CN210757009U - Full-automatic chip machining device - Google Patents
Full-automatic chip machining device Download PDFInfo
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- CN210757009U CN210757009U CN201921512408.1U CN201921512408U CN210757009U CN 210757009 U CN210757009 U CN 210757009U CN 201921512408 U CN201921512408 U CN 201921512408U CN 210757009 U CN210757009 U CN 210757009U
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Abstract
The utility model discloses a full-automatic machining device of chip, concretely relates to chip processing technology field, which comprises a frame, the activity of frame top is provided with the swivel work head, swivel work head outside surface evenly is provided with four polishing trench, the fixed feeding conveying frame that is provided with in swivel work head rear side, the inside activity of feeding conveying frame is provided with feeding conveyer belt, the fixed ejection of compact conveying frame that is provided with in swivel work head one side, the inside activity of ejection of compact conveying frame is provided with exit conveyor, be provided with wafer chip transport mechanism between feeding conveying frame and the ejection of compact conveying frame and the swivel work head. The utility model discloses a slide rail horizontal motion of activity slip table on the conveying frame utilizes to snatch the sucking disc and adsorbs wafer chip, utilizes the chip at feeding conveying frame and ejection of compact conveying frame and polishing groove position within a definite time motion, realizes the bullet material loading of chip and gets the material, reduces work load, improves work efficiency.
Description
Technical Field
The utility model relates to a chip processing technology field, more specifically say, the utility model relates to a full-automatic machining device of chip.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide.
The utility model patent of patent application publication No. CN201711133211.2 discloses a wafer chip processing device, which is characterized in that a safety fence is arranged, and a carrying manipulator, a feeding box, a processing platform and a discharging box are arranged in the safety fence; and carrying the chips to be machined to the machining platform from the feeding box by utilizing the manipulator to complete the grinding operation of the chips, and carrying the chips after grinding to the discharging box, thereby completing the full-automatic grinding process of the wafer chips.
However, in practical use, there are still many disadvantages, such as high cost of the robot arm, complex control operation, and influence on the operation efficiency, and the powder generated by grinding is liable to influence on the adsorption effect of the suction cup.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a full-automatic machining device of chip utilizes to snatch the sucking disc and adsorbs wafer chip through the slide rail horizontal motion of activity slip table on transfer frame, utilizes the chip to move between feeding transfer frame and ejection of compact transfer frame and polishing groove position, realizes the bullet material loading of chip and gets the material, reduces work load, improves work efficiency to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a full-automatic chip machining device comprises a rack, wherein a rotating workbench is movably arranged at the top of the rack, four polishing groove positions are uniformly arranged on the outer surface of the rotating workbench, a feeding conveying frame is fixedly arranged at the rear side of the rotating workbench, a feeding conveying belt is movably arranged in the feeding conveying frame, a discharging conveying frame is fixedly arranged on one side of the rotating workbench, a discharging conveying belt is movably arranged in the discharging conveying frame, wafer chip conveying mechanisms are arranged between the feeding conveying frame and the rotating workbench, and the feeding conveying frame and the discharging conveying frame are arranged in a vertical crossing manner;
the wafer chip conveying mechanism comprises two conveying frames, the two conveying frames are respectively arranged between the top of a feeding conveying frame and the top of a rotating workbench and between the top of a discharging conveying frame and the top of the rotating workbench, a movable groove is formed in the middle of each conveying frame, slide rails are fixedly arranged on two sides of each movable groove, a movable sliding table is movably arranged between the two slide rails, a lifting cylinder is arranged at the top of each movable sliding table, the output end of the lifting cylinder is vertically and downwards arranged, a grabbing sucker is fixedly arranged on each lifting cylinder, a moving cylinder is arranged on one side of each movable sliding table, a through groove is fixedly formed in each of one side of the feeding conveying frame and one side of the discharging conveying frame, and the polishing groove, the grabbing;
a polishing frame is fixedly arranged on the other side of the rotary workbench, lifting slide bars are fixedly arranged on two surfaces of the polishing frame, a first polishing motor is movably arranged between the two lifting slide bars, a first polishing grinding disc is fixedly arranged at the output end of the first polishing motor, the first polishing grinding disc and the polishing groove are vertically arranged in a collinear manner, and a movable air cylinder is arranged on one side of the first polishing motor;
the rotary worktable is characterized in that a fixing support is fixedly arranged on the front side of the rotary worktable, an air pump is fixedly arranged at the top of the fixing support, an extension support is fixedly arranged on one side of the top of the fixing support, and the end part of the extension support is fixedly arranged at an air blowing opening.
