CN118156180A - Wet cleaning equipment for semiconductor integrated circuit process - Google Patents

Abstract

The invention relates to the technical field of wet cleaning, in particular to wet cleaning equipment for a semiconductor integrated circuit process, which comprises a machine body, a liquid supplementing mechanism, a recovery mechanism and a purifying mechanism, wherein the liquid supplementing mechanism and the recovery mechanism are respectively arranged at the left side and the right side of the machine body.

Description

Wet cleaning equipment for semiconductor integrated circuit process

Technical Field

The invention relates to the technical field of wet cleaning, in particular to wet cleaning equipment for a semiconductor integrated circuit process.

Background

With the rapid development of computer, communication and multimedia technologies, the digital process of the global advanced and new technical field is continuously advancing, the electronic product card is developed towards miniaturization, portability, multifunction, high integration and high reliability, and the chip technology as the basis and core of the electronic product plays an important role for the development, so that the cleaning process is more and more important in the manufacture of advanced process chips. Some contaminants such as particles, organics, metals, and oxides are inevitably introduced in the semiconductor manufacturing home, and semiconductor chips are extremely sensitive to impurities, so that a cleaning step is indispensable in semiconductor processing. In order to reduce the influence of impurities on the yield of the chip to the maximum extent, the high-efficiency single cleaning is required to be ensured in the actual production process, frequent cleaning is required to be carried out before and after almost all the processes, and the method is a necessary link in key process technologies such as monocrystalline silicon wafer manufacturing, photoetching, etching, deposition and the like.

The technical scheme adopted by the prior wet cleaning equipment for the semiconductor integrated circuit process is generally similar to that of a semiconductor wet cleaning equipment (publication day 2023.01.13) of patent CN218282846U and a wet cleaning device (publication day 2019.01.29) for semiconductor manufacturing of patent CN208437358U, but the following problems are often encountered in the practical use process of the wet cleaning equipment: for example, the workpiece has a dead cleaning angle, because the workpiece must be cleaned by using a clamp or a supporting device, but the existing wet cleaning jig is basically similar to a semiconductor wafer wet cleaning jig (publication day 2020.06.19) of patent CN210805720U, and a part of the area must not be effectively scoured and cleaned in the cleaning process; in addition, in order to reduce production cost, the conventional wet cleaning equipment generally needs to be used for a long time when in use, and whether impurities contained in the cleaning liquid exceed standard or not is difficult to ensure in the cleaning process (if the impurities in the cleaning liquid exceed standard, the problem of invalid cleaning occurs), and the conventional wet cleaning equipment generally needs to be stopped for replacing the cleaning liquid when encountering the problem of exceeding standard of the impurities in the cleaning liquid, so that the operation mode can be used before cleaning work, but if the problem is found in the cleaning process, a workpiece is often required to be taken out from the equipment, so that the working efficiency is reduced on one hand, and the possibility of pollution damage to the workpiece is also realized on the other hand.

Disclosure of Invention

The present invention is directed to a wet cleaning apparatus for semiconductor integrated circuit processes, which solves the above-mentioned problems of the prior art.

In order to solve the technical problems, the invention provides the following technical scheme: the invention relates to wet cleaning equipment for semiconductor integrated circuit technology, which comprises a machine body, a liquid supplementing mechanism, a recovery mechanism and a purifying mechanism, wherein the liquid supplementing mechanism and the recovery mechanism are respectively arranged at the left side and the right side of the machine body, new cleaning liquid is conveyed into the machine body through the liquid supplementing mechanism, old cleaning liquid in the machine body is recovered through the recovery mechanism (functions realized by the liquid supplementing mechanism and the recovery mechanism belong to the conventional technical means in the field and are not described in specific structures), the purifying mechanism is arranged above the machine body, the machine body is in a closed state when in operation, the purifying mechanism purifies the gas environment in the machine body, so that the wafer is prevented from being polluted in the cleaning process of different stations, a linear motor is arranged at the inner top end of the machine body, a fixing mechanism is arranged below the linear motor, the wafer is fixed through the fixing mechanism, the fixing mechanism is connected with the linear motor through the support frame, the support frame has a telescopic function (the function realized by the support frame belongs to the conventional technical means in the field and the specific structure is not described), the linear motor and the support frame are used for driving the fixing mechanism and the wafer to move to different stations according to the needs, the lower end of the inside of the machine body is provided with a first cleaning tank, a second cleaning tank and a drying tank, cleaning liquid is filled in the first cleaning tank and the second cleaning tank, the types of the cleaning liquid are selected by staff according to the needs, circulation components are arranged in the first cleaning tank and the second cleaning tank, the side wall of the upper end of the drying tank is provided with an air injection component, the fluid supplementing mechanism is connected with the two groups of circulation components through a fluid supplementing pipe, the recovery mechanism is connected with the two groups of circulation components through a recovery pipe, the circulating assembly is used for generating high-frequency ultrasonic vibration in the cleaning solution so as to clean the wafer, on the other hand, a worker can replace the cleaning solution while cleaning the wafer, the air injection assembly is connected with an external air transmission system, the air injection assembly has a telescopic function, when the wafer is cleaned, the air injection assembly is not positioned in the drying tank, when the wafer is dried, the air injection assembly is positioned in the drying tank (the telescopic function of the air injection assembly belongs to the conventional technical means in the field and a specific structure is not described), when the wafer is dried, nitrogen with certain heat is input into the air injection assembly by the external air transmission system so as to be dried quickly, finally, the upper ends of the first cleaning tank, the second cleaning tank and the drying tank are provided with sliding plates, the side ends of the drying tank are provided with air pumps, the cleaning solution is splashed by the sliding plates, and the functions realized by the air pumps are recovered (the sliding plates and the air pumps belong to the conventional technical means in the field and the specific structure is not described).

Further, the fixing mechanism comprises two groups of movable seats and a fixed seat, the two groups of movable seats are arranged between the two groups of fixed seats, a group of first movable plates and first electromagnets are arranged in each group of movable seats, one ends of the first movable plates, which are far away from the first electromagnets, are connected with the movable seats through first reset springs, a plurality of groups of first clamping grooves are arranged at one ends, which are close to each other, of the two groups of movable seats, a group of first clamping plates and air bags are arranged in each group of first clamping grooves, the plurality of groups of first clamping plates are fixedly connected with the first movable plates, when the fixing mechanism in the invention is not in work, the first clamping plates and the air bags in each group of first clamping grooves are in a state of being far away from each other, when a wafer needs to be fixed, a worker only needs to place the wafer into a first clamping groove and then starts a first electromagnet, one end of a first movable plate, which is close to the first electromagnet, is provided with magnetism, the first movable plate can be driven to move with a plurality of groups of first clamping plates through the first electromagnet, the purpose of clamping the wafer can be achieved through the double action of the first clamping plates and an air bag, a group of screw rod modules are arranged below each group of fixed seats, the distance between two groups of movable seats is controlled through the screw rod modules (the functions realized by the screw rod modules belong to the conventional technical means in the field and are not described in specific structures), the wafer clamping device can be used for fixing wafers with different sizes through the screw rod modules, and finally compared with the existing clamp, the wafer clamping device can be automatically separated from a clamping state when power is off, avoid the staff to dismantle anchor clamps when getting the wafer.

Further, a second cylinder and a gas storage groove are arranged at the lower end of the inside of the movable seat, a compression plate is arranged in the gas storage groove, the gas storage groove is connected with a plurality of groups of gas bags through a diversion channel, in the invention, the compression plate is connected with the working end of the second cylinder, compressed gas is stored in the gas storage groove, the fixing mechanism is different from the existing fixing clamp in use mode, when a worker places a wafer in the first clamping groove, the screw rod module is started so that the outer surface of the wafer is not contacted with the first movable plate (namely, a gap is reserved between the wafer and the first movable plate), after the gap is reserved between the outer surface of the wafer and the first movable plate, the first electromagnet and the second cylinder are started, at the moment, the first clamping plate and the gas bags are mutually close, and compared with the existing fixing clamp, the wafer is not blocked and dead angles exist due to shielding, and the specific working principle is as follows: when the wafer is initially cleaned, the first clamping plates and the air bags at the two side ends of the wafer can firmly clamp the wafer, and when the wafer is about to be cleaned, the first clamping plates and the air bags at the two side ends of the wafer can be alternately loosened, so that the wafer shielding part can be cleaned.

Further, in order to ensure that the wafer is always in a stable state in the cleaning process, the wafer is prevented from being fixed to be unstable and swayed, the fixing mechanism further comprises a supporting mechanism, the supporting mechanism is arranged at the lower ends of the two groups of fixing seats, the supporting mechanism comprises a supporting seat and a lifting seat, the supporting seat is fixedly connected with the two groups of fixing seats, the lifting seat is arranged in the supporting seat, the upper end of the lifting seat is provided with a plurality of groups of second clamping grooves, each group of second clamping grooves is internally provided with a group of second clamping plates and a group of rubber pads, the lower end of the inner part of the lifting seat is provided with a second movable plate and a second electromagnet, one end of the second movable plate, which is close to the second electromagnet, is provided with magnetism, one end of the second movable plate, which is far away from the second electromagnet, is fixedly connected with the lifting seat through a second reset spring, and the plurality of groups of second clamping plates are fixedly connected with the second movable plate.

Further, a third electromagnet is arranged at the lower end of the supporting seat, one end of the lifting seat, which is close to the third electromagnet, is provided with magnetism, and the supporting seat is connected with the lifting seat through the sliding block and the sliding groove.

Further, the circulating assembly comprises a circulating seat, a first circulating box and a second circulating box, the first circulating box and the second circulating box are oppositely arranged at the left side and the right side of the circulating seat, a first air cylinder, a circulating chamber, a one-way liquid discharging channel and a one-way liquid inlet channel are arranged in the circulating seat, in the invention, a sealing ball core and a spring (the arrangement of the sealing ball core and the spring belongs to the conventional technical means in the field and is not described herein, the structure such as a one-way valve can be referred to), a piston is arranged in the circulating chamber, the piston is connected with the working end of the first air cylinder, one end of the one-way liquid discharging channel is connected with the circulating chamber, the other end of the one-way liquid discharging channel is connected with the circulating chamber through a first connecting channel, the other end of the one-way liquid inlet channel is connected with the second circulating box through a second connecting channel, liquid in the circulating chamber can flow unidirectionally through the one-way liquid discharging channel and the one-way liquid inlet channel, and the impurity can only be conveniently detected in the liquid can be detected in the circulating chamber by a liquid detecting device which is arranged near the working end of the cleaning liquid in time.

Furthermore, the unidirectional liquid discharge channel is connected with the liquid supplementing mechanism through the liquid supplementing pipe, the unidirectional liquid inlet channel is connected with the recovery mechanism through the recovery pipe, and valves are arranged at one ends of the liquid supplementing pipe and the recovery pipe, which are close to the circulating assembly.

Further, the purification mechanism comprises a purification seat, a fan, an annular groove, a reversing motor and an exhaust channel, one end of the annular groove is connected with the fan, the other end of the annular groove is connected with the exhaust channel, a plurality of groups of fixing pipes are arranged in the annular groove, a plurality of groups of fixing pipes are annularly arranged in the annular groove and are all connected with a rotating shaft of the reversing motor through fixing rods, a group of purification plates are arranged in the fixing pipes, the fan is required to be started before operation, gas in a machine body is input into a group of fixing pipes between the fan and the exhaust channel through the fan, impurities in the gas are removed through the purification plates in the group of fixing pipes, the purification plates are connected with the fixing pipes through sliding rods, an induction spring is wound at one end of each sliding rod, which is close to the induction spring, the piezoelectric plates are arranged at one end, which is close to the induction spring, of each purification plate, when the impurities attached to the purification plates are too much, the purification plates can squeeze the induction spring because of gas does not flow, the piezoelectric plates are connected with the electric signal motor, and the electric signal motor is input into a group of fixing pipes, and the number of the electric signal motor is limited by the reversing pipes, and the number value is required to be driven by the fan to be close to the reversing pipes, and the number value is not limited by the reversing pipes to be driven by the fan to rotate, and then the number is required to be fixed by the fan to be driven by a number to be driven by a person.

Compared with the prior art, the invention has the following beneficial effects: compared with the existing wet cleaning equipment provided with a circulating mechanism and a fixing mechanism, the circulating assembly is used for enabling high-frequency ultrasonic vibration to be generated in cleaning liquid so that the wafer can be cleaned, on the other hand, the impurity content of the cleaning liquid in the first cleaning tank and the second cleaning tank can be monitored in real time, when the impurity content of the cleaning liquid in the first cleaning tank and the second cleaning tank is overlarge, a worker can synchronously process cleaning the wafer and replacing the cleaning liquid through the circulating assembly, the liquid supplementing mechanism and the recovering mechanism, on the basis of ensuring the cleaning effect of the wafer, the wafer is prevented from being polluted by taking out halfway, in addition, compared with the existing clamp, the fixing mechanism in the invention can automatically break away from a clamping state, the clamp is prevented from being detached by the worker when the wafer is taken out, meanwhile, compared with the existing clamp, the fixing mechanism in the invention is different in use mode, when the wafer is fixed, the contact part of the fixing mechanism and the wafer can be changed according to the requirement, in the process of changing the contact part, the wafer can be kept stable when the wafer is cleaned, on the basis of ensuring that the wafer is not used for the cleaning, the cleaning effect is guaranteed, the cleaning effect is improved, and the air is prevented from being polluted by the cleaning mechanism when the filter screen is arranged at the end, and the cleaning position is not required, and the cleaning effect is improved by adopting the cleaning mechanism, and the cleaning mechanism is compared with the existing in the invention, and the cleaning mechanism and the cleaning effect can be cleaned by the cleaning mechanism.

Drawings

The foregoing and/or other advantages of the invention will become more apparent from the following detailed description of the invention when taken in conjunction with the accompanying drawings and detailed description.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the fuselage of the present invention;

FIG. 3 is a cross-sectional view of the fuselage of the present invention;

FIG. 4 is a schematic view of the structure of the fixing mechanism of the present invention;

FIG. 5 is a schematic view of the internal structure of the fixing mechanism of the present invention;

FIG. 6 is a schematic view of the internal structure of the movable seat of the present invention;

FIG. 7 is a schematic view of the structure of the support mechanism of the present invention;

FIG. 8 is a schematic view of the cyclic group structure of the present invention;

FIG. 9 is a schematic view of the structure of section A-A of FIG. 8 in accordance with the present invention;

Fig. 10 is a schematic view of the internal structure of the purification seat of the present invention.

In the figure: 1. a body; 11. a first cleaning tank; 12. a second cleaning tank; 13. a drying pool; 131. a jet assembly; 14. a slide plate; 15. an air pump; 16. a linear motor; 17. a circulation assembly; 171. a circulation seat; 1711. a unidirectional liquid discharge channel; 1712. a unidirectional liquid inlet channel; 1713. a first connection channel; 1714. a second connection channel; 1715. a first cylinder; 172. a first circulation box; 173. a second circulation box; 2. a fluid supplementing mechanism; 21. a fluid supplementing pipe; 3. a recovery mechanism; 31. a recovery pipe; 4. a purifying seat; 41. a blower; 42. an annular groove; 43. reversing the motor; 44. a fixed tube; 441. a purification plate; 5. a fixing mechanism; 51. a support frame; 52. a movable seat; 521. a first clamping groove; 522. a first clamping plate; 523. an air bag; 524. a first movable plate; 525. a first electromagnet; 526. a second cylinder; 53. a fixing seat; 531. a screw module; 54. a support mechanism; 541. a support base; 542. a lifting seat; 5421. a second clamping groove; 5422. a second clamping plate; 5423. a second movable plate; 5424. a second electromagnet; 543. and a third electromagnet.

Detailed Description

It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

As shown in fig. 1-3, the present invention provides the following technical solutions: the invention relates to a wet cleaning device for a semiconductor integrated circuit process, which comprises a machine body 1, a liquid supplementing mechanism 2, a recovery mechanism 3 and a purifying mechanism, wherein the liquid supplementing mechanism 2 and the recovery mechanism 3 are respectively arranged at the left side and the right side of the machine body 1, new cleaning liquid is conveyed into the machine body 1 through the liquid supplementing mechanism 2, old cleaning liquid in the machine body 1 is recovered through the recovery mechanism 3 (the functions realized by the liquid supplementing mechanism 2 and the recovery mechanism 3 belong to the conventional technical means in the field, the specific structure is not described), the purifying mechanism is arranged above the machine body 1, the machine body 1 is in a closed state when in operation, the gas environment inside the machine body 1 is purified through the purifying mechanism, so that the wafer is prevented from being polluted during the cleaning process of different stations, a linear motor 16 is arranged at the inner top end of the machine body 1, a fixing mechanism 5 is arranged below the linear motor 16, the wafer is fixed by the fixing mechanism 5, the fixing mechanism 5 is connected with the linear motor 16 through the supporting frame 51, the supporting frame 51 has a telescopic function (the function realized by the supporting frame 51 belongs to the conventional technical means in the field, the specific structure is not described), the fixing mechanism 5 and the wafer are driven to move to different stations according to the needs through the linear motor 16 and the supporting frame 51, the lower end of the inside of the machine body 1 is provided with a first cleaning tank 11, a second cleaning tank 12 and a drying tank 13, cleaning liquid is filled in the first cleaning tank 11 and the second cleaning tank 12, the types of the cleaning liquid are selected by staff according to the needs, the inside of the first cleaning tank 11 and the second cleaning tank 12 is provided with a circulating assembly 17, the side wall of the upper end of the drying tank 13 is provided with an air injection assembly 131, the fluid supplementing mechanism 2 is connected with two groups of circulating assemblies 17 through fluid supplementing pipes 21, the recovery mechanism 3 is connected with two groups of circulation components 17 through a recovery pipe 31, on one hand, high-frequency ultrasonic vibration is generated in cleaning liquid through the circulation components 17 so that the wafer can be cleaned, on the other hand, workers can replace the cleaning liquid while cleaning the wafer, the air injection component 131 is connected with an external air transmission system, the air injection component 131 has a telescopic function, when the wafer is cleaned, the air injection component 131 is not positioned in the drying tank 13, when the wafer is dried, the air injection component 131 is positioned in the drying tank 13 (the telescopic function of the air injection component 131 belongs to the conventional technical means in the field and the specific structure is not described), when the wafer is dried, nitrogen with a certain heat is input into the air injection component 131 by the external air transmission system so that the wafer is quickly dried, finally, the sliding plate 14 is arranged at the upper ends of the first cleaning tank 11, the second cleaning tank 12 and the drying tank 13, the air pump 15 is arranged at the side ends of the drying tank 13, splashing is reduced through the sliding plate 14, and the nitrogen is recovered through the air pump 15 (the functions realized by the sliding plate 14 and the air pump 15 belong to the conventional technical means in the field and the specific structure is not described).

As shown in fig. 2-6, the fixing mechanism 5 includes a movable seat 52 and a fixed seat 53, the fixed seat 53 is provided with two groups, the movable seat 52 is provided with two groups, the two groups of movable seats 52 are oppositely arranged between the two groups of fixed seats 53, a group of first movable plates 524 and a first electromagnet 525 are respectively arranged in each group of movable seats 52, one end of the first movable plate 524, which is far away from the first electromagnet 525, is connected with the movable seat 52 through a first return spring, one end of the two groups of movable seats 52, which is close to each other, is provided with a plurality of groups of first clamping grooves 521, a group of first clamping plates 522 and an air bag 523 are respectively arranged in each group of first clamping grooves 521, the plurality of groups of first clamping plates 522 are fixedly connected with the first movable plates 524, when the fixing mechanism 5 in the invention does not work, the first clamping plates 522 and the air bags 523 in each group of first clamping grooves 521 are in a state far away from each other, when a wafer needs to be fixed, a worker only needs to place the wafer into the first clamping groove 521 and then opens the first electromagnet 525, one end of the first movable plate 524, which is close to the first electromagnet 525, has magnetism, the first movable plate 524 can be driven to move with a plurality of groups of first clamping plates 522 through the first electromagnet 525, the purpose of clamping the wafer can be achieved through the dual functions of the first clamping plates 522 and the air bags 523, a group of screw rod modules 531 are arranged below each group of fixed seats 53, the distance between the two groups of movable seats 52 is controlled through the screw rod modules 531 (the functions realized by the screw rod modules 531 belong to the conventional technical means in the field, the specific structure is not described), the invention can fix wafers with different sizes through the screw rod modules 531, and finally compared with the existing clamp, the invention can be automatically separated from a clamping state when power is off, avoid the staff to dismantle anchor clamps when getting the wafer.

As shown in fig. 5 to 6, the lower end of the inside of the movable seat 52 is provided with a second cylinder 526 and a gas storage tank, the inside of the gas storage tank is provided with a compression plate, the gas storage tank is connected with a plurality of groups of gas bags 523 through a diversion channel, in the invention, the compression plate is connected with the working end of the second cylinder 526, the gas storage tank stores compressed gas, the fixing mechanism 5 in the invention is different from the existing fixing clamp in use mode, when a worker places a wafer into the first clamping groove 521, the screw rod module 531 is opened, so that the outer surface of the wafer is not contacted with the first movable plate 524 (namely, a gap is formed between the wafer and the first movable plate 524), after the gap is formed between the outer surface of the wafer and the first movable plate 524, the first electromagnet 525 and the second cylinder 526 are opened, at this time, the first clamping plate 522 and the gas bags 523 are mutually close, compared with the existing fixing clamp, the invention does not exist because of shielding when the wafer is cleaned, the specific working principle is as follows: during initial cleaning, the first clamping plates 522 and the air bags 523 at the two side ends of the wafer can firmly clamp the wafer, and when the cleaning is about to be finished, the first clamping plates 522 and the air bags 523 at the two side ends of the wafer can alternately loosen the wafer, so that the cleaning of the shielding part of the wafer can be completed.

As shown in fig. 5 and 7, in order to ensure that the wafer is always in a stable state during the cleaning process and avoid shaking caused by unstable fixing of the wafer, the fixing mechanism 5 in the present invention further comprises a supporting mechanism 54, the supporting mechanism 54 is arranged at the lower ends of the two groups of fixing seats 53, the supporting mechanism 54 comprises a supporting seat 541 and a lifting seat 542, the supporting seat 541 is fixedly connected with the two groups of fixing seats 53, the lifting seat 542 is arranged in the supporting seat 541, a plurality of groups of second clamping grooves 5421 are arranged at the upper end of the lifting seat 542, a group of second clamping plates 5422 and a group of rubber pads are arranged in each group of second clamping grooves 5421, a second movable plate 5423 and a second electromagnet 5424 are arranged at the lower end of the lifting seat 542, one end of the second movable plate 5423, which is close to the second electromagnet 5424, is magnetic, is connected with the lifting seat 542 through a second reset spring, a plurality of groups of second clamping plates 5422 are fixedly connected with the second movable plate 5423, and the lower ends of the wafer should be inserted into the second clamping plates 5422 and the second clamping plates 5422 before the work, and the wafer is clamped between the second clamping plates 5422 and the second clamping plates 5424.

As shown in fig. 5 and 7, a third electromagnet 543 is disposed at the lower end of the supporting seat 541, one end of the lifting seat 542 near the third electromagnet 543 is magnetic, and the supporting seat 541 is connected to the lifting seat 542 through a sliding block and a sliding slot.

As shown in fig. 3 and fig. 8-fig. 9, the circulation assembly 17 includes a circulation seat 171, a first circulation box 172 and a second circulation box 173, the first circulation box 172 and the second circulation box 173 are oppositely disposed on the left and right sides of the circulation seat 171, a first cylinder 1715, a circulation chamber, a unidirectional liquid-discharging channel 1711 and a unidirectional liquid-feeding channel 1712 are disposed in the circulation seat 171, in the invention, a sealing ball core and a spring (the arrangement of the sealing ball core and the spring is a conventional technical means in the art, which is not described herein, and can refer to a structure such as a unidirectional valve) are disposed in the circulation chamber, the piston is connected with the working end of the first cylinder 1715, one end of the unidirectional liquid-discharging channel 1711 is connected with the circulation chamber, the other end of the unidirectional liquid-discharging channel 1711 is connected with the first circulation box 172 through a first connecting channel 1713, one end of the unidirectional liquid-feeding channel 1712 is connected with the circulation chamber, the other end of the unidirectional liquid-feeding channel 1712 is connected with the second circulation box 173 through a second connecting channel 1714, the other end of the unidirectional liquid-discharging channel 1712 is capable of detecting impurities by detecting impurities in the liquid by detecting the liquid-feeding channel through the unidirectional liquid-discharging channel 1711 and the liquid-detecting impurities in the liquid-feeding channel can be replaced by the existing device (the conventional device can be conveniently detected by detecting impurities in the liquid impurities in the circulation device).

As shown in fig. 3 and fig. 8-fig. 9, the unidirectional liquid drain channel 1711 is connected with the liquid replenishing mechanism 2 through the liquid replenishing pipe 21, the unidirectional liquid inlet channel 1712 is connected with the recovery mechanism 3 through the recovery pipe 31, and valves are arranged at one ends of the liquid replenishing pipe 21 and the recovery pipe 31, which are close to the circulation assembly 17.

As shown in fig. 10, the purification mechanism comprises a purification seat 4, a fan 41, an annular groove 42, a reversing motor 43 and an exhaust channel, one end of the annular groove 42 is connected with the fan 41, the other end of the annular groove 42 is connected with the exhaust channel, a plurality of groups of fixing pipes 44 are arranged in the annular groove 42, the plurality of groups of fixing pipes 44 are all connected with a rotating shaft of the reversing motor 43 through fixing rods, a group of purification plates 441 are arranged in each group of fixing pipes 44, before the purification mechanism works, the fan 41 is required to be started, gas in a machine body 1 is input into the group of fixing pipes 44 between the fan 41 and the exhaust channel through the fan 41, impurities in the gas are removed through the group of fixing plates 441 in the group of fixing pipes 44, in the purification plate 441 and the fixing pipes 44 are connected through sliding rods, an inductive spring is wound at one end of the sliding rod far away from the fan 41, the purification plate 441 is close to the inductive spring, when the impurities attached to the purification plate 441 are too much, the piezoelectric plate 441 can not squeeze the inductive spring because of gas circulation, the electric signal is connected with the motor 43, and when the electric signal is connected with the motor 43, the reversing motor is required to be driven to be close to the reversing pipe 43, and a specific value is required to be driven by the reversing pipe 43, and the value is not limited by the reversing pipe 43 when the value is required to be driven to be rotated, and the value is required to be more than the value to be fixed by the reversing pipe 44.

The working principle of the invention is as follows: before working, the third electromagnet 543 is turned on, a set of magnetic fields repelling the lifting seat 542 is generated by the third electromagnet 543, so that the lifting seat 542 is positioned at the upper end of the inside of the supporting seat 541, then a worker can place the wafer into the first clamping groove 521 and the second clamping groove 5421, and turn on the screw module 531, so that the outer surface of the wafer is not contacted with the first movable plate 524, then turn on the first electromagnet 525 and the second cylinder 526, at this time, the first clamping plate 522 and the air bag 523 are close to each other, the two ends of the wafer are clamped by the first clamping plate 522 and the air bag 523, finally the second electromagnet 5424 is turned on, after the preparation work is finished, the gas environment inside the machine body 1 is purified by the purifying mechanism, so that the wafer is prevented from being polluted during the cleaning process of different stations, then the fixing mechanism 5 and the wafer are driven by the linear motor 16 and the supporting frame 51 to sequentially enter the first cleaning tank 11 and the second cleaning tank 12, the cleaning liquid in the first cleaning tank 11 and the second cleaning tank 12 is used for cleaning the wafer, when the cleaning is about to be finished, the first electromagnet 525 and the second air cylinder 526 can be controlled by a worker to enable the first clamping plates 522 and the air bags 523 at the two side ends of the wafer to alternately loosen the wafer so as to enable the shielding part at the side end of the wafer to be completely cleaned, when the side end of the wafer is completely cleaned, the first electromagnet 525 and the second air cylinder 526 are started so as to enable the first clamping plates 522 and the air bags 523 at the two side ends of the wafer to clamp the wafer, then the second electromagnet 5424 is closed, and the third electromagnet 543 is controlled to generate a set of magnetic fields for attracting the lifting seat 542 so as to enable the second clamping plates 5422 and the rubber pads to be separated from the wafer, so that after the cleaning is finished, the fixing mechanism 5 and the wafer are driven into the drying pool 13 through the linear motor 16 and the supporting frame 51, nitrogen with certain heat is input into the air injection assembly 131 through an external air transmission system, and then the wafer is dried.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (8)

1. A wet cleaning apparatus for semiconductor integrated circuit processes, characterized by: the wet cleaning device comprises a machine body (1), a liquid supplementing mechanism (2), a recycling mechanism (3) and a cleaning mechanism, wherein the liquid supplementing mechanism (2) and the recycling mechanism (3) are respectively arranged on the left side and the right side of the machine body (1), the cleaning mechanism is arranged above the machine body (1), a linear motor (16) is arranged at the top end of the interior of the machine body (1), a fixing mechanism (5) is arranged below the linear motor (16), the fixing mechanism (5) is connected with the linear motor (16) through a supporting frame (51), the supporting frame (51) has a telescopic function, a first cleaning tank (11), a second cleaning tank (12) and a drying tank (13) are arranged at the lower end of the interior of the machine body (1), circulating components (17) are arranged inside the first cleaning tank (11) and the second cleaning tank (12), air injection components (131) are arranged on the side wall of the upper end of the drying tank (13), the liquid supplementing mechanism (2) is connected with two groups of circulating components (17) through a liquid supplementing pipe (21), and the two groups of circulating components (31) are connected with an air injection system (17), and the two groups of circulating components (31) are connected with an air delivery system (17).

2. A wet cleaning apparatus for semiconductor integrated circuit processes according to claim 1, wherein: fixed establishment (5) are including movable seat (52) and fixing base (53), fixing base (53) are provided with two sets of, movable seat (52) are provided with two sets of, two sets of movable seat (52) set up relatively between two sets of fixing bases (53), every set of the below of fixing base (53) all is provided with a set of lead screw module (531), through the interval of two sets of movable seats (52) of lead screw module control, every set of the inside of movable seat (52) all is provided with a set of first fly leaf (524) and first electro-magnet (525), the one end that first fly leaf (524) is close to first electro-magnet (525) has magnetism, the one end that first electro-magnet (525) was kept away from to first fly leaf (524) is connected with movable seat (52) through first reset spring, and two sets of the one end that movable seat (52) are close to each other all is provided with a plurality of first grip-holder groove (521), every set of the inside of first grip-holder groove (521) all is provided with a set of first fly leaf (522), a plurality of fly leaf (522) and first fly leaf (522) are connected with first fly leaf (522).

3. A wet cleaning apparatus for semiconductor integrated circuit processes according to claim 2, wherein: the lower end of the inside of the movable seat (52) is provided with a second cylinder (526) and a gas storage groove, the inside of the gas storage groove is provided with a compression plate, and the gas storage groove is connected with a plurality of groups of air bags (523) through a diversion channel.

4. A wet cleaning apparatus for semiconductor integrated circuit processes according to claim 2, wherein: the fixing mechanism (5) further comprises a supporting mechanism (54), the supporting mechanism (54) is arranged at the lower ends of the two groups of fixing seats (53), the supporting mechanism (54) comprises a supporting seat (541) and a lifting seat (542), the supporting seat (541) is fixedly connected with the two groups of fixing seats (53), the lifting seat (542) is arranged in the supporting seat (541), a plurality of groups of second clamping grooves (5421) are formed in the upper end of the lifting seat (542), a plurality of groups of second clamping plates (5422) and a plurality of rubber pads are arranged in the second clamping grooves (5421), a second movable plate (5423) and a second electromagnet (5424) are arranged at the lower end of the lifting seat (542), one end, close to the second electromagnet (5424), of the second movable plate (5423) is magnetic, one end, far away from the second electromagnet (5424), of the lifting seat (542) is connected with the lifting seat (542) through a second reset spring, and the second clamping plates (5422) are connected with the second movable plates (5424).

5. A wet cleaning apparatus for semiconductor integrated circuit processes according to claim 4, wherein: the lower extreme of supporting seat (541) is provided with third electro-magnet (543), the one end that goes up and down seat (542) to be close to third electro-magnet (543) has magnetism.

6. A wet cleaning apparatus for semiconductor integrated circuit processes according to any one of claims 1 to 5, wherein: the circulating assembly (17) comprises a circulating seat (171), a first circulating box (172) and a second circulating box (173), the first circulating box (172) and the second circulating box (173) are oppositely arranged on the left side and the right side of the circulating seat (171), a first cylinder (1715), a circulating chamber, a one-way liquid discharging channel (1711) and a one-way liquid inlet channel (1712) are arranged in the circulating seat (171), a piston is arranged in the circulating chamber, the piston is connected with the working end of the first cylinder (1715), one end of the one-way liquid discharging channel (1711) is connected with the circulating chamber, the other end of the one-way liquid discharging channel (1711) is connected with the first circulating box (172) through a first connecting channel (1713), one end of the one-way liquid inlet channel (1712) is connected with the circulating chamber, and the other end of the one-way liquid inlet channel (1712) is connected with the second circulating box (173) through a second connecting channel (1714).

7. The wet cleaning apparatus for semiconductor integrated circuit process according to claim 6, wherein: the one-way liquid draining channel (1711) is connected with the liquid supplementing mechanism (2) through the liquid supplementing pipe (21), the one-way liquid draining channel (1712) is connected with the recycling mechanism (3) through the recycling pipe (31), and valves are arranged at one ends of the liquid supplementing pipe (21) and the recycling pipe (31) close to the circulating assembly (17).

8. A wet cleaning apparatus for semiconductor integrated circuit processes according to claim 1, wherein: the purifying mechanism comprises a purifying seat (4) and a fan (41); annular groove (42), switching-over motor (43) and exhaust passage, the one end of annular groove (42) is connected with fan (41), the other end and the exhaust passage of annular groove (42) are connected, the inside of annular groove (42) is provided with a plurality of fixed pipe (44) of group, and a plurality of group fixed pipe (44) are the annular setting in annular groove (42), and a plurality of group fixed pipe (44) all are connected with the pivot of switching-over motor (43) through the dead lever, every group the inside of fixed pipe (44) all is provided with a set of purge plate (441), be connected through the slide bar between purge plate (441) and the fixed pipe (44), the one end winding that the fan (41) was kept away from to the slide bar has the response spring, the one end that purge plate (441) is close to the response spring is provided with the piezoelectric plate.