CN115557794A - 一种基于丝网印刷用钨浆的高温共烧陶瓷htcc制备工艺 - Google Patents
一种基于丝网印刷用钨浆的高温共烧陶瓷htcc制备工艺 Download PDFInfo
- Publication number
- CN115557794A CN115557794A CN202211361194.9A CN202211361194A CN115557794A CN 115557794 A CN115557794 A CN 115557794A CN 202211361194 A CN202211361194 A CN 202211361194A CN 115557794 A CN115557794 A CN 115557794A
- Authority
- CN
- China
- Prior art keywords
- temperature
- aluminum nitride
- tungsten
- screen printing
- furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 239000000919 ceramic Substances 0.000 title claims abstract description 45
- 229910052721 tungsten Inorganic materials 0.000 title claims abstract description 36
- 239000010937 tungsten Substances 0.000 title claims abstract description 36
- 238000007650 screen-printing Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 title abstract 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 60
- 235000015895 biscuits Nutrition 0.000 claims abstract description 24
- 239000002002 slurry Substances 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 16
- 238000007599 discharging Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 238000005245 sintering Methods 0.000 claims abstract description 12
- 239000012299 nitrogen atmosphere Substances 0.000 claims abstract description 11
- 239000011268 mixed slurry Substances 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 238000005303 weighing Methods 0.000 claims abstract description 4
- 239000011230 binding agent Substances 0.000 claims abstract description 3
- 238000007731 hot pressing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000000462 isostatic pressing Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 230000003068 static effect Effects 0.000 claims description 2
- 229940116411 terpineol Drugs 0.000 claims description 2
- 238000009489 vacuum treatment Methods 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000010344 co-firing Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000002706 hydrostatic effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- ZPUCINDJVBIVPJ-LJISPDSOSA-N cocaine Chemical compound O([C@H]1C[C@@H]2CC[C@@H](N2C)[C@H]1C(=O)OC)C(=O)C1=CC=CC=C1 ZPUCINDJVBIVPJ-LJISPDSOSA-N 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910001254 electrum Inorganic materials 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010940 green gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/638—Removal thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6562—Heating rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6565—Cooling rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Products (AREA)
