CN115445859B - 一种半导体元件的制造设备 - Google Patents
一种半导体元件的制造设备 Download PDFInfo
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- CN115445859B CN115445859B CN202211081092.1A CN202211081092A CN115445859B CN 115445859 B CN115445859 B CN 115445859B CN 202211081092 A CN202211081092 A CN 202211081092A CN 115445859 B CN115445859 B CN 115445859B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims description 74
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 23
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 23
- 241001330002 Bambuseae Species 0.000 claims description 23
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 23
- 239000011425 bamboo Substances 0.000 claims description 23
- 238000007599 discharging Methods 0.000 claims description 14
- 230000006978 adaptation Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 12
- 238000003860 storage Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 8
- 241001232346 Gymnosperma glutinosum Species 0.000 description 7
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- 238000012986 modification Methods 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
- B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
- B05C5/0279—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve independently, e.g. individually, flow controlled
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202211081092.1A CN115445859B (zh) | 2022-09-05 | 2022-09-05 | 一种半导体元件的制造设备 |
Applications Claiming Priority (1)
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CN202211081092.1A CN115445859B (zh) | 2022-09-05 | 2022-09-05 | 一种半导体元件的制造设备 |
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Publication Number | Publication Date |
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CN115445859A CN115445859A (zh) | 2022-12-09 |
CN115445859B true CN115445859B (zh) | 2023-05-02 |
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CN202211081092.1A Active CN115445859B (zh) | 2022-09-05 | 2022-09-05 | 一种半导体元件的制造设备 |
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Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103464342A (zh) * | 2013-08-30 | 2013-12-25 | 中南大学 | 一种喷射点胶阀装置及喷射点胶方法 |
CN205308718U (zh) * | 2016-01-28 | 2016-06-15 | 绍兴文理学院 | 一种喇叭组装用自动涂胶压紧装置 |
CN106179876A (zh) * | 2016-08-25 | 2016-12-07 | 利欧集团浙江泵业有限公司 | 一种工件的涂胶装置 |
CN107497635A (zh) * | 2017-09-19 | 2017-12-22 | 海盐众信电子有限公司 | 一种用于生产继电器的封胶下料机及封胶方法 |
CN109939893A (zh) * | 2019-04-13 | 2019-06-28 | 丁晟 | 一种全自动高精度led点胶机 |
CN209138986U (zh) * | 2018-08-31 | 2019-07-23 | 佛山市三水区金广宏利无纺布有限公司 | 一种用于生产喷胶棉的粘合剂喷涂装置 |
CN210847009U (zh) * | 2019-10-22 | 2020-06-26 | 江西科技学院 | 一种涂胶机的挤胶装置 |
CN210935670U (zh) * | 2019-07-20 | 2020-07-07 | 温州千禾纸业有限公司 | 一种便于更换胶桶的点胶机 |
CN211275270U (zh) * | 2019-12-11 | 2020-08-18 | 威海颢福自动化设备有限公司 | 一种多功能全自动组装机 |
CN211637132U (zh) * | 2019-11-13 | 2020-10-09 | 随州市华亿光电科技有限公司 | 一种玻璃镜片胶合加工点胶设备 |
CN111957515A (zh) * | 2020-08-18 | 2020-11-20 | 马鞍山英维爱生态科技有限公司 | 一种三轴气动振动点胶机 |
CN212143253U (zh) * | 2019-12-23 | 2020-12-15 | 泰州海天电子科技股份有限公司 | 晶体管加工用点胶装置 |
CN212238010U (zh) * | 2020-05-06 | 2020-12-29 | 浙江爱吉仁科技股份有限公司 | 一种应用于点胶机的点胶装置 |
WO2021196302A1 (zh) * | 2020-04-01 | 2021-10-07 | 南京美高美新材料有限公司 | 一种上料挤出机用全自动定量投料装置 |
CN215918013U (zh) * | 2021-06-30 | 2022-03-01 | 北京华科讯达科技有限公司 | 一种电控泄压模组 |
-
2022
- 2022-09-05 CN CN202211081092.1A patent/CN115445859B/zh active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103464342A (zh) * | 2013-08-30 | 2013-12-25 | 中南大学 | 一种喷射点胶阀装置及喷射点胶方法 |
CN205308718U (zh) * | 2016-01-28 | 2016-06-15 | 绍兴文理学院 | 一种喇叭组装用自动涂胶压紧装置 |
CN106179876A (zh) * | 2016-08-25 | 2016-12-07 | 利欧集团浙江泵业有限公司 | 一种工件的涂胶装置 |
CN107497635A (zh) * | 2017-09-19 | 2017-12-22 | 海盐众信电子有限公司 | 一种用于生产继电器的封胶下料机及封胶方法 |
CN209138986U (zh) * | 2018-08-31 | 2019-07-23 | 佛山市三水区金广宏利无纺布有限公司 | 一种用于生产喷胶棉的粘合剂喷涂装置 |
CN109939893A (zh) * | 2019-04-13 | 2019-06-28 | 丁晟 | 一种全自动高精度led点胶机 |
CN210935670U (zh) * | 2019-07-20 | 2020-07-07 | 温州千禾纸业有限公司 | 一种便于更换胶桶的点胶机 |
CN210847009U (zh) * | 2019-10-22 | 2020-06-26 | 江西科技学院 | 一种涂胶机的挤胶装置 |
CN211637132U (zh) * | 2019-11-13 | 2020-10-09 | 随州市华亿光电科技有限公司 | 一种玻璃镜片胶合加工点胶设备 |
CN211275270U (zh) * | 2019-12-11 | 2020-08-18 | 威海颢福自动化设备有限公司 | 一种多功能全自动组装机 |
CN212143253U (zh) * | 2019-12-23 | 2020-12-15 | 泰州海天电子科技股份有限公司 | 晶体管加工用点胶装置 |
WO2021196302A1 (zh) * | 2020-04-01 | 2021-10-07 | 南京美高美新材料有限公司 | 一种上料挤出机用全自动定量投料装置 |
CN212238010U (zh) * | 2020-05-06 | 2020-12-29 | 浙江爱吉仁科技股份有限公司 | 一种应用于点胶机的点胶装置 |
CN111957515A (zh) * | 2020-08-18 | 2020-11-20 | 马鞍山英维爱生态科技有限公司 | 一种三轴气动振动点胶机 |
CN215918013U (zh) * | 2021-06-30 | 2022-03-01 | 北京华科讯达科技有限公司 | 一种电控泄压模组 |
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CN115445859A (zh) | 2022-12-09 |
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Effective date of registration: 20240315 Address after: No. 88 Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province, 221300 Patentee after: SU Normal University Semiconductor Materials and Equipment Research Institute (Pizhou) Co.,Ltd. Country or region after: China Patentee after: Jiangsu Normal University Address before: No.88 Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: SU Normal University Semiconductor Materials and Equipment Research Institute (Pizhou) Co.,Ltd. Country or region before: China |