CN115715489A - 电气设备 - Google Patents

电气设备 Download PDF

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Publication number
CN115715489A
CN115715489A CN202180042507.1A CN202180042507A CN115715489A CN 115715489 A CN115715489 A CN 115715489A CN 202180042507 A CN202180042507 A CN 202180042507A CN 115715489 A CN115715489 A CN 115715489A
Authority
CN
China
Prior art keywords
cooling medium
liquid cooling
insulating liquid
electronic component
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180042507.1A
Other languages
English (en)
Chinese (zh)
Inventor
须永隆弘
久保木秀幸
广田将义
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of CN115715489A publication Critical patent/CN115715489A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
CN202180042507.1A 2020-07-03 2021-06-17 电气设备 Pending CN115715489A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020115388A JP7419994B2 (ja) 2020-07-03 2020-07-03 電気機器
JP2020-115388 2020-07-03
PCT/JP2021/022971 WO2022004400A1 (ja) 2020-07-03 2021-06-17 電気機器

Publications (1)

Publication Number Publication Date
CN115715489A true CN115715489A (zh) 2023-02-24

Family

ID=79316091

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180042507.1A Pending CN115715489A (zh) 2020-07-03 2021-06-17 电气设备

Country Status (4)

Country Link
US (1) US12484201B2 (enExample)
JP (1) JP7419994B2 (enExample)
CN (1) CN115715489A (enExample)
WO (1) WO2022004400A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12402272B2 (en) * 2021-01-12 2025-08-26 Cooler Master Co., Ltd. Single-phase immersion cooling system and method of the same
DE102021130926B4 (de) * 2021-11-25 2025-08-14 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Flüssigkeitsgekühlte Leistungselektronikeinheit
JP7715062B2 (ja) * 2022-03-14 2025-07-30 株式会社豊田自動織機 電気機器
EP4468337B1 (en) * 2023-05-26 2025-10-29 Hitachi Energy Ltd Semiconductor power module, semiconductor power package and method for manufacturing a semiconductor power module

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745761A (ja) * 1993-07-30 1995-02-14 Takeo Yoshino 液冷式ハイブリッドｉｃ
JPH1148766A (ja) * 1997-08-06 1999-02-23 Denso Corp 冷凍サイクル装置
CN1690919A (zh) * 2004-04-28 2005-11-02 株式会社东芝 电子设备
US20070053163A1 (en) * 2005-09-02 2007-03-08 Alex Thompson Integrated thermal and electrical connection system for power devices
CN201243015Y (zh) * 2008-03-04 2009-05-20 无锡爱迪信光电科技有限公司 大功率发光二极管的液体散热装置
CN101588707A (zh) * 2008-05-19 2009-11-25 华为技术有限公司 一种散热装置及应用其的电子设备
CN101593950A (zh) * 2008-05-30 2009-12-02 住友电装株式会社 电接线盒
US20100290190A1 (en) * 2009-05-12 2010-11-18 Iceotope Limited Cooled electronic system
KR20150111753A (ko) * 2014-03-26 2015-10-06 박일권 발광다이오드 조명장치
US20170345799A1 (en) * 2016-05-27 2017-11-30 General Electric Company Power module
CN108563305A (zh) * 2018-01-29 2018-09-21 广东合新材料研究院有限公司 一种喷淋式液冷服务器
JP2019029539A (ja) * 2017-07-31 2019-02-21 株式会社ケーヒン・サーマル・テクノロジー 半導体冷却装置
CN110536586A (zh) * 2019-06-13 2019-12-03 北京玖琳创新科技有限公司 一种浸没式冷却装置
US20190383559A1 (en) * 2018-06-18 2019-12-19 Fujitsu Limited Heat exchanger for liquid immersion cooling

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249351A (ja) * 1984-05-24 1985-12-10 Fujitsu Ltd 沸騰冷却型回路基板と冷媒液中での配置構造
JPS6285449A (ja) * 1985-10-09 1987-04-18 Fujitsu Ltd 半導体装置の冷却構造
JPH0727997B2 (ja) * 1986-06-12 1995-03-29 富士通株式会社 冷媒クリ−ニング装置
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
EP3317708A2 (en) * 2015-06-30 2018-05-09 CommScope Connectivity Belgium BVBA System for compensation of expansion/contraction of a cooling medium inside a sealed closure
JP6642088B2 (ja) 2016-02-18 2020-02-05 株式会社オートネットワーク技術研究所 電気機器
JP2019140247A (ja) * 2018-02-09 2019-08-22 日本電気株式会社 冷却装置及び電子機器
JP7011221B2 (ja) * 2018-03-28 2022-01-26 日本電気株式会社 実装基板、電子機器及び素子冷却方法
JP2020088090A (ja) 2018-11-21 2020-06-04 アイシン・エィ・ダブリュ株式会社 電力変換装置用冷却装置

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745761A (ja) * 1993-07-30 1995-02-14 Takeo Yoshino 液冷式ハイブリッドｉｃ
JPH1148766A (ja) * 1997-08-06 1999-02-23 Denso Corp 冷凍サイクル装置
CN1690919A (zh) * 2004-04-28 2005-11-02 株式会社东芝 电子设备
US20070053163A1 (en) * 2005-09-02 2007-03-08 Alex Thompson Integrated thermal and electrical connection system for power devices
CN201243015Y (zh) * 2008-03-04 2009-05-20 无锡爱迪信光电科技有限公司 大功率发光二极管的液体散热装置
CN101588707A (zh) * 2008-05-19 2009-11-25 华为技术有限公司 一种散热装置及应用其的电子设备
CN101593950A (zh) * 2008-05-30 2009-12-02 住友电装株式会社 电接线盒
US20100290190A1 (en) * 2009-05-12 2010-11-18 Iceotope Limited Cooled electronic system
KR20150111753A (ko) * 2014-03-26 2015-10-06 박일권 발광다이오드 조명장치
US20170345799A1 (en) * 2016-05-27 2017-11-30 General Electric Company Power module
JP2019029539A (ja) * 2017-07-31 2019-02-21 株式会社ケーヒン・サーマル・テクノロジー 半導体冷却装置
CN108563305A (zh) * 2018-01-29 2018-09-21 广东合新材料研究院有限公司 一种喷淋式液冷服务器
US20190383559A1 (en) * 2018-06-18 2019-12-19 Fujitsu Limited Heat exchanger for liquid immersion cooling
CN110536586A (zh) * 2019-06-13 2019-12-03 北京玖琳创新科技有限公司 一种浸没式冷却装置

Also Published As

Publication number Publication date
US12484201B2 (en) 2025-11-25
US20230292473A1 (en) 2023-09-14
JP7419994B2 (ja) 2024-01-23
JP2022013081A (ja) 2022-01-18
WO2022004400A1 (ja) 2022-01-06

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