JP7629012B2 - 放熱シート - Google Patents

放熱シート Download PDF

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Publication number
JP7629012B2
JP7629012B2 JP2022530641A JP2022530641A JP7629012B2 JP 7629012 B2 JP7629012 B2 JP 7629012B2 JP 2022530641 A JP2022530641 A JP 2022530641A JP 2022530641 A JP2022530641 A JP 2022530641A JP 7629012 B2 JP7629012 B2 JP 7629012B2
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JP
Japan
Prior art keywords
inorganic filler
particle size
heat dissipation
boron nitride
dissipation sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022530641A
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English (en)
Japanese (ja)
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JPWO2021251495A1 (https=
Inventor
光祐 和田
清隆 藤
佳孝 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2021251495A1 publication Critical patent/JPWO2021251495A1/ja
Application granted granted Critical
Publication of JP7629012B2 publication Critical patent/JP7629012B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Combustion & Propulsion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022530641A 2020-06-12 2021-06-11 放熱シート Active JP7629012B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020102303 2020-06-12
JP2020102303 2020-06-12
PCT/JP2021/022361 WO2021251495A1 (ja) 2020-06-12 2021-06-11 放熱シート

Publications (2)

Publication Number Publication Date
JPWO2021251495A1 JPWO2021251495A1 (https=) 2021-12-16
JP7629012B2 true JP7629012B2 (ja) 2025-02-12

Family

ID=78846142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022530641A Active JP7629012B2 (ja) 2020-06-12 2021-06-11 放熱シート

Country Status (5)

Country Link
US (1) US20230220262A1 (https=)
EP (1) EP4149226B1 (https=)
JP (1) JP7629012B2 (https=)
CN (1) CN115700021A (https=)
WO (1) WO2021251495A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022149434A1 (ja) * 2021-01-06 2022-07-14 デンカ株式会社 放熱シート及び放熱シートの製造方法
JP2026061713A (ja) * 2024-09-30 2026-04-09 デンカ株式会社 熱伝導性シート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005343983A (ja) 2004-06-02 2005-12-15 Denki Kagaku Kogyo Kk 無機質粉末及びその用途
WO2019065150A1 (ja) 2017-09-28 2019-04-04 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9656868B2 (en) * 2013-03-07 2017-05-23 Denka Company Limited Boron-nitride powder and resin composition containing same
US10308856B1 (en) * 2013-03-15 2019-06-04 The Research Foundation For The State University Of New York Pastes for thermal, electrical and mechanical bonding
WO2014199650A1 (ja) * 2013-06-14 2014-12-18 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
JP6244128B2 (ja) * 2013-07-17 2017-12-06 日東シンコー株式会社 熱伝導性シート及び剥離シート付熱伝導性シート
JP6538337B2 (ja) * 2014-12-08 2019-07-03 昭和電工株式会社 樹脂組成物及びその製造方法
US20190300771A1 (en) * 2016-09-28 2019-10-03 Teijin Limited Heat dissipation sheet
JP6815152B2 (ja) * 2016-09-30 2021-01-20 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体
JP6822836B2 (ja) * 2016-12-28 2021-01-27 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP7104503B2 (ja) * 2017-10-13 2022-07-21 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
JP7389014B2 (ja) * 2018-02-26 2023-11-29 デンカ株式会社 絶縁放熱シート
JPWO2020049817A1 (ja) * 2018-09-07 2020-09-10 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005343983A (ja) 2004-06-02 2005-12-15 Denki Kagaku Kogyo Kk 無機質粉末及びその用途
WO2019065150A1 (ja) 2017-09-28 2019-04-04 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス

Also Published As

Publication number Publication date
EP4149226A4 (en) 2023-10-25
CN115700021A (zh) 2023-02-03
JPWO2021251495A1 (https=) 2021-12-16
EP4149226A1 (en) 2023-03-15
WO2021251495A1 (ja) 2021-12-16
US20230220262A1 (en) 2023-07-13
EP4149226B1 (en) 2024-10-02

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