In a preferred embodiment, a rotating motor is fixedly arranged inside the rack, the output end of the rotating motor is fixedly connected with the center of the rotating workbench, the feeding conveying frame and the discharging conveying frame are fixedly connected with one end of the conveying frame, the other end of the conveying frame extends to the top of the circle center of the rotating workbench, and the feeding conveying frame, the discharging conveying frame and the conveying frame are arranged in a cross manner.
In a preferred embodiment, the movable air cylinder is horizontally arranged, the cylinder body of the movable air cylinder is fixedly arranged on the surface of the conveying frame, and the output end of the movable air cylinder is fixedly connected with one side of the movable sliding table.
In a preferred embodiment, one side of the polishing groove is communicated with the outer side of the rotary workbench, and the through groove is arranged in accordance with the horizontal height of the polishing groove.
In a preferred embodiment, a second polishing grinding disc is movably arranged in the polishing groove, a second polishing motor is arranged at the bottom of the second polishing grinding disc, a rotating workbench is fixedly arranged on the second polishing motor, the output end of the second polishing motor is fixedly arranged with the circle center at the bottom of the second polishing grinding disc, and the first polishing grinding disc and the second polishing grinding disc are correspondingly arranged.
In a preferred embodiment, the first polishing motor is movably disposed between the two lifting slide bars through a sliding frame, the output end of the movable cylinder is fixedly connected with the sliding frame, and the cylinder body of the movable cylinder is fixedly connected with the polishing frame.
In a preferred embodiment, the extension bracket is horizontally arranged in parallel with the rotary table, the extension bracket is arranged at a height greater than that of the rotary table, and the extension bracket extends to the top of the polishing groove.
In a preferred embodiment, the air blowing port is fixedly connected with an output end of the air pump, and the air blowing port is arranged corresponding to the polishing groove in the direction.
The utility model discloses a technological effect and advantage:
1. the utility model discloses a set up feeding conveying frame and ejection of compact conveying frame, utilize the feeding conveyer belt on the feeding conveying frame to carry the wafer chip of treating polishing, utilize the ejection of compact conveyer belt on the ejection of compact conveying frame to carry the wafer chip that polishes, the lift cylinder drives and snatchs the sucking disc and descends, absorb the wafer chip, the removal cylinder promotes movable slip table horizontal motion, cooperation logical groove, switch over the wafer chip that absorbs between feeding conveyer belt and ejection of compact conveyer belt and polishing trench, the rotation of cooperation swivel work head, drive four polishing trench movements, utilize first polishing mill to polish the wafer chip, relative to current chip processing equipment, make things convenient for automatic material loading and ejection of compact of wafer chip, reduce work load, improve work efficiency;
2. the utility model discloses a set up the fixed bolster. Utilize the extension support on the fixed bolster to extend to the polishing trench on the swivel work head, utilize the air pump to carry air to the gas outlet, recycle the gas outlet and blow to the polishing trench that rotates to extension bottom of the shelf portion, clean the wafer chip that polishes on the polishing trench, make things convenient for subsequent sucking disc that snatchs to the absorption of chip, make things convenient for device's normal use, improve job stabilization nature.
Drawings
Fig. 1 is an overall schematic plan view of the present invention.
Fig. 2 is an overall sectional view of the present invention.
Fig. 3 is a schematic view of a portion a of fig. 1 according to the present invention.
Fig. 4 is an overall schematic view of the rotary table of the present invention.
Fig. 5 is a schematic sectional view of the side view of the present invention.
