JPWO2021200265A1 - - Google Patents

Info

Publication number
JPWO2021200265A1
JPWO2021200265A1 JP2022511918A JP2022511918A JPWO2021200265A1 JP WO2021200265 A1 JPWO2021200265 A1 JP WO2021200265A1 JP 2022511918 A JP2022511918 A JP 2022511918A JP 2022511918 A JP2022511918 A JP 2022511918A JP WO2021200265 A1 JPWO2021200265 A1 JP WO2021200265A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022511918A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021200265A1 publication Critical patent/JPWO2021200265A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
JP2022511918A 2020-03-30 2021-03-19 Pending JPWO2021200265A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020061387 2020-03-30
PCT/JP2021/011334 WO2021200265A1 (ja) 2020-03-30 2021-03-19 熱電変換モジュール

Publications (1)

Publication Number Publication Date
JPWO2021200265A1 true JPWO2021200265A1 (ja) 2021-10-07

Family

ID=77928584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511918A Pending JPWO2021200265A1 (ja) 2020-03-30 2021-03-19

Country Status (4)

Country Link
US (1) US20230139556A1 (ja)
JP (1) JPWO2021200265A1 (ja)
CN (1) CN115362566A (ja)
WO (1) WO2021200265A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8063298B2 (en) * 2004-10-22 2011-11-22 Nextreme Thermal Solutions, Inc. Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields
WO2007020775A1 (ja) * 2005-08-16 2007-02-22 Matsushita Electric Industrial Co., Ltd. 熱電変換デバイス、並びにそれを用いた冷却方法および発電方法
JP4953841B2 (ja) * 2006-03-31 2012-06-13 京セラ株式会社 熱電モジュール
JP5040765B2 (ja) * 2008-03-25 2012-10-03 日本電気株式会社 半導体装置
KR101249292B1 (ko) * 2008-11-26 2013-04-01 한국전자통신연구원 열전소자, 열전소자 모듈, 및 그 열전 소자의 형성 방법
EP2790474B1 (en) * 2013-04-09 2016-03-16 Harman Becker Automotive Systems GmbH Thermoelectric cooler/heater integrated in printed circuit board
JP6394491B2 (ja) * 2014-06-03 2018-09-26 株式会社デンソー 熱電変換素子シートの製造方法、熱電変換装置の製造方法
TWI563909B (en) * 2016-01-29 2016-12-21 Delta Electronics Inc Thermo electric heat dissipation module
JP2019149501A (ja) * 2018-02-28 2019-09-05 京セラ株式会社 配線基板及び電子装置

Also Published As

Publication number Publication date
WO2021200265A1 (ja) 2021-10-07
US20230139556A1 (en) 2023-05-04
CN115362566A (zh) 2022-11-18

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231227