JPWO2022004051A1 - - Google Patents

Info

Publication number
JPWO2022004051A1
JPWO2022004051A1 JP2022533675A JP2022533675A JPWO2022004051A1 JP WO2022004051 A1 JPWO2022004051 A1 JP WO2022004051A1 JP 2022533675 A JP2022533675 A JP 2022533675A JP 2022533675 A JP2022533675 A JP 2022533675A JP WO2022004051 A1 JPWO2022004051 A1 JP WO2022004051A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022533675A
Other languages
Japanese (ja)
Other versions
JPWO2022004051A5 (https=
JP7444258B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022004051A1 publication Critical patent/JPWO2022004051A1/ja
Publication of JPWO2022004051A5 publication Critical patent/JPWO2022004051A5/ja
Application granted granted Critical
Publication of JP7444258B2 publication Critical patent/JP7444258B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/62—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/62—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
    • G01N27/64—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode using wave or particle radiation to ionise a gas, e.g. in an ionisation chamber
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00—Particle spectrometers or separator tubes
    • H01J49/02—Details
    • H01J49/10—Ion sources; Ion guns
    • H01J49/16—Ion sources; Ion guns using surface ionisation, e.g. field-, thermionic- or photo-emission

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Electrochemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Toxicology (AREA)
  • Lasers (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Electron Tubes For Measurement (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
JP2022533675A 2020-07-02 2021-02-26 レーザ光強度調整方法及びレーザ光強度調整装置 Active JP7444258B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020114969 2020-07-02
JP2020114969 2020-07-02
PCT/JP2021/007284 WO2022004051A1 (ja) 2020-07-02 2021-02-26 レーザ光強度調整方法及びレーザ光強度調整装置

Publications (3)

Publication Number Publication Date
JPWO2022004051A1 true JPWO2022004051A1 (https=) 2022-01-06
JPWO2022004051A5 JPWO2022004051A5 (https=) 2023-03-03
JP7444258B2 JP7444258B2 (ja) 2024-03-06

Family

ID=79315265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533675A Active JP7444258B2 (ja) 2020-07-02 2021-02-26 レーザ光強度調整方法及びレーザ光強度調整装置

Country Status (4)

Country Link
US (1) US20230241713A1 (https=)
JP (1) JP7444258B2 (https=)
CN (1) CN115702376A (https=)
WO (1) WO2022004051A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022066435A1 (en) * 2020-09-28 2022-03-31 Corning Incorporated Methods for adjusting beam properties for laser processing coated substrates

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093643A (ja) * 2005-09-26 2007-04-12 Laserfront Technologies Inc 光レベル制御器とその制御方法並びにこれを用いたレーザ応用装置
JP2009262223A (ja) * 2008-04-30 2009-11-12 Sunx Ltd レーザ加工装置
US20150146295A1 (en) * 2013-11-28 2015-05-28 U&U Engineering Inc. Laser energy output control apparatus and method thereof
JP2019204766A (ja) * 2019-02-21 2019-11-28 株式会社島津製作所 Ｍａｌｄｉイオン源及び質量分析装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140091198A1 (en) * 2011-10-11 2014-04-03 Mitsubishi Electric Corporation Laser output measurement mechanism

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093643A (ja) * 2005-09-26 2007-04-12 Laserfront Technologies Inc 光レベル制御器とその制御方法並びにこれを用いたレーザ応用装置
JP2009262223A (ja) * 2008-04-30 2009-11-12 Sunx Ltd レーザ加工装置
US20150146295A1 (en) * 2013-11-28 2015-05-28 U&U Engineering Inc. Laser energy output control apparatus and method thereof
JP2019204766A (ja) * 2019-02-21 2019-11-28 株式会社島津製作所 Ｍａｌｄｉイオン源及び質量分析装置

Also Published As

Publication number Publication date
CN115702376A (zh) 2023-02-14
WO2022004051A1 (ja) 2022-01-06
JP7444258B2 (ja) 2024-03-06
US20230241713A1 (en) 2023-08-03

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