JPWO2021200265A1 - - Google Patents
Info
- Publication number
- JPWO2021200265A1 JPWO2021200265A1 JP2022511918A JP2022511918A JPWO2021200265A1 JP WO2021200265 A1 JPWO2021200265 A1 JP WO2021200265A1 JP 2022511918 A JP2022511918 A JP 2022511918A JP 2022511918 A JP2022511918 A JP 2022511918A JP WO2021200265 A1 JPWO2021200265 A1 JP WO2021200265A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/28—Arrangements for cooling comprising Peltier coolers
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020061387 | 2020-03-30 | ||
| PCT/JP2021/011334 WO2021200265A1 (ja) | 2020-03-30 | 2021-03-19 | 熱電変換モジュール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021200265A1 true JPWO2021200265A1 (https=) | 2021-10-07 |
Family
ID=77928584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022511918A Pending JPWO2021200265A1 (https=) | 2020-03-30 | 2021-03-19 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230139556A1 (https=) |
| JP (1) | JPWO2021200265A1 (https=) |
| CN (1) | CN115362566A (https=) |
| WO (1) | WO2021200265A1 (https=) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0997930A (ja) * | 1995-07-27 | 1997-04-08 | Aisin Seiki Co Ltd | 熱電冷却モジュール及びその製造方法 |
| WO2007020775A1 (ja) * | 2005-08-16 | 2007-02-22 | Matsushita Electric Industrial Co., Ltd. | 熱電変換デバイス、並びにそれを用いた冷却方法および発電方法 |
| US20070089773A1 (en) * | 2004-10-22 | 2007-04-26 | Nextreme Thermal Solutions, Inc. | Methods of Forming Embedded Thermoelectric Coolers With Adjacent Thermally Conductive Fields and Related Structures |
| JP2007294864A (ja) * | 2006-03-31 | 2007-11-08 | Kyocera Corp | 熱電モジュール |
| JP2009231729A (ja) * | 2008-03-25 | 2009-10-08 | Nec Corp | 半導体装置 |
| JP2010118475A (ja) * | 2008-11-12 | 2010-05-27 | Mitsumi Electric Co Ltd | 熱電変換モジュール及び熱電変換装置 |
| JP2010130002A (ja) * | 2008-11-26 | 2010-06-10 | Korea Electronics Telecommun | 熱電素子及び熱電素子モジュール並びにその熱電素子の形成方法 |
| JP2014204123A (ja) * | 2013-04-09 | 2014-10-27 | ハーマン ベッカー オートモーティブ システムズ ゲーエムベーハー | 印刷回路基板一体型熱電冷却器／加熱器 |
| JP2016012716A (ja) * | 2014-06-03 | 2016-01-21 | 株式会社デンソー | 熱電変換素子シートおよびその製造方法、熱電変換装置の製造方法 |
| US20160322555A1 (en) * | 2015-04-30 | 2016-11-03 | Lg Innotek Co., Ltd. | Thermoelectric module and heat converter including the same |
| US20170223817A1 (en) * | 2016-01-29 | 2017-08-03 | Delta Electronics, Inc. | Thermoelectric cooling module |
| JP2017212389A (ja) * | 2016-05-27 | 2017-11-30 | 株式会社デンソー | 熱電変換装置およびその製造方法 |
| JP2017228610A (ja) * | 2016-06-21 | 2017-12-28 | パナソニックＩｐマネジメント株式会社 | 熱電変換器 |
| JP2019149501A (ja) * | 2018-02-28 | 2019-09-05 | 京セラ株式会社 | 配線基板及び電子装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102652928B1 (ko) * | 2017-02-06 | 2024-03-29 | 엘지이노텍 주식회사 | 열전 소자 |
-
2021
- 2021-03-19 JP JP2022511918A patent/JPWO2021200265A1/ja active Pending
- 2021-03-19 CN CN202180025830.8A patent/CN115362566A/zh active Pending
- 2021-03-19 WO PCT/JP2021/011334 patent/WO2021200265A1/ja not_active Ceased
- 2021-03-19 US US17/915,549 patent/US20230139556A1/en not_active Abandoned
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0997930A (ja) * | 1995-07-27 | 1997-04-08 | Aisin Seiki Co Ltd | 熱電冷却モジュール及びその製造方法 |
| US20070089773A1 (en) * | 2004-10-22 | 2007-04-26 | Nextreme Thermal Solutions, Inc. | Methods of Forming Embedded Thermoelectric Coolers With Adjacent Thermally Conductive Fields and Related Structures |
| WO2007020775A1 (ja) * | 2005-08-16 | 2007-02-22 | Matsushita Electric Industrial Co., Ltd. | 熱電変換デバイス、並びにそれを用いた冷却方法および発電方法 |
| JP2007294864A (ja) * | 2006-03-31 | 2007-11-08 | Kyocera Corp | 熱電モジュール |
| JP2009231729A (ja) * | 2008-03-25 | 2009-10-08 | Nec Corp | 半導体装置 |
| JP2010118475A (ja) * | 2008-11-12 | 2010-05-27 | Mitsumi Electric Co Ltd | 熱電変換モジュール及び熱電変換装置 |
| JP2010130002A (ja) * | 2008-11-26 | 2010-06-10 | Korea Electronics Telecommun | 熱電素子及び熱電素子モジュール並びにその熱電素子の形成方法 |
| JP2014204123A (ja) * | 2013-04-09 | 2014-10-27 | ハーマン ベッカー オートモーティブ システムズ ゲーエムベーハー | 印刷回路基板一体型熱電冷却器／加熱器 |
| JP2016012716A (ja) * | 2014-06-03 | 2016-01-21 | 株式会社デンソー | 熱電変換素子シートおよびその製造方法、熱電変換装置の製造方法 |
| US20160322555A1 (en) * | 2015-04-30 | 2016-11-03 | Lg Innotek Co., Ltd. | Thermoelectric module and heat converter including the same |
| US20170223817A1 (en) * | 2016-01-29 | 2017-08-03 | Delta Electronics, Inc. | Thermoelectric cooling module |
| JP2017212389A (ja) * | 2016-05-27 | 2017-11-30 | 株式会社デンソー | 熱電変換装置およびその製造方法 |
| JP2017228610A (ja) * | 2016-06-21 | 2017-12-28 | パナソニックＩｐマネジメント株式会社 | 熱電変換器 |
| JP2019149501A (ja) * | 2018-02-28 | 2019-09-05 | 京セラ株式会社 | 配線基板及び電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021200265A1 (ja) | 2021-10-07 |
| US20230139556A1 (en) | 2023-05-04 |
| CN115362566A (zh) | 2022-11-18 |
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