CN115380377A - 半导体模块 - Google Patents

半导体模块 Download PDF

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Publication number
CN115380377A
CN115380377A CN202180023469.5A CN202180023469A CN115380377A CN 115380377 A CN115380377 A CN 115380377A CN 202180023469 A CN202180023469 A CN 202180023469A CN 115380377 A CN115380377 A CN 115380377A
Authority
CN
China
Prior art keywords
conductor
lead frame
switching element
voltage detection
detection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180023469.5A
Other languages
English (en)
Chinese (zh)
Inventor
木村润一
海原一裕
穗积则充
出口幸太郎
松本惇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN115380377A publication Critical patent/CN115380377A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
CN202180023469.5A 2020-04-01 2021-03-18 半导体模块 Pending CN115380377A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-065452 2020-04-01
JP2020065452 2020-04-01
PCT/JP2021/011065 WO2021200211A1 (ja) 2020-04-01 2021-03-18 半導体モジュール

Publications (1)

Publication Number Publication Date
CN115380377A true CN115380377A (zh) 2022-11-22

Family

ID=77928393

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180023469.5A Pending CN115380377A (zh) 2020-04-01 2021-03-18 半导体模块

Country Status (5)

Country Link
US (1) US20230163055A1 (https=)
EP (1) EP4131370A4 (https=)
JP (1) JPWO2021200211A1 (https=)
CN (1) CN115380377A (https=)
WO (1) WO2021200211A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025197045A1 (ja) * 2024-03-21 2025-09-25 Ａｓｔｅｍｏ株式会社 半導体装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004022960A (ja) * 2002-06-19 2004-01-22 Mitsubishi Electric Corp 電力用半導体装置
US20100308421A1 (en) * 2009-06-05 2010-12-09 Renesas Electronics Corporation Semiconductor device
CN102484110A (zh) * 2009-10-22 2012-05-30 松下电器产业株式会社 电力半导体模块
CN102549744A (zh) * 2009-10-02 2012-07-04 日立汽车系统株式会社 半导体装置、功率半导体模块及具备功率半导体模块的电力转换装置
US20150042373A1 (en) * 2013-08-09 2015-02-12 Mitsubishi Electric Corporation Semiconductor device
CN105723619A (zh) * 2013-11-20 2016-06-29 罗姆股份有限公司 开关器件及电子电路

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5201171B2 (ja) * 2010-05-21 2013-06-05 株式会社デンソー 半導体モジュール、および、それを用いた駆動装置
JP2013004943A (ja) * 2011-06-22 2013-01-07 Renesas Electronics Corp 半導体装置及びその製造方法
JP6125984B2 (ja) * 2013-12-11 2017-05-10 トヨタ自動車株式会社 半導体装置
JP6475918B2 (ja) * 2014-02-05 2019-02-27 ローム株式会社 パワーモジュール
JP6261642B2 (ja) * 2016-04-04 2018-01-17 三菱電機株式会社 電力半導体装置
EP3584592A4 (en) * 2017-02-20 2020-11-18 Shindengen Electric Manufacturing Co., Ltd. ELECTRONIC DEVICE AND CONNECTOR
JP6691984B2 (ja) * 2019-02-04 2020-05-13 ローム株式会社 パワーモジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004022960A (ja) * 2002-06-19 2004-01-22 Mitsubishi Electric Corp 電力用半導体装置
US20100308421A1 (en) * 2009-06-05 2010-12-09 Renesas Electronics Corporation Semiconductor device
CN102549744A (zh) * 2009-10-02 2012-07-04 日立汽车系统株式会社 半导体装置、功率半导体模块及具备功率半导体模块的电力转换装置
CN102484110A (zh) * 2009-10-22 2012-05-30 松下电器产业株式会社 电力半导体模块
US20150042373A1 (en) * 2013-08-09 2015-02-12 Mitsubishi Electric Corporation Semiconductor device
CN105723619A (zh) * 2013-11-20 2016-06-29 罗姆股份有限公司 开关器件及电子电路
US20160294379A1 (en) * 2013-11-20 2016-10-06 Rohm Co., Ltd. Switching device and electronic circuit

Also Published As

Publication number Publication date
JPWO2021200211A1 (https=) 2021-10-07
WO2021200211A1 (ja) 2021-10-07
EP4131370A4 (en) 2023-10-11
EP4131370A1 (en) 2023-02-08
US20230163055A1 (en) 2023-05-25

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Application publication date: 20221122

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