CN215354995U - Wafer clamping rotary cleaning machine - Google Patents
Wafer clamping rotary cleaning machine Download PDFInfo
- Publication number
- CN215354995U CN215354995U CN202121828667.2U CN202121828667U CN215354995U CN 215354995 U CN215354995 U CN 215354995U CN 202121828667 U CN202121828667 U CN 202121828667U CN 215354995 U CN215354995 U CN 215354995U
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- wafer
- partition plate
- machine body
- outlet pipe
- air
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- 238000004140 cleaning Methods 0.000 title claims abstract description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000007921 spray Substances 0.000 claims abstract description 33
- 238000005192 partition Methods 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 229920000742 Cotton Polymers 0.000 claims abstract description 9
- 238000007664 blowing Methods 0.000 claims abstract description 8
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 238000005406 washing Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 4
- 230000029058 respiratory gaseous exchange Effects 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a wafer clamping rotary cleaning machine, which comprises a machine body, wherein a water outlet pipe and a control panel are arranged on the outer wall of the machine body, the upper part of the machine body is open, a spray cleaning device is arranged on the open inner side of the machine body, a first partition plate and a second partition plate are arranged in the machine body, a circulating fan and a first motor are arranged above the second partition plate, the air outlet end of the circulating fan is connected with an air outlet pipe, the air inlet end of the circulating fan is connected with an air inlet pipe, one ends of the air outlet pipe and the air inlet pipe, which are far away from the circulating fan, are respectively provided with an air blowing pipe and an air suction plate, a filter is arranged on the position of the air inlet pipe, which is close to the middle section, detachable filter cotton is arranged in the filter, the wafer clamping rotary cleaning machine can quickly and effectively remove water molecules and other harmful components on a wafer after a cleaning machine table stops working, thereby reducing the damage of the cleaning liquid to the wafer and improving the quality of the wafer.
Description
Technical Field
The utility model relates to the field of wafer cleaning, in particular to a wafer clamping rotary cleaning machine.
Background
In a wafer manufacturing process, which generally includes many processes such as photolithography, ion implantation, etching, heat treatment, vapor deposition, etc., after the relevant processes, for example, photolithography, the wafer needs to be cleaned to remove impurities on the wafer surface. According to statistics, the wafer cleaning process accounts for about 20% -30% of the whole wafer manufacturing process, if the wafer is insufficiently cleaned, impurities are left on the surface of the wafer, the wafer can be damaged in the next procedure, and the wafer is scrapped.
The existing wafer needs a cleaning machine in the cleaning process, corrosive liquid and water particles may stay on the surface of the wafer and in the cleaning space after the wafer is cleaned, so that the corrosive liquid and the water particles may stay on the surface of the wafer and in the cleaning space after the cleaning machine is cleaned at present.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a power pin for a PCB (printed circuit board), which is used for solving the problems that the existing wafer in the market needs a cleaning machine in the cleaning process, corrosive liquid and water particles possibly stay on the surface and the cleaning space of the wafer after cleaning, so that the corrosive liquid and the water particles possibly stay on the surface and the cleaning space of the wafer after the cleaning of the existing cleaning machine, the existing cleaning machine performs a liquid discharge process through a circulating pipeline, the liquid discharge time on the surface of the wafer is long, the efficiency is low, and the liquid on the surface of the wafer can continuously etch the wafer in the process.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a wafer centre gripping rotation type cleaning machine, includes the organism, the outer wall of organism is provided with outlet pipe and control panel, and the top of organism is for opening wide the form, and the uncovered inboard of organism is provided with the jetter, and inside first baffle and the second baffle of being provided with of organism, second baffle top are installed circulating fan and first motor, circulating fan's the end of giving vent to anger is connected with the outlet duct, and the intake pipe is connected to the circulating fan inlet end, the one end that circulating fan was kept away from to outlet duct and intake pipe is provided with gas blow pipe and suction plate respectively, the intake pipe is close to and is provided with the filter on the middle section position, and the internally mounted of filter has detachable filter pulp, and the pivot of first motor is connected with the shaft coupling, and the top of shaft coupling is provided with rotary mechanism.
