CN115698187A - 导热性树脂组合物和散热片 - Google Patents

导热性树脂组合物和散热片 Download PDF

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Publication number
CN115698187A
CN115698187A CN202180041089.4A CN202180041089A CN115698187A CN 115698187 A CN115698187 A CN 115698187A CN 202180041089 A CN202180041089 A CN 202180041089A CN 115698187 A CN115698187 A CN 115698187A
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CN
China
Prior art keywords
inorganic filler
thermally conductive
resin composition
boron nitride
conductive resin
Prior art date
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Pending
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CN202180041089.4A
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English (en)
Chinese (zh)
Inventor
和田光祐
藤清隆
谷口佳孝
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Denka Co Ltd
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Denka Co Ltd
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Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN115698187A publication Critical patent/CN115698187A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Combustion & Propulsion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180041089.4A 2020-06-12 2021-06-11 导热性树脂组合物和散热片 Pending CN115698187A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020102302 2020-06-12
JP2020-102302 2020-06-12
PCT/JP2021/022360 WO2021251494A1 (ja) 2020-06-12 2021-06-11 熱伝導性樹脂組成物及び放熱シート

Publications (1)

Publication Number Publication Date
CN115698187A true CN115698187A (zh) 2023-02-03

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Family Applications (1)

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CN202180041089.4A Pending CN115698187A (zh) 2020-06-12 2021-06-11 导热性树脂组合物和散热片

Country Status (5)

Country Link
US (1) US12305113B2 (https=)
EP (1) EP4148091B1 (https=)
JP (1) JP7541090B2 (https=)
CN (1) CN115698187A (https=)
WO (1) WO2021251494A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI895130B (zh) * 2023-12-19 2025-08-21 日商Ｄｉｃ股份有限公司 樹脂組成物、片材、金屬基底基板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023007894A1 (ja) * 2021-07-29 2023-02-02 昭和電工株式会社 熱伝導性樹脂組成物、硬化物、熱伝導部材及び電子機器
EP4473074A4 (en) * 2022-02-01 2026-01-14 Xgs Energy Inc HIGH THERMAL COEFFICIENT SUSPENSION COMPOSITIONS AND THEIR PROCESSES
CN116354705B (zh) * 2023-04-17 2024-06-21 天津巴莫科技有限责任公司 一种导热耐火泥及其制备方法

Citations (8)

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JP2009286809A (ja) * 2006-10-23 2009-12-10 Denki Kagaku Kogyo Kk 樹脂組成物
JP2014210857A (ja) * 2013-04-18 2014-11-13 電気化学工業株式会社 熱伝導性シート
JP2015193504A (ja) * 2014-03-31 2015-11-05 ナガセケムテックス株式会社 窒化ホウ素粒子、樹脂組成物および熱伝導性シート
JP2017092322A (ja) * 2015-11-12 2017-05-25 デンカ株式会社 高熱伝導性、高絶縁性放熱シート
CN108495897A (zh) * 2016-02-01 2018-09-04 阪东化学株式会社 热传导性树脂成型品
JP2019073409A (ja) * 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
CN109790025A (zh) * 2016-10-07 2019-05-21 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
CN111212811A (zh) * 2017-10-13 2020-05-29 电化株式会社 氮化硼粉末、其制造方法及使用其的散热构件

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JP3461651B2 (ja) 1996-01-24 2003-10-27 電気化学工業株式会社 六方晶窒化ほう素粉末及びその用途
US7494635B2 (en) 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
CN102574684B (zh) 2009-10-09 2015-04-29 水岛合金铁株式会社 六方氮化硼粉末及其制备方法
JP5969314B2 (ja) 2012-08-22 2016-08-17 デンカ株式会社 窒化ホウ素粉末及びその用途
US10308856B1 (en) 2013-03-15 2019-06-04 The Research Foundation For The State University Of New York Pastes for thermal, electrical and mechanical bonding
US10351728B2 (en) 2013-06-14 2019-07-16 Mitsubishi Electric Corporation Thermosetting resin composition, method of producing thermal conductive sheet, and power module
JP6822836B2 (ja) 2016-12-28 2021-01-27 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2019164002A1 (ja) * 2018-02-26 2019-08-29 デンカ株式会社 絶縁放熱シート
JP7138328B2 (ja) * 2018-03-19 2022-09-16 株式会社アクシス 採便容器
JPWO2020049817A1 (ja) * 2018-09-07 2020-09-10 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009286809A (ja) * 2006-10-23 2009-12-10 Denki Kagaku Kogyo Kk 樹脂組成物
JP2014210857A (ja) * 2013-04-18 2014-11-13 電気化学工業株式会社 熱伝導性シート
JP2015193504A (ja) * 2014-03-31 2015-11-05 ナガセケムテックス株式会社 窒化ホウ素粒子、樹脂組成物および熱伝導性シート
JP2017092322A (ja) * 2015-11-12 2017-05-25 デンカ株式会社 高熱伝導性、高絶縁性放熱シート
CN108495897A (zh) * 2016-02-01 2018-09-04 阪东化学株式会社 热传导性树脂成型品
CN109790025A (zh) * 2016-10-07 2019-05-21 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
JP2019073409A (ja) * 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
CN111212811A (zh) * 2017-10-13 2020-05-29 电化株式会社 氮化硼粉末、其制造方法及使用其的散热构件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI895130B (zh) * 2023-12-19 2025-08-21 日商Ｄｉｃ股份有限公司 樹脂組成物、片材、金屬基底基板

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WO2021251494A1 (ja) 2021-12-16
EP4148091B1 (en) 2024-10-09
JPWO2021251494A1 (https=) 2021-12-16
EP4148091A4 (en) 2023-11-01
EP4148091A1 (en) 2023-03-15
US20230220263A1 (en) 2023-07-13
JP7541090B2 (ja) 2024-08-27
US12305113B2 (en) 2025-05-20

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