacting with holes on the overflow adhesive; a second motor is fixed in one end of the type frame 800, one end of the roller 900 is rotationally connected with the type frame 800 through a rotating shaft, belt wheels 810 are sleeved and fixed at the output ends of the rotating shaft and the second motor, and a belt is connected between the two belt wheels 810 in a transmission manner, so that the motor rotates with the roller 900 through the belt wheels 810 and the belt to enable the sponge roller 910 to rotate.
A photoresist removing process of a high-efficiency low-cost chip photoresist removing device specifically comprises the following steps:
step one: step one: placing the substrate and the chip on the sucking disc 214, sucking and fixing the clamping plate by the sucking disc 214, moving the chip to a position between the lower parts of the two suction columns 500, and enabling the overflow glue to correspond to the suction tube 510 on the suction column 500;
step two: the air pump 310 transmits air to the hose one so that the piston shaft 620 in the sleeve 610 pushes the suction column 500 along the inclined direction of the suction pipes 510, and the plurality of suction pipes 510 are inserted into the flash by means of the annular cutters 511 at the bottom ends thereof;
step three: the air pump 310 sucks air into the sleeve 610, and the piston shaft 620 moves the suction pipes 510 to leave the glue overflow again by carrying the suction column 500;
step four: the motor rotates the sleeve 211 to enable the slide bar 213 to rotate, the sucker 214 rotates the base plate and the chip by 180 degrees, and the sheared overflow glue on two sides of the chip is exchanged;
step five: the suction pipe 510 is inserted into the glue overflow after the exchange position again, and the vacuum cleaner 530 sucks air into the suction cavity 520 of the suction column 500 to generate negative pressure, so that the cut glue blocks are sucked and removed;
step six: moving the support 210 to a position between the two sponge rollers 910, so that the chip is moved to a position between the lower sides of the two sponge rollers 910;
step seven: alcohol in the alcohol box 120 is pumped into the roller 900 through a hose II by a pump, and then flows into a hole formed in the overflow glue through a circular hole 912;
step eight: the motor II rotates with the roller 900 to enable one side of the sponge lug 911 on the sponge roller 910 to rotate to the glue overflow area, and the motor II rotates with the sponge lug 911 in a reciprocating manner;
step nine: the third air cylinder 820 reciprocates with the type frame 800 to make the sponge bump 911 on the sponge roller 910 reciprocate and move transversely, so as to wipe and remove the spilled glue soaked by alcohol fully.
Working principle: when in use, a substrate and a chip are placed on the sucker 214, the sucker 214 is used for adsorbing and fixing the clamping plate, the chip is stuck on the clamping plate by using the die bond adhesive, the chip is positioned between the lower parts of the two suction columns 500, the overflow adhesive corresponds to the suction pipe 510 on the suction column 500, the air pump 310 is used for conveying air to the hose I so that the piston shaft 620 in the sleeve 610 pushes the suction column 500 along the inclined direction of the suction pipe 510, the plurality of suction pipes 510 are inserted into the overflow adhesive by the annular cutters 511 at the bottom ends of the suction columns 510, at the moment, the upright post 420 on the connecting plate I400 moves downwards along the square pipe I300, the suction column 500 slides in the corresponding position type clamping rail 411, then the air pump 310 is used for sucking air into the sleeve 610, the piston shaft 620 is used for moving the plurality of suction pipes 510 to leave the overflow adhesive by carrying the suction column 500 again, and the motor is used for rotating the slide bar 213 along the sleeve 211, the suction cup 214 is rotated 180 degrees with the base plate and the chip, the cut spilled glue at two sides of the chip is interchanged, the suction tube 510 is inserted into the spilled glue at the interchanged position again, the spilled glue at the same side of the chip breaks away from the glue at the position between the two insertion cuts under the insertion cutting action of the suction tube 510, the suction chamber 520 of the suction column 500 is sucked by the dust collector 530 to generate negative pressure, the cut glue is sucked and removed, the spilled glue is primarily removed, then the electric push rod 212 is moved downwards with the slide bar 213 to move the suction cup 214 downwards with the chip, then the supporting piece 210 is moved to the position between the two sponge rollers 910, the chip is moved to the position between the two sponge rollers 910, the motor II is rotated with the belt pulley 810 to rotate the drum 900 with the sponge rollers 910 to rotate the circular holes 912 at the outer side of the drum 900 to the position opposite to the glue, then the electric push rod 212 moves upwards with the sucker 214 to enable glue overflow to move to the position below the circular hole 912, alcohol in the alcohol box 120 is pumped into the roller 900 through the second hose through the pump, then flows into a hole formed in the glue overflow through the circular hole 912 (the hole is a hole left by a glue block sucked between the holes), the alcohol in the hole is convenient to soak in the glue overflow, meanwhile, the sponge roller 910 can be pressed on the glue overflow for a period of time to prevent the alcohol from volatilizing, the effect of alcohol soaking the glue overflow is improved, finally the second motor rotates with the roller 900 to enable one side of the sponge bump 911 on the sponge roller 910 to rotate to a glue overflow area, the third motor rotates with the sponge bump 911 in a reciprocating mode, and meanwhile the third cylinder 820 moves in a reciprocating mode with the type frame 800 to enable the sponge bump 911 on the sponge roller 910 to reciprocate and transversely move in a reciprocating mode, so that glue soaked by the alcohol can be cleaned thoroughly, and glue overflows on two sides of a chip can be cleaned in the same mode.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative and explanatory of the invention, as various modifications and additions may be made to the particular embodiments described, or in a similar manner, by those skilled in the art, without departing from the scope of the invention or exceeding the scope of the invention as defined in the claims.