Abstract
本发明公开了一种基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺。将氮化铝粉体、钨粉、有机体按一定比例称重配置;将有机体通过水浴加热溶解配置成有机体系溶剂,将有机体系溶剂、氮化铝粉体、钨粉进行混合,经过脱泡处理,得到混合浆料,氮化铝在钨浆中作为粘结载体;将混合浆料通过丝网印刷在氮化铝坯片上印刷钨电极;将素坯置于排胶炉中进行排胶处理,在氮气气氛下排胶烧结,以排除素坯中的有机物,从而获得不含残余碳的陶瓷素坯;将排胶后的陶瓷素坯置于高温烧结炉中,在氮气气氛下进行高温烧制,陶瓷素坯中的钨浆和氮化铝均匀收缩结合,得到共晶化的高温共烧陶瓷。本发明烧结后钨与氮化铝收缩均匀,致密性一致,粘接强度好。
Description
技术领域:
本发明属于氮化铝陶瓷技术领域,特别涉及一种基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺。
背景技术:
氮化铝陶瓷(Aluminium Nitride Ceramic)是一种综合性能优良的新型陶瓷材料,是新一代半导体制造、电子器件封装的理想材料,其性能优良:具有高热导率(理论热导率为320W/m.k)、高电绝缘性、低介电常数和损耗、无毒以及与硅相匹配的热膨系数,随着半导体制造、电子信息和电力电子技术不断地向高集成化、高速度化、微型化、智能化的方向发展,并且在大规模集成电路(LSI)制造工艺中广为应用,对氮化铝陶瓷材料的应用开发越为广泛。
氮化铝材料优异的特性使其成为半导体制造、新一代大规模集成电路、半导体模块电路及大功率器件的理想散热和封装材料,在电子信息、电力电子等高技术领域的应用前景十分广阔。
人们研究了氮化铝粉体掺杂后一些特性,发现对于不同的配方可以实现具有不同电阻率导电陶瓷。(1)改变氮化铝电阻率,使其具有静电吸附的功能;(2)改变氮化铝陶瓷的电阻率,变为导电陶瓷,更具有不同电阻率。
氮化铝基导电陶瓷材料技术正是新一代氮化铝全陶瓷加热器件核心材料,其具有低热容、能耗低而热辐射系数高、导致电热效率高、热膨胀系数小、高温不变形、重量轻、功率大、节能、无污染、安全可靠等优异特点,能够满足现代半导体制造、高科技创新领域中对氮化铝基导电材料的技术需求。
氮化铝基导电陶瓷材料共烧工艺中普遍存在布线导体电阻率高,信号传输损耗较大,氮化铝与钨等导体共烧后其热导率有所下降的问题。为了更好的改善该技术问题,结合本公司的项目特性对基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺和特性进行研究。
公开于该背景技术部分的信息仅仅旨在增加对本发明的总体背景的理解,而不应当被视为承认或以任何形式暗示该信息构成已为本领域一般技术人员所公知的现有技术。
发明内容:
本发明的目的在于提供一种基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,从而克服上述现有技术中的缺陷。
为实现上述目的,本发明提供了一种基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其步骤为:
S01:将氮化铝粉体、钨粉、有机体按一定比例称重配置;
S02:将有机体通过水浴加热溶解配置成有机体系溶剂,将有机体系溶剂、氮化铝粉体、钨粉进行混合,经过脱泡处理,得到混合浆料,氮化铝粉体在浆料中作为钨粉的粘结载体;
S03:准备好氮化铝坯片,将混合浆料通过丝网印刷在氮化铝坯片上印刷钨电极;
S04:将印有钨电极的氮化铝坯片放置在压机中,将另一片氮化铝坯片叠放在印有钨电极的氮化铝坯片上,压机通过热压将两片氮化铝坯片压合,再经过温等静压处理,得到素坯;
S05:将素坯置于排胶炉中进行排胶处理,在氮气气氛下排胶,以排除素坯中的有机物,从而获得不含残余碳的陶瓷素坯;
S06:将排胶后的陶瓷素坯置于高温烧结炉中,在氮气气氛下进行高温烧制,陶瓷素坯中的钨浆和氮化铝均匀收缩结合,得到共晶化的高温共烧陶瓷。
优选地,技术方案中,步骤S01中将重量百分比为80~90wt%的钨粉、5~10wt%的氮化铝粉体、10~15wt%的有机体,按化学计量的方式进行称重。
优选地,技术方案中,有机体为丙烯酸、碳酸乙烯酯、松油醇中的任意一种或任意几种以任意比例混合的混合物。
优选地,技术方案中,步骤S02中将有机体在水浴箱中混合,加热到80℃,溶解2-3小时,得到有机体系溶剂。
优选地,技术方案中,步骤S02中将有机体系溶剂、氮化铝粉体、钨粉加入非介入式材料均质机进行预混,得到预混浆料,然后将预混浆料加入三辊机混合,经过脱泡处理,得到混合浆料。
优选地,技术方案中,通过调节浆料的粘度、改变网版的式样实现薄膜或厚膜印刷。
