CN115702376A - 激光强度调整方法及激光强度调整装置 - Google Patents

激光强度调整方法及激光强度调整装置 Download PDF

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Publication number
CN115702376A
CN115702376A CN202180042194.XA CN202180042194A CN115702376A CN 115702376 A CN115702376 A CN 115702376A CN 202180042194 A CN202180042194 A CN 202180042194A CN 115702376 A CN115702376 A CN 115702376A
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CN
China
Prior art keywords
intensity
laser light
optical element
polarization direction
changing
Prior art date
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Pending
Application number
CN202180042194.XA
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English (en)
Chinese (zh)
Inventor
志知秀治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
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Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of CN115702376A publication Critical patent/CN115702376A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/62—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/62—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
    • G01N27/64—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode using wave or particle radiation to ionise a gas, e.g. in an ionisation chamber
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00—Particle spectrometers or separator tubes
    • H01J49/02—Details
    • H01J49/10—Ion sources; Ion guns
    • H01J49/16—Ion sources; Ion guns using surface ionisation, e.g. field-, thermionic- or photo-emission

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Electrochemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Toxicology (AREA)
  • Lasers (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Electron Tubes For Measurement (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
CN202180042194.XA 2020-07-02 2021-02-26 激光强度调整方法及激光强度调整装置 Pending CN115702376A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020114969 2020-07-02
JP2020-114969 2020-07-02
PCT/JP2021/007284 WO2022004051A1 (ja) 2020-07-02 2021-02-26 レーザ光強度調整方法及びレーザ光強度調整装置

Publications (1)

Publication Number Publication Date
CN115702376A true CN115702376A (zh) 2023-02-14

Family

ID=79315265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180042194.XA Pending CN115702376A (zh) 2020-07-02 2021-02-26 激光强度调整方法及激光强度调整装置

Country Status (4)

Country Link
US (1) US20230241713A1 (https=)
JP (1) JP7444258B2 (https=)
CN (1) CN115702376A (https=)
WO (1) WO2022004051A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022066435A1 (en) * 2020-09-28 2022-03-31 Corning Incorporated Methods for adjusting beam properties for laser processing coated substrates

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070070484A1 (en) * 2005-09-26 2007-03-29 Laserfront Technologies, Inc. Optical level control device, method for controlling same, and laser application device
CN103649696A (zh) * 2011-10-11 2014-03-19 三菱电机株式会社 激光输出测量机构
US20150146295A1 (en) * 2013-11-28 2015-05-28 U&U Engineering Inc. Laser energy output control apparatus and method thereof
JP2019204766A (ja) * 2019-02-21 2019-11-28 株式会社島津製作所 Ｍａｌｄｉイオン源及び質量分析装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5081711B2 (ja) 2008-04-30 2012-11-28 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070070484A1 (en) * 2005-09-26 2007-03-29 Laserfront Technologies, Inc. Optical level control device, method for controlling same, and laser application device
CN103649696A (zh) * 2011-10-11 2014-03-19 三菱电机株式会社 激光输出测量机构
US20150146295A1 (en) * 2013-11-28 2015-05-28 U&U Engineering Inc. Laser energy output control apparatus and method thereof
JP2019204766A (ja) * 2019-02-21 2019-11-28 株式会社島津製作所 Ｍａｌｄｉイオン源及び質量分析装置

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Publication number Publication date
WO2022004051A1 (ja) 2022-01-06
JPWO2022004051A1 (https=) 2022-01-06
JP7444258B2 (ja) 2024-03-06
US20230241713A1 (en) 2023-08-03

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