JPWO2021200211A1 - - Google Patents
Info
- Publication number
- JPWO2021200211A1 JPWO2021200211A1 JP2022511880A JP2022511880A JPWO2021200211A1 JP WO2021200211 A1 JPWO2021200211 A1 JP WO2021200211A1 JP 2022511880 A JP2022511880 A JP 2022511880A JP 2022511880 A JP2022511880 A JP 2022511880A JP WO2021200211 A1 JPWO2021200211 A1 JP WO2021200211A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/886—Die-attach connectors and strap connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/941—Dispositions of bond pads
- H10W72/944—Dispositions of multiple bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020065452 | 2020-04-01 | ||
| PCT/JP2021/011065 WO2021200211A1 (ja) | 2020-04-01 | 2021-03-18 | 半導体モジュール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021200211A1 true JPWO2021200211A1 (https=) | 2021-10-07 |
Family
ID=77928393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022511880A Pending JPWO2021200211A1 (https=) | 2020-04-01 | 2021-03-18 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230163055A1 (https=) |
| EP (1) | EP4131370A4 (https=) |
| JP (1) | JPWO2021200211A1 (https=) |
| CN (1) | CN115380377A (https=) |
| WO (1) | WO2021200211A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025197045A1 (ja) * | 2024-03-21 | 2025-09-25 | Ａｓｔｅｍｏ株式会社 | 半導体装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4220731B2 (ja) * | 2002-06-19 | 2009-02-04 | 三菱電機株式会社 | 電力用半導体装置 |
| JP5443837B2 (ja) * | 2009-06-05 | 2014-03-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5481148B2 (ja) * | 2009-10-02 | 2014-04-23 | 日立オートモティブシステムズ株式会社 | 半導体装置、およびパワー半導体モジュール、およびパワー半導体モジュールを備えた電力変換装置 |
| JP5422663B2 (ja) * | 2009-10-22 | 2014-02-19 | パナソニック株式会社 | パワー半導体モジュール |
| JP5201171B2 (ja) * | 2010-05-21 | 2013-06-05 | 株式会社デンソー | 半導体モジュール、および、それを用いた駆動装置 |
| JP2013004943A (ja) * | 2011-06-22 | 2013-01-07 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
| JP6094420B2 (ja) * | 2013-08-09 | 2017-03-15 | 三菱電機株式会社 | 半導体装置 |
| US10263612B2 (en) * | 2013-11-20 | 2019-04-16 | Rohm Co., Ltd. | Switching device and electronic circuit |
| JP6125984B2 (ja) * | 2013-12-11 | 2017-05-10 | トヨタ自動車株式会社 | 半導体装置 |
| JP6475918B2 (ja) * | 2014-02-05 | 2019-02-27 | ローム株式会社 | パワーモジュール |
| JP6261642B2 (ja) * | 2016-04-04 | 2018-01-17 | 三菱電機株式会社 | 電力半導体装置 |
| EP3584592A4 (en) * | 2017-02-20 | 2020-11-18 | Shindengen Electric Manufacturing Co., Ltd. | ELECTRONIC DEVICE AND CONNECTOR |
| JP6691984B2 (ja) * | 2019-02-04 | 2020-05-13 | ローム株式会社 | パワーモジュール |
-
2021
- 2021-03-18 JP JP2022511880A patent/JPWO2021200211A1/ja active Pending
- 2021-03-18 EP EP21780660.3A patent/EP4131370A4/en not_active Withdrawn
- 2021-03-18 US US17/906,619 patent/US20230163055A1/en not_active Abandoned
- 2021-03-18 CN CN202180023469.5A patent/CN115380377A/zh active Pending
- 2021-03-18 WO PCT/JP2021/011065 patent/WO2021200211A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN115380377A (zh) | 2022-11-22 |
| WO2021200211A1 (ja) | 2021-10-07 |
| EP4131370A4 (en) | 2023-10-11 |
| EP4131370A1 (en) | 2023-02-08 |
| US20230163055A1 (en) | 2023-05-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20221024 |