优选地,技术方案中,通过调整钨粉或有机体系溶剂的重量比改变浆料粘度。
优选地,技术方案中,步骤S04中将热压后的坯片通过抽真空处理,然后放入温等静压设备,在水温75℃、80MPa压力条件下,进行静压处理,让热压后的坯片层与层之间结合的更均匀,更致密,结合力更强。
优选地,技术方案中,步骤S05中在≤800℃的温度下,氮气气氛中进行排胶处理。
优选地,技术方案中,步骤S06中在氮气气氛下进行高温烧结,炉内温度T≤1200℃时,升温速率为15~25℃/min,当炉内温度T达到1200℃时,保温5~10h,然后继续加热,当炉内温度1200℃<T<1700℃时,升温速率为2~5℃/min,当炉内温度1700℃≤T≤Tmax时,升温速率为0.5~1.5℃/min,Tmax设定在1850℃~1950℃之间,当炉内温度达到Tmax后,保温2~7h,然后开始冷却降温,当炉内温度Tmax≤T≤1650℃时,降温速率为3~6℃/min,当炉内温度达到1650℃时,保温3~6h,然后自然冷却到室温。
与现有技术相比,本发明具有如下有益效果:
通过充分混合使得浆料中氮化铝粉体作为钨粉的粘结载体,通过温等静压处理使热压后的坯片层与层之间结合的更均匀致密,这样的素坯经过高温烧结后形成一个均匀致密的加热带,钨电极和氮化铝晶粒之间相互咬合在一起,粘接强度好,热导率好,导体电阻率得到有效降低,大大减少了信号传输损耗。
附图说明:
图1为本发明丝网印刷叠层后的素坯金相图;
图2为本发明基于丝网印刷用钨浆的高温共烧陶瓷金相图。
具体实施方式:
下面对本发明的具体实施方式进行详细描述,但应当理解本发明的保护范围并不受具体实施方式的限制。
除非另有其它明确表示,否则在整个说明书和权利要求书中,术语“包括”或其变换如“包含”或“包括有”等等将被理解为包括所陈述的元件或组成部分,而并未排除其它元件或其它组成部分。
一种基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其步骤为:
S01:将重量百分比为85wt%的钨粉、5wt%的氮化铝粉体、10wt%的丙烯酸和碳酸乙烯酯混合物,按化学计量的方式进行称重;
S02:将丙烯酸和碳酸乙烯酯混合物在水浴箱中混合,加热到80℃,溶解3小时,得到有机体系溶剂,将有机体系溶剂、氮化铝粉体、钨粉加入非介入式材料均质机进行预混,得到预混浆料,然后将预混浆料加入三辊机混合,经过脱泡处理,得到混合浆料,氮化铝粉体在浆料中作为钨粉的粘结载体;
S03:准备好氮化铝坯片,将混合浆料通过丝网印刷在氮化铝坯片上印刷钨电极;通过调整钨粉或有机体系溶剂的重量比改变浆料粘度或改变网版的式样实现薄膜(3~20μm)或厚膜(40~60μm)印刷;
S04:将印有钨电极的氮化铝坯片放置在压机中,将另一片氮化铝坯片叠放在印有钨电极的氮化铝坯片上,压机通过热压将两片氮化铝坯片压合,如图1所示,将热压后的坯片通过抽真空处理,然后放入温等静压设备,在水温75℃、80MPa压力条件下,进行静压处理,得到素坯,静压处理让热压后的坯片层与层之间结合的更均匀,更致密,结合力更强;
S05:将素坯置于排胶炉中进行排胶处理,在氮气气氛、750℃的温度下排胶,以排除素坯中的有机物,从而获得不含残余碳的陶瓷素坯;
S06:将排胶后的陶瓷素坯置于高温烧结炉中,在氮气气氛下进行高温烧制,炉内温度T≤1200℃时,升温速率为20℃/min,当炉内温度T达到1200℃时,保温8h,然后继续加热,当炉内温度1200℃<T<1700℃时,升温速率为5℃/min,当炉内温度1700℃≤T≤1900℃时,升温速率为1℃/min,当炉内温度达到1900℃后,保温5h,然后开始冷却降温,当炉内温度1900℃≤T≤1650℃时,降温速率为5℃/min,当炉内温度达到1650℃时,保温4h,然后自然冷却到室温,陶瓷素坯中的钨浆和氮化铝均匀收缩结合,如图2所示,经过高温烧结后形成一个均匀致密的加热带,钨电极和氮化铝晶粒之间相互咬合在一起,粘接强度好,热导率好。
分别取改善前的工艺制得的高温共烧陶瓷、本申请高温共烧陶瓷样品A、B,通过直流低电阻测试仪测量其电性能。
表1
样品名称 | 电阻率Ω·cm(室温) |
A | 6.54×10<sup>5</sup> |
B | 3.33×10<sup>5</sup> |
由表1可得,本申请制得的高温共烧陶瓷其电阻率为,相比于改善前工艺的产品,导体电阻率得到有效降低,大大减少了信号传输损耗。
前述对本发明的具体示例性实施方案的描述是为了说明和例证的目的。这些描述并非想将本发明限定为所公开的精确形式,并且很显然,根据上述教导,可以进行很多改变和变化。对示例性实施例进行选择和描述的目的在于解释本发明的特定原理及其实际应用,从而使得本领域的技术人员能够实现并利用本发明的各种不同的示例性实施方案以及各种不同的选择和改变。本发明的范围意在由权利要求书及其等同形式所限定。
Claims (8)
1.一种基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其步骤为:
S01:将重量百分比为80~90wt%的钨粉、5~10wt%的氮化铝粉体、10~15wt%的有机体,按化学计量的方式进行称重;有机体为丙烯酸、碳酸乙烯酯、松油醇中的任意一种或任意几种以任意比例混合的混合物;
S02:将有机体通过水浴加热溶解配置成有机体系溶剂,将有机体系溶剂、氮化铝粉体、钨粉进行混合,经过脱泡处理,得到混合浆料,氮化铝粉体在浆料中作为钨粉的粘结载体;