The reference signs are: the polishing machine comprises a machine frame 1, a rotary workbench 2, a polishing groove 3, a feeding conveying frame 4, a feeding conveying belt 5, a discharging conveying frame 6, a discharging conveying belt 7, a conveying frame 8, a movable groove 9, a sliding rail 10, a movable sliding table 11, a lifting cylinder 12, a grabbing sucker 13, a movable cylinder 14, a through groove 15, a polishing frame 16, a lifting sliding rod 17, a first polishing motor 18, a first polishing grinding disc 19, a movable cylinder 20, a fixed support 21, an air pump 22, an extending support 23, an air blowing opening 24, a rotating motor 25, a second polishing grinding disc 26 and a second polishing motor 27.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a full-automatic chip machining device as shown in figures 1-4, which comprises a frame 1, the top of the frame 1 is movably provided with a rotary worktable 2, the surface of the outer side of the rotary worktable 2 is uniformly provided with four polishing groove positions 3, the rear side of the rotary worktable 2 is fixedly provided with a feeding conveying frame 4, the feeding conveying frame 4 is internally movably provided with a feeding conveying belt 5, one side of the rotary worktable 2 is fixedly provided with a discharging conveying frame 6, the discharging conveying frame 6 is internally movably provided with a discharging conveying belt 7, wafer chip conveying mechanisms are arranged between the feeding conveying frame 4 and the discharging conveying frame 6 and the rotary worktable 2, and the feeding conveying frame 4 and the discharging conveying frame 6 are arranged in a vertical crossing way;
the wafer chip conveying mechanism comprises two conveying frames 8, the two conveying frames 8 are respectively arranged between the top of a feeding conveying frame 4 and the top of a rotating workbench 2 and between the top of a discharging conveying frame 6 and the top of the rotating workbench 2, a movable groove 9 is formed in the middle of each conveying frame 8, slide rails 10 are fixedly arranged on two sides of each movable groove 9, a movable sliding table 11 is movably arranged between the two slide rails 10, a lifting cylinder 12 is arranged at the top of each movable sliding table 11, the output end of each lifting cylinder 12 is vertically and downwards arranged and is fixedly provided with a grabbing sucker 13, a movable cylinder 14 is arranged on one side of each movable sliding table 11, through grooves 15 are fixedly formed in one side of each feeding conveying frame 4 and one side of each discharging conveying frame 6, and the polishing groove 3, the grabbing sucker 13 and the through grooves 15 are;
2 opposite sides of swivel work head are fixed and are provided with polishing frame 16, 16 fixed lifting slide bars 17, two of polishing frame 16 surfaces are all fixed and are provided with lift slide bar 17, two the activity is provided with first polishing motor 18 between the lift slide bar 17, first polishing motor 18 output end is fixed and is provided with first polishing mill 19, first polishing mill 19 sets up with the vertical collineation of polishing trench 3, first polishing motor 18 one side is provided with movable cylinder 20.
Further, 1 inside fixed being provided with of frame rotates motor 25, rotate motor 25 output and 2 central fixed connection of swivel work head, feeding conveying frame 4 and ejection of compact conveying frame 6 all with 8 one end fixed connection of transfer frame, the 8 other ends of transfer frame extend to 2 centre of a circle tops of swivel work head, feeding conveying frame 4 and ejection of compact conveying frame 6 all are the cross setting with transfer frame 8, realize the shortest setting of transfer frame 8, make things convenient for setting up of device.
Further, the movable air cylinder 14 is the level setting, the fixed setting of movable air cylinder 14 cylinder body and the 8 surfaces of transfer frame, the output of movable air cylinder 14 and 11 one side fixed connection of activity slip table conveniently move 14 level promotion activity slip table 11, conveniently drive the lift cylinder 12 on the activity slip table 11 and remove, and then realize driving and snatch the absorbent wafer chip motion on the sucking disc 13.
Further, polishing trench 3 one side is linked together with the 2 outsides of rotating table, it is unanimous with polishing trench 3 level to lead to groove 15, makes things convenient for wafer chip to lead to the horizontal motion between groove 15 and polishing trench 3, makes things convenient for wafer chip's transportation.
Further, polishing trench 3 is inside to be moved about and to set up second polishing mill 26, second polishing mill 26 bottom is provided with second polishing motor 27, second polishing motor 27 is fixed and is provided with swivel work head 2, second polishing motor 27 output and the fixed setting in second polishing mill 26 bottom centre of a circle, first polishing mill 19 corresponds the setting with second polishing mill 26, and first polishing motor 18 is electronic first polishing mill 19, and second polishing motor 27 drives second polishing mill 26 and rotates, and the wafer chip is placed at second polishing mill 26 top, utilizes first polishing mill 19 and second polishing mill 26 centre gripping wafer chip, and the rotation direction of first polishing mill 19 and second polishing mill 26 is opposite, realizes carrying out two-sided polishing to the wafer chip and polishes.