Claims (10)
1. The utility model provides a high-efficient low-cost chip gumming device, includes type guide rail (100), its characterized in that, the both ends of type guide rail (100) all are fixed with support panel (110), two be fixed with crossbeam (111) between support panel (110), the inside sliding connection of type guide rail (100) has quick-witted case (200), the top surface of machine case (200) is provided with support piece (210), the one end of crossbeam (111) is fixed with square pipe one (300), square pipe one (300)'s bottom sliding connection has connecting plate one (400), connecting plate one (400) both ends all sliding sleeve joint rectangular pipe one (410), rectangular pipe one (410)'s bottom surface is fixed with type clamping rail (411), the inside sliding connection of type clamping rail (411) has suction post (500), the bottom surface tilting arrangement of suction post (500) has a plurality of suction pipes (510), square pipe one (300)'s outside is fixed with the guide block, the inside sliding connection of guide block has square pipe one (300) to be fixed with connecting plate one (400), two moving plate one end (700) of connecting plate one end (700) is kept away from square pipe one (700), two ends of the second connecting plate (710) are both in sliding sleeve connection with the second rectangular pipe (711), a type frame (800) is fixed on the bottom surface of the second rectangular pipe (711), a roller (900) is rotatably connected to the bottom of the type frame (800), and a sponge roller (910) is fixedly sleeved on the outer side of the roller (900).
2. The efficient low-cost chip photoresist removing device according to claim 1, wherein the supporting piece (210) comprises a sleeve (211) and an electric push rod (212), the sleeve (211) is rotationally connected with the case (200), the electric push rod (212) is fixedly connected with the case (200), a sliding rod (213) is slidably clamped in the sleeve (211), a sucking disc (214) is fixed on the top surface of the sliding rod (213), a lantern ring fixedly connected with the electric push rod (212) is rotationally sleeved on the outer side of the sliding rod (213), a first motor is fixed in the case (200), and an output end of the first motor is fixedly connected with the sleeve (211).
3. The efficient low-cost chip photoresist remover according to claim 1, wherein the top surface of the first connecting plate (400) is fixed with a column (420) in sliding connection with the first square tube (300), the transmission member (600) comprises a sleeve (610) fixedly connected with the movable plate (320), a piston shaft (620) fixedly connected with the suction column (500) at the corresponding position is clamped in the sleeve (610) in a sliding manner, an air pump (310) is fixed at the top end of the first square tube (300), one end of the sleeve (610) deviating from the piston shaft (620) is fixedly communicated with the output end of the air pump (310) through a first hose, and the middle part of the first hose is stored in the movable plate (320).
4. The efficient low-cost chip photoresist remover according to claim 1, wherein a suction chamber (520) communicated and fixed with the top ends of a plurality of suction pipes (510) is formed in the suction column (500), a dust collector (530) is fixed on the top surface of one end of the suction column (500), a suction port of the dust collector (530) is communicated with the suction chamber (520), and a circular cutter (511) is fixed at the bottom end of the suction pipe (510).
5. The efficient low-cost chip photoresist remover according to claim 1, wherein the first connecting plate (400) is fixed with the first cylinder (412) on both sides, and the output end of the first cylinder (412) is fixedly connected with the first rectangular tube (410) at the corresponding position.
6. The efficient low-cost chip photoresist removing device according to claim 1, wherein two sides of the second connecting plate (710) are respectively fixed with a second air cylinder (720), an output end of the second air cylinder (720) is fixedly connected with a second rectangular pipe (711) at a corresponding position, a third air cylinder (820) is arranged at the top of the type frame (800), an output end of the third air cylinder (820) is fixedly connected with the type frame (800), and a fixed end of the third air cylinder (820) is fixedly connected with the second rectangular pipe (711) at the corresponding position.