S03:准备好氮化铝坯片,将混合浆料通过丝网印刷在氮化铝坯片上印刷钨电极;
S04:将印有钨电极的氮化铝坯片放置在压机中,将另一片氮化铝坯片叠放在印有钨电极的氮化铝坯片上,压机通过热压将两片氮化铝坯片压合,再经过温等静压处理,得到素坯;
S05:将素坯置于排胶炉中进行排胶处理,在氮气气氛下排胶,以排除素坯中的有机物,从而获得不含残余碳的陶瓷素坯;
S06:将排胶后的陶瓷素坯置于高温烧结炉中,在氮气气氛下进行高温烧制,陶瓷素坯中的钨浆和氮化铝均匀收缩结合,得到共晶化的高温共烧陶瓷。
2.根据权利要求1所述的基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其特征在于:步骤S02中将有机体在水浴箱中混合,加热到80℃,溶解2-3小时,得到有机体系溶剂。
3.根据权利要求1所述的基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其特征在于:步骤S02中将有机体系溶剂、氮化铝粉体、钨粉加入非介入式材料均质机进行预混,得到预混浆料,然后将预混浆料加入三辊机混合,经过脱泡处理,得到混合浆料。
4.根据权利要求1所述的基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其特征在于:通过调节浆料的粘度、改变网版的式样实现薄膜或厚膜印刷。
5.根据权利要求4所述的基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其特征在于:通过调整钨粉或有机体系溶剂的重量比改变浆料粘度。
6.根据权利要求1所述的基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其特征在于:步骤S04中将热压后的坯片通过抽真空处理,然后放入温等静压设备,在水温75℃、80MPa压力条件下,进行静压处理。
7.根据权利要求1所述的基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其特征在于:步骤S05中在≤800℃的温度下,氮气气氛中进行排胶处理。
8.根据权利要求1所述的基于丝网印刷用钨浆的高温共烧陶瓷HTCC制备工艺,其特征在于:步骤S06中炉内温度T≤1200℃时,升温速率为15~25℃/min,当炉内温度T达到1200℃时,保温5~10h,然后继续加热,当炉内温度1200℃<T<1700℃时,升温速率为2~5℃/min,当炉内温度1700℃≤T≤Tmax时,升温速率为0.5~1.5℃/min,Tmax设定在1850℃~1950℃之间,当炉内温度达到Tmax后,保温2~7h,然后开始冷却降温,当炉内温度Tmax≤T≤1650℃时,降温速率为3~6℃/min,当炉内温度达到1650℃时,保温3~6h,然后自然冷却到室温。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211361194.9A CN115557794A (zh) | 2022-11-02 | 2022-11-02 | 一种基于丝网印刷用钨浆的高温共烧陶瓷htcc制备工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211361194.9A CN115557794A (zh) | 2022-11-02 | 2022-11-02 | 一种基于丝网印刷用钨浆的高温共烧陶瓷htcc制备工艺 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115557794A true CN115557794A (zh) | 2023-01-03 |
Family
ID=84767834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211361194.9A Pending CN115557794A (zh) | 2022-11-02 | 2022-11-02 | 一种基于丝网印刷用钨浆的高温共烧陶瓷htcc制备工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115557794A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116252385A (zh) * | 2023-03-16 | 2023-06-13 | 无锡海古德新技术有限公司 | 一种氮化铝陶瓷厚基板的成型制备工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0483783A (ja) * | 1990-07-24 | 1992-03-17 | Kyocera Corp | メタライズ金属層を有する窒化アルミニウム質焼結体 |
US20050013989A1 (en) * | 2002-05-28 | 2005-01-20 | Yoshiyuki Hirose | Aluminum nitride sintered compact having metallized layer and method for preparation thereof |
CN105430940A (zh) * | 2015-11-24 | 2016-03-23 | 合肥圣达电子科技实业公司 | 一种用于高温共烧AlN多层布线基板的填孔钨浆及制备方法 |