Preferably, rotary mechanism includes the revolving stage, is equipped with the logical groove that the symmetry set up on the outer wall of revolving stage, it is provided with the slide rail to lead to the inslot side, and the slide rail top slides and is provided with the centre gripping subassembly, and the lower extreme of revolving stage is provided with cylinder group, and cylinder group comprises four cylinders, and the flexible end of cylinder is connected with the position that the centre gripping subassembly passed logical groove, every cylinder of cylinder group all with every centre gripping subassembly fixed connection that corresponds, the lower extreme central point of revolving stage puts and is provided with the shaft coupling, the pivot fixed connection of one end and the first motor of revolving stage is kept away from to the shaft coupling.
Preferably, the outer walls of the first partition board and the second partition board are provided with through holes corresponding to the positions of the air inlet pipe and the air outlet pipe, rubber rings are clamped in the two through holes in the outer parts of the first partition board and the second partition board, and the two rubber rings are sleeved outside the air inlet pipe and the air outlet pipe respectively.
Preferably, the spray rinsing device includes the second motor, be provided with the spray rinsing arm in the pivot of second motor, the inside of spray rinsing arm is cavity form, the inside of spray rinsing arm is provided with the feed liquor pipeline, the feed liquor pipeline is connected with the water inlet of valve body, and the play water end of valve body is provided with the shower nozzle, and the central point of rotary mechanism is aimed at to the shower nozzle.
Preferably, one side of the machine body, which is far away from the water outlet pipe, is provided with a hole, and the hole and the filter are arranged in the horizontal direction.
Preferably, one end of the water outlet pipe is communicated with the space above the first partition plate.
Compared with the prior art, the utility model has the beneficial effects that:
this wafer centre gripping rotation type cleaning machine, through circulating fan's the board of breathing in and the work of mutually supporting of gas blow pipe, the gas blow pipe blows out the tiny particle drop of water motion to the board of breathing in around the dry gas promotion wafer, circulating fan's the pipeline that passes through makes the board of breathing in produce suction, tiny particle drop of water is inhaled the intake pipe, when through the filter that is in the intake pipe, tiny particle drop of water and other harmful component are adsorbed by the filter pulp, can clear away tiny particle drop of water and other harmful component on the wafer surface fast through above structure, improve the cleaning performance of wafer.
Drawings
FIG. 1 is a schematic view of a wafer-clamping rotary cleaning machine according to the present invention;
FIG. 2 is a top view of a wafer-clamping rotary cleaning machine body according to the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1 of a wafer-clamping rotary cleaning machine according to the present invention;
FIG. 4 is a schematic view of a spray cleaning apparatus of a wafer-clamping rotary cleaning machine according to the present invention.
FIG. 5 is an enlarged view of a portion B of the wafer-clamping rotary cleaning machine of the present invention;
FIG. 6 is an enlarged view of a wafer-clamping rotary cleaning machine of the present invention at point C in FIG. 3.
