CN115552618A - 一种显示基板和显示装置 - Google Patents
一种显示基板和显示装置 Download PDFInfo
- Publication number
- CN115552618A CN115552618A CN202180000997.9A CN202180000997A CN115552618A CN 115552618 A CN115552618 A CN 115552618A CN 202180000997 A CN202180000997 A CN 202180000997A CN 115552618 A CN115552618 A CN 115552618A
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- conductive
- hollow
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- 239000000758 substrate Substances 0.000 title claims abstract description 149
- 230000000875 corresponding effect Effects 0.000 claims description 62
- 238000012360 testing method Methods 0.000 claims description 40
- 230000002596 correlated effect Effects 0.000 claims description 20
- 230000036961 partial effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 94
- 239000000463 material Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 230000005611 electricity Effects 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910003336 CuNi Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
Abstract
本公开提供一种显示基板和显示装置。显示基板包括衬底基板、第一导电层、第二导电层和绝缘层,第一导电层位于衬底基板的一侧,包括沿第一方向延伸的第一导电部,第二导电层位于第一导电层背离衬底基板的一侧,绝缘层位于第一导电层和第二导电层之间,至少一个第一导电部包括第一镂空部,第一镂空部包括多个沿第二方向排布的槽结构,该槽结构沿第一方向延伸,第一方向与第二方向之间存在夹角。本公开在第一导电部设置第一镂空部,可以通过第一镂空部中的多个沿第二方向排布,沿第一方向延伸的槽结构增强第一导电部与层膜之间的附着力,从而提高产品良率,提高产品性能稳定性。
Description
PCT国内申请,说明书已公开。
Claims (23)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2021/091389 WO2022226976A1 (zh) | 2021-04-30 | 2021-04-30 | 一种显示基板和显示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115552618A true CN115552618A (zh) | 2022-12-30 |
Family
ID=83846727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180000997.9A Pending CN115552618A (zh) | 2021-04-30 | 2021-04-30 | 一种显示基板和显示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240105894A1 (zh) |
CN (1) | CN115552618A (zh) |
DE (1) | DE112021004601T5 (zh) |
WO (1) | WO2022226976A1 (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100583311B1 (ko) * | 2003-10-14 | 2006-05-25 | 엘지.필립스 엘시디 주식회사 | 액정표시패널 및 그 제조 방법 |
KR100647775B1 (ko) * | 2004-12-01 | 2006-11-23 | 엘지.필립스 엘시디 주식회사 | 박막 트랜지스터 기판 및 제조 방법 |
CN107203060A (zh) * | 2017-06-05 | 2017-09-26 | 昆山龙腾光电有限公司 | 彩膜基板和液晶显示面板 |
CN111146238B (zh) * | 2018-10-17 | 2022-08-16 | 昆山工研院新型平板显示技术中心有限公司 | 阵列基板及其制作方法、显示面板、电子设备 |
-
2021
- 2021-04-30 CN CN202180000997.9A patent/CN115552618A/zh active Pending
- 2021-04-30 DE DE112021004601.2T patent/DE112021004601T5/de active Pending
- 2021-04-30 WO PCT/CN2021/091389 patent/WO2022226976A1/zh active Application Filing
- 2021-04-30 US US17/769,032 patent/US20240105894A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20240105894A1 (en) | 2024-03-28 |
WO2022226976A1 (zh) | 2022-11-03 |
DE112021004601T5 (de) | 2023-06-15 |
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