Furthermore, first polishing motor 18 sets up between two lift slide bars 17 through the carriage activity, activity cylinder 20 output and carriage fixed connection, activity cylinder 20 cylinder body and polishing frame 16 fixed connection utilize activity cylinder 20 to drive first polishing motor 18 up-and-down motion, make things convenient for first polishing mill 19 to press on the wafer chip, and then make things convenient for the wafer chip polishing to polish.
The implementation mode is specifically as follows: when chip processing is carried out, a feeding conveying belt 5 on a feeding conveying frame 4 conveys a wafer chip to be polished, a discharging conveying belt 7 on a discharging conveying frame 6 is utilized to convey the polished wafer chip, a lifting cylinder 12 on a conveying frame 8 connected with the feeding conveying frame 4 drives a grabbing sucker 13 to descend to suck the wafer chip, a movable sliding table 11 is pushed by a movable cylinder 14 to horizontally move on a sliding rail 10, the wafer chip is placed in a polishing groove position 3 by matching with a through groove 15, the polishing groove position 3 in which the wafer chip is placed is driven to move to the bottom of a polishing frame 16 by the rotation of a rotating workbench 2, the chip is polished by a first polishing grinding disc 19, a second polishing grinding disc 26 is arranged in the polishing groove position 3, the wafer chip is placed at the top of the second polishing grinding disc 26, and the wafer chip is clamped by the first polishing grinding disc 19 and the second polishing grinding disc 26, first polishing mill 19 and second polishing mill 26's rotation opposite direction, the realization is polished wafer chip and is carried out two-sided polishing, then swivel work head 2 continues to rotate, the good chip of polishing removes the 8 bottoms of the conveying frame that ejection of compact conveying frame 6 connects, equally utilize and snatch sucking disc 13 and absorb the good chip of processing, the relative reverse motion of activity slip table 11, transport the chip ejection of compact conveying 7 on, the realization is chip processing in proper order, swivel work head 2's rotation, drive four polishing trench 3 motions, the automatic feeding and the ejection of compact of wafer chip are made things convenient for to the benefit, reduce work load, and the work efficiency is improved.
As shown in fig. 1 and 5, a fixing support 21 is fixedly arranged on the front side of the rotary worktable 2, an air pump 22 is fixedly arranged on the top of the fixing support 21, an extension support 23 is fixedly arranged on one side of the top of the fixing support 21, and the end of the extension support 23 is fixedly arranged at an air blowing port 24.
Further, extend support 23 and swivel work head 2 and be horizontal parallel arrangement, extend support 23 and set up highly to be greater than swivel work head 2 height, extend support 23 and extend to polishing trench 3 tops, conveniently extend support 23 and erect at swivel work head 2 tops, conveniently blow mouthful 24 and aim at polishing trench 3.
Further, the air blowing port 24 is fixedly connected with the output end of the air pump 22, the air blowing port 24 is arranged corresponding to the orientation of the polishing groove 3, the air pump 22 delivers air to the air outlet 24, and the air outlet 24 blows air to the polishing groove 3 rotated to the bottom of the extension frame 23 to clean the surface of the wafer chip.
The implementation mode is specifically as follows: after wafer chip polishing processing, swivel work head 2 rotates, drive the inside wafer chip of 3 polishing trench and leave polishing frame 16 bottoms, extension support 23 on the fixed bolster 21 extends to on the polishing trench 3 on swivel work head 2, air pump 22 is to gas outlet 24 air this moment, gas outlet 24 blows to the polishing trench 3 that rotates to extension 23 bottoms, because polish the back of polishing to wafer chip surface, wafer chip surface has a lot of dusts of polishing out, if not clear up, it snatchs the sucking disc to the adsorption effect of wafer chip to influence easily, and then influence the processing of device and use, clean the wafer chip that polishes on polishing trench 3, make things convenient for subsequent absorption of snatching the sucking disc 13 and snatching the chip, convenience of device's normal use, improve job stabilization nature.
The utility model discloses the theory of operation:
referring to the attached drawings 1-4 of the specification, when chip processing is carried out, a feeding conveying belt 5 on a feeding conveying frame 4 conveys a wafer chip to be polished, a discharging conveying belt 7 on a discharging conveying frame 6 conveys the polished wafer chip, a lifting cylinder 12 on a conveying frame 8 connected with the feeding conveying frame 4 drives a grabbing sucker 13 to descend to suck the wafer chip, a movable cylinder 14 pushes a movable sliding table 11 to horizontally move on a sliding rail 10, the wafer chip is placed in a polishing groove position 3 by matching with a through groove 15, the polishing groove position 3 with the wafer chip is driven to move to the bottom of a polishing frame 16 by the rotation of a rotating workbench 2, the chip is polished by a first polishing grinding disc 19, then the rotating workbench 2 continuously rotates, the polished chip is moved to the bottom of the conveying frame 8 connected with the discharging conveying frame 6, the grabbed sucker 13 is also used to suck the processed chip, the movable sliding table 11 moves reversely relatively to convey the chips to the discharge port 7, so that the chips are sequentially processed, the four polishing groove positions 3 are driven to move by rotating the working table 2, the automatic feeding and discharging of the wafer chips are facilitated, the workload is reduced, and the working efficiency is improved;
referring to the attached drawings 1 and 5 of the specification, after the wafer chip is polished and processed, the rotary workbench 2 rotates to drive the wafer chip inside the polishing groove position 3 to leave the bottom of the polishing frame 16, the extension support 23 on the fixed support 21 extends to the polishing groove position 3 on the rotary workbench 2, the air pump 22 conveys air to the air outlet 24 at the moment, the air outlet 24 blows air to the polishing groove position 3 rotating to the bottom of the extension frame 23, the polished wafer chip on the polishing groove position 3 is cleaned, subsequent grabbing of the chip by the grabbing sucker 13 is facilitated, the normal use of the device is facilitated, and the working stability is improved.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a full automatic machine processingequipment of chip, includes frame (1), its characterized in that: a rotating workbench (2) is movably arranged at the top of the rack (1), four polishing groove positions (3) are uniformly arranged on the surface of the outer side of the rotating workbench (2), a feeding conveying frame (4) is fixedly arranged at the rear side of the rotating workbench (2), a feeding conveying belt (5) is movably arranged in the feeding conveying frame (4), a discharging conveying frame (6) is fixedly arranged on one side of the rotating workbench (2), a discharging conveying belt (7) is movably arranged in the discharging conveying frame (6), wafer chip conveying mechanisms are arranged between the feeding conveying frame (4) and the rotating workbench (2), and the feeding conveying frame (4) and the discharging conveying frame (6) are vertically crossed;
the wafer chip conveying mechanism comprises two conveying frames (8), wherein the two conveying frames (8) are respectively arranged between the top of a feeding conveying frame (4) and a rotating workbench (2) and between the top of a discharging conveying frame (6) and the top of the rotating workbench (2), a movable groove (9) is formed in the middle of each conveying frame (8), slide rails (10) are fixedly arranged on two sides of each movable groove (9), a movable sliding table (11) is movably arranged between the two slide rails (10), a lifting cylinder (12) is arranged at the top of each movable sliding table (11), an output end of each lifting cylinder (12) is vertically arranged downwards, a grabbing sucker (13) is fixedly arranged, a movable cylinder (14) is arranged on one side of each movable sliding table (11), and a through groove (15) is fixedly formed in one side of the feeding conveying frame (4) and one side of the discharging conveying frame (6), the polishing groove position (3), the grabbing sucker (13) and the through groove (15) are horizontally arranged in a collinear manner;
a polishing frame (16) is fixedly arranged on the other side of the rotary workbench (2), two lifting slide bars (17) are fixedly arranged on the surface of the polishing frame (16), a first polishing motor (18) is movably arranged between the two lifting slide bars (17), a first polishing grinding disc (19) is fixedly arranged at the output end of the first polishing motor (18), the first polishing grinding disc (19) and the polishing groove position (3) are vertically arranged in a collinear manner, and a movable air cylinder (20) is arranged on one side of the first polishing motor (18);
the air pump is characterized in that a fixing support (21) is fixedly arranged on the front side of the rotary workbench (2), an air pump (22) is fixedly arranged at the top of the fixing support (21), an extension support (23) is fixedly arranged on one side of the top of the fixing support (21), and the end of the extension support (23) is fixedly arranged at an air blowing opening (24).
2. The full-automatic chip machining device according to claim 1, wherein: frame (1) inside fixed rotation motor (25) that is provided with, rotate motor (25) output and swivel work head (2) center fixed connection, feeding conveying frame (4) and ejection of compact conveying frame (6) all with conveying frame (8) one end fixed connection, conveying frame (8) other end extends to swivel work head (2) centre of a circle top, feeding conveying frame (4) and ejection of compact conveying frame (6) all are the cross setting with conveying frame (8).
3. The full-automatic chip machining device according to claim 1, wherein: the movable air cylinder (14) is horizontally arranged, the cylinder body of the movable air cylinder (14) is fixedly arranged on the surface of the conveying frame (8), and the output end of the movable air cylinder (14) is fixedly connected with one side of the movable sliding table (11).
4. The full-automatic chip machining device according to claim 1, wherein: one side of the polishing groove position (3) is communicated with the outer side of the rotary workbench (2), and the horizontal height of the through groove (15) is consistent with that of the polishing groove position (3).
5. The full-automatic chip machining device according to claim 1, wherein: polishing trench (3) inside activity sets up second polishing mill (26), second polishing mill (26) bottom is provided with second polishing motor (27), second polishing motor (27) are fixed to be provided with swivel work head (2), second polishing motor (27) output and second polishing mill (26) bottom centre of a circle are fixed to be set up, first polishing mill (19) and second polishing mill (26) correspond the setting.
6. The full-automatic chip machining device according to claim 1, wherein: the polishing machine is characterized in that the first polishing motor (18) is movably arranged between the two lifting slide bars (17) through a sliding frame, the output end of the movable air cylinder (20) is fixedly connected with the sliding frame, and the cylinder body of the movable air cylinder (20) is fixedly connected with the polishing frame (16).
7. The full-automatic chip machining device according to claim 1, wherein: the extension support (23) is horizontal parallel arrangement with the rotary worktable (2), the extension support (23) is arranged to be higher than the rotary worktable (2), and the extension support (23) extends to the top of the polishing groove (3).
8. The full-automatic chip machining device according to claim 1, wherein: the air blowing port (24) is fixedly connected with the output end of the air pump (22), and the air blowing port (24) is arranged corresponding to the polishing groove position (3) in the direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921512408.1U CN210757009U (en) | 2019-09-11 | 2019-09-11 | Full-automatic chip machining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921512408.1U CN210757009U (en) | 2019-09-11 | 2019-09-11 | Full-automatic chip machining device |
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| Publication Number | Publication Date |
|---|---|
| CN210757009U true CN210757009U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921512408.1U Active CN210757009U (en) | 2019-09-11 | 2019-09-11 | Full-automatic chip machining device |
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| CN (1) | CN210757009U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113814854A (en) * | 2021-09-28 | 2021-12-21 | 浙江芯晖装备技术有限公司 | A novel burnishing machine for wafer processing |
| CN114535814A (en) * | 2022-04-20 | 2022-05-27 | 广东永加内衣材料科技有限公司 | Metal piece surface polishing method and polishing device based on laser shock wave |
| CN115582503A (en) * | 2022-09-15 | 2023-01-10 | 无锡锡钻地质装备有限公司 | Drill rod heating upsetting turnover device |
| CN115805207A (en) * | 2022-12-15 | 2023-03-17 | 安徽富乐德长江半导体材料股份有限公司 | Full-automatic wafer cleaning device |
-
2019
- 2019-09-11 CN CN201921512408.1U patent/CN210757009U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113814854A (en) * | 2021-09-28 | 2021-12-21 | 浙江芯晖装备技术有限公司 | A novel burnishing machine for wafer processing |
| CN114535814A (en) * | 2022-04-20 | 2022-05-27 | 广东永加内衣材料科技有限公司 | Metal piece surface polishing method and polishing device based on laser shock wave |
| CN115582503A (en) * | 2022-09-15 | 2023-01-10 | 无锡锡钻地质装备有限公司 | Drill rod heating upsetting turnover device |
| CN115805207A (en) * | 2022-12-15 | 2023-03-17 | 安徽富乐德长江半导体材料股份有限公司 | Full-automatic wafer cleaning device |
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230925 Address after: Room 303, Building 1, Jingli Garden, No. 36 Jingtian East Road, Jinghua Community, Lianhua Street, Futian District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Chuanyuan Trading Co.,Ltd. Address before: No. 38 East Commercial Street, Guangtang Village, Xinya Street, Huadu District, Guangzhou City, Guangdong Province, 510000 Patentee before: Li Jiamei |
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| TR01 | Transfer of patent right |