CN115700021A - 散热片 - Google Patents

散热片 Download PDF

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Publication number
CN115700021A
CN115700021A CN202180041144.XA CN202180041144A CN115700021A CN 115700021 A CN115700021 A CN 115700021A CN 202180041144 A CN202180041144 A CN 202180041144A CN 115700021 A CN115700021 A CN 115700021A
Authority
CN
China
Prior art keywords
inorganic filler
heat sink
particle size
boron nitride
maximum point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180041144.XA
Other languages
English (en)
Chinese (zh)
Inventor
和田光祐
藤清隆
谷口佳孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN115700021A publication Critical patent/CN115700021A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Combustion & Propulsion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180041144.XA 2020-06-12 2021-06-11 散热片 Pending CN115700021A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020102303 2020-06-12
JP2020-102303 2020-06-12
PCT/JP2021/022361 WO2021251495A1 (ja) 2020-06-12 2021-06-11 放熱シート

Publications (1)

Publication Number Publication Date
CN115700021A true CN115700021A (zh) 2023-02-03

Family

ID=78846142

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180041144.XA Pending CN115700021A (zh) 2020-06-12 2021-06-11 散热片

Country Status (5)

Country Link
US (1) US20230220262A1 (https=)
EP (1) EP4149226B1 (https=)
JP (1) JP7629012B2 (https=)
CN (1) CN115700021A (https=)
WO (1) WO2021251495A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022149434A1 (ja) * 2021-01-06 2022-07-14 デンカ株式会社 放熱シート及び放熱シートの製造方法
JP2026061713A (ja) * 2024-09-30 2026-04-09 デンカ株式会社 熱伝導性シート

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105026312A (zh) * 2013-03-07 2015-11-04 电气化学工业株式会社 氮化硼粉末及含有该氮化硼粉末的树脂组合物
JP2016108457A (ja) * 2014-12-08 2016-06-20 昭和電工株式会社 樹脂組成物及びその製造方法
JP2018052782A (ja) * 2016-09-30 2018-04-05 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体
WO2018123788A1 (en) * 2016-12-28 2018-07-05 Showa Denko K.K. Hexagonal boron nitride powder, method for producing same, resin composition and resin sheet
JP2019073409A (ja) * 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
CN109790309A (zh) * 2016-09-28 2019-05-21 帝人株式会社 散热片

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4906243B2 (ja) * 2004-06-02 2012-03-28 電気化学工業株式会社 無機質粉末及びその用途
US10308856B1 (en) * 2013-03-15 2019-06-04 The Research Foundation For The State University Of New York Pastes for thermal, electrical and mechanical bonding
WO2014199650A1 (ja) * 2013-06-14 2014-12-18 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
JP6244128B2 (ja) * 2013-07-17 2017-12-06 日東シンコー株式会社 熱伝導性シート及び剥離シート付熱伝導性シート
JP7101693B2 (ja) * 2017-09-28 2022-07-15 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス
JP7389014B2 (ja) * 2018-02-26 2023-11-29 デンカ株式会社 絶縁放熱シート
JPWO2020049817A1 (ja) * 2018-09-07 2020-09-10 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105026312A (zh) * 2013-03-07 2015-11-04 电气化学工业株式会社 氮化硼粉末及含有该氮化硼粉末的树脂组合物
JP2016108457A (ja) * 2014-12-08 2016-06-20 昭和電工株式会社 樹脂組成物及びその製造方法
CN109790309A (zh) * 2016-09-28 2019-05-21 帝人株式会社 散热片
JP2018052782A (ja) * 2016-09-30 2018-04-05 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体
WO2018123788A1 (en) * 2016-12-28 2018-07-05 Showa Denko K.K. Hexagonal boron nitride powder, method for producing same, resin composition and resin sheet
JP2019073409A (ja) * 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材

Also Published As

Publication number Publication date
EP4149226A4 (en) 2023-10-25
JPWO2021251495A1 (https=) 2021-12-16
EP4149226A1 (en) 2023-03-15
WO2021251495A1 (ja) 2021-12-16
US20230220262A1 (en) 2023-07-13
JP7629012B2 (ja) 2025-02-12
EP4149226B1 (en) 2024-10-02

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