In the figure: 1. a first motor; 2. a rotation mechanism; 3. a spray washing device; 4. spray-washing the mechanical arm; 5. a second motor; 6. a valve body; 7. a liquid inlet pipeline; 8. an air blowing pipe; 9. a spray head; 10. a filter; 11. a water outlet pipe; 12. a first separator; 13. a body; 14. a clamping assembly; 15. a cylinder group; 16. a slide rail; 17. a control panel; 18. a gas suction plate; 19. a circulating fan; 21. filtering cotton; 22. an air inlet pipe; 23. an air outlet pipe; 24. a coupling; 25. a second separator; 26. a through groove; 27. a rubber ring; 28. a hole; 29. and (4) rotating the table.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a wafer clamping rotary cleaning machine comprises a machine body 13, a water outlet pipe 11 and a control panel 17 are arranged on the outer wall of the machine body 13, the upper part of the machine body 13 is in an open shape, a spray-washing device 3 is arranged on the open inner side of the machine body 13, a first partition plate 12 and a second partition plate 25 are arranged inside the machine body 13, a circulating fan 19 and a first motor 1 are arranged above the second partition plate 25, an air outlet end of the circulating fan 19 is connected with an air outlet pipe 23, an air inlet end of the circulating fan 19 is connected with an air inlet pipe 22, one ends, far away from the circulating fan 19, of the air outlet pipe 23 and the air inlet pipe 22 are respectively provided with an air blowing pipe 8 and an air suction plate 18, a filter 10 is arranged on the position, close to the middle section, the filter 10 is internally provided with detachable filter cotton 21, a shaft coupling 24 is connected with a rotating shaft of the first motor 1, a rotating mechanism 2 is arranged above the coupling 24, the first motor 1 of the structure drives the rotating mechanism 2 to rotate through the coupling 24, after the rotating mechanism 2 drives the wafer to rotate, the cleaning liquid on the surface of the wafer quickly collides with the inner wall of the machine body 13 to form fine particle water droplets, at this time, the circulating fan 19 can be started, the circulating fan 19 guides dry air into the air blowing pipe 8 through the air outlet pipe 23, the air blowing pipe 8 sprays the dry air into the machine body 13, the dry air pushes the fine water droplets towards the air suction plate 18, meanwhile, the circulating fan 19 enables the air suction plate 18 to generate suction through the air inlet pipe 22, so that the water droplets near the air suction plate 18 can be sucked, the cleaning liquid particles in the machine body 13 are reduced, and the cleaning liquid is prevented from being attached to the wafer again.
The rotating mechanism 2 comprises a rotating platform 29, through grooves 26 symmetrically arranged are formed in the outer wall of the rotating platform 29, slide rails 16 are arranged inside the through grooves 26, clamping assemblies 14 are slidably arranged above the slide rails 16, a cylinder group 15 is arranged at the lower end of the rotating platform 29, the cylinder group 15 is composed of four cylinders, the telescopic ends of the cylinders are connected with the positions, where the clamping assemblies 14 penetrate through the through grooves 26, of the clamping assemblies 14, each cylinder of the cylinder group 15 is fixedly connected with each corresponding clamping assembly 14, a coupler 24 is arranged at the central position of the lower end of the rotating platform 29, one end, away from the rotating platform 29, of the coupler 24 is fixedly connected with a rotating shaft of the first motor 1, the cylinders in the cylinder group 15 of the mechanism push the clamping assemblies 14 to move towards the wafer, so that the clamping assemblies 14 fix the edge of the wafer, the first motor 1 is started, and the first motor 1 drives the rotating mechanism 2 to rotate through the coupler 24, the rotating mechanism 2 drives the wafer to rotate by fixing the clamping component 14.
The through holes corresponding to the positions of the air inlet pipe 22 and the air outlet pipe 23 are formed in the outer walls of the first partition plate 12 and the second partition plate 25, rubber rings 27 are clamped in the two through holes in the outer portions of the first partition plate 12 and the second partition plate 25, the two rubber rings 27 are respectively sleeved on the outer portions of the air inlet pipe 22 and the air outlet pipe 23, the rubber rings 27 can be clamped in gaps between the inner wall of the through hole of the first partition plate 12 and the air inlet pipe 22 and the air outlet pipe 23, liquid is prevented from flowing into a space formed by the first partition plate 12 and the second partition plate 25 through the rubber rings 27, and the circulating fan 19 and the first motor 1 are prevented from being corroded by the liquid.
