CN115362566A - 热电转换模块 - Google Patents

热电转换模块 Download PDF

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Publication number
CN115362566A
CN115362566A CN202180025830.8A CN202180025830A CN115362566A CN 115362566 A CN115362566 A CN 115362566A CN 202180025830 A CN202180025830 A CN 202180025830A CN 115362566 A CN115362566 A CN 115362566A
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CN
China
Prior art keywords
electrode
conversion module
substrate
element layer
thermoelectric conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180025830.8A
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English (en)
Chinese (zh)
Inventor
关佑太
武藤豪志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN115362566A publication Critical patent/CN115362566A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180025830.8A 2020-03-30 2021-03-19 热电转换模块 Pending CN115362566A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020061387 2020-03-30
JP2020-061387 2020-03-30
PCT/JP2021/011334 WO2021200265A1 (ja) 2020-03-30 2021-03-19 熱電変換モジュール

Publications (1)

Publication Number Publication Date
CN115362566A true CN115362566A (zh) 2022-11-18

Family

ID=77928584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180025830.8A Pending CN115362566A (zh) 2020-03-30 2021-03-19 热电转换模块

Country Status (4)

Country Link
US (1) US20230139556A1 (https=)
JP (1) JPWO2021200265A1 (https=)
CN (1) CN115362566A (https=)
WO (1) WO2021200265A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104105333A (zh) * 2013-04-09 2014-10-15 哈曼贝克自动系统股份有限公司 集成在印刷电路板中的热电冷却器/加热器
US20170047500A1 (en) * 2014-06-03 2017-02-16 Denso Corporation Method for manufacturing thermoelectric conversion element sheet, and method for manufacturing thermoelectric conversion device
US20170223817A1 (en) * 2016-01-29 2017-08-03 Delta Electronics, Inc. Thermoelectric cooling module
CN109196670A (zh) * 2016-05-27 2019-01-11 株式会社电装 热电转换装置及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997930A (ja) * 1995-07-27 1997-04-08 Aisin Seiki Co Ltd 熱電冷却モジュール及びその製造方法
US8063298B2 (en) * 2004-10-22 2011-11-22 Nextreme Thermal Solutions, Inc. Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields
CN101032038B (zh) * 2005-08-16 2010-04-21 松下电器产业株式会社 热电转换器件、以及使用该热电转换器件的冷却方法和发电方法
JP4953841B2 (ja) * 2006-03-31 2012-06-13 京セラ株式会社 熱電モジュール
JP5040765B2 (ja) * 2008-03-25 2012-10-03 日本電気株式会社 半導体装置
JP2010118475A (ja) * 2008-11-12 2010-05-27 Mitsumi Electric Co Ltd 熱電変換モジュール及び熱電変換装置
KR101249292B1 (ko) * 2008-11-26 2013-04-01 한국전자통신연구원 열전소자, 열전소자 모듈, 및 그 열전 소자의 형성 방법
KR20160129637A (ko) * 2015-04-30 2016-11-09 엘지이노텍 주식회사 열전모듈 및 이를 포함하는 열전환장치
JP6607448B2 (ja) * 2016-06-21 2019-11-20 パナソニックＩｐマネジメント株式会社 熱電変換器
KR102652928B1 (ko) * 2017-02-06 2024-03-29 엘지이노텍 주식회사 열전 소자
JP2019149501A (ja) * 2018-02-28 2019-09-05 京セラ株式会社 配線基板及び電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104105333A (zh) * 2013-04-09 2014-10-15 哈曼贝克自动系统股份有限公司 集成在印刷电路板中的热电冷却器/加热器
US20170047500A1 (en) * 2014-06-03 2017-02-16 Denso Corporation Method for manufacturing thermoelectric conversion element sheet, and method for manufacturing thermoelectric conversion device
US20170223817A1 (en) * 2016-01-29 2017-08-03 Delta Electronics, Inc. Thermoelectric cooling module
CN109196670A (zh) * 2016-05-27 2019-01-11 株式会社电装 热电转换装置及其制造方法

Also Published As

Publication number Publication date
JPWO2021200265A1 (https=) 2021-10-07
WO2021200265A1 (ja) 2021-10-07
US20230139556A1 (en) 2023-05-04

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