CN109734480A (zh) * | 2019-02-27 | 2019-05-10 | 常州联德陶业有限公司 | 一种氮化铝陶瓷加热器用共烧高温发热浆料及其制备方法 |
CN112071464A (zh) * | 2020-09-09 | 2020-12-11 | 西安宏星电子浆料科技股份有限公司 | 一种共烧填孔导体浆料及其制备方法 |
-
2022
- 2022-11-02 CN CN202211361194.9A patent/CN115557794A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0483783A (ja) * | 1990-07-24 | 1992-03-17 | Kyocera Corp | メタライズ金属層を有する窒化アルミニウム質焼結体 |
US20050013989A1 (en) * | 2002-05-28 | 2005-01-20 | Yoshiyuki Hirose | Aluminum nitride sintered compact having metallized layer and method for preparation thereof |
CN105430940A (zh) * | 2015-11-24 | 2016-03-23 | 合肥圣达电子科技实业公司 | 一种用于高温共烧AlN多层布线基板的填孔钨浆及制备方法 |
CN109734480A (zh) * | 2019-02-27 | 2019-05-10 | 常州联德陶业有限公司 | 一种氮化铝陶瓷加热器用共烧高温发热浆料及其制备方法 |
CN112071464A (zh) * | 2020-09-09 | 2020-12-11 | 西安宏星电子浆料科技股份有限公司 | 一种共烧填孔导体浆料及其制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116252385A (zh) * | 2023-03-16 | 2023-06-13 | 无锡海古德新技术有限公司 | 一种氮化铝陶瓷厚基板的成型制备工艺 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5024975A (en) | Crystallizable, low dielectric constant, low dielectric loss composition | |
JPS5922399B2 (ja) | 多層セラミツク基板 | |
CN115557794A (zh) | 一种基于丝网印刷用钨浆的高温共烧陶瓷htcc制备工艺 | |
EP4282848A1 (en) | Preparation method for copper plate-covered silicon nitride ceramic substrate | |
JP3528037B2 (ja) | ガラスセラミック基板の製造方法 | |
CN114409262B (zh) | 一种导电玻璃粉及其制备方法、导电浆料及其制备方法与应用 | |
JP3687443B2 (ja) | 低温焼成セラミック組成物及びセラミック多層基板 | |
CN113213894A (zh) | 一种高纯氧化铝陶瓷基板及其制备工艺 | |
US4364100A (en) | Multi-layered metallized silicon matrix substrate | |
CN112010650A (zh) | 一种低温烧结高品质因素微波介质陶瓷及其制备方法 | |
CN114560706B (zh) | 一种高热导氮化铝陶瓷基板的制备方法 | |
CN113782250B (zh) | 一种高触变性低温共烧陶瓷内电极银浆及其制备方法和应用 | |
JP2634133B2 (ja) | 高誘電体層を有する窒化アルミニウム多層配線基板及びその製造方法 | |
CN114538932A (zh) | 一种共烧氮化铝陶瓷基板的制备方法 | |
CN113698213A (zh) | 一种高导热陶瓷通用覆铜基板及其制备方法 | |
CN109047962B (zh) | 一种用于多芯片封装钎焊过程中保持界面平整的方法 | |
CN209052591U (zh) | 一种石墨烯改性的陶瓷基pcb覆铜板 | |
CN112954834B (zh) | 一种htcc用空腔造型印刷浆料的制备方法 | |
CN114591090A (zh) | 一种电路用氮化硅陶瓷基片及其制备方法 | |
CN115894002B (zh) | 一种双相陶瓷增强低温共烧陶瓷材料及其制备方法和用途 | |
CN109336577B (zh) | 一种陶瓷基板材料及其制备方法 | |
CN1256296C (zh) | 高频热稳定性陶瓷介质材料的制备方法 | |
JP2016160176A (ja) | 低温焼結アルミナセラミックスの製造方法 | |
CN116761285A (zh) | 一种低电阻温度系数的氮化铝加热器及其制备方法 | |
CN114230186A (zh) | 一种玻璃粉、多层陶瓷低温共烧的内电极铜浆及其两者的制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20230103 |