The spray rinsing device 3 comprises a second motor 5, a spray rinsing mechanical arm 4 is arranged on a rotating shaft of the second motor 5, the interior of the spray rinsing mechanical arm 4 is hollow, a liquid inlet pipeline 7 is arranged inside the spray rinsing mechanical arm 4, the liquid inlet pipeline 7 is connected with a water inlet of a valve body 6, a spray head 9 is arranged at a water outlet end of the valve body 6, the spray head 9 is aligned with the central point of the rotating mechanism 2, the spray rinsing mechanical arm 4 connected with the second motor 5 is driven to move by the rotation of the second motor 5, the moving track of the spray rinsing mechanical arm 4 carries out horizontal arc motion by taking the length of the spray rinsing mechanical arm 4 as a radius, the liquid inlet pipeline 7 is connected with the valve body 6 inside the spray rinsing mechanical arm 4, cleaning liquid enters the valve body 6 through the liquid inlet pipeline 7, the flow size of the cleaning liquid is controlled by the valve body 6 to be sprayed out from the spray head 9, and the position of the spray head 9 is just at the center of a wafer, the rotating mechanism 2 driven by the first motor 1 rotates, the spraying mechanical arm 4 driven by the second motor 5 performs arc motion, and the spraying mechanical arm are matched with each other to clean the wafer in an all-around manner.
The side of the machine body 13 far away from the water outlet pipe 11 is provided with a hole 28, the opening of the hole 28 is arranged in the horizontal direction with the filter 10, the structure absorbs fine particle water drops sucked by the suction plate 18 of the circulating fan 19 from the air inlet pipe 22 into the filter 10, then the fine particle water drops and other harmful ingredients are absorbed on the filter cotton 21 through the filtration of the filter cotton 21, the filter cotton 21 can be detached and installed through the hole 28, and the external shape of one end of the filter cotton 21 is matched with the internal shape of the hole 28.
One end of the water outlet pipe 11 is communicated with the space above the first partition plate 12, cleaning liquid sprayed by the spray head 9 flows from the surface of the wafer to the first partition plate 12, and the cleaning liquid above the first partition plate 12 flows out through the water outlet pipe 11.
The working principle is as follows: when the wafer clamping rotary cleaning machine is used, firstly, the first motor 1 of the structure drives the rotary mechanism 2 to rotate through the coupler 24, the second motor drives the spray cleaning mechanical arm 4 to perform horizontal arc motion, the spray nozzle 9 sprays cleaning liquid to the surface of the wafer, after the rotary mechanism 2 drives the wafer to rotate, the cleaning liquid on the surface of the wafer will quickly impact the inner wall of the machine body 13 to form fine particle water drops, at this time, the circulating fan 19 can be started, the circulating fan 19 guides the dry air into the blowing pipe 8 through the air outlet pipe 23, the blowing pipe 8 sprays the dry air into the machine body 13, the dry air can push the fine water drops to the air suction plate 18, meanwhile, the circulating fan 19 enables the air suction plate 18 to generate suction through the air inlet pipe 22, so that water drops near the air suction plate 18 can be sucked, cleaning liquid particles in the machine body 13 are reduced, and the cleaning liquid is prevented from being attached to a wafer through rewashing.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.
Claims (6)
1. The utility model provides a wafer centre gripping rotation type cleaning machine which characterized in that: comprises a machine body (13), a water outlet pipe (11) and a control panel (17) are arranged on the outer wall of the machine body (13), the top of the machine body (13) is open, a spray washing device (3) is arranged on the open inner side of the machine body (13), a first partition plate (12) and a second partition plate (25) are arranged in the machine body (13), a circulating fan (19) and a first motor (1) are arranged above the second partition plate (25), an air outlet end of the circulating fan (19) is connected with an air outlet pipe (23), an air inlet end of the circulating fan (19) is connected with an air inlet pipe (22), one ends of the air outlet pipe (23) and the air inlet pipe (22) far away from the circulating fan (19) are respectively provided with an air blowing pipe (8) and an air suction plate (18), the air inlet pipe (22) is provided with a filter (10) close to the position, and detachable filter cotton (21) is arranged in the filter (10), a rotating shaft of the first motor (1) is connected with a coupler (24), and a rotating mechanism (2) is arranged above the coupler (24).
2. The wafer-holding spin cleaner of claim 1, wherein: rotary mechanism (2) are including revolving stage (29), are equipped with logical groove (26) that the symmetry set up on the outer wall of revolving stage (29), it is provided with slide rail (16) to lead to groove (26) inboard, and slide rail (16) top is slided and is provided with clamping component (14), and the lower extreme of revolving stage (29) is provided with cylinder group (15), and cylinder group (15) comprise four cylinders, and the flexible end of cylinder is connected with the position that clamping component (14) passed logical groove (26), every cylinder of cylinder group (15) all with every clamping component (14) fixed connection that corresponds, the lower extreme central point of revolving stage (29) puts and is provided with shaft coupling (24), the pivot fixed connection of one end and first motor (1) of revolving stage (29) is kept away from in shaft coupling (24).
3. The wafer-holding spin cleaner of claim 1, wherein: the air inlet pipe (22) and the air outlet pipe (23) are arranged on the outer walls of the first partition plate (12) and the second partition plate (25), through holes corresponding to the positions of the air inlet pipe (22) and the air outlet pipe (23) are formed in the outer walls of the first partition plate (12) and the second partition plate (25), rubber rings (27) are clamped in the two through holes in the outer portions of the first partition plate (12) and the second partition plate (25), and the two rubber rings (27) are sleeved on the outer portions of the air inlet pipe (22) and the air outlet pipe (23) respectively.
4. The wafer-holding spin cleaner of claim 1, wherein: the spray rinsing device (3) comprises a second motor (5), a spray rinsing mechanical arm (4) is arranged in a rotating shaft of the second motor (5), the inside of the spray rinsing mechanical arm (4) is hollow, a liquid inlet pipeline (7) is arranged inside the spray rinsing mechanical arm (4), the liquid inlet pipeline (7) is connected with a water inlet of a valve body (6), a water outlet end of the valve body (6) is provided with a spray head (9), and the spray head (9) is aligned to a central point of the rotating mechanism (2).
5. The wafer-holding spin cleaner of claim 1, wherein: one side of the machine body (13) far away from the water outlet pipe (11) is provided with a hole (28), the hole (28) is communicated with the inside of the filter (10), and one end of the filter cotton (21) in the filter (10) is clamped in the hole (28).
6. The wafer-holding spin cleaner of claim 1, wherein: one end of the water outlet pipe (11) is communicated with the space above the first partition plate (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121828667.2U CN215354995U (en) | 2021-08-06 | 2021-08-06 | Wafer clamping rotary cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121828667.2U CN215354995U (en) | 2021-08-06 | 2021-08-06 | Wafer clamping rotary cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215354995U true CN215354995U (en) | 2021-12-31 |
Family
ID=79616185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121828667.2U Active CN215354995U (en) | 2021-08-06 | 2021-08-06 | Wafer clamping rotary cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215354995U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115805207A (en) * | 2022-12-15 | 2023-03-17 | 安徽富乐德长江半导体材料股份有限公司 | Full-automatic wafer cleaning device |
| CN117583982A (en) * | 2024-01-18 | 2024-02-23 | 山东粤海金半导体科技有限公司 | Special silicon carbide substrate wafer chamfering device |
| CN118448306A (en) * | 2024-04-30 | 2024-08-06 | 江苏美科太阳能科技股份有限公司 | Monocrystalline silicon piece cleaning equipment and monocrystalline silicon piece cleaning method |
-
2021
- 2021-08-06 CN CN202121828667.2U patent/CN215354995U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115805207A (en) * | 2022-12-15 | 2023-03-17 | 安徽富乐德长江半导体材料股份有限公司 | Full-automatic wafer cleaning device |
| CN117583982A (en) * | 2024-01-18 | 2024-02-23 | 山东粤海金半导体科技有限公司 | Special silicon carbide substrate wafer chamfering device |
| CN118448306A (en) * | 2024-04-30 | 2024-08-06 | 江苏美科太阳能科技股份有限公司 | Monocrystalline silicon piece cleaning equipment and monocrystalline silicon piece cleaning method |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee after: Shanghai Shenhe Investment Co.,Ltd. Address before: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230713 Address after: No. 21, Nanhai Road, Yi'an District, Tongling City, Anhui Province 244151 Patentee after: Anhui fulede Changjiang semiconductor material Co.,Ltd. Address before: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee before: Shanghai Shenhe Investment Co.,Ltd. |
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| TR01 | Transfer of patent right |