7. The efficient low-cost chip photoresist remover according to claim 1, wherein one end of the roller (900) is rotatably inserted with a transfusion tube (920), an alcohol box (120) is fixed on the outer side of the guide rail (100), the transfusion tube (920) is communicated with the alcohol box (120) through a second hose, and a water pump is fixed on the bottom end of the second hose.
8. The efficient low-cost chip photoresist removing device according to claim 1, wherein a plurality of circular holes (912) communicated with the roller (900) are formed at equal intervals on one side of the sponge roller (910), and a plurality of sponge bumps (911) are fixed at equal intervals on the other side of the sponge roller (910).
9. The efficient low-cost chip photoresist removing device according to claim 1, wherein a second motor is fixed in one end of the type frame (800), one end of the roller (900) is rotatably connected with the type frame (800) through a rotating shaft, belt wheels (810) are sleeved and fixed at the output ends of the rotating shaft and the second motor, and a belt is connected between the two belt wheels (810) in a transmission manner.
10. A photoresist removing process of a high efficiency and low cost chip photoresist removing apparatus according to any one of claims 1 to 9, said process comprising the steps of:
step one: step one: placing the substrate and the chip on the sucking disc (214), sucking and fixing the clamping plate by the sucking disc (214), moving the chip to a position between the lower parts of the two suction columns (500), and enabling the overflow glue to correspond to the suction pipe (510) on the suction column (500);
step two: the air pump (310) transmits air to the hose so that a piston shaft (620) in the sleeve (610) pushes the suction column (500) along the inclined direction of the suction pipes (510), and the plurality of suction pipes (510) are inserted into the glue overflow by means of annular cutters (511) at the bottom ends of the suction pipes;
step three: the air pump (310) sucks air into the sleeve (610), and the piston shaft (620) moves again by carrying the suction column (500) to enable the suction pipes (510) to leave the glue overflow;
step four: the motor rotates the slide bar (213) with the sleeve (211), the sucker (214) rotates (180) degrees with the base plate and the chip, and the sheared overflow glue at two sides of the chip exchanges positions;
step five: the suction pipe (510) is plugged into the glue overflow after the exchange position again, the dust collector (530) sucks gas to the suction cavity (520) of the suction column (500) to generate negative pressure, and then the cut glue blocks are sucked and removed;
step six: moving the support (210) to a position between the two sponge rollers (910) to move the chip to a position between the two sponge rollers (910);
step seven: alcohol in the alcohol box (120) is pumped into the roller (900) through a hose II by a pump, and then flows into a hole formed in the overflow glue by a circular hole (912);
step eight: the motor II rotates with the roller (900) to enable one side of the sponge lug (911) on the sponge roller (910) to rotate to the glue overflow area, and the motor II rotates with the sponge lug (911) in a reciprocating manner;
step nine: the third air cylinder (820) carries the type frame (800) to reciprocate to make the sponge convex blocks (911) on the sponge roller (910) reciprocate and transversely reciprocate at the same time, so as to fully wipe and remove the glue overflowed after being soaked by alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211543670.9A CN116116820A (en) | 2022-12-03 | 2022-12-03 | Efficient low-cost chip photoresist removing device and photoresist removing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211543670.9A CN116116820A (en) | 2022-12-03 | 2022-12-03 | Efficient low-cost chip photoresist removing device and photoresist removing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116116820A true CN116116820A (en) | 2023-05-16 |
Family
ID=86299839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211543670.9A Pending CN116116820A (en) | 2022-12-03 | 2022-12-03 | Efficient low-cost chip photoresist removing device and photoresist removing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116116820A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116748184A (en) * | 2023-08-11 | 2023-09-15 | 山东汉芯科技有限公司 | Chip packaging glue overflow removing device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6186848B1 (en) * | 1996-07-30 | 2001-02-13 | Matsushita Electric Industrial Co., Ltd. | Disassembling method of electronic appliance and disassembling apparatus thereof |
| CN111618793A (en) * | 2020-06-16 | 2020-09-04 | 泉州台商投资区国进信息技术有限公司 | High-rise home decoration glass safe dismounting device |
| CN211802532U (en) * | 2019-12-12 | 2020-10-30 | 速珂智能科技（上海）有限公司 | Oil removing device for producing electric vehicle brake pad |
| CN212884120U (en) * | 2020-08-31 | 2021-04-06 | 衡阳华灏新材料科技有限公司 | Recovery processing device for Chip On Film (COF) |
| CN113042417A (en) * | 2021-03-30 | 2021-06-29 | 惠安竹点点通讯设备有限公司 | Glue removing device for electronic product production |
| CN216420004U (en) * | 2021-12-08 | 2022-05-03 | 深圳华和信科技发展有限公司 | Frictioning device is used in production of liquid crystal display outer screen |
| CN216459825U (en) * | 2021-11-23 | 2022-05-10 | 双峰县众鑫鞋材有限公司 | Adjustable glue scraping device for corrugated carton production |
| CN217222575U (en) * | 2022-01-10 | 2022-08-19 | 湖北科利节能科技有限公司 | Rock wool double-side-sealing partition plate |
| CN217797535U (en) * | 2022-07-06 | 2022-11-15 | 深圳市爱米无线科技有限公司 | Automatic OCA rubberizing replacement of screen assembly removes gluey laminating equipment |
-
2022
- 2022-12-03 CN CN202211543670.9A patent/CN116116820A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6186848B1 (en) * | 1996-07-30 | 2001-02-13 | Matsushita Electric Industrial Co., Ltd. | Disassembling method of electronic appliance and disassembling apparatus thereof |
| CN211802532U (en) * | 2019-12-12 | 2020-10-30 | 速珂智能科技（上海）有限公司 | Oil removing device for producing electric vehicle brake pad |
| CN111618793A (en) * | 2020-06-16 | 2020-09-04 | 泉州台商投资区国进信息技术有限公司 | High-rise home decoration glass safe dismounting device |
| CN212884120U (en) * | 2020-08-31 | 2021-04-06 | 衡阳华灏新材料科技有限公司 | Recovery processing device for Chip On Film (COF) |
| CN113042417A (en) * | 2021-03-30 | 2021-06-29 | 惠安竹点点通讯设备有限公司 | Glue removing device for electronic product production |
| CN216459825U (en) * | 2021-11-23 | 2022-05-10 | 双峰县众鑫鞋材有限公司 | Adjustable glue scraping device for corrugated carton production |
| CN216420004U (en) * | 2021-12-08 | 2022-05-03 | 深圳华和信科技发展有限公司 | Frictioning device is used in production of liquid crystal display outer screen |
| CN217222575U (en) * | 2022-01-10 | 2022-08-19 | 湖北科利节能科技有限公司 | Rock wool double-side-sealing partition plate |
| CN217797535U (en) * | 2022-07-06 | 2022-11-15 | 深圳市爱米无线科技有限公司 | Automatic OCA rubberizing replacement of screen assembly removes gluey laminating equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116748184A (en) * | 2023-08-11 | 2023-09-15 | 山东汉芯科技有限公司 | Chip packaging glue overflow removing device |
| CN116748184B (en) * | 2023-08-11 | 2023-11-03 | 山东汉芯科技有限公司 | Chip packaging glue overflow removing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110379747B (en) | Full-automatic wafer cleaning and pasting integrated machine | |
| CN116116820A (en) | Efficient low-cost chip photoresist removing device and photoresist removing process | |
| CN212421825U (en) | Full-automatic cutting and cleaning integrated machine for wafer | |
| CN110605795B (en) | Device for providing instantaneous pressure and integrating cutting and polishing based on reciprocating motion | |
| CN110315405B (en) | Float TFT-LCD glass production process | |
| CN112951743B (en) | Semiconductor packaging equipment and packaging method | |
| CN111267330A (en) | Mobile phone display screen delivery film pasting equipment | |
| CN113522662B (en) | Wax coating processing device for LED chip patch workpiece related to intelligent community | |
| CN114453911A (en) | Cutting device for metal substrate | |
| CN212733145U (en) | Cell-phone center edge cleaning machine | |
| CN212300796U (en) | Automatic piece device and test system that send of display screen | |
| CN112405970A (en) | A excessive cleaning device that glues for integrated circuit board processing | |
| CN219187520U (en) | Automatic efficient dispensing jig for chip dispensing | |
| CN216728607U (en) | Self-cleaning adhesive type cleaning mechanism | |
| CN216273804U (en) | Bonding device for hollow glass | |
| CN216968166U (en) | Servo multi-station automatic glaze dipping equipment | |
| CN214440575U (en) | Double-station glue removing machine | |
| CN116231109A (en) | Full-automatic flexible lead-acid battery assembly production line | |
| CN215008141U (en) | Edge removing device for flat edge and round edge after wafer gluing | |
| CN213036845U (en) | Novel cavity glass carries spacingly device | |
| CN210414002U (en) | LOW-E glass film removing machine | |
| CN109304815B (en) | Low-dust cutting method for marble stone | |
| CN212542386U (en) | Transfer device in chip bonding process | |
| CN220258540U (en) | Optical part gluing device | |
| CN216330087U (en) | Semi-automatic screen dispensing and